heat dissipating device

Abstract

This invention provides a heat dissipation device for connecting multiple heat-generating elements. The heat dissipation device includes a fin assembly, a vapor chamber, multiple connecting elements, and a fan. The fin assembly has multiple fins. The vapor chamber is connected to the fin assembly and includes a body and multiple protrusions. The body has a surface facing the multiple heat-generating elements, and the protrusions protrude from this surface with varying thicknesses. The connecting elements connect the protrusions and the heat-generating elements respectively. The fan is disposed adjacent to the fins.

Description

Technical Field

[0001] This invention relates to a heat dissipation device. More specifically, this invention relates to a heat dissipation device corresponding to multiple heat-generating elements. Background Technology

[0002] If the temperature of electronic devices or servers is not properly controlled during use, instability can easily occur, affecting product reliability. Therefore, existing electronic devices often need to be equipped with heat dissipation devices.

[0003] However, electronic devices or servers typically contain multiple heat-generating components. Individually configuring heat dissipation devices for each component not only increases costs but can also reduce cooling efficiency due to obstructed fluid flow caused by the placement of these devices (e.g., airflow from multiple fans). Therefore, addressing these issues has become an important research topic. Utility Model Content

[0004] To address the aforementioned problems, this invention provides a heat dissipation device for connecting multiple heat-generating elements. The heat dissipation device includes a fin assembly, a vapor chamber, multiple connecting elements, and a fan. The fin assembly has multiple fins. The vapor chamber is connected to the fin assembly and includes a body and multiple protrusions. The body has a surface facing the multiple heat-generating elements, and the protrusions protrude from this surface with varying thicknesses. The connecting elements connect the protrusions to the heat-generating elements respectively. The fan is disposed adjacent to the fins.

[0005] In some embodiments, the aforementioned protrusion includes a first protrusion and a second protrusion, and the heating element includes a first heating element and a second heating element. The first protrusion corresponds to the first heating element, and the second protrusion corresponds to the second heating element, wherein the distance between the first protrusion and the first heating element is approximately the same as the distance between the second protrusion and the second heating element.

[0006] In some embodiments, the aforementioned heat dissipation device further includes an adhesive element disposed between the fin assembly and the vapor chamber.

[0007] In some embodiments, the thermal conductivity of the aforementioned adhesive element is greater than that of the connecting element.

[0008] In some embodiments, the bonding strength of the aforementioned adhesive element is greater than the bonding strength of the connecting element.

[0009] In some embodiments, the aforementioned body includes an edge portion and a cavity portion, the edge portion surrounding the cavity portion, and the thickness of the cavity portion being greater than the thickness of the edge portion, wherein the aforementioned surface is formed on the cavity portion.

[0010] In some embodiments, the fins are disposed in a virtual region, and the projection of the virtual region onto the vapor chamber does not completely cover the vapor chamber.

[0011] In some embodiments, the projection of the fins onto the heat spreader occupies 25-40% of the area of ​​the heat spreader.

[0012] In some embodiments, the fin assembly includes a base plate, the fins are connected to the base plate, and a fan is disposed on the base plate, wherein a gap is formed between the fan and the base plate, and the gap communicates with an external environment.

[0013] In some embodiments, one of the fan's outlets faces the fins. Attached Figure Description

[0014] Figure 1 This is a schematic diagram showing a heat dissipation device in one embodiment of the present invention;

[0015] Figure 2 This is an exploded view showing a heat dissipation device in one embodiment of the present invention;

[0016] Figure 3 It means Figure 1 A cross-sectional view along the AA direction;

[0017] Figure 4A This is a bottom view showing the temperature distribution plate in one embodiment of the present invention;

[0018] Figure 4B This is a front view of the heat spreader in one embodiment of the present invention;

[0019] Figure 5 This is a schematic diagram showing that, in one embodiment of the present invention, the protrusion on the heat spreader and the heating element are connected by a connecting element.

[0020] Figure 6 This is a schematic diagram showing the overlapping portion of the virtual area where the heat spreader and fins are located in one embodiment of the present invention.

