Wafer cassette handling system
By designing a wafer cassette handling system, sensors are used to detect the status of the cassette cover and obstacles, ensuring that the cover is closed correctly. This solves the problems of cover detachment and double handling, and improves the safety of semiconductor production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN JING XIANG TECH CO LTD
- Filing Date
- 2024-01-03
- Publication Date
- 2026-06-23
AI Technical Summary
The cover of the wafer box is prone to falling off during handling, which can lead to safety accidents. Furthermore, existing technology cannot effectively avoid the problem of double handling of wafer boxes, which affects the safety of semiconductor production.
A wafer cassette handling system was designed, including a walking component, a lifting component, a gripping component, a sensor component, and a controller. The system uses sensors to detect the closed state of the cassette cover and obstacles at the target location to ensure that the cover is closed correctly and to avoid duplicate placement of the wafer cassette. Reflectors and mirrors are used to assist sensor detection and achieve safe handling.
This effectively prevents the wafer box lid from falling off during handling, ensuring the safe transfer of the wafer box, avoiding the problem of double handling, and improving the safety of semiconductor production.
Smart Images
Figure CN224394426U_ABST
Abstract
Description
[0001] The original application, with application number 202420043590.5 and application date of January 3, 2024, was entitled "A Crane Device and Material Handling System." This utility model is a divisional application of that application. Technical Field
[0002] This utility model relates to the field of semiconductor technology, and in particular to an overhead crane device and a material handling system. Background Technology
[0003] In semiconductor manufacturing processes, wafers need to be transferred between different steps. To prevent wafer contamination or damage, wafers are typically placed in wafer cassettes, which carry the wafers for transfer. Overhead hoist transfer (OHT) is used to move these wafer cassettes along tracks, transporting them onto a carrier plate.
[0004] In existing technology, the side wall of the wafer cassette has a cover that can be opened or closed, and this cover can be separated from the wafer cassette. During transportation, if the cover of the wafer cassette is tilted, i.e., in an open state, the cover is prone to falling, thus causing a safety accident. Furthermore, before the overhead crane places the wafer cassette onto the carrier plate, it needs to first confirm whether a wafer cassette is already on the carrier plate to avoid placing another wafer cassette if one is already on the carrier plate. Therefore, there are areas for improvement. Utility Model Content
[0005] This utility model provides a wafer cassette handling system to solve the technical problem of safety accidents caused by the detachment of the wafer cassette cover during wafer cassette handling.
[0006] This utility model provides a wafer cassette handling system, characterized in that it includes:
[0007] A wafer box for holding wafers includes a base plate, a top plate, side walls, a lid, and a handle. The side walls are connected between the base plate and the top plate. The lid is detachable or openable and connected to an opening in the side wall. The handle is connected to the top surface of the top plate.
[0008] Crane track;
[0009] Multiple support platforms are arranged directly below the overhead crane track; and
[0010] The overhead crane device, movably connected to the overhead crane track, includes:
[0011] The traveling component is mobilely connected to the overhead crane track;
[0012] A lifting assembly is connected to the walking assembly;
[0013] A gripping component, connected to the output end of the lifting component, is used to grip or release the wafer cassette; and
[0014] A sensor assembly, connected to the grasping assembly, includes:
[0015] The second sensor is located at the bottom of the gripping assembly. The second sensor is located on the side of the cover away from the wafer cassette. The second sensor detects obstacles at the target location of the wafer cassette. When there is an obstacle at the target location, the second sensor generates a second warning signal.
[0016] The walking component, the lifting component, and the grasping component overlap in the vertical direction, while the sensor component and the wafer cassette are misaligned in the vertical direction.
[0017] In one embodiment of the present invention, a controller is further included, which is electrically connected to the walking component, the lifting component, the grasping component, and the sensor component.
[0018] In one embodiment of this utility model, the sensor assembly includes:
[0019] A first sensor is disposed at the bottom of the gripping assembly, the first sensor being located on the side of the wafer cassette cover near the wafer cassette cover; and
[0020] The second sensor is located at the bottom of the gripping assembly, on the side of the cover away from the wafer cassette.
[0021] In one embodiment of the present invention, the first sensor detects whether the lid is closed, and when the lid is not closed, the first sensor generates a first warning signal.
[0022] In one embodiment of the present invention, the second sensor detects obstacles at the target location of the wafer cassette, and when obstacles exist at the target location, the second sensor generates a second warning signal.
