Transparent iridescent flexible circuit board

Abstract

This utility model discloses a transparent iridescent flexible circuit board, comprising a substrate and a control circuit board. The substrate includes a first transparent substrate layer, a second transparent substrate layer, and a light source layer. The light source layer has multiple light-emitting elements arranged in an array. The first transparent substrate layer has a first hemispherical groove, and the second transparent substrate layer has a second hemispherical groove. The light-emitting elements are simultaneously embedded in the first and second hemispherical grooves. The control circuit board is disposed on one side of the first transparent substrate layer and is used to control the on and off of the light-emitting elements. By bidirectionally embedding the light-emitting elements in the first and second hemispherical grooves, uneven filling of the colloid or displacement of the LED beads during the colloid curing process is avoided, improving the positional accuracy of the LED beads and enhancing the display effect. At the same time, the first and second transparent substrate layers can assist in the uniform transmission of light, achieving efficient light conduction and diffusion, and improving display uniformity and brightness consistency.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, and in particular to a transparent iridescent flexible circuit board. Background Technology

[0002] Flexible printed circuit boards (FPCs), also known as flexible circuit boards or simply "flexible boards" in the industry, are a new type of circuit board that integrates flexible electronics technology with dynamic optical effects. They can be freely bent, rolled, and folded. The circuit board can dynamically adjust the light-emitting elements through control circuits, such as brightness changes, color gradients, and flicker frequency adjustments, thereby creating diverse iridescent effects. Traditional circuit boards typically use an adhesive layer to completely encapsulate the light source layer for fixation, but this suffers from problems such as uneven adhesive filling leading to LED misalignment and interlayer thermal expansion differences causing delamination, resulting in image distortion and affecting visual effects. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a transparent iridescent flexible circuit board, which has the advantage of good visual effects.

[0004] The transparent iridescent flexible circuit board according to this utility model includes:

[0005] The substrate includes a first transparent substrate layer, a second transparent substrate layer, and a light source layer. The light source layer has multiple light-emitting elements arranged in an array. The first transparent substrate layer is provided with a first hemispherical groove, and the second transparent substrate layer is provided with a second hemispherical groove. The light-emitting elements are simultaneously embedded in the first hemispherical groove and the second hemispherical groove.

[0006] A control circuit board is disposed on one side of the first transparent substrate layer, and the control circuit board is used to control the turning on and off of the light-emitting element.

[0007] The transparent iridescent flexible circuit board according to this utility model has at least the following beneficial effects: The hemispherical grooves on the first and second transparent substrate layers bidirectionally embed the light-emitting elements, forming a physical constraint that avoids uneven filling of the colloid or displacement of the LED beads during the colloid curing process, thereby improving the positional accuracy of the LED beads and enhancing the display effect. Simultaneously, the first and second transparent substrate layers can assist in the uniform transmission of light, achieving efficient light conduction and diffusion, and improving display uniformity and brightness consistency.

[0008] According to some embodiments of the present invention, the radius of the first hemispherical groove is equal to the radius of the second hemispherical groove, the light-emitting element is an LED bead, and the difference between the radius of the first hemispherical groove and the radius of the LED bead is A, where 0.05mm≤A≤0.1mm.

[0009] According to some embodiments of the present invention, the transparent iridescent flexible circuit board has heat dissipation holes on the second transparent substrate layer, and the heat dissipation holes are connected to the second hemispherical groove.

[0010] According to some embodiments of the present invention, a transparent iridescent flexible circuit board is provided between the first transparent substrate layer and the light source layer, and a second transparent adhesive layer is provided between the second transparent substrate layer and the light source layer. The first transparent substrate layer, the second transparent substrate layer and the light source layer are all connected by pressing.

[0011] According to some embodiments of the present invention, the transparent iridescent flexible circuit board has a light-shielding member provided on the side wall of the substrate.

[0012] According to some embodiments of the present invention, the thickness of the substrate of the transparent iridescent flexible circuit board is A, where 5mm≤A≤50mm.

[0013] According to some embodiments of the present invention, the first transparent substrate layer and the second transparent substrate layer are both flexible and transparent PI or PET materials.

[0014] According to some embodiments of the present invention, the transparent iridescent flexible circuit board further includes a metal circuit in the light source layer. The metal circuit has a grid-like hollow structure, and the light-emitting element is connected to the grid nodes of the metal circuit.

[0015] According to some embodiments of the present invention, the thickness of the metal circuit is B, where 5um ≤ B ≤ 40um.

[0016] According to some embodiments of the present invention, the transparent iridescent flexible circuit board has a first transparent substrate layer and a second transparent substrate layer, both of which are rectangular structures. On the thickness direction of the substrate, the projected area of ​​the second transparent substrate layer includes the projected area of ​​the first transparent substrate layer to form a mounting area, and the control circuit board is pressed and mounted in the mounting area.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a top view of the transparent iridescent flexible circuit board according to an embodiment of the present invention;

[0020] Figure 2 This is a cross-sectional view of the transparent iridescent flexible circuit board according to an embodiment of the present invention;

[0021] Figure 3 This is a side view of a transparent iridescent flexible circuit board according to an embodiment of the present invention.

