heat sink
By designing a heat sink made of phonon thermal conductive material, using a body with decreasing cross-sectional area and a low thermal conductivity attachment layer, the problem of component damage caused by bidirectional heat conduction was solved, unidirectional heat conduction was achieved, and heat dissipation efficiency and equipment stability were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUZHOU UNIVERSITY
- Filing Date
- 2025-05-13
- Publication Date
- 2026-06-19
AI Technical Summary
Most existing heat dissipation products are bidirectional heat conduction products, which cause heat to be transferred into the electronic products when the external ambient temperature is too high, resulting in damage to components and inconvenience in use.
Design a heat sink that uses a body made of phonon thermally conductive material with a cross-sectional area decreasing from the large end to the small end, and is wrapped with an adhesive layer with low thermal conductivity on the outer surface to achieve unidirectional heat transfer and ensure that heat is transferred from the high temperature region to the low temperature region.
It achieves unidirectional heat conduction, preventing heat transfer from the outside high temperature to the inside, improving the heat dissipation efficiency and performance stability of the equipment, and reducing energy waste.
Smart Images
Figure CN224385930U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology, and in particular to a unidirectional heat sink. Background Technology
[0002] As electronic products become more powerful and complex, heat dissipation has become a key factor limiting their performance. Most existing heat dissipation products are bidirectional heat conductors. During the use of electronic products, when the ambient temperature is too high, the heat dissipation products often transfer heat into the internal components of the electronic products, which can easily damage components and cause inconvenience. Summary of the Invention
[0003] Based on this, this application provides a heat sink that enables unidirectional heat transfer, preventing heat transfer into the electronic product when the ambient temperature is too high.
[0004] A heat sink includes a body made of a phonon thermally conductive material, the body having opposing first and second ends, the second end of the body being for contacting a heat-dissipating device, the cross-sectional area of the first end being larger than the cross-sectional area of the second end, and the cross-sectional area of the body decreasing from the first end to the second end.
[0005] In one embodiment, the body has an interior cavity with a cross-sectional area decreasing from a first end to a second end; or, the body has an interior cavity with a cross-sectional area decreasing from a first end to a second end, and the cavity is filled with a filler having a thermal conductivity lower than that of the body.
[0006] In one embodiment, the outer surface of the body from the first end to the second end is provided with an adhesion layer, the thermal conductivity of the adhesion layer being less than that of the body.
[0007] In one embodiment, the adhesion layer is a filling adhesive or a thermal insulation paint.
[0008] In one embodiment, the body is conical, frustum-shaped, pyramidal, or frustum-shaped; or the body is composed of multiple cylinders with successively decreasing diameters connected together.
[0009] In one embodiment, the end face of the first end of the body is parallel to the end face of the second end; and / or, the heat sink further includes a pad, through which the second end of the body contacts the heat-dissipating device.
[0010] In one embodiment, the heat sink further includes a first base plate with thermal conductivity no greater than that of the main body. The main body includes a plurality of main bodies, a first end of which is connected to the first base plate. The plurality of main bodies and the first base plate are integrally formed to constitute a first heat dissipation assembly.
[0011] Alternatively, the heat sink may further include a first base plate with thermal conductivity no greater than that of the main body and a mounting plate with thermal conductivity no less than that of the main body. The main body may include multiple components, with a first end of the main body connected to the first base plate and a second end of the main body connected to the mounting plate. The multiple first base plates, the main body, and the mounting plate are integrally formed to constitute a first heat sink assembly.
[0012] In one embodiment, the first heat dissipation component includes a plurality of first heat dissipation components, which are stacked in the same orientation, and the second end of the outermost first heat dissipation component is used to contact the heat-dissipating device.
[0013] In one embodiment, the heat sink further includes a second base plate, the thermal conductivity of the second base plate being less than that of the main body, the main body comprising a plurality of recesses, the second base plate having a plurality of recesses matching the shape of the main body and the recesses having the same orientation, the main body being disposed in the recesses one by one to form a second heat dissipation assembly.