[0021] [Symbol Explanation]

[0022] 100: Fin assembly

[0023] 110: Base Plate

[0024] 111: First Page

[0025] 112: Second page

[0026] 120: Fins

[0027] 200: Fan

[0028] 210: Shell

[0029] 211: First air inlet

[0030] 212: Second air inlet

[0031] 213: Air vent

[0032] 220: Fan blade

[0033] 300: Heat spreader

[0034] 310:Ontology

[0035] 301: Part One

[0036] 302: Part Two

[0037] 311: Edge

[0038] 311A: Lower surface

[0039] 312: Chamber section

[0040] 312A: Surface

[0041] 320: Protrusion

[0042] 321: First protrusion

[0043] 322: Second protrusion

[0044] 400: Attached Components

[0045] 500: Connecting element

[0046] G: Gap

[0047] H: Heat dissipation device

[0048] H1: Thickness

[0049] H2: Thickness

[0050] M: Heating element

[0051] M1: First heating element

[0052] M2: Second heating element

[0053] R: Virtual Region

[0054] T1: Thickness

[0055] T2: Thickness Detailed Implementation

[0056] The following describes a heat dissipation device according to an embodiment of the present invention. However, it will be readily apparent that the embodiments of the present invention provide many suitable inventive concepts for implementation in a wide range of specific contexts. The specific embodiments disclosed are merely illustrative of the use of the present invention in a particular manner and are not intended to limit the scope of the present invention.

[0057] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant technology and the context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0058] The following disclosure of this specification describes specific examples of the various components and their arrangements to simplify the explanation. Of course, these specific examples are not intended to limit the present invention. For example, if the following disclosure describes a first feature formed on or above a second feature, it indicates that it includes embodiments where the first and second features are in direct contact, and also includes embodiments where additional features may be formed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, to facilitate the description of the relationship between one feature and another in the drawings, spatial terms such as "below," "under," "below," "above," "above," and similar terms may be used. In addition to the orientations shown in the drawings, spatial terms cover different orientations of the device during use or operation. The device may also be positioned otherwise (rotated 90 degrees or in other orientations), and the spatial descriptions used herein may be interpreted accordingly.

[0059] Figure 1 This is a schematic diagram illustrating a heat dissipation device H according to an embodiment of the present invention. The aforementioned heat dissipation device H is connected to one or more heat-generating elements to dissipate the heat generated by the heat-generating elements and reduce their temperature. For example, the aforementioned heat-generating elements include various components in a computer or server, such as a central processing unit (CPU), a graphics processing unit (GPU), a chipset, a hard disk drive (HDD), and / or a solid-state drive (SSD), but are not limited thereto.

[0060] Figure 2 This is an exploded view of the aforementioned heat dissipation device H, and Figure 3 It means Figure 1 A cross-sectional view along the AA direction. (See example...) Figure 2 and 3As shown, the aforementioned heat dissipation device H mainly includes a fin assembly 100, a fan 200, and a heat spreader 300.

[0061] The fin assembly 100 includes a base plate 110 and a plurality of fins 120, wherein the base plate 110 includes a first surface 111 and a second surface 112 opposite to each other, and the fins 120 are connected to the base plate 110 and protrude from the first surface 111. Furthermore, the fin assembly 100 including the base plate 110 and the fins 120 may also be a single casting made of aluminum alloy.

[0062] The fan 200 is disposed on the first surface 111 of the base plate 110 and adjacent to the aforementioned fins 120. Specifically, the fan 200 has a housing 210 and a fan blade 220, with the housing 210 surrounding the fan blade 220. A first air inlet 211, a second air inlet 212, and an air outlet 213 are formed on the housing 210. The first air inlet 211 is formed on the surface of the housing 210 facing away from the base plate 110, the second air inlet 212 is formed on the surface of the housing 210 facing the base plate 110, and the air outlet 213 is formed on the side of the housing 210 facing the fins 120. In this embodiment, a gap G is formed between the fan 200 and the base plate 110, and this gap G communicates with the external environment. Therefore, air from the external environment will sequentially pass through the gap G and the second air inlet 212 to enter the fan.

[0063] When the aforementioned fan 200 is operating, the fan blades 220 rotate to draw air from the external environment into the fan 200. Air from the external environment enters the fan 200 through the first air inlet 211 and the second air inlet 212, and then exits the fan 200 through the air outlet 213. The air exiting the fan 200 from the air outlet 213 flows through the space between the fins 120, thereby carrying away the heat energy on the fins 120.

