A water-cooled heat dissipation assembly, a water-cooled heat dissipation system and a grid-constructed energy storage system

Abstract

This utility model discloses a water-cooled heat dissipation component, a water-cooled heat dissipation system, and a grid-type energy storage system, relating to the field of power electronics technology. The key technical points are: the water-cooled heat dissipation component includes a water-cooled plate and a first pipe and a second pipe arranged on the water-cooled plate; wherein the first pipe is used for heat dissipation of the power module, and the second pipe is used for heat dissipation of the control module; both the first and second pipes have an outlet and an inlet; wherein the outlet of the first pipe is connected to the inlet of the second pipe, the inlet of the first pipe is used for water intake, and the outlet of the second pipe is used for water return; at least one connecting pipe is provided between the first and second pipes to reduce heat accumulation caused by the connection between the first and second pipes. This utility model solves the problem of insufficient heat dissipation efficiency in traditional air-cooled grid-type energy storage systems.

Description

Technical Field

[0001] This utility model relates to the field of power electronics technology, and more specifically, it relates to a water-cooled heat dissipation component, a water-cooled heat dissipation system, and a grid-type energy storage system. Background Technology

[0002] A grid-type energy storage converter system (PCS) integrating a water-cooled heat dissipation system and a virtual synchronous generator (VSG) control strategy is suitable for high power density energy storage scenarios, including renewable energy power generation bases, distributed microgrids, island independent power supply systems, and grid fault recovery.

[0003] Currently, the heat dissipation method of traditional air-cooled grid-type energy storage systems mainly relies on air cooling, which depends on air convection. The heat dissipation efficiency is only 1 / 10 of that of water cooling (for example, under the same power, the temperature rise of the air-cooled module is 45 degrees Celsius, while the temperature rise of the water-cooled module is only 5 degrees Celsius). Due to the low heat dissipation efficiency of air cooling, the lifespan of power semiconductor devices in grid-type energy storage systems is shortened. Utility Model Content

[0004] The purpose of this invention is to provide a water-cooled heat dissipation component, a water-cooled heat dissipation system, and a grid-type energy storage system, which solves the problem of insufficient heat dissipation efficiency in traditional air-cooled grid-type energy storage systems.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0006] In a first aspect, this utility model provides a water-cooled heat dissipation assembly for dissipating heat from a power semiconductor module including a power module and a control module. The water-cooled heat dissipation assembly includes a water-cooled plate and a first pipe and a second pipe disposed on the water-cooled plate. The first pipe is used to dissipate heat from the power module, and the second pipe is used to dissipate heat from the control module.

[0007] Both the first pipeline and the second pipeline have an outlet and an inlet; wherein, the outlet of the first pipeline is connected to the inlet of the second pipeline, the inlet of the first pipeline is used for water intake, and the outlet of the second pipeline is used for water return.

[0008] At least one connecting pipe is provided between the first pipe and the second pipe to reduce heat accumulation caused by the connection between the first pipe and the second pipe.

[0009] In one implementation, both the first and second pipelines are spiral-shaped.

[0010] In one implementation, the height of the first pipeline is lower than that of the second pipeline, so that the first pipeline and the second pipeline form a staggered spatial distribution.

[0011] In one implementation, the outlet of the first pipeline and the inlet of the second pipeline are integrally formed or connected by a sealing ring.

[0012] In one implementation, the number of water loops in the first and second pipelines can be adjusted according to the heat dissipation requirements of the power semiconductor module.

[0013] In one implementation, the spacing between each loop of water in the first and second pipelines is consistent.

[0014] In one implementation, both the inlet of the first pipeline and the outlet of the second pipeline are equipped with sealing rings for installation and fixation.

[0015] In one implementation, the first pipeline and the second pipeline are arranged asymmetrically on the water-cooled plate.

[0016] A second aspect of this utility model provides a water-cooled heat dissipation system, including a plurality of water-cooled heat dissipation components as provided in the first aspect of this utility model.