[0014] In one embodiment, the second heat dissipation component includes a plurality of second heat dissipation components, which are stacked in the same orientation, and the second end of the outermost second heat dissipation component is used to contact the heat-dissipating device.
[0015] In this heat sink application, during use, the second end with the smaller cross-sectional area of the main body contacts the heat-dissipating device. The heat generated by the heat-dissipating device is conducted to the main body. Since solid heat conduction is mainly caused by phonon propagation, the higher the temperature, the more intense the lattice vibration. The transmission of lattice vibration leads to heat transfer. Lattice vibration in a crystal generates mechanical waves. When the wavelength is close to the lattice period, this mechanical wave is called a phonon. The transmission characteristics of phonons follow the wave propagation law. Waves in an independent object generally tend to move and concentrate towards the tip (the end of the geometric shape). Phonon heat conduction exhibits different heat conduction efficiencies in specific directions. Experiments have shown that by setting the cross-sectional area of the first end of the main body to be larger than that of the second end, and by decreasing the cross-sectional area of the main body from the first end to the second end, heat is mainly transferred from the second end to the first end. Restricting heat transfer in the opposite direction can basically achieve unidirectional heat conduction, preventing heat transfer into the electronic product when the external ambient temperature is too high. This maintains a temperature difference, ensuring that heat can only be transferred from the high-temperature area to the low-temperature area, improving the heat dissipation efficiency and performance stability of the device, and reducing energy waste. Attached Figure Description
[0016] The above and other objects, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the present disclosure are illustrated by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein:
[0017] Figure 1 This is a perspective view of the heat sink in the first embodiment;
[0018] Figure 2 This is a perspective view of the heat sink in the second embodiment;
[0019] Figure 3 This is a perspective view of the heat sink in the third embodiment;
[0020] Figure 4 This is a perspective view of the heat sink in the fourth embodiment;
[0021] Figure 5 This is a perspective view of the heat sink in the fifth embodiment;
[0022] Figure 6 This is a perspective view of the heat sink in the sixth embodiment;
[0023] Figure 7 This is a cross-sectional schematic diagram of a heat sink according to an embodiment of this application;
[0024] Figure 8 This is a cross-sectional schematic diagram of a heat sink according to another embodiment of this application;
[0025] Figure 9 This is a cross-sectional schematic diagram of a heat sink according to another embodiment of this application.
[0026] The attached figures are labeled as follows:
[0027] 10. Body; 110. First end; 120. Second end; 20. First base plate; 30. Second base plate; 40. Mounting plate; 50. Filler. Detailed Implementation
[0028] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0029] The specific embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.
[0030] Reference Figure 1-6One embodiment of this application provides a heat sink, including a body 10 made of a phonon thermally conductive material such as hexagonal boron nitride (h-BN), diamond, silicon (Si), germanium (Ge), or boron nitride nanosheets (BNNS). The body 10 has a first end 110 and a second end 120 opposite to each other. The second end 120 of the body 10 is used to contact a heat-dissipating device. The cross-sectional area of the first end 110 is larger than that of the second end 120, and the cross-sectional area of the body 10 decreases from the first end 110 to the second end 120. The second end 120 can be point-shaped or planar, and the longitudinal cross-section of the body 10 can be conical, trapezoidal, etc., as long as the first end 110 with a larger cross-section of the body 10 is connected to the second end 120 with a smaller cross-sectional area in a decreasing manner. For example, the body 10 is conical, frustum-shaped, pyramidal, or frustum-shaped, or the body 10 is composed of multiple cylinders with successively decreasing diameters connected together, with adjacent cylinders bonded together using a high thermal conductivity material to ensure good contact between the surfaces of each segment.