[0023] In one embodiment of the present invention, the overhead crane device further includes a protective component connected to the bottom of the traveling component to form a receiving cavity, in which the lifting component and the gripping component are housed.
[0024] In one embodiment of this utility model, the support platform includes:
[0025] Support plate; and
[0026] The reflector is rotatably connected to the support plate;
[0027] The carrier plate and the reflector plate are provided with reflectors at positions corresponding to the sensor assembly.
[0028] In one embodiment of the present invention, the reflector includes a reflective surface and a pressure-bearing surface, and the reflector is connected to the reflective surface.
[0029] In one embodiment of this utility model, the included angle between the reflective surface and the pressure-bearing surface is in the range of 120° to 165°.
[0030] In summary, this invention provides a wafer cassette handling system with the following advantages: This invention ensures that the wafer cassette lid is properly closed during transport, preventing safety accidents. Furthermore, this invention avoids the problem of double-loading of wafer cassettes, improving the safety of semiconductor manufacturing. Attached Figure Description
[0031] Figure 1 The diagram shows a schematic of a wafer cell in the prior art.
[0032] Figure 2 The diagram shown is a structural schematic of a crane device provided by this utility model.
[0033] Figure 3 The diagram shown is a structural schematic of a material handling system provided by this utility model.
[0034] Figure 4 The diagram shown is a schematic of a wafer-gripping device in one embodiment of the present invention.
[0035] Figure 5 The diagram shown is a schematic of placing a wafer cassette in one embodiment of the present invention.
[0036] Icon labels:
[0037] 100. Overhead crane device; 110. Traveling assembly; 120. Lifting assembly; 130. Gripping assembly; 140. Sensor assembly; 141. First sensor; 142. Second sensor; 150. Controller; 160. Protective assembly;
[0038] 200. Wafer box; 201. Base plate; 202. Top plate; 203. Side wall; 204. Box lid; 205. Handle;
[0039] 300. Crane track;
[0040] 400, support platform; 410, support plate; 411, first reflector; 420, reflector plate; 421, reflective surface; 422, pressure-bearing surface; 423, second reflector. Detailed Implementation
[0041] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.
[0042] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.
[0043] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the present invention.
[0044] Please see Figure 1 , Figure 1 The diagram shows a schematic of a wafer cassette 200 in the prior art. The wafer cassette 200 is used to house wafers and may include a base plate 201, a top plate 202, side walls 203, a cover 204, and a handle 205. The side wall 203 connects the base plate 201 and the top plate 202 and has an opening. The cover 204 is detachable or openable and connected to the opening in the side wall 203, allowing wafers to be placed into the wafer cassette 200 through the opening. The handle 205 is connected to the top surface of the top plate 202, and the wafer cassette 200 can be moved by gripping the handle 205. When moving the wafer cassette 200, if the cover 204 is not properly installed or closed, problems such as the cover 204 falling off or the wafer falling may occur, leading to safety accidents.
[0045] Please see Figures 2 to 5 This invention proposes an overhead crane device and material handling system, applicable to the wafer cassette transfer process in semiconductor manufacturing. This invention ensures the wafer cassette lid is properly closed during transfer, preventing safety accidents. Furthermore, it avoids the problem of double-loading of wafer cassettes, improving the safety of semiconductor production. Detailed descriptions are provided below using specific embodiments.
[0046] Please see Figure 2 , Figure 2 This diagram illustrates the structure of a crane device according to the present invention. The crane device 100 is movably mounted on a crane track 300 and can be used to grasp a photomask 200 and move it to a target position. In one embodiment, the crane device 100 may include a traveling component 110, a lifting component 120, a grasping component 130, and a sensor component 140. The traveling component 110 is movably connected to the crane track 300. The traveling component 110 can be driven by a motor or a cylinder. The lifting component 120 is connected to the traveling component 110. Specifically, the lifting component 120 is connected to the bottom of the traveling component 110. The grasping component 130 is mounted on the output end of the lifting component 120, and the lifting component 120 can drive the grasping component 130 to move vertically. The grasping component 130 can be used to grasp or release the wafer cassette 200. The sensor component 140 is connected to the grasping component 130. In this embodiment, the walking component 110, the lifting component 120, and the gripping component 130 can overlap in the vertical direction. After the overhead crane track 300 moves to directly above the wafer box 200, it grips it. At this time, the sensor component 140 and the wafer box 200 are misaligned in the vertical direction.
