A laser package apparatus

Abstract

This application discloses a laser packaging apparatus, including a die bonding stage, a socket support stage, a socket transfer mechanism, a transition heat sink transfer mechanism, and a chip transfer mechanism. The die bonding stage has multiple packaging holes of different sizes arranged sequentially. The die bonding stage is used to heat the product in the packaging holes. The socket support stage is used to support the socket. The socket transfer mechanism is used to transport the socket between the socket support stage and the packaging holes of the die bonding stage. The transition heat sink transfer mechanism is used to transport the transition heat sink to the die bonding stage and place it on the socket. Solder is applied to both sides of the transition heat sink. The chip transfer mechanism is used to transport the chip to the die bonding stage and place it on the transition heat sink. The chip transfer mechanism presses down on the chip so that both sides of the transition heat sink react eutecticly with the chip and the socket, respectively. This simplifies the packaging process, reduces equipment costs, and improves packaging yield and production efficiency. This application has wide applications in the field of laser technology.

Description

Technical Field

[0001] This application relates to the field of laser technology, and in particular to a laser packaging device. Background Technology

[0002] To meet market demands for miniaturization, high reliability, and low cost, semiconductor lasers often employ TO (Transistor Outline) packaging. In medium-to-high power TO surface mount packaging, two machines are typically used: one to mount the chip onto the transition heat sink, and the other to mount the heat sink onto the TO socket. This ensures low porosity at the bonding interfaces between the chip and the heat sink, and between the heat sink and the TO socket. However, using two separate packaging machines in similar surface mount packaging processes not only increases equipment costs but also adds numerous steps and reduces production efficiency. Furthermore, due to the wide variety of TO package sizes available (e.g., TO-38, TO-46, TO-56, TO-9), packaging different sizes requires switching fixtures for adjustments, which is time-consuming and affects packaging yield. Using a separate machine for each size would drastically increase equipment costs. Utility Model Content

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a laser packaging device that simplifies the packaging process, reduces equipment costs, and improves packaging yield and production efficiency.

[0004] A laser packaging apparatus according to an embodiment of this application includes:

[0005] A surface mount eutectic stage, wherein the surface mount eutectic stage is provided with a plurality of encapsulation holes of different sizes in sequence, and the surface mount eutectic stage is used to heat the product in the encapsulation holes;

[0006] A tube seat support platform, which is used to support the tube seat;

[0007] A tube socket transfer mechanism is used to transport the tube socket between the tube socket carrier stage and the encapsulation hole of the surface mount eutectic stage;

[0008] A transition heat sink transfer mechanism is used to transport the transition heat sink to the surface mount eutectic stage and place it on the tube base. Solder is provided on both sides of the transition heat sink.

[0009] A chip transfer mechanism is used to transport the chip to the surface mount eutectic stage and place it on the transition heat sink. The chip transfer mechanism is used to press down on the chip so that the two sides of the transition heat sink react with the chip and the socket respectively.

[0010] The tube support platform, the transition heat sink transfer mechanism, and the chip transfer mechanism are arranged at intervals around the outer periphery of the surface mount eutectic stage.

[0011] The laser packaging equipment according to the embodiments of this application has at least the following beneficial effects: By setting a eutectic stage with multiple packaging holes of different sizes in sequence, it can accommodate products of different sizes, enabling one machine to meet the packaging needs of products of multiple sizes, thereby reducing equipment costs and improving packaging yield and production efficiency. Simultaneously, by setting solder on both sides of the transition heat sink transfer mechanism, and by having the socket transfer mechanism, transition heat sink transfer mechanism, and chip transfer mechanism work sequentially, the transition heat sink is placed between the socket and the chip. The chip transfer mechanism presses down the chip, causing the solder on both sides of the transition heat sink to undergo a eutectic reaction with the chip and the socket respectively under the heating effect of the eutectic stage. This allows for the one-time completion of chip-to-transition heat sink and transition heat sink-to-socket packaging, simplifying the packaging process and reducing equipment costs.

[0012] According to some embodiments of this application, the laser packaging equipment further includes a socket preheating stage, which is located between the socket carrier stage and the surface mount eutectic stage. The socket preheating stage is used to preheat the socket before it is transported to the surface mount eutectic stage.