[0017] A third aspect of this utility model provides a grid-type energy storage system, including a water-cooled heat dissipation system as provided in the second aspect of this utility model, multiple power semiconductor modules, and a capacitor bank; wherein, each power semiconductor module is configured with a water-cooled heat dissipation component.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The present invention provides a water-cooled heat dissipation component that uses a series-parallel combination of pipes. The parallel pipes can reduce the heat accumulation caused by the series pipes. In addition, the first and second pipes are staggered vertically to reduce temperature superposition and improve heat dissipation efficiency, thereby solving the problem of insufficient heat dissipation efficiency of traditional air-cooled grid-type energy storage systems. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0021] Figure 1 A schematic diagram of the structure of a water-cooled heat dissipation component provided in an embodiment of this utility model;

[0022] Figure 2 This is a schematic diagram of a grid-type energy storage system provided in an embodiment of the present invention.

[0023] The attached diagram shows the markings and corresponding component names:

[0024] 1. Water-cooled plate; 2. Second pipeline; 3. First pipeline; 4. Connecting pipeline; 5. Water inlet of the first pipeline; 6. Water outlet of the second pipeline. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model.

[0026] It should be noted that the terms "comprising" or "may include" used in the various embodiments of this application indicate the presence of the claimed function, operation, or element, and do not limit the addition of one or more functions, operations, or elements. Furthermore, as used in the various embodiments of this application, the terms "comprising," "having," and their cognates are intended only to indicate a specific feature, number, step, operation, element, component, or combination of the foregoing, and should not be construed as primarily excluding the presence of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing, or adding one or more combinations of the foregoing.

[0027] It should be understood that terms such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a water-cooled heat dissipation component provided in an embodiment of the present invention. This heat dissipation component is used to dissipate heat from a power semiconductor module including a power module and a control module. Figure 1 As shown, the water-cooled heat dissipation assembly includes a water-cooled plate 1 and a first pipe 3 and a second pipe 2 arranged on the water-cooled plate 1; wherein, the first pipe 3 is used to dissipate heat from the power module and the second pipe 2 is used to dissipate heat from the control module.

[0029] Both the first pipe 3 and the second pipe 2 have an outlet and an inlet; wherein, the outlet of the first pipe 3 is connected to the inlet of the second pipe 2, the inlet of the first pipe 3 is used for water intake, and the outlet of the second pipe 2 is used for water return.

[0030] At least one connecting pipe 4 is provided between the first pipe 3 and the second pipe 2 to reduce the heat accumulation caused by the connection between the first pipe 3 and the second pipe 2.

[0031] In this embodiment, the water-cooled heat dissipation component includes a water-cooled plate 1 and a first pipe 3 and a second pipe 2 arranged on the water-cooled plate 1. The function of the water-cooled plate 1 is to provide a carrier for the installation of the second pipe 2. The first pipe 3 and the second pipe 2 are connected in series, so that the coolant enters from the inlet of the first pipe 3 and flows into the inlet of the second pipe 2 from the outlet of the first pipe 3, realizing the circulation of coolant in the two pipes, thereby improving the flow uniformity of the two pipes and improving the heat dissipation efficiency of the power semiconductor module.

[0032] Secondly, at least one connecting pipe 4 is provided between the first pipe 3 and the second pipe 2. This connecting pipe 4 is essentially connected in parallel between the first pipe 3 and the second pipe 2. The purpose of this arrangement in this embodiment is to take into account that the first pipe 3 is used for heat dissipation of the power module and the second pipe 2 is used for heat dissipation of the control module. As is common knowledge to those skilled in the art, the heat generated by the power module is higher than that of the control module. Therefore, in this embodiment, at least one connecting pipe 4 is provided between the first pipe 3 and the second pipe 2. When the power module is under high load, the coolant that has undergone heat exchange can flow directly into the first pipe 3 through the connecting pipe 4, thereby quickly removing heat and reducing the temperature of the power module.

[0033] As can be seen, the water-cooled heat dissipation component provided by this utility model adopts a series-parallel combination of pipes. The parallel pipes can reduce the heat accumulation caused by the series pipes. Secondly, the first pipe 3 and the second pipe 2 are staggered vertically in space, which reduces the temperature superposition and improves the heat dissipation efficiency. This solves the problem of insufficient heat dissipation efficiency of traditional air-cooled grid-type energy storage systems.

