Chip package pressing device

Abstract

The utility model relates to chip packaging press fit technical field, and disclose a kind of chip packaging press fit device, including pedestal, the surface of the pedestal is fixedly connected with four vertical blocks, the surface of vertical block is equipped with threaded hole, the inside thread of threaded hole is connected with clamping mechanism, the both sides of the pedestal are fixedly connected with extension plate, the surface middle part of extension plate is installed with horizontal bubble instrument, the bottom of extension plate is fixedly connected with leveling mechanism.This chip packaging press fit device, through the setting of clamping mechanism, when using, chip is placed in the inside of placing groove, then the threaded rod of both sides is screwed, threaded rod is driven under the one side pivot, so that the relative motion of the clamping plate installed in pivot side occurs, until the chip inside placing groove is firmly clamped and fixed, prevent clamping plate loosening in press fit process using the self-locking characteristic of screw, guarantee press fit accuracy, compared with flexible clamping, it is more stable and reliable.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging and pressing technology, and in particular to a chip packaging and pressing device. Background Technology

[0002] A microfluidic chip is a miniaturized laboratory device used for fluid control and analysis at the microscale. It typically consists of microstructures such as microchannels, microvalves, micropumps, and microreaction chambers, enabling precise manipulation and analysis of minute samples. Microfluidic chip encapsulation is a commonly used packaging technology used to tightly connect the microfluidic chip to a substrate or cover plate to protect the chip and achieve fluid control. Microfluidic chip encapsulation technology enables the packaging and integration of microfluidic chips, making them more stable and reliable in practical applications.

[0003] A microfluidic chip encapsulation and pressing device disclosed in announcement number CN221459885U includes: a working platform, a clamping assembly, and a pressing assembly. The working platform has a circumferential array of placement slots. The clamping assembly includes: a fixed base, a movable hole, and a tension rod. A limit plate and a clamping block are connected to the tension rod, and a telescopic spring is installed between the clamping block and the fixed base. The pressing assembly includes: a support base, a telescopic cylinder, and a guide connecting rod. One end of the guide connecting rod is fixedly connected to a connecting plate, and a pressing plate is installed in a circumferential array on the connecting plate. The microfluidic chip to be encapsulated is placed in the placement slot, and pulling the pull ring causes the tension rod to move relative to it. The telescopic spring clamps the microfluidic chip, facilitating the return of the tension rod. The control panel activates the telescopic cylinder, causing the guide connecting rod to move and encapsulate the chip. This solves the problem that the chip easily slips during pressing, leading to poor adhesion of the pressure-sensitive adhesive and slight air bubbles that affect subsequent use.

[0004] While the aforementioned patent achieves the goal of placing the microfluidic chip requiring compression packaging in a placement slot, pulling the pull ring to move the tension rod relative to it, and using the limit of the telescopic spring to clamp the microfluidic chip, facilitating the return of the tension rod, and activating the telescopic cylinder on the control panel to move the guide connecting rod for compression packaging, thus solving the problem of chip slippage during compression leading to poor adhesion of the pressure-sensitive adhesive and slight air bubbles affecting subsequent use; however, this device uses a combination of tension rod and spring to clamp and fix the chip. The elastic force of the spring varies with the deformation length (following Hooke's Law), and after prolonged use, fatigue may cause the elastic force to decrease, making it difficult to maintain a constant clamping force and affecting compression accuracy. Utility Model Content

[0005] The purpose of this invention is to provide a chip packaging pressing device to solve the problem in the background art where a tension rod and a spring are used to clamp and fix the chip. However, the elastic force of the spring changes with the deformation length (following Hooke's law), and after long-term use, the elastic force may decrease due to fatigue, making it difficult to maintain a constant clamping force and affecting the pressing accuracy.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a chip packaging and pressing device, comprising a base, four upright blocks fixedly connected to the surface of the base, threaded holes formed on the surface of each upright block, a clamping mechanism threadedly connected to the inside of each threaded hole, extension plates fixedly connected to both sides of the base, a leveling bubble leveler mounted in the center of the surface of each extension plate, a leveling mechanism fixedly connected to the bottom of each extension plate, the clamping mechanism comprising a threaded rod threadedly connected to the inside of a threaded hole, a rotating shaft rotatably connected to one side of the threaded rod, and a clamping plate fixedly connected to one side of the rotating shaft; the leveling mechanism comprising a threaded cylinder fixedly connected to the bottom of the extension plate, a threaded post threadedly connected to the inside of the threaded cylinder, and a support block fixedly connected to the bottom of the threaded post.