[0013] According to some embodiments of this application, the tube socket transfer mechanism includes a tube socket pick-up nozzle and a tube socket clamping assembly. The tube socket pick-up nozzle is located between the tube socket preheating stage and the tube socket support stage, and the tube socket clamping assembly is located between the tube socket preheating stage and the surface mount eutectic stage. The tube socket pick-up nozzle is used to move the tube socket between the tube socket support stage and the tube socket preheating stage. The tube socket pick-up nozzle is also used to move the tube socket between the tube socket preheating stage and the tube socket clamping assembly. The tube socket clamping assembly is used to place the tube socket in or remove it from the encapsulation hole.

[0014] According to some embodiments of this application, the tube holder gripping assembly includes a tube holder inserting finger and a tube holder removing finger. The tube holder inserting finger is used to move the tube holder to the encapsulation hole, and the tube holder removing finger is used to remove the tube holder out of the encapsulation hole for the tube holder to be picked up by the tube holder picking nozzle.

[0015] According to some embodiments of this application, the tube seat is provided with clamping and positioning grooves on both sides, and the tube seat clamping assembly engages with the clamping and positioning grooves when transporting the tube seat.

[0016] According to some embodiments of this application, the tube preheating platform is provided with a plurality of preheating holes of different sizes in sequence.

[0017] According to some embodiments of this application, the surface mount eutectic stage has a first limiting surface and a second limiting surface, the first limiting surface and the second limiting surface together form the encapsulation hole, the surface mount eutectic stage is provided with a first positioning drive and a second positioning drive, the first positioning drive is used to push the tube seat along a first direction so that the tube seat abuts against the first limiting surface, the second positioning drive is used to push the tube seat along a second direction so that the tube seat abuts against the second limiting surface, the first direction is perpendicular to the second direction.

[0018] According to some embodiments of this application, the first direction is the height direction of the laser packaging device, the second direction is the direction from the tube socket to the chip, the second positioning drive member abuts against the side of the tube socket away from the second limiting surface, and the transition heat sink is located on the side of the tube socket away from the second positioning drive member.

[0019] According to some embodiments of this application, the tube seat is provided with a limiting groove, the limiting groove is located at an end away from the tube seat and away from the first limiting surface, and the first positioning drive member abuts against the inner wall of the limiting groove.

[0020] According to some embodiments of this application, the laser packaging equipment further includes a transition heat sink carrier stage, a transition heat sink calibration mechanism, a chip carrier stage, and a chip calibration mechanism. The transition heat sink calibration mechanism is located between the transition heat sink carrier stage and the die bonding eutectic stage. The transition heat sink carrier stage is used to carry the transition heat sink. The transition heat sink transfer mechanism includes a transition heat sink pick-up nozzle and a transition heat sink eutectic nozzle. The transition heat sink pick-up nozzle is used to move the transition heat sink on the transition heat sink carrier stage to the transition heat sink calibration mechanism, and the transition heat sink eutectic nozzle is used to move the transition heat sink from the transition heat sink calibration mechanism to the die bonding eutectic stage.

[0021] The chip calibration mechanism is located between the chip carrier stage and the chip calibration mechanism. The chip carrier stage is used to carry the chip. The chip transfer mechanism includes a chip pick-up nozzle and a chip eutectic nozzle. The chip pick-up nozzle is used to move the chip on the chip carrier stage to the chip calibration mechanism, and the chip eutectic nozzle is used to move the chip from the chip calibration mechanism to the chip eutectic stage.

[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0023] The present application will be further illustrated below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments illustrated in the following drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application.

[0024] Figure 1 This is a schematic diagram of the structure of the laser packaging device disclosed in the embodiments of this application;

[0025] Figure 2 This is a front view of the tube seat placed in the encapsulation hole as disclosed in the embodiments of this application;

[0026] Figure 3 This is a side view of the tube seat placed in the encapsulation hole according to an embodiment of this application.