[0047] In one embodiment of this invention, the overhead crane device 100 may further include a controller 150. The controller 150 may be electrically connected to the traveling assembly 110, the lifting assembly 120, the gripping assembly 130, and the sensor assembly 140. In this embodiment, the sensor assembly 140 can detect whether there is an obstacle within a preset range directly below it, and when an obstacle exists within the preset range directly below the sensor assembly 140, it emits a signal. The controller 150 can control the traveling assembly 110, the lifting assembly 120, and the gripping assembly 130 to perform actions based on the signal emitted by the sensor 140.
[0048] Please see Figure 2In one embodiment of this utility model, the sensor assembly 140 may include a first sensor 141 and a second sensor 142. The first sensor 141 may be disposed at the bottom of the gripping assembly 130. The second sensor 142 may be disposed at the bottom of the gripping assembly 130. When the trolley device 100 grips a wafer cassette 200, the first sensor may be located on the side near the cover 204 of the wafer cassette 200, and the second sensor may be located on the side away from the cover 204 of the wafer cassette 200. In this embodiment, the first sensor 141 can be used to detect whether the cover 204 is properly closed, and the second sensor 142 can be used to detect whether there are other obstacles at the target location of the wafer cassette 200. The first sensor 141 and the second sensor 142 may be photoelectric sensors, and they may be configured to emit sensing light towards the target location and receive sensing light reflected by a reflector. When the reflected sensing light cannot be received due to obstruction by an obstacle or a change in the reflection angle, the first sensor 141 and the second sensor 142 will generate corresponding warning signals.
[0049] Please see Figure 2 In one embodiment of this invention, the overhead crane device 100 further includes a protective component 160. The protective component 160 can be connected to the bottom of the traveling component 110 to form a receiving cavity. The lifting component 120 and the gripping component 130 can be housed within the receiving cavity. In this embodiment, the protective component 160 can be at least two plate-like structures extending away from the traveling component 110. The two plate-like structures can be connected in parallel to opposite sides of the traveling component 110 to form a receiving cavity.
[0050] Please see Figure 3 , Figure 3 The diagram shown illustrates the structure of a material handling system provided by this utility model. In one embodiment of this utility model, the material handling system may include an overhead crane device 100, an overhead crane track 300, and a support platform 400. The overhead crane track 300 is suspended above the semiconductor manufacturing workshop. The overhead crane device 100 is movably mounted on the overhead crane track 300. The overhead crane device 100 may be any of the overhead crane devices described in the above embodiments. Multiple support platforms 400 may be present, each arranged directly below the overhead crane track 300 to support materials. In this embodiment, the overhead crane device 100 can move along the overhead crane track 300 to pick up a wafer cassette 200 from one support platform 400, move it, and place it onto another support platform 400.
[0051] Please see Figure 3In one embodiment of this utility model, the support platform 400 may include a support plate 410 and a reflector plate 420. The support plate 410 can be used to support the wafer cassette 200 transported by the overhead crane device 100. The reflector plate 420 may have a V-shaped cross-section and may include a reflective surface 421 and a pressure-bearing surface 422. The included angle between the reflective surface 421 and the pressure-bearing surface 422 may be between 120° and 165°. The reflector plate 420 is rotatably mounted on the support platform 400, and the rotation axis of the reflector plate 420 may be located at the connection between the reflective surface 421 and the pressure-bearing surface 422. When no wafer cassette is placed on the support plate 410, the reflective surface 421 is horizontal, and the pressure-bearing surface 422 is tilted upwards. When the wafer cassette 200 is placed on the carrier plate 410, the bottom of the wafer cassette 200 will contact the pressure surface 422. The pressure surface 422 is kept horizontal by the pressure of the wafer cassette 200, and the reflective surface 421 is tilted upwards. A first reflector 411 is provided on the carrier plate 410 at the position aligned with the first sensor 141, and a second reflector 423 is provided at the position of the reflective surface 421 aligned with the second sensor 142, for reflecting the light signal emitted by the sensor assembly 140.