[0007] As a further embodiment of this utility model, a bracket is fixedly connected to one edge of the top surface of the base, and a hydraulic rod is installed on the top of the bracket. The hydraulic rod is used to drive the connecting plate to extend and retract.

[0008] As a further embodiment of this utility model, the output end of the hydraulic rod is fixedly connected to a connecting plate, and extension rods are fixedly connected to both sides of the surface of the connecting plate. The extension rods serve to fix the pressing plate.

[0009] As a further embodiment of this utility model, a pressing plate is fixedly connected to the bottom of the extension rod. The pressing plate is positioned directly above the chip to be processed, and the pressing plate serves to press the chip together.

[0010] As a further embodiment of this utility model, two placement slots are formed on the surface of the base, and the chip to be processed is placed inside the placement slots. The placement slots serve to place the chip.

[0011] As a further embodiment of this utility model, a plurality of anti-slip strips are fixedly connected to the surface of the clamping plate. The anti-slip strips are made of silicone, and the anti-slip strips serve to prevent slipping.

[0012] As a further embodiment of this utility model, a PLC controller is fixedly connected to one side of the bracket, and one side of the PLC controller is electrically connected to the surface of the hydraulic rod via a power cord. The PLC controller controls the opening and closing of the hydraulic rod.

[0013] This utility model provides a chip packaging and pressing device, which has the following advantages:

[0014] 1. This chip packaging and pressing device, through the setting of the clamping mechanism, when in use, places the chip inside the placement slot, and then turns the threaded rods on both sides. Driven by the rotating shaft on one side, the threaded rods cause the clamping plate installed on the side of the rotating shaft to move relative to the chip until the chip inside the placement slot is firmly clamped and fixed. The self-locking property of the thread can prevent the clamping plate from loosening during the pressing process, ensuring pressing accuracy. It is more stable and reliable than flexible clamping.

[0015] 2. This chip packaging and pressing device, through the setting of a leveling mechanism and a level bubble level, allows users to determine whether the device is level by observing the level bubble level during use. If not, the height of the four threaded posts at the bottom can be adjusted by rotating the four threaded posts inside the top threaded cylinder. This allows for fine adjustment of the height of the four support blocks, thereby achieving the effect of leveling the device and avoiding uneven force on the chip during the pressing process due to device tilt. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the clamping mechanism of this utility model;

[0018] Figure 3 This is a schematic diagram of the leveling mechanism of this utility model;

[0019] Figure 4 This is a schematic diagram of the support structure of this utility model.

[0020] In the diagram: 1. Base; 2. Stand block; 3. Clamping mechanism; 301. Threaded rod; 302. Rotating shaft; 303. Clamping plate; 4. Extension plate; 5. Horizontal bubble meter; 6. Leveling mechanism; 601. Threaded cylinder; 602. Threaded column; 603. Support block; 7. Bracket; 8. Hydraulic rod; 9. Connecting plate; 10. Extension rod; 11. Pressing plate; 12. Anti-slip strip; 13. PLC controller. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0022] Please see Figures 1 to 4This utility model provides a technical solution: a chip packaging pressing device, including a base 1, four upright blocks 2 are fixedly connected to the surface of the base 1, and threaded holes are opened on the surface of the upright blocks 2. The internal threads of the threaded holes are connected to a clamping mechanism 3. By setting the clamping mechanism 3, the self-locking characteristic of the threads can prevent the clamping plate 303 from loosening during the pressing process, ensuring the pressing accuracy. It is more stable and reliable than flexible clamping. Extension plates 4 are fixedly connected to both sides of the base 1. A horizontal bubble meter 5 is installed in the middle of the surface of the extension plate 4. A leveling mechanism 6 is fixedly connected to the bottom of the extension plate 4. By setting the leveling mechanism 6 and the horizontal bubble meter 5, the device is leveled, avoiding uneven force on the chip during the pressing process due to the tilt of the device.

[0023] The clamping mechanism 3 includes a threaded rod 301 threadedly connected to the inside of a threaded hole, a rotating shaft 302 rotatably connected to one side of the threaded rod 301, and a clamping plate 303 fixedly connected to one side of the rotating shaft 302.