[0027] Figure label:

[0028] 100. Laser packaging equipment; 101. Chip eutectic stage; 1011. Encapsulation hole; 1012. First limiting surface; 1013. Second limiting surface; 102. Tube socket carrier stage; 103. Tube socket transfer mechanism; 1031. Tube socket pick-up nozzle; 1032. Inserting finger into tube socket; 1033. Removing finger from tube socket; 104. Tube socket preheating stage; 1041. Preheating hole; 105. First positioning drive; 106. Second positioning drive; 107. Transition heat sink carrier stage; 108. Chip carrier stage; 109. Transition heat sink pick-up nozzle; 110. Transition heat sink eutectic nozzle; 111. Chip pick-up nozzle; 112. Chip eutectic nozzle; 113. Transition heat sink calibration stage; 114. Transition heat sink calibration camera; 115. Chip calibration stage; 116. Chip calibration camera;

[0029] 200. Pipe seat; 201. Clamping and positioning groove;

[0030] 300. Transitional heat sink;

[0031] 400. Chip. Detailed Implementation

[0032] The embodiments of this application are described in detail below with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0033] In the description of this application, it should be understood that the terms "center", "middle", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0035] In the description of this application, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] In the description of this application, the use of terms such as "as one implementation," "an embodiment," "some examples," "some embodiments," "illustrative embodiment," "example," "specific example," "some examples," etc., indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0037] The contents of this application are described in detail below with reference to specific embodiments. It should be noted that the following description is merely illustrative and not a specific limitation of this application.

[0038] Please refer to the following: Figures 1 to 3This application provides a laser packaging device 100, including a die bonding stage 101, a socket support stage 102, a socket transfer mechanism 103, a heat sink transfer mechanism, and a chip transfer mechanism. The die bonding stage 101 is provided with a plurality of packaging holes 1011 of different sizes. The die bonding stage 101 is used to heat the product in the packaging holes 1011. The socket support stage 102 is used to support the socket 200. The socket transfer mechanism 103 is used to transport the socket 200 between the socket support stage 102 and the packaging holes 1011 of the die bonding stage 101. The transition heat sink transfer mechanism is used to transport the transition heat sink 300 to the surface mount eutectic stage 101 and place it on the socket 200. Solder is provided on both sides of the transition heat sink 300. The chip transfer mechanism is used to transport the chip 400 to the surface mount eutectic stage and place it on the transition heat sink 300. The chip transfer mechanism is used to press down the chip 400 so that the two sides of the transition heat sink 300 react with the chip 400 and the socket 200 respectively. The socket support stage 102, the transition heat sink transfer mechanism and the chip transfer mechanism are arranged around the outer periphery of the surface mount eutectic stage 101 at intervals.

[0039] The laser packaging equipment 100 provided in this application embodiment has multiple packaging holes 1011 of different sizes arranged sequentially on the surface mount eutectic stage 101 to accommodate products of different sizes. This allows one machine to meet the packaging needs of products of various sizes, thereby reducing equipment costs and improving packaging yield and production efficiency. Simultaneously, solder is provided on both sides of the transition heat sink 300. Through the sequential operation of the socket transfer mechanism 103, the transition heat sink transfer mechanism, and the chip transfer mechanism, the transition heat sink 300 is placed between the socket 200 and the chip 400. The chip transfer mechanism presses down on the chip 400, causing the solder on both sides of the transition heat sink 300 to undergo a eutectic reaction with the chip 400 and the socket 200 respectively under the heating effect of the surface mount eutectic stage 101. This allows for the one-time packaging of the chip 400 and the transition heat sink 300, and the transition heat sink 300 and the socket 200, simplifying the packaging process and reducing equipment costs.

[0040] In some embodiments, multiple encapsulation holes 1011 are arranged sequentially in ascending order of size. For example, the multiple encapsulation holes 1011 are sequentially designated as TO-38 encapsulation holes, TO-46 encapsulation holes, TO-56 encapsulation holes, and TO-9 encapsulation holes. This facilitates the identification of the encapsulation location for easy encapsulation operations.

[0041] In some embodiments, the laser packaging apparatus 100 further includes a socket preheating stage 104 located between the socket carrier stage 102 and the surface mount eutectic stage 101. The socket preheating stage 104 is used to preheat the socket 200 before it is transported to the surface mount eutectic stage 101.

[0042] In this way, on the one hand, the socket 200 can be preheated in advance to shorten the heating time of the socket 200 on the surface mount eutectic stage 101, thereby improving production efficiency. On the other hand, since the socket 200 has a large range of movement in the tray and its position accuracy is not high, the socket transfer mechanism 103 is easily affected by positional deviation when transporting the socket 200 from the tray on the socket carrier stage 102, which may cause the socket 200 to be unable to be accurately placed into the encapsulation hole 1011. Before being placed on the surface mount eutectic stage 101, the socket 200 passes through the socket preheating stage 104, which can also perform secondary calibration of the position and angle of the socket 200 to improve the positional accuracy of the socket 200 on the surface mount eutectic stage and reduce positional deviation.