[0031] Traditional heat conduction follows the fundamental law of heat conduction, which states that the amount of heat passing through a given cross-section per unit time is proportional to the rate of temperature change perpendicular to that interface and the cross-sectional area. Unidirectional heat conduction further restricts the direction of heat transfer, achieving unidirectional heat flow. Compared to heat sinks that primarily rely on convection, the heat sink in this embodiment primarily uses phonon conduction for heat transfer. Its performance is determined by its internal structure and is unaffected by the external environment. Experimental testing revealed that the structure of the heat sink in this embodiment allows for better heat transfer from the second end 120 to the first end 110, while restricting heat transfer in the opposite direction, thus essentially achieving unidirectional heat conduction.
[0032] In this embodiment, during use, the second end 120 of the body 10, with the smaller cross-sectional area, contacts the heat-dissipating device, and the heat generated by the heat-dissipating device is conducted to the body 10. Since solid-state heat conduction is primarily caused by phonon propagation, the higher the temperature, the more intense the lattice vibration. The transmission of lattice vibration leads to heat transfer. Lattice vibration in a crystal generates mechanical waves. When the wavelength is close to the lattice period, this mechanical wave is called a phonon. The transmission characteristics of phonons follow the laws of wave propagation; waves in an independent object tend to concentrate towards the tip (the end of the geometric shape). Phonon heat conduction exhibits different heat conduction efficiencies in specific directions. Experimental testing revealed that by setting the cross-sectional area of the first end 110 of the body 10 to be larger than that of the second end 120, and by decreasing the cross-sectional area of the body 10 from the first end 110 to the second end 120, heat is mainly transferred from the second end 120 to the first end 110. Restricting heat transfer in the opposite direction essentially achieves unidirectional heat conduction, thereby maintaining a temperature difference and ensuring that heat can only be transferred from the high-temperature region to the low-temperature region, improving the heat dissipation efficiency and performance stability of the equipment, and reducing energy waste.
[0033] In one embodiment, the interior of the body 10 is hollow. Experimental tests have shown that a hollow body 10 provides better unidirectional heat conduction.
[0034] In one embodiment, the surface of the body 10 from the first end 110 to the second end 120 is provided with an adhesion layer, the thermal conductivity of which is lower than that of the body 10. By wrapping the outer surface of the body 10 with an adhesion layer of low thermal conductivity, external heat is prevented from being conducted to the body 10, thus better ensuring unidirectional heat transfer. The adhesion layer can be made of a heat-insulating material. Optionally, the adhesion layer is a potting adhesive or a heat-insulating paint; the wrapping method is to use a potting adhesive with low thermal conductivity or to apply a heat-insulating paint.
[0035] In one embodiment, the end face of the first end 110 of the body 10 is parallel to the end face of the second end 120. By setting the upper and lower end faces parallel, it is easier to install the heat sink.
[0036] First Embodiment
[0037] Reference Figure 1 In this embodiment, the heat sink includes a first base plate 20 and a plurality of bodies 10. The first end 110 of each body 10 is connected to the first base plate 20, and the plurality of bodies 10 are integrally formed with the first base plate 20 to constitute a first heat dissipation assembly. In this embodiment, the first base plate 20 may be made of the same heat dissipation material as the body 10 or a material with thermal conductivity no better than that of the body 10, so that heat can be better conducted from the second end 120 to the first end 110 and the first base plate 20.
[0038] Second Embodiment
[0039] Reference Figure 2 In this embodiment, the heat sink includes multiple first heat dissipation components as in the first embodiment, which are stacked in the same orientation. It can be understood that in two adjacent first heat dissipation components, the second end 120 of one first heat dissipation component is adjacent to or in contact with the first end 110 of the other first heat dissipation component. The second end 120 of the outermost first heat dissipation component is used to contact the heat-dissipating device. Experimental verification revealed that the heat sink has multiple layers of special structures stacked inside. For example, the heat sink in this embodiment consists of two layers of special structures stacked together. The thermal conductivity from the tip to the bottom of the internal structure is enhanced, which exacerbates the unidirectional heat conduction phenomenon.