[0022] Explanation of icon numbers:

[0023] Substrate 100; First transparent substrate layer 110; Heat dissipation hole 111; Second transparent substrate layer 120; Light source layer 130; Light-emitting element 131; First hemispherical groove 140; Second hemispherical groove 150;

[0024] Control circuit board 200;

[0025] 300 light-blocking component. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0027] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0029] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0030] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0031] Flexible printed circuit boards (FPCs), also known as flexible circuit boards or simply "flexible boards" in the industry, are a new type of circuit board that integrates flexible electronics technology with dynamic optical effects. They can be freely bent, rolled, and folded. The circuit board can dynamically adjust the light-emitting elements through control circuits, such as brightness changes, color gradients, and flicker frequency adjustments, thereby creating diverse iridescent effects. Traditional circuit boards typically use an adhesive layer to completely encapsulate the light source layer for fixation, but this suffers from problems such as uneven adhesive filling leading to LED misalignment and interlayer thermal expansion differences causing delamination, resulting in image distortion and affecting visual effects.

[0032] Therefore, such as Figures 1 to 3 As shown, the transparent iridescent flexible circuit board proposed in this utility model includes: a substrate 100 and a control circuit board 200. The substrate 100 has a regular rectangular structure and includes a first transparent substrate layer 110, a second transparent substrate layer 120, and a light source layer 130. The light source layer 130 has multiple light-emitting elements 131 arranged in an array. The first transparent substrate layer 110 is provided with a first hemispherical groove 140, and the second transparent substrate layer 120 is provided with a second hemispherical groove 150. The first hemispherical groove 140 and the second hemispherical groove 150 have the same radius and together form a spherical groove. The light-emitting elements 131 are bidirectionally embedded in the hemispherical grooves on the first transparent substrate layer 110 and the second transparent substrate layer 120, forming a physical constraint, avoiding uneven filling of the colloid or displacement of the lamp beads during the colloid curing process, improving the positional accuracy of the lamp beads, and enhancing the display effect. The light-emitting elements 131 are simultaneously embedded in the first hemispherical groove 140 and the second hemispherical groove 150. A control circuit board 200 is disposed on one side of the first transparent substrate layer 110. The length of the control circuit board 200 is the same as the width of the substrate 100. The side of the substrate 100 and the sidewall of the control cable board transition smoothly, resulting in a natural and aesthetically pleasing appearance. The control circuit board 200 is used to control the on and off of the light-emitting element 131. Simultaneously, the first transparent substrate layer 110 and the second transparent substrate layer 120 assist in the uniform transmission of light, achieving efficient light conduction and diffusion, and improving display uniformity and brightness consistency.

[0033] In some embodiments of this utility model, such as Figure 2As shown, the radius of the first hemispherical groove 140 is equal to the radius of the second hemispherical groove 150. The light-emitting element 131 is an LED bead. The difference between the radius of the first hemispherical groove 140 (140) and the radius of the LED bead is A, where 0.05mm≤A≤0.1mm. This ensures that the LED bead has sufficient physical restraint when embedded in the spherical groove, while also preventing damage to the bead due to excessive compression.

[0034] In some embodiments of this utility model, the light-emitting element 131 has a rectangular cross-section. A first transparent substrate layer 110 is provided with a first groove, and a second transparent substrate layer 120 is provided with a second groove. The first and second grooves are the same size, and their cross-sections are rectangular, together enclosing the light-emitting element 131. The light-emitting element 131 is bidirectionally embedded in the grooves on the first and second transparent substrate layers 110 and 120, forming a physical constraint. This avoids uneven filling of the colloid or displacement of the LED beads during the colloid curing process, improving the positional accuracy of the LED beads and enhancing the display effect.

[0035] In some embodiments of this utility model, such as Figure 2 As shown, a heat dissipation hole 111 is formed on the second transparent substrate layer 120. The heat dissipation hole 111 penetrates the second transparent substrate layer 120 and communicates with the second hemispherical groove 150. The heat generated by the lamp bead during operation can be directly conducted outward through the heat dissipation hole 111, avoiding softening of the substrate 100 or aging of the colloid caused by local overheating, and extending the service life of the substrate 100.

[0036] In some embodiments of this utility model, a first transparent adhesive layer is disposed between the first transparent substrate layer 110 and the light source layer 130, and a second transparent adhesive layer is disposed between the second transparent substrate layer 120 and the light source layer 130. The first transparent substrate layer 110, the second transparent substrate layer 120, and the light source layer 130 are all connected by compression bonding. The first and second transparent adhesive layers can be optically transparent adhesives such as acrylic resin, silicone, epoxy resin, and PU adhesive, which have certain optical transparency, bonding strength, and temperature stability, ensuring a stable connection between the first transparent substrate layer 110, the second transparent substrate layer 120, and the light source layer 130.

[0037] In some embodiments of this utility model, such as Figure 1 As shown, a light-shielding member 300 is provided on the sidewall of the substrate 100. The light-shielding member 300 can be black ink, light-shielding tape, or metal foil. Light from the transparent substrate 100 may be refracted through the sidewall, and the light-shielding member 300 can absorb or block the side-leaking light to improve the visual display effect.