[0064] like Figure 1 and 2 As shown, in this embodiment, at least some of the fins 120 have a curved structure, and some of the fins are not arranged parallel to each other, so that air can effectively contact the fins to increase the heat dissipation efficiency of the heat dissipation device H.

[0065] Please refer to the following: Figure 3 , 4A 4B, the heat spreader 300 is attached to the second surface 112 of the base plate 110, and includes a body 310 and a plurality of protrusions 320. In this embodiment, the heat spreader is made of copper and has a nickel layer plated on its surface.

[0066] The body 310 includes an edge portion 311 and a chamber portion 312, wherein the edge portion 311 surrounds the chamber portion 312, and the thickness H2 of the chamber portion 312 is greater than the thickness H1 of the edge portion 311. In this embodiment, the upper surface of the edge portion 311 facing the fin assembly 100 is flush with the upper surface of the chamber portion 312 facing the fin assembly 100. In other words, the chamber portion 312 only protrudes from the lower surface 311A ​​of the edge portion 311 facing away from the fin assembly 100.

[0067] The protrusion 320 is connected to the chamber portion 312 and protrudes from the surface 312A of the chamber portion 312. In particular, the dimensions (length and width) and thickness of each protrusion 320 will be different from each other. The dimensions of the protrusion 320 are larger than or approximately the same as the dimensions of the corresponding heating element, and the larger protrusion 320 is closer to the center of the heat spreader 300 than the smaller protrusion 320.

[0068] In addition, such as Figure 4A As shown, in this embodiment, the heat spreader 300 is divided into a first portion 301 and a second portion 302. The first portion 301 corresponds to the area where the protrusion 320 is provided, and the second portion 302 corresponds to the remaining area. The size of the second portion 302 is smaller than the size of the first portion 301, thereby reducing the weight and manufacturing cost of the heat dissipation device H.

[0069] Please see Figure 5 The heat dissipation device H also includes an adhesive element 400. When assembling the heat dissipation device H, the adhesive element 400 is disposed between and in contact with the body 310 of the heat spreader 300 and the base plate 110 of the fin assembly 100 to attach the heat spreader 300 to the fin assembly 100. The aforementioned adhesive element 400 includes, for example, a suitable solder (e.g., solder paste), but is not limited thereto.

[0070] When a user wishes to connect the heat dissipation device H to the heating element M, the connecting element 500 is used to connect the protrusions 320 on the heat spreader 300 to the respective heating elements M. The connecting element 500 may include, for example, a thermally conductive adhesive to facilitate the transfer of heat energy from the heating element M to the heat spreader 300, such as thermal paste. It should be noted that the thermal conductivity and bonding strength of the adhesive element 400 are greater than those of the connecting element 500. Therefore, when the user removes the heat dissipation device H from the heating element M, only the heating element M is separated from the protrusions 320, while the heat spreader 300 and the fin assembly 100 remain fixed together by the adhesive element 400.

[0071] In this embodiment, the thermal conductivity of the adhesive element 400 is, for example, 21 W / mK, and the thermal conductivity of the connecting element 500 is, for example, 5.1 W / mK.

[0072] Through the aforementioned heat spreader 300, the heat generated by the heating element M will be evenly transferred to all areas of the fin assembly 100, thereby improving the heat dissipation effect of the heat dissipation device H.

[0073] Furthermore, since the heat dissipation plate 300 in the heat dissipation device H has protrusions 320 of different thicknesses, it will help to further improve the heat dissipation effect of the heat dissipation device H. The following explanation will take the first protrusion 321 and the second protrusion 322 in the protrusions 320 and the first heating element M1 and the second heating element M2 corresponding to the two in the heating element M as examples.

[0074] like Figure 5 As shown, the surface 312A of the chamber portion 312 of the heat spreader 300 faces the heating element M, and the height of the first heating element M1 is greater than the height of the second heating element M2. A first protrusion 321 corresponding to the first heating element M1 protrudes from the aforementioned surface 312A by a thickness T1, and a second protrusion 322 corresponding to the second heating element M2 protrudes from the aforementioned surface 312A by a thickness T2, with the thickness T1 being less than the thickness T2. Therefore, the distance between the first protrusion 321 and the first heating element M1 is approximately the same as the distance between the second protrusion 322 and the second heating element M2. The thickness of the connecting element 500 filling the space between the first protrusion 321 and the first heating element M1 is approximately the same as the thickness of the connecting element 500 filling the space between the second protrusion 322 and the second heating element M2, thereby allowing heat energy to be transferred to the heat spreader 300 more evenly and quickly.