[0034] Secondly, it should be noted that both the first pipe 3 and the second pipe 2 are spiral-shaped. The spiral shape of the cooling water pipes has the following advantages: The spiral shape allows for a longer pipe length within the same spatial range, significantly increasing the contact area between the pipe and the coolant, which is beneficial for heat transfer and dissipation. The spiral shape alters the flow state of the coolant, creating strong turbulence within the pipe. In turbulent flow, water molecules move more violently and randomly, breaking the boundary layer and increasing the chances of contact and collision between the water and the pipe wall, thereby improving heat transfer efficiency and allowing heat to dissipate from the pipe more quickly.

[0035] Spiral water pipes can be wound and arranged in multiple layers within a limited space to achieve a compact spatial layout and effectively utilize the internal space of the equipment. For example, in a grid-type energy storage system, spiral water pipes can be tightly fitted around the heat-generating power modules, making full use of the limited internal space for heat dissipation without occupying too much additional space.

[0036] Finally, the spiral shape of the water pipes lengthens the path of the coolant within the pipes, increasing its residence time and allowing for more efficient heat absorption and dissipation. This ensures sufficient time for heat exchange during the coolant's journey through the pipes, resulting in better cooling performance. The spiral structure also ensures more even heat distribution around the pipes, preventing localized overheating or uneven heat dissipation.

[0037] In some embodiments, the height of the first pipe 3 is lower than that of the second pipe 2, so that the first pipe 3 and the second pipe 2 form a staggered spatial distribution.

[0038] Specifically, the first pipe 3 is positioned at a lower level on the cooling plate than the second pipe 2. This arrangement aims to stagger the water channels and reduce heat accumulation.

[0039] In some embodiments, the outlet of the first pipe 3 and the inlet of the second pipe 2 are integrally formed or connected by a sealing ring.

[0040] Specifically, this embodiment includes two methods for connecting the first pipe 3 and the second pipe 2: one-piece molding and sealing ring connection. Both of these are common pipe connection methods, and will not be described in detail in this embodiment. However, it should be noted that the advantage of the sealing ring connection method is that if one part of the two pipes is damaged, the damaged part can be replaced, while the undamaged part can continue to be used, thus saving maintenance costs. Of course, the one-piece molding method also avoids heat loss at the connection point, which can slightly improve heat dissipation efficiency.

[0041] In some embodiments, the number of water loops in the first pipe 3 and the second pipe 2 can be adjusted according to the heat dissipation requirements of the power semiconductor module.

[0042] Specifically, setting the number of water loops is a conventional technique in this field. The more water loops there are, the more coolant flows in. This ensures that the power semiconductor module can maintain good heat dissipation efficiency even under high load, thus preventing the power semiconductor module from continuously operating under high temperature conditions and effectively improving the service life of the power semiconductor module.

[0043] In some embodiments, the spacing between each loop of the first pipe 3 and the second pipe 2 is consistent.

[0044] Specifically, consistent spacing between water channels ensures temperature uniformity. Uneven spacing can lead to heat buildup in localized areas, creating hotspots and impacting the performance and lifespan of the power module. A consistent spacing design allows heat to be transferred evenly from the power module to the coolant, preventing localized overheating and ensuring uniform temperature across all parts of the power module, maintaining optimal operating conditions. Therefore, uniform water channel spacing allows for smoother coolant flow within the pipes, reducing flow resistance and eddy currents. This ensures the coolant flows evenly through each loop, preventing uneven heat dissipation caused by excessively fast or slow flow rates in certain areas, thus improving overall heat dissipation.

[0045] In some embodiments, the inlet of the first pipe 3 and the outlet of the second pipe 2 are both equipped with sealing rings for installation and fixation.

[0046] Specifically, since the coolant circulates between the inlet of the first pipe 3 and the outlet of the second pipe 2 through the pump, it is necessary to use sealing rings to fix the inlet of the first pipe 3 and the outlet of the second pipe 2 at the two interfaces of the pump in order to complete the circulation of the coolant.