[0043] Optionally, the tube socket preheating stage 104 is provided with a plurality of preheating holes 1041 of different sizes. This allows for the preheating of tube sockets 200 of different sizes to meet the packaging requirements of products of different sizes.

[0044] Optionally, the multiple preheating holes 1041 are arranged sequentially in an increasing order of size, with each preheating hole 1041 corresponding to a different encapsulation hole 1011, and the diameter of any two corresponding preheating holes 1041 and encapsulation holes 1011 being the same. This facilitates the movement and loading of the tube base 200.

[0045] In some embodiments, the tube socket transfer mechanism 103 includes a tube socket pick-up nozzle 1031 and a tube socket 200 clamping assembly. The tube socket pick-up nozzle 1031 is located between the tube socket preheating stage 104 and the tube socket support stage 102. The tube socket 200 clamping assembly is located between the tube socket preheating stage 104 and the surface mount eutectic stage 101. The tube socket pick-up nozzle 1031 is used to move the tube socket 200 between the tube socket support stage 102 and the tube socket preheating stage 104. The tube socket pick-up nozzle 1031 is also used to move the tube socket 200 between the tube socket preheating stage 104 and the tube socket 200 clamping assembly. The tube socket 200 clamping assembly is used to place the tube socket 200 into or remove it from the encapsulation hole 1011.

[0046] In this way, the tray containing the tube socket 200 is placed on the tube socket support stage 102. The tube socket 200 is picked up from the tube socket support stage 102 by the tube socket pick-up nozzle 1031, which can reduce the impact of the positional accuracy of the tube socket 200 on the tray. The tube socket 200 is moved from the tube socket support stage 102 to the tube socket preheating stage 104 by the tube socket pick-up nozzle 1031. The tube socket 200 is preheated in the tube socket preheating stage 104 to shorten the heating time of the tube socket 200 on the surface mount eutectic stage 101. After preheating, the tube socket 200 is picked up from the tube socket preheating stage 104 by the tube socket pick-up nozzle 1031 and placed in the tube socket 200 clamping assembly. The tube socket 200 is inserted into the encapsulation hole 1011 of the surface mount eutectic stage 101 by rotating the tube socket 200 at a certain angle for heating.

[0047] The preheating station 104 performs secondary calibration of the position and angle of the tube seat 200, which improves the accuracy of the tube seat pick-up nozzle 1031 in picking up the tube seat 200. This facilitates the accurate placement of the tube seat 200 into the tube seat 200 clamping assembly, enhancing the reliability of tube seat 200 handling and preventing the tube seat 200 clamping assembly from failing to hold and fix the tube seat 200 when the tube seat pick-up nozzle 1031 directly places the tube seat 200 from the material tray into the tube seat 200 clamping assembly. Simultaneously, the tube seat 200 clamping assembly moves the tube seat 200 into the encapsulation hole 1011 through clamping, facilitating the handling of tube seats 200 of different sizes.

[0048] Optionally, the tube holder 200 gripping assembly includes a tube holder insertion finger 1032 and a tube holder removal finger 1033. The tube holder insertion finger 1032 is used to move the tube holder 200 into the encapsulation hole 1011, and the tube holder removal finger 1033 is used to remove the tube holder 200 out of the encapsulation hole 1011 for the tube holder pick-up nozzle 1031 to pick up. This allows for simultaneous insertion of the tube holder 200 into the encapsulation hole 1011 and removal of the tube holder 200 from the encapsulation hole 1011, thereby improving production efficiency.

[0049] Optionally, the insertion of the finger into the tube holder 1032 and the removal of the finger from the tube holder 1033 are rotatably connected to the frame.

[0050] Optionally, the tube seat 200 is provided with clamping and positioning grooves 201 on both sides. When the tube seat 200 clamping assembly moves the tube seat 200, it is engaged with the clamping and positioning grooves 201. This facilitates the positioning of the tube seat 200 clamping assembly and improves the clamping reliability of the tube seat 200 clamping assembly on the tube seat 200.