[0040] Third Embodiment
[0041] Reference Figure 3The difference between this embodiment and the first or second embodiment is that the body 10 in this embodiment is hollow. The body 10 has an internal cavity, and the cross-sectional area of the cavity decreases from the first end 110 to the second end 120. Experimental testing shows that the hollow body 10 has better unidirectional heat conduction. Optionally, refer to... Figure 8 In other embodiments, the cavity is filled with a filler 50 whose thermal conductivity is lower than that of the body 10. The body 10 can be filled with fillers 50 having the same tip shape, or it can even be made into a cavity. When the thermal conductivity of the body 10 is better than that of the first base plate 20 and the filler 50, the heat sink as a whole still has unidirectional heat conduction characteristics.
[0042] Fourth embodiment
[0043] Reference Figure 4 The difference between this embodiment and the previous embodiment is that the heat sink in this embodiment further includes a mounting plate 40. The second end 120 of the body 10 is connected to the mounting plate 40, and the thermal conductivity of the mounting plate 40 is not less than that of the body 10. This arrangement facilitates contact between the mounting plate 40 and the heat dissipation device, ensuring unidirectional heat transfer from the second end 120 of the body 10 to the first end 110.
[0044] Fifth embodiment
[0045] Reference Figure 5 , Figure 7 The heat sink in this embodiment includes a second base plate 30 and a plurality of bodies 10. The thermal conductivity of the second base plate 30 is lower than that of the bodies 10. The second base plate 30 has a plurality of recesses that match the shape of the bodies 10 and the recesses face the same direction. This can be understood as the recesses all being configured with their pointed ends facing down. The bodies 10 are correspondingly disposed within the recesses to form a second heat dissipation assembly.
[0046] Based on the wave transmission characteristics, reasoning and experimentation were conducted. It was found through experiments that when the internal structure of the solid presents a funnel-like shape, narrow at the top and wide at the bottom, such as the tip shape of the body 10 in this embodiment, and the second base plate 30 is filled with other materials, when the thermal conductivity of the body 10 is better than that of the second base plate 30, the heat sink exhibits different thermal conduction efficiencies in a specific direction. The internal structure of the body 10 makes the heat sink in this embodiment have better thermal conductivity from the tip (the second end 120 of the body 10) to the bottom (the first end 110 of the body 10), and the opposite is true in the opposite direction.
[0047] Optionally, refer to Figure 8 The main body 10 can be configured as a hollow shape as in the third embodiment.
[0048] Sixth Embodiment
[0049] Reference Figure 6 , Figure 9 In this embodiment, the heat sink includes multiple second heat dissipation components as in the fifth embodiment, which are stacked in the same orientation. It can be understood that in two adjacent second heat dissipation components, the second end 120 of one second heat dissipation component is adjacent to or in contact with the first end 110 of the other second heat dissipation component. The second end 120 of the outermost second heat dissipation component is used to contact the heat-dissipating device. Experimental verification revealed that the heat sink has multiple layers of special structures stacked inside. For example, the heat sink in this embodiment consists of two layers of special structures stacked together, which enhances the thermal conductivity from the bottom to the tip of the internal structure, thus exacerbating the unidirectional heat conduction phenomenon.
[0050] Optionally, refer to Figure 8 In this embodiment, the body 10 can be configured as a hollow shape as in the third embodiment.
[0051] Furthermore, the heat sink in any of the above embodiments also includes a pad, and the second end 120 of the body 10 contacts the heat-dissipating device through the pad. The second end 120 of the heat sink with a small cross-section is mounted on the pad, and the pad is in contact with the heat-dissipating device. The heat generated by the heat-dissipating device is conducted through the pad to the second end 120 of the body 10, and then from the second end 120 to the first end 110, dissipating in a unidirectional manner.
