Back plate hot-pressing and fine-cutting integrated die for automobile

Abstract

The utility model relates to mould technical field and disclose a kind of backboard hot-pressing fine cutting integrated mould on car, including lower mould base, the top of lower mould base is provided with lower mould, the bottom of lower mould is fixedly connected with heat conduction plate, the bottom of heat conduction plate is fixedly connected with fin one, the inside of fin one is sleeved with cooling assembly, the center of lower mould top surface is fixedly connected with four groups of supporting assembly, the side of supporting assembly is fixedly connected with support spring, cooling assembly includes the cooling pipe of the inside of fin one, one end of cooling pipe is connected with conveying pump, the input of conveying pump is connected with storage tank. The backboard hot-pressing fine cutting integrated mould on car, through the setting of cooling assembly, reach the effect of multistage heat dissipation, avoid the uneven shrinkage or warping of backboard due to local high temperature, reduce product curing time at the same time, improve the production efficiency and quality of backboard on car.

Description

Technical Field

[0001] This utility model relates to the field of mold technology, and in particular to a hot-pressing precision cutting integrated mold for automobile upper back panel. Background Technology

[0002] The automotive back panel hot-pressing and precision-cutting integrated mold is a production tool used in automobile manufacturing for back panel components. It is primarily used to hot-press the back panel raw material at high temperatures and then precision-cut it into the required shape and size. This mold combines hot-pressing and precision-cutting technologies and is typically used for automotive interior trim or other components with high technical requirements.

[0003] Patent document CN214872159U discloses a mechanism for achieving balanced punching in a thermoforming integrated mold. The mechanism includes an upper mold body and a lower mold body. A cutting plate is located at the bottom of the upper mold body. A cavity is formed inside the lower mold body, and the top of the lower mold body contacts the cutting plate. Connecting blocks are fixedly connected to both sides of the bottom front and rear ends of the lower mold body. Each connecting block has a cavity inside, and a movable groove is formed on one opposite side of each connecting block. This mechanism for achieving balanced punching in a thermoforming integrated mold, through the design of a rack, pinion, cam, shaft, connecting rod, and reset rod, provides a secondary safety function. This effectively prevents poor diaphragm forming due to spring failure, improving the stability and yield of the diaphragm during the forming process, reducing economic losses for users, enhancing the practicality of the device, and meeting user needs.

[0004] However, when using existing integrated hot-pressing and precision-cutting molds for automotive back panels, the back panels are prone to uneven shrinkage or warping due to localized high temperatures, and multi-stage heat dissipation is difficult, which increases the product curing time and reduces the production efficiency and quality of automotive back panels. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] The purpose of this utility model is to provide a hot-pressing precision-cutting integrated mold for automotive back panels, which solves the problems mentioned in the background art, such as the back panel being prone to uneven shrinkage or warping due to local high temperature during use, and the difficulty in multi-stage heat dissipation, which increases the product curing time and reduces the production efficiency and quality of automotive back panels.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: a hot-pressing precision-cutting integrated mold for an automotive upper back panel, comprising a lower mold base, a lower mold being disposed on the top of the lower mold base, a heat-conducting plate being fixedly connected to the bottom of the lower mold, a heat sink being fixedly connected to the bottom of the heat-conducting plate, a cooling assembly being sleeved inside the heat sink, four sets of support assemblies being fixedly connected to the center of the top surface of the lower mold, a support spring being fixedly connected to one side of each support assembly, the cooling assembly comprising a cooling pipe sleeved inside the heat sink, a delivery pump being connected to one end of the cooling pipe, a storage box being connected to the input end of the delivery pump, and a semiconductor cooling chip being fixedly connected to one side of the storage box; the support assembly comprising a support bolt fixedly connected to the center of the top surface of the lower mold, a support rod being rotatably connected to the top of the support bolt, and a sliding seat being rotatably connected to the top of the support rod.

[0009] As a further embodiment of this utility model, a number of heat sinks are fixedly connected to one side of the semiconductor cooling chip, and a partition is sleeved on the surface of the semiconductor cooling chip. The partition serves to support the semiconductor cooling chip and isolate its cold and hot surfaces.

[0010] As a further embodiment of this utility model, a support shell is fixedly connected to the surface of the partition, and a cooling fan is fixedly connected to one side of the support shell. The cooling fan accelerates heat dissipation.

[0011] As a further embodiment of this utility model, a fixing rod is slidably connected to the surface of the sliding seat, and fixing blocks are sleeved at both ends of the fixing rod. The fixing blocks serve to connect and support the fixing rod.

[0012] As a further embodiment of this utility model, a support plate is fixedly connected to the top of the fixed block, and four sets of damping hydraulic rods are fixedly connected to the bottom of the support plate in a rectangular array. A buffer spring is sleeved on the surface of the damping hydraulic rod. The buffer spring helps to offset part of the downward impact.