[0051] In some embodiments, the surface mount eutectic stage 101 has a first limiting surface 1012 and a second limiting surface 1013. The first limiting surface 1012 and the second limiting surface 1013 surround and form an encapsulation hole 1011. The surface mount eutectic stage 101 is provided with a first positioning drive 105 and a second positioning drive 106. The first positioning drive 105 is used to push the tube seat 200 along a first direction so that the tube seat 200 abuts against the first limiting surface 1012. The second positioning drive 106 is used to push the tube seat 200 along a second direction so that the tube seat 200 abuts against the second limiting surface 1013. The first direction is perpendicular to the second direction.

[0052] This allows the socket 200 to be positioned in two directions, making its position within the encapsulation hole 1011 more stable and facilitating a tight fit between the socket 200 and the inner wall of the encapsulation hole 1011. This promotes heat transfer, ensuring the socket 200 is fully heated and further reducing the heating time of the socket 200 on the surface mount eutectic stage 101, thereby improving production efficiency.

[0053] Optionally, the first direction is the height direction of the laser packaging equipment 100, and the second direction is the direction from the socket 200 to the chip 400. The second positioning drive 106 abuts against the side of the socket 200 away from the second limiting surface 1013, and the transition heat sink 300 is located on the side of the socket 200 away from the second positioning drive 106. This satisfies both the limiting of the socket 200 and facilitates the packaging of the transition heat sink 300 with the socket 200.

[0054] Optionally, the tube seat 200 is provided with a limiting groove, which is located at the end away from the tube seat 200 and away from the first limiting surface 1012, and the first positioning drive member 105 abuts against the inner wall of the limiting groove.

[0055] By setting a limiting groove to position the first positioning drive 105, it is beneficial to improve the reliability of the first positioning drive 105 in pushing the tube seat 200 to move along the first direction, and avoid the tube seat 200 from deviating in the direction of movement, thereby improving the positioning accuracy of the tube seat 200 in the encapsulation hole 1011.

[0056] For example, the first positioning drive 105 and the second positioning drive 106 can be any of the following: a cylinder, an electric push rod, or a lead screw and nut structure. The limiting groove can be provided at the bottom of the tube seat 200, and the first positioning drive 105 abuts against the bottom of the tube seat 200.

[0057] In some embodiments, the laser packaging apparatus 100 further includes a transition heat sink carrier stage 107, a transition heat sink calibration mechanism, a chip carrier stage 108, and a chip calibration mechanism. The transition heat sink calibration mechanism is located between the transition heat sink carrier stage 107 and the surface mount eutectic stage 101. The transition heat sink carrier stage 107 is used to carry the transition heat sink 300. The transition heat sink transfer mechanism includes a transition heat sink pick-up nozzle 109 and a transition heat sink eutectic nozzle 110. The transition heat sink pick-up nozzle 109 is used to move the transition heat sink 300 on the transition heat sink carrier stage 107 to the transition heat sink calibration mechanism. The transition heat sink eutectic nozzle 110 is used to move the transition heat sink 300 from the transition heat sink calibration mechanism to the surface mount eutectic stage 101. The chip calibration mechanism is located between the chip carrier stage 108 and the chip calibration mechanism. The chip carrier stage 108 is used to carry the chip 400. The chip transfer mechanism includes a chip pick-up nozzle 111 and a chip eutectic nozzle 112. The chip pick-up nozzle 111 is used to move the chip 400 on the chip carrier stage 108 to the chip calibration mechanism, and the chip eutectic nozzle 112 is used to move the chip 400 from the chip calibration mechanism to the chip eutectic stage 101.

[0058] In this way, by setting up a transition heat sink calibration mechanism and a chip calibration mechanism, the position and angle of the transition heat sink 300 and the chip 400 can be calibrated so that the transition heat sink 300 and the chip 400 can be accurately placed on the socket 200 for packaging, thereby improving production efficiency and packaging yield.