[0052] In the foregoing description of this specification, unless otherwise expressly specified and limited, the terms "fixed," "installed," "connected," or "linked" should be interpreted broadly. For example, the term "linked" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; or it can refer to the internal communication of two components or the interaction between two components. Therefore, unless otherwise expressly limited in this specification, those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0053] Based on the above description in this specification, those skilled in the art will also understand that the following terms used, such as "upper," "lower," "front," "rear," "left," "right," "length," "width," "thickness," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," "center," "longitudinal," "transverse," "clockwise," or "counterclockwise," are terms indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings of this specification. They are only for the purpose of facilitating the explanation of the present application and simplifying the description, and do not explicitly or implicitly suggest that the device or element involved must have the specific orientation, or be constructed and operated in a specific orientation. Therefore, the above-mentioned orientation or positional relationship terms should not be understood or interpreted as limitations on the present application.
[0054] Furthermore, the terms "first" or "second," etc., used in this specification to refer to numbers or ordinal numbers are for descriptive purposes only and should not be construed as indicating, explicitly or implicitly, relative importance or specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this specification, "a plurality of" means at least two, such as two, three, or more, unless otherwise explicitly specified.
[0055] While this specification has shown and described numerous embodiments of the present application, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Many modifications, alterations, and alternatives will occur to those skilled in the art without departing from the spirit and intent of the present application. It should be understood that various alternatives to the embodiments of the present application described herein may be employed in the practice of this application. The appended claims are intended to define the scope of protection of this application and therefore cover modular compositions, equivalents, or alternatives within the scope of these claims.
Claims
1. A heat sink, characterized by, The body comprises a body made of a phonon thermally conductive material, the body having opposing first and second ends, the second end of the body being used to contact a heat-generating device, the cross-sectional area of the first end being larger than the cross-sectional area of the second end, and the cross-sectional area of the body decreasing from the first end to the second end.
2. The radiator according to claim 1, characterized in that, The body has an internal cavity, the cross-sectional area of which decreases from the first end to the second end; or, the body has an internal cavity, the cross-sectional area of which decreases from the first end to the second end, and the cavity is filled with a filler with a thermal conductivity lower than that of the body.
3. The radiator according to claim 1 or 2, characterized in that, The outer surface of the body from the first end to the second end is provided with an adhesion layer, and the thermal conductivity of the adhesion layer is less than that of the body.
4. The heat sink of claim 3, wherein, The adhesive layer is either potting adhesive or thermal insulation paint.
5. The heat sink of claim 3, wherein, The body is conical, frustum-shaped, pyramidal, or frustum-shaped; or the body is composed of multiple cylinders with successively decreasing diameters connected together.
6. The heat sink of claim 1 or 2, wherein, The end face of the first end of the body is parallel to the end face of the second end; and / or, the heat sink further includes a pad, and the second end of the body contacts the heat-dissipating device through the pad.
7. The heat sink of claim 1 or 2, wherein, It also includes a first base plate with thermal conductivity no greater than that of the main body. The main body includes multiple bodies, and a first end of the main body is connected to the first base plate. The multiple bodies and the first base plate are integrally formed to constitute a first heat dissipation assembly. Alternatively, the heat sink may further include a first base plate with thermal conductivity no greater than that of the main body and a mounting plate with thermal conductivity no less than that of the main body. The main body may include multiple components, with a first end of the main body connected to the first base plate and a second end of the main body connected to the mounting plate. The multiple first base plates, the main body, and the mounting plate are integrally formed to constitute a first heat sink assembly.
8. The heat sink of claim 7, wherein, The first heat dissipation component includes multiple components, which are stacked in the same orientation, and the second end of the outermost first heat dissipation component is used to contact the heat-dissipating device.
9. The radiator according to claim 1 or 2, characterized in that, It also includes a second base plate, the thermal conductivity of which is less than that of the main body. The main body includes multiple components, and the second base plate has multiple recesses that match the shape of the main body and the recesses face the same direction. The main body is disposed in the recesses one by one to form a second heat dissipation component.
10. The heat spreader of claim 9, wherein, The second heat dissipation component includes multiple components, which are stacked in the same orientation, and the second end of the outermost second heat dissipation component is used to contact the heat-dissipating device.