[0047] In some embodiments, the first pipe 3 and the second pipe 2 are arranged asymmetrically on the water-cooled plate 1.

[0048] Specifically, the first pipe 3 and the second pipe 2 have different flow directions. The first pipe 3 flows from right to left, while the second pipe 2 flows from left to right. The two sets of media flow in opposite directions, and the heat exchange efficiency is improved by adopting a counter-current heat exchange method.

[0049] This utility model embodiment also provides a water-cooled heat dissipation system, including a plurality of water-cooled heat dissipation components as described in the above embodiments.

[0050] Specifically, since this application is applied to the heat dissipation of grid-type energy storage systems, and a grid-type energy storage system generally contains multiple power semiconductor modules, while a water-cooling heat dissipation component only dissipates heat for one power semiconductor module, this embodiment provides a water-cooling heat dissipation system, including multiple water-cooling heat dissipation components as described in the above embodiment, which can complete the heat dissipation of the grid-type energy storage system.

[0051] like Figure 2 As shown in the figure, this utility model embodiment also provides a grid-type energy storage system, including a water-cooled heat dissipation system as described in the above embodiment, multiple power semiconductor modules and a capacitor bank; wherein, each power semiconductor module is configured with a water-cooled heat dissipation component.

[0052] In this embodiment, the present invention provides a grid-type energy storage system, which includes a water-cooled heat dissipation system composed of multiple water-cooled heat dissipation components. The water-cooled heat dissipation components adopt a series-parallel combination of pipes. The parallel pipes can reduce the heat accumulation caused by the series pipes. In addition, the first pipe 3 and the second pipe are staggered vertically in space to reduce temperature superposition and improve heat dissipation efficiency, thereby solving the problem of insufficient heat dissipation efficiency of traditional air-cooled grid-type energy storage systems.

[0053] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A water-cooled heat dissipation component for dissipating heat from a power semiconductor module including a power module and a control module, characterized in that, The water-cooled heat dissipation assembly includes a water-cooled plate and a first pipe and a second pipe arranged on the water-cooled plate; wherein, the first pipe is used to dissipate heat from the power module and the second pipe is used to dissipate heat from the control module. Both the first pipeline and the second pipeline have an outlet and an inlet; wherein, the outlet of the first pipeline is connected to the inlet of the second pipeline, the inlet of the first pipeline is used for water intake, and the outlet of the second pipeline is used for water return. At least one connecting pipe is provided between the first pipe and the second pipe to reduce the heat accumulation caused by the connection between the first pipe and the second pipe.

2. The water-cooled heat dissipation component according to claim 1, characterized in that, Both the first and second pipelines are spiral-shaped.

3. A water-cooled heat dissipation component according to claim 2, characterized in that, The height of the first pipeline is lower than that of the second pipeline, so that the first pipeline and the second pipeline form a staggered spatial distribution.

4. A water-cooled heat dissipation component according to claim 3, characterized in that, The outlet of the first pipeline and the inlet of the second pipeline are integrally formed or connected by a sealing ring.

5. A water-cooled heat dissipation component according to claim 1, characterized in that, The number of water loops in the first and second pipelines can be adjusted according to the heat dissipation requirements of the power semiconductor module.

6. A water-cooled heat dissipation component according to claim 5, characterized in that, The spacing between each loop of water in the first and second pipelines is consistent.

7. A water-cooled heat dissipation component according to claim 1, characterized in that, Both the inlet of the first pipeline and the outlet of the second pipeline are equipped with sealing rings for installation and fixation.

8. A water-cooled heat dissipation component according to claim 1, characterized in that, The first and second pipes are arranged asymmetrically on the water-cooled plate.

9. A water-cooled heat dissipation system, characterized in that, It includes a plurality of water-cooled heat dissipation components as described in any one of claims 1 to 8.

10. A grid-type energy storage system, characterized in that, It includes a water-cooled heat dissipation system as described in claim 9, multiple power semiconductor modules, and a capacitor bank; wherein each power semiconductor module is configured with a water-cooled heat dissipation component.

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