[0059] Optionally, the transition heat sink calibration mechanism includes a transition heat sink calibration stage 113 and a transition heat sink calibration camera 114. The transition heat sink pick-up nozzle 109 is used to move the transition heat sink 300 on the transition heat sink carrier stage 107 to the transition heat sink calibration stage 113, perform position calibration on the transition heat sink 300 on the transition heat sink calibration stage 113 by the transition heat sink calibration camera 114, and move the transition heat sink 300 from the transition heat sink calibration stage 113 to the tube seat 200 of the surface mount eutectic stage 101 by the transition heat sink eutectic nozzle 110. The chip calibration mechanism includes a chip calibration stage 115 and a chip calibration camera 116. The chip pick-up nozzle 111 is used to move the chip 400 on the chip carrier stage 108 to the chip calibration stage 115. The chip calibration camera 116 performs position calibration on the chip 400 on the chip calibration stage 115. The chip eutectic nozzle 112 moves the chip 400 from the chip calibration stage 115 to the transition heat sink 300 of the surface mount eutectic stage 101.

[0060] To facilitate reading and understanding, the working process of the laser packaging equipment 100 is illustrated below with an example:

[0061] The tube socket 200 is picked up from the tube socket carrier 102 by the tube socket pick-up nozzle 1031 and moved from the tube socket carrier 102 to the preheating hole 1041 of the tube socket preheating stage 104. The tube socket 200 is preheated in the tube socket preheating stage 104 to shorten the heating time of the tube socket 200 on the surface mount eutectic stage 101. After preheating, the tube socket 200 is picked up from the tube socket preheating stage 104 by the tube socket pick-up nozzle 1031 and placed in the tube socket insertion finger 1032. The tube socket 200 is placed into the encapsulation hole 1011 of the surface mount eutectic stage 101 by rotating the tube socket insertion finger 1032 at a certain angle for heating. The tube socket 200 is pushed by the first positioning drive 105 and the second positioning drive 106 so that the tube socket 200 abuts against the first limiting surface 1012 and the second limiting surface 1013. Then the tube socket insertion finger 1032 is reset.

[0062] The transition heat sink 300 on the transition heat sink carrier stage 107 is moved to the transition heat sink calibration stage 113 by the transition heat sink pick-up nozzle 109. Then the transition heat sink pick-up nozzle 109 is reset. The position of the transition heat sink 300 on the transition heat sink calibration stage 113 is calibrated by the transition heat sink calibration camera 114. Then the transition heat sink 300 is moved from the transition heat sink calibration stage 113 to the tube seat 200 of the surface mount eutectic stage 101 by the transition heat sink eutectic nozzle 110. Finally, the transition heat sink eutectic nozzle 110 is reset.

[0063] The chip 400 on the chip carrier stage 108 is moved to the chip calibration stage 115 by the chip pick-up nozzle 111. Then the chip pick-up nozzle 111 is reset, and the position of the chip 400 on the chip calibration stage 115 is calibrated by the chip calibration camera 116. Subsequently, the chip eutectic nozzle 112 moves the chip 400 from the chip calibration stage 115 to the transition heat sink 300 on the surface mount eutectic stage 101. The chip eutectic nozzle 112 presses down to squeeze the chip 400, so that the transition heat sink 300 applies pressure to the socket 200. The chip eutectic nozzle 112 remains in a pressed state. After a certain period of time, the solder on one side of the transition heat sink 300 and the socket 200 complete eutectic bonding, and the solder on the other side of the transition heat sink 300 and the chip 400 complete eutectic bonding. Then the chip eutectic nozzle 112 is lifted and reset. The first positioning drive 105 and the second positioning drive 106 are reset to release the restriction on the socket 200. The socket removal finger 1033 is inserted into the packaging hole 1011 to remove the socket 200. The socket removal finger 1033 is rotated at a certain angle to be parallel to the socket pickup nozzle 1031. The socket pickup nozzle 1031 picks up the socket 200 from the socket removal finger 1033 and moves it to the socket return carrier stage 102 to complete the TO device surface mount packaging.

[0064] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A laser package apparatus, characterized by, include: A surface mount eutectic stage, wherein the surface mount eutectic stage is provided with a plurality of encapsulation holes of different sizes in sequence, and the surface mount eutectic stage is used to heat the product in the encapsulation holes; A tube seat support platform, which is used to support the tube seat; A tube socket transfer mechanism is used to transport the tube socket between the tube socket carrier stage and the encapsulation hole of the surface mount eutectic stage; A transition heat sink transfer mechanism is used to transport the transition heat sink to the surface mount eutectic stage and place it on the tube base. Solder is provided on both sides of the transition heat sink. A chip transfer mechanism is used to transport the chip to the surface mount eutectic stage and place it on the transition heat sink. The chip transfer mechanism is used to press down on the chip so that the two sides of the transition heat sink react with the chip and the socket respectively. The tube support platform, the transition heat sink transfer mechanism, and the chip transfer mechanism are arranged at intervals around the outer periphery of the surface mount eutectic stage.