[0038] In some embodiments of this utility model, such as Figure 3As shown, the thickness of substrate 100 is A, where 5mm ≤ A ≤ 50mm. The thinner 5mm substrate 100 has higher light transmittance and is suitable for displays with high transparency requirements; although the light transmittance of the 50mm substrate 100 is slightly lower, it can diffuse light more evenly and reduce glare.

[0039] In some embodiments of this invention, both the first transparent substrate layer 110 and the second transparent substrate layer 120 are flexible and transparent PI or PET materials. PET and PI have high light transmittance, and both can reduce light reflection and improve light efficiency. Furthermore, they have good weather resistance, can operate stably in environments ranging from -40℃ to 150℃, and have excellent processability, allowing for mass production through coating, lamination, and other processes to meet the requirements of flexible circuit boards.

[0040] In some embodiments of this invention (not shown in the figures), the light source layer 130 further includes metal circuitry. The metal circuitry can be made of copper, silver nanowires, copper alloys, or indium tin oxide, and has a mesh-like perforated structure. The light-emitting element 131 is connected to the mesh nodes of the metal circuitry. The metal circuitry is attached to the second transparent substrate layer 120 using conventional etching methods. The mesh structure is almost invisible at a distance, which is beneficial for achieving the effect of "invisible circuitry." Furthermore, the perforated structure disperses the stress generated when the circuitry is bent along the mesh edges, reducing the risk of cracking and improving the stability of the circuit board.

[0041] In some embodiments of this invention (not shown in the figures), the thickness of the metal circuit is B, where 5µm ≤ B ≤ 40µm. A 5µm thick metal circuit has a lower sheet resistance, suitable for low-current scenarios; a 40µm thick metal circuit has a higher sheet resistance, can carry high current, and can also effectively reduce the LED junction temperature. The thickness of the metal circuit can be flexibly changed according to usage requirements to ensure performance needs in different scenarios.

[0042] In some embodiments of this utility model, such as Figures 1 to 3 As shown, both the first transparent substrate layer 110 and the second transparent substrate layer 120 are rectangular structures. On the projection of the substrate 100 in the thickness direction, the projected area of ​​the second transparent substrate layer 120 includes the projected area of ​​the first transparent substrate layer 110 to form a mounting area. The control circuit board 200 is a conventional circuit board. The control circuit board 200 is pressed and mounted in the mounting area. The control circuit board 200 is connected to the metal circuit, thereby realizing the connection between the control circuit board 200 and the LED beads.

[0043] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A transparent, iridescent flexible circuit board, characterized in that, include: The substrate includes a first transparent substrate layer, a second transparent substrate layer, and a light source layer. The light source layer has multiple light-emitting elements arranged in an array. The first transparent substrate layer is provided with a first hemispherical groove, and the second transparent substrate layer is provided with a second hemispherical groove. The light-emitting elements are simultaneously embedded in the first hemispherical groove and the second hemispherical groove. A control circuit board is disposed on one side of the first transparent substrate layer, and the control circuit board is used to control the turning on and off of the light-emitting element.

2. The transparent iridescent flexible circuit board according to claim 1, characterized in that: The radius of the first hemispherical groove is equal to the radius of the second hemispherical groove. The light-emitting element is an LED lamp bead. The difference between the radius of the first hemispherical groove and the radius of the LED lamp bead is A, where 0.05mm≤A≤0.1mm.

3. The transparent iridescent flexible circuit board according to claim 2, characterized in that: The second transparent substrate layer has heat dissipation holes, which are connected to the second hemispherical groove.

4. The transparent iridescent flexible circuit board according to claim 1, characterized in that: A first transparent adhesive layer is disposed between the first transparent substrate layer and the light source layer, and a second transparent adhesive layer is disposed between the second transparent substrate layer and the light source layer. The first transparent substrate layer, the second transparent substrate layer and the light source layer are all connected by pressing.

5. The transparent iridescent flexible circuit board according to claim 1, characterized in that: The sidewall of the substrate is provided with a light-shielding element.

6. The transparent iridescent flexible circuit board according to claim 1, characterized in that: The thickness of the substrate is A, where 5mm ≤ A ≤ 50mm.

7. The transparent iridescent flexible circuit board according to claim 1, characterized in that: Both the first transparent substrate layer and the second transparent substrate layer are flexible and transparent PI or PET parts.

8. The transparent iridescent flexible circuit board according to claim 1, characterized in that: The light source layer also includes metal circuits, which have a grid-like hollow structure, and the light-emitting element is connected to the grid nodes of the metal circuits.

9. The transparent iridescent flexible circuit board according to claim 8, characterized in that: The thickness of the metal line is B, where 5um ≤ B ≤ 40um.

10. The transparent iridescent flexible circuit board according to claim 1, characterized in that: Both the first transparent substrate layer and the second transparent substrate layer have rectangular structures. The projected area of ​​the second transparent substrate layer includes the projected area of ​​the first transparent substrate layer in the thickness direction of the substrate, so as to form a mounting area. The control circuit board is pressed and mounted in the mounting area.

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