[0013] As a further embodiment of this utility model, buffer seats are fixedly connected to the four corners of the lower mold base, and an upper mold base is slidably connected to the top of the buffer seats. The upper mold base serves to support the upper mold.

[0014] As a further embodiment of this utility model, an upper mold is provided at the bottom of the upper mold base, and lifting rings are threadedly connected to both sides of the upper mold base and the lower mold base. The lifting rings facilitate the lifting of the upper mold base and the lower mold base.

[0015] (III) Beneficial Effects

[0016] This utility model provides a hot-pressing precision-cut integrated mold for automotive upper back panels, which has the following beneficial effects:

[0017] 1. This integrated hot-pressing and precision-cutting mold for automotive back panels utilizes a cooling system. After hot pressing, the heat from the lower mold is transferred to heat sink one via a heat-conducting plate, increasing the heat dissipation area. Simultaneously, the coolant in the internal cooling pipes absorbs some of the heat. A pump then transfers the heated coolant to a storage tank, activating a semiconductor cooling chip to cool the coolant. The hot surface of the semiconductor cooling chip is further cooled by heat sink two and a cooling fan, achieving a multi-stage cooling effect. This prevents uneven shrinkage or warping of the back panel due to localized high temperatures, reduces product curing time, and improves the production efficiency and quality of automotive back panels.

[0018] 2. This integrated hot-press precision-cutting mold for the car upper back panel, through the setting of the support components, allows the upper mold to press down on the support plate during use. In turn, the support plate drives the fixed rod to press down. Since the position of the support bolt remains unchanged, the two ends of the support rod rotate on the support bolt and the sliding seat respectively. The sliding seat then slides on the fixed rod and squeezes the support spring, causing the support spring to deform under force and generate elastic force, pushing the sliding seat in the opposite direction. At the same time, the damping hydraulic rod contracts under force, and the buffer spring deforms under force and generates elastic force, thereby ensuring the stability of the pressure transmission path, preventing mold skewing that could lead to product deformation, and effectively suppressing the instantaneous impact during high-speed mold closing. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the disassembled structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the cooling component structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the support component structure of this utility model.

[0023] In the diagram: 1. Lower mold base; 2. Lower mold; 3. Heat-conducting plate; 4. Heat sink one; 5. Cooling assembly; 501. Cooling pipe; 502. Transfer pump; 503. Storage box; 504. Semiconductor cooling chip; 6. Support assembly; 601. Support bolt; 602. Support rod; 603. Sliding seat; 7. Support spring; 8. Heat sink two; 9. Partition plate; 10. Support shell; 11. Cooling fan; 12. Fixing rod; 13. Fixing block; 14. Support plate; 15. Damping hydraulic rod; 16. Buffer spring; 17. Buffer seat; 18. Upper mold base; 19. Upper mold; 20. Lifting ring. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0025] Please see Figures 1 to 4 This utility model provides a technical solution: a hot-pressing precision-cut integrated mold for automotive back panels, including a lower mold base 1, a lower mold 2 disposed on the top of the lower mold base 1, a heat-conducting plate 3 fixedly connected to the bottom of the lower mold 2, a heat sink 4 fixedly connected to the bottom of the heat-conducting plate 3, and a cooling component 5 sleeved inside the heat sink 4. The cooling component 5 achieves multi-stage heat dissipation, preventing uneven shrinkage or warping of the back panel due to localized high temperatures, while also reducing product curing time and improving the production efficiency and quality of automotive back panels. Four sets of support components 6 are fixedly connected to the center of the top surface of the lower mold 2, ensuring the pressure transmission path. The system is stable and prevents product deformation caused by mold skewing. It also effectively suppresses the instantaneous impact during high-speed mold closing. A support spring 7 is fixedly connected to one side of the support component 6. The cooling component 5 includes a cooling pipe 501 sleeved inside the heat sink 4. One end of the cooling pipe 501 is connected to a delivery pump 502. The input end of the delivery pump 502 is connected to a storage box 503. A semiconductor cooling chip 504 is fixedly connected to one side of the storage box 503. The support component 6 includes a support bolt 601 fixedly connected to the center of the top surface of the lower mold 2. A support rod 602 is rotatably connected to the top of the support bolt 601. A sliding seat 603 is rotatably connected to the top of the support rod 602.

[0026] As a further embodiment of this utility model, a number of heat sinks 8 are fixedly connected to one side of the semiconductor cooling chip 504, and a partition 9 is sleeved on the surface of the semiconductor cooling chip 504. The partition 9 serves to support the semiconductor cooling chip 504 and isolate its cold and hot surfaces.

[0027] As a further embodiment of this utility model, a support shell 10 is fixedly connected to the surface of the partition 9, and a cooling fan 11 is fixedly connected to one side of the support shell 10. The cooling fan 11 helps to accelerate heat dissipation.

[0028] As a further embodiment of this utility model, a fixing rod 12 is slidably connected to the surface of the sliding seat 603, and fixing blocks 13 are sleeved at both ends of the fixing rod 12. The fixing blocks 13 serve to connect and support the fixing rod 12.