2. The laser packaging equipment according to claim 1, characterized in that, The laser packaging equipment also includes a socket preheating stage, which is located between the socket carrier stage and the surface mount eutectic stage. The socket preheating stage is used to preheat the socket before it is transported to the surface mount eutectic stage.

3. The laser packaging equipment according to claim 2, characterized in that, The tube socket transfer mechanism includes a tube socket pick-up nozzle and a tube socket clamping assembly. The tube socket pick-up nozzle is located between the tube socket preheating stage and the tube socket support stage. The tube socket clamping assembly is located between the tube socket preheating stage and the surface mount eutectic stage. The tube socket pick-up nozzle is used to move the tube socket between the tube socket support stage and the tube socket preheating stage. The tube socket pick-up nozzle is also used to move the tube socket between the tube socket preheating stage and the tube socket clamping assembly. The tube socket clamping assembly is used to place the tube socket in or remove it from the encapsulation hole.

4. The laser packaging equipment according to claim 3, characterized in that, The tube holder gripping assembly includes a tube holder insertion finger and a tube holder removal finger. The tube holder insertion finger is used to move the tube holder to the encapsulation hole, and the tube holder removal finger is used to remove the tube holder from the encapsulation hole for the tube holder to be picked up by the tube holder pickup nozzle.

5. The laser packaging equipment according to claim 2, characterized in that, The tube seat is provided with clamping and positioning grooves on both sides, and the tube seat clamping assembly engages with the clamping and positioning grooves when transporting the tube seat.

6. The laser packaging equipment according to claim 2, characterized in that, The tube preheating platform is provided with multiple preheating holes of different sizes in sequence.

7. The laser packaging equipment according to claim 1, characterized in that, The surface mount eutectic stage has a first limiting surface and a second limiting surface, which together form the encapsulation hole. The surface mount eutectic stage is provided with a first positioning drive and a second positioning drive. The first positioning drive is used to push the tube seat along a first direction so that the tube seat abuts against the first limiting surface. The second positioning drive is used to push the tube seat along a second direction so that the tube seat abuts against the second limiting surface. The first direction is perpendicular to the second direction.

8. The laser packaging equipment according to claim 7, characterized in that, The first direction is the height direction of the laser packaging device, the second direction is the direction from the tube socket to the chip, the second positioning drive member abuts against the side of the tube socket away from the second limiting surface, and the transition heat sink is located on the side of the tube socket away from the second positioning drive member.

9. The laser packaging equipment according to claim 7, characterized in that, The tube seat is provided with a limiting groove, which is located at the end away from the tube seat and away from the first limiting surface. The first positioning drive member abuts against the inner wall of the limiting groove.

10. The laser packaging apparatus according to any one of claims 1-9, characterized in that, The laser packaging equipment further includes a transition heat sink carrier stage, a transition heat sink calibration mechanism, a chip carrier stage, and a chip calibration mechanism. The transition heat sink calibration mechanism is located between the transition heat sink carrier stage and the die bonding eutectic stage. The transition heat sink carrier stage is used to carry the transition heat sink. The transition heat sink transfer mechanism includes a transition heat sink pick-up nozzle and a transition heat sink eutectic nozzle. The transition heat sink pick-up nozzle is used to move the transition heat sink on the transition heat sink carrier stage to the transition heat sink calibration mechanism, and the transition heat sink eutectic nozzle is used to move the transition heat sink from the transition heat sink calibration mechanism to the die bonding eutectic stage. The chip calibration mechanism is located between the chip carrier stage and the chip calibration mechanism. The chip carrier stage is used to carry the chip. The chip transfer mechanism includes a chip pick-up nozzle and a chip eutectic nozzle. The chip pick-up nozzle is used to move the chip on the chip carrier stage to the chip calibration mechanism, and the chip eutectic nozzle is used to move the chip from the chip calibration mechanism to the chip eutectic stage.

Images