[0052] Please see Figure 4 , Figure 4 This diagram illustrates the grasping of a wafer cassette 200 according to one embodiment of the present invention. In one embodiment, the wafer cassette 200 is placed on a support platform 400. When the trolley device 100 moves directly above the wafer cassette 200 to be grasped, the first sensor 141 is aligned with the first reflector 411 on the support plate 410. If the cover 204 of the wafer cassette 200 is properly closed, the first sensor 141 can receive the light signal reflected by the first reflector 411. If the cover 204 of the wafer cassette 200 is not properly closed, i.e., the cover 204 is tilted in the vertical direction, the cover 204 will block the light signal emitted by the first sensor 141, meaning the first sensor 141 cannot receive the light signal reflected by the first reflector 411, causing the first sensor 141 to generate a first warning signal.
[0053] When the controller 150 receives the first warning signal, it will keep the gripping component 130 in the released state to avoid safety accidents caused by the wafer box 200 cover 204 not being closed.
[0054] Please see Figure 5 , Figure 5This diagram illustrates the placement of a wafer cassette 200 in one embodiment of the present invention. In one embodiment, the trolley device 100 moves the wafer cassette 200 directly above the support platform 400. If there are no other wafer cassettes 200 on the support platform 400, the reflective surface 421 is horizontal, the pressure surface 422 is raised, and the second sensor 142, when aligned with the reflective surface 421, can receive the light signal reflected back by the second reflector 423. If other wafer cassettes 200 are already placed on the support platform 400, the pressure surface 422 is horizontal, the reflective surface 421 is raised, and the second sensor 142, when aligned with the reflective surface 421, cannot receive the light signal reflected back by the second reflector 423. In this case, the second sensor 142 will issue a second warning signal. Upon receiving the second warning signal, the controller 150 will control the lifting assembly 120 to remain raised to prevent the wafer cassette 200 from being lowered and causing a secondary loading issue.
[0055] In summary, this invention provides an overhead crane device and material handling system that ensures the wafer cassette lid is properly closed during transport, preventing safety accidents. Furthermore, this invention avoids the problem of double-loading of wafer cassettes, improving the safety of semiconductor manufacturing. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial application value.
[0056] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of implementation of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this utility model, should still fall within the scope of the technical content disclosed in this utility model. Furthermore, the terms such as "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of implementation of this utility model. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of implementation of this utility model.
[0057] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.
Claims
1. A wafer cassette handling system, characterized in that, include: A wafer box for holding wafers includes a base plate, a top plate, side walls, a lid, and a handle. The side walls are connected between the base plate and the top plate. The lid is detachable or openable and connected to an opening in the side wall. The handle is connected to the top surface of the top plate. Crane track; Multiple support platforms are arranged directly below the overhead crane track; as well as The overhead crane device, movably connected to the overhead crane track, includes: The traveling component is connected to the overhead crane track. A lifting assembly is connected to the walking assembly; A gripping component, connected to the output end of the lifting component, is used to grip or release the wafer cassette; and A sensor assembly, connected to the grasping assembly, includes: The second sensor is located at the bottom of the gripping assembly. The second sensor is located on the side of the cover away from the wafer cassette. The second sensor detects obstacles at the target location of the wafer cassette. When there is an obstacle at the target location, the second sensor generates a second warning signal. The walking component, the lifting component, and the grasping component overlap in the vertical direction, while the sensor component and the wafer cassette are misaligned in the vertical direction.
2. The wafer cassette handling system according to claim 1, characterized in that, It also includes a controller that is electrically connected to the walking assembly, the lifting assembly, the gripping assembly, and the sensor assembly.
3. The wafer cassette handling system according to claim 1, characterized in that, The sensor assembly includes: A first sensor is disposed at the bottom of the gripping assembly, and the first sensor is located on the side of the cover of the wafer cassette.
4. The wafer cassette handling system according to claim 3, characterized in that, The first sensor detects whether the lid is closed. When the lid is not closed, the first sensor generates a first warning signal.
5. The wafer cassette handling system according to claim 1, characterized in that, The overhead crane device also includes a protective component connected to the bottom of the traveling component to form a receiving cavity, in which the lifting component and the gripping component are housed.
6. The wafer cassette handling system according to claim 1, characterized in that, The support platform includes: Support plate; and The reflector is rotatably connected to the support plate; The carrier plate and the reflector plate are provided with reflectors at positions corresponding to the sensor assembly.
7. The wafer cassette handling system according to claim 6, characterized in that, The reflector includes a reflective surface and a pressure-bearing surface, and a reflector is connected to the reflective surface.
8. The wafer cassette handling system according to claim 7, characterized in that, The angle between the reflective surface and the pressure-bearing surface is in the range of 120° to 165°.