[0029] As a further embodiment of this utility model, a support plate 14 is fixedly connected to the top of the fixed block 13, and four sets of damping hydraulic rods 15 are fixedly connected to the bottom of the support plate 14 in a rectangular array. A buffer spring 16 is sleeved on the surface of the damping hydraulic rod 15. The buffer spring 16 is used to offset part of the downward impact.

[0030] As a further embodiment of this utility model, buffer seats 17 are fixedly connected to the four corners of the lower mold base 1, and an upper mold base 18 is slidably connected to the top of the buffer seats 17. The upper mold base 18 serves to support the upper mold 19.

[0031] As a further embodiment of this utility model, an upper mold 19 is provided at the bottom of the upper mold base 18, and lifting rings 20 are threadedly connected to both sides of the upper mold base 18 and the lower mold base 1. The lifting rings 20 facilitate the lifting of the upper mold base 18 and the lower mold base 1.

[0032] In this invention, the working steps of the device are as follows:

[0033] First step: After hot pressing the product, the heat on the lower mold 2 is transferred to the heat sink 4 by the heat conduction plate 3 to increase the heat dissipation area. At the same time, the coolant in the internal cooling pipe 501 absorbs some of the heat. The coolant with heat is input into the storage tank 503 by the transfer pump 502, and then the semiconductor cooling chip 504 is activated to cool the coolant. The hot surface of the semiconductor cooling chip 504 is accelerated to dissipate heat through the heat sink 8 and the cooling fan 11.

[0034] The second step: When in use, the upper mold 19 presses down on the support plate 14, and the support plate 14 drives the fixed rod 12 to press down. Since the position of the support bolt 601 remains unchanged, the two ends of the support rod 602 rotate on the support bolt 601 and the sliding seat 603 respectively. Then the sliding seat 603 slides on the fixed rod 12 and squeezes the support spring 7, causing the support spring 7 to deform under force and generate elastic force, pushing the sliding seat 603 in the opposite direction. At the same time, the damping hydraulic rod 15 is compressed under force, and the buffer spring 16 is deformed under force and generates elastic force.

[0035] It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0036] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A hot-pressing precision-cutting integrated mold for an automotive upper back panel, comprising a lower mold base (1), characterized in that: The lower mold base (1) is provided with a lower mold (2) at its top. A heat-conducting plate (3) is fixedly connected to the bottom of the lower mold (2). A heat sink (4) is fixedly connected to the bottom of the heat-conducting plate (3). A cooling component (5) is sleeved inside the heat sink (4). Four sets of support components (6) are fixedly connected to the center of the top surface of the lower mold (2). A support spring (7) is fixedly connected to one side of the support component (6). The cooling assembly (5) includes a cooling pipe (501) sleeved inside the heat sink (4), one end of the cooling pipe (501) is connected to a delivery pump (502), the input end of the delivery pump (502) is connected to a storage box (503), and a semiconductor cooling chip (504) is fixedly connected to one side of the storage box (503). The support assembly (6) includes a support bolt (601) fixedly connected to the center of the top surface of the lower mold (2), a support rod (602) rotatably connected to the top of the support bolt (601), and a sliding seat (603) rotatably connected to the top of the support rod (602).

2. The integrated hot-pressing and precision-cutting mold for an automotive upper back panel according to claim 1, characterized in that: A number of heat sinks (8) are fixedly connected to one side of the semiconductor cooling chip (504), and a partition (9) is sleeved on the surface of the semiconductor cooling chip (504).

3. The integrated hot-pressing and precision-cutting mold for an automotive upper back panel according to claim 2, characterized in that: A support shell (10) is fixedly connected to the surface of the partition (9), and a cooling fan (11) is fixedly connected to one side of the support shell (10).

4. The integrated hot-pressing and precision-cutting mold for an automotive upper back panel according to claim 1, characterized in that: The surface of the sliding seat (603) is slidably connected to a fixing rod (12), and both ends of the fixing rod (12) are fitted with fixing blocks (13).

5. The integrated hot-pressing and precision-cutting mold for an automotive upper back panel according to claim 4, characterized in that: The top of the fixed block (13) is fixedly connected to a support plate (14), and the bottom of the support plate (14) is fixedly connected to four sets of damping hydraulic rods (15) in a rectangular array. The surface of the damping hydraulic rods (15) is fitted with a buffer spring (16).

6. The integrated hot-pressing and precision-cutting mold for an automotive upper back panel according to claim 1, characterized in that: The lower mold base (1) is fixedly connected to four corners of a buffer seat (17), and the top of the buffer seat (17) is slidably connected to an upper mold base (18).

7. The integrated hot-pressing and precision-cutting mold for an automotive upper back panel according to claim 6, characterized in that: The upper mold base (18) is provided with an upper mold (19) at its bottom, and both sides of the upper mold base (18) and the lower mold base (1) are threaded with lifting rings (20).

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