[0024] The leveling mechanism 6 includes a threaded cylinder 601 fixedly connected to the bottom of the extension plate 4, a threaded post 602 threadedly connected inside the threaded cylinder 601, and a support block 603 fixedly connected to the bottom of the threaded post 602.

[0025] A bracket 7 is fixedly connected to one edge of the top surface of the base 1. A hydraulic rod 8 is installed on the top of the bracket 7. The hydraulic rod 8 is used to drive the connecting plate 9 to extend and retract.

[0026] The output end of the hydraulic rod 8 is fixedly connected to a connecting plate 9. Extension rods 10 are fixedly connected to both sides of the surface of the connecting plate 9. The extension rods 10 serve to fix the pressing plate 11.

[0027] A pressing plate 11 is fixedly connected to the bottom of the extension rod 10. The pressing plate 11 is positioned directly above the chip to be processed. The pressing plate 11 serves to press the chip.

[0028] Two placement slots are formed on the surface of the base 1. The chip to be processed is placed inside the placement slots. The placement slots serve to place the chip.

[0029] Several anti-slip strips 12 are fixedly connected to the surface of the clamping plate 303. The anti-slip strips 12 are made of silicone and serve to prevent slipping.

[0030] A PLC controller 13 is fixedly connected to one side of the bracket 7. The PLC controller 13 is electrically connected to the surface of the hydraulic rod 8 via a power cord. The PLC controller 13 controls the opening and closing of the hydraulic rod 8.

[0031] In this invention, the working steps of the device are as follows:

[0032] First step: When using the chip, place it inside the placement slot, and then turn the threaded rods 301 on both sides. Driven by the rotating shaft 302 on one side, the threaded rods 301 cause the clamping plate 303 installed on one side of the rotating shaft 302 to move relative to each other until the chip inside the placement slot is firmly clamped and fixed.

[0033] The second step: When using the device, the user can determine whether the device is level by observing the level bubble meter 5. If not, the user can rotate the four threaded posts 602 at the bottom to adjust the height of the threaded posts 602 inside the top threaded cylinder 601, thereby fine-tuning the height of the four support blocks 603.

[0034] It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0035] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip packaging and bonding device, comprising a base (1), characterized in that: Four upright blocks (2) are fixedly connected to the surface of the base (1). Threaded holes are opened on the surface of the upright blocks (2). A clamping mechanism (3) is threaded inside the threaded holes. Extension plates (4) are fixedly connected to both sides of the base (1). A leveling bubble meter (5) is installed in the middle of the surface of the extension plate (4). A leveling mechanism (6) is fixedly connected to the bottom of the extension plate (4). The clamping mechanism (3) includes a threaded rod (301) threaded into the threaded hole, a rotating shaft (302) rotatably connected to one side of the threaded rod (301), and a clamping plate (303) fixedly connected to one side of the rotating shaft (302). The leveling mechanism (6) includes a threaded cylinder (601) fixedly connected to the bottom of the extension plate (4), and a threaded column (602) is threadedly connected inside the threaded cylinder (601). A support block (603) is fixedly connected to the bottom of the threaded column (602).

2. The chip packaging and pressing device according to claim 1, characterized in that: A bracket (7) is fixedly connected to one edge of the top surface of the base (1), and a hydraulic rod (8) is installed on the top of the bracket (7).

3. The chip packaging and pressing device according to claim 2, characterized in that: The output end of the hydraulic rod (8) is fixedly connected to a connecting plate (9), and extension rods (10) are fixedly connected to both sides of the surface of the connecting plate (9).

4. The chip packaging and pressing device according to claim 3, characterized in that: A pressing plate (11) is fixedly connected to the bottom of the extension rod (10), and the pressing plate (11) is positioned directly above the chip to be processed.

5. The chip packaging and pressing device according to claim 1, characterized in that: The base (1) has two placement slots on its surface, and the chip to be processed is placed inside the placement slots.

6. The chip packaging and pressing device according to claim 1, characterized in that: The surface of the clamping plate (303) is fixedly connected with several anti-slip strips (12), and the anti-slip strips (12) are made of silicone.

7. The chip packaging and pressing device according to claim 2, characterized in that: A PLC controller (13) is fixedly connected to one side of the bracket (7), and one side of the PLC controller (13) is electrically connected to the surface of the hydraulic rod (8) via a power line.

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