[0075] Additionally, please see Figure 3 and 6 In this embodiment, the fins 120 of the fin assembly 100 are disposed in a virtual region R. The projection of this virtual region R onto the heat spreader 300 will not cover the heat spreader 300. For example, the projection of the fins 120 on the fin assembly 100 onto the heat spreader 300 occupies about 25% to 40% of the area of ​​the heat spreader 300, but is not limited thereto.

[0076] In summary, this utility model provides a heat dissipation device for connecting multiple heat-generating elements. The aforementioned heat dissipation device includes a fin assembly, a vapor chamber, multiple connecting elements, and a fan. The fin assembly has multiple fins. The vapor chamber is connected to the fin assembly and includes a body and multiple protrusions. The body has a surface facing the heat-generating elements, and the protrusions protrude from this surface with varying thicknesses. The connecting elements connect the protrusions and the heat-generating elements respectively. The fan is disposed adjacent to the fins.

[0077] While the embodiments and advantages of this utility model have been disclosed above, it should be understood that anyone skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of this utility model. Furthermore, the scope of protection of this utility model is not limited to the processes, machines, manufacturing, material composition, apparatus, methods, and steps described in the specific embodiments of the specification. Anyone skilled in the art can understand from the disclosure of this utility model any existing or future developed processes, machines, manufacturing, material composition, apparatus, methods, and steps, as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein, and can be used according to this utility model. Therefore, the scope of protection of this utility model includes the aforementioned processes, machines, manufacturing, material composition, apparatus, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of this utility model also includes combinations of the various claims and embodiments.

Claims

1. A heat dissipation device, characterized in that, Used to connect multiple heating elements, including: A fin assembly having multiple fins; A heat spreader plate is connected to the fin assembly, wherein the heat spreader plate includes: A body having a surface facing the plurality of heating elements; and Multiple protrusions protrude from the surface, and the thickness of the multiple protrusions protruding from the surface is different; Multiple connecting elements, respectively connecting the multiple protrusions and the multiple heating elements; and A fan is arranged adjacent to the plurality of fins.

2. The heat dissipation device as described in claim 1, characterized in that, The plurality of protrusions include a first protrusion and a second protrusion, and the plurality of heating elements include a first heating element and a second heating element. The first protrusion corresponds to the first heating element, and the second protrusion corresponds to the second heating element. The distance between the first protrusion and the first heating element is approximately the same as the distance between the second protrusion and the second heating element.

3. The heat dissipation device as described in claim 1, characterized in that, The heat dissipation device also includes an adhesive element disposed between the fin assembly and the heat spreader.

4. The heat dissipation device as described in claim 3, characterized in that, The thermal conductivity of the adhesive element is greater than that of the connecting element.

5. The heat dissipation device as described in claim 3, characterized in that, The bonding strength of the adhesive element is greater than that of the connecting element.

6. The heat dissipation device as described in claim 1, characterized in that, The body includes an edge portion and a cavity portion, the edge portion surrounding the cavity portion, and the thickness of the cavity portion being greater than the thickness of the edge portion, wherein the surface is formed on the cavity portion.

7. The heat dissipation device as described in claim 1, characterized in that, The plurality of fins are disposed in a virtual area, and the projection of the virtual area onto the heat exchange plate does not completely cover the heat exchange plate.

8. The heat dissipation device as described in claim 1, characterized in that, The projection of the plurality of fins onto the heat exchange plate occupies 25 to 40% of the area of ​​the heat exchange plate.

9. The heat dissipation device as described in claim 1, characterized in that, The fin assembly includes a base plate, the plurality of fins are connected to the base plate, and the fan is disposed on the base plate, wherein a gap is formed between the fan and the base plate, and the gap communicates with an external environment.

10. The heat dissipation device as claimed in claim 1, characterized in that, One of the fan's outlets faces the plurality of fins.

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