A resistive patch sensor and battery pack temperature monitoring system

Abstract

The utility model relates to sensor technical field especially is concerned with a kind of resistance patch sensor and battery pack temperature monitoring system, the resistance patch sensor, comprising: shell, inside is provided with accommodating cavity;Heat-conducting electrically-conductive part, is worn in shell and is fixedly connected with shell and forms integrated structure;Thermistor, is located in accommodating cavity;Thermistor's signal input end is electrically connected with heat-conducting electrically-conductive part, signal output end is electrically connected with electrically-conductive terminal;Terminal support, terminal support and electrically-conductive terminal fixedly connected form integrated structure;Terminal support cooperates with shell.This application provides resistance patch sensor, heat-conducting electrically-conductive part and shell, electrically-conductive terminal and terminal support are all integrated injection molding fixed, eliminate the risk of loosening, after filling insulation package, based on the cooperation of terminal support and shell to seal thermistor, to add physical protection, improve structural stability.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a resistive patch sensor and a battery pack temperature monitoring system. Background Technology

[0002] With the large-scale application of new energy vehicles, the battery management system (BMS) needs to monitor the cell temperature in real time and accurately, and work with the thermal management system to control the battery temperature within a safe and efficient range. This requirement places high demands on the space occupied, reliability, and response accuracy of temperature sensors.

[0003] Existing battery pack temperature monitoring mainly relies on two types of technologies: one is wire harness temperature monitoring, which requires manual wiring and occupies a large space; the other is surface mount thermistor, which is directly soldered to the cell contacting system (CCS) without physical protection. The solder joints are exposed to electrolyte or vibration environment, resulting in high failure rate and insufficient insulation reliability. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a resistive patch sensor and a battery pack temperature monitoring system.

[0005] In a first aspect, embodiments of the present invention provide a resistive patch sensor, comprising:

[0006] The shell has an internal cavity for receiving the contents;

[0007] Thermally and electrically conductive components are inserted into the housing and fixedly connected to the housing to form an integral structure;

[0008] A thermistor is located in the receiving cavity; the signal input terminal of the thermistor is electrically connected to a thermally and electrically conductive component, and the signal output terminal is electrically connected to a conductive terminal.

[0009] Terminal bracket, which is fixedly connected to conductive terminals to form an integral structure; terminal bracket fits into housing.

[0010] The thermistor is provided with an insulating coating at the electrical connection between the thermistor and the thermally conductive component, and the cavity is filled with an insulating encapsulation to seal the thermistor.

[0011] In conjunction with the first aspect, it also includes:

[0012] The first guide structure is located on the inner wall of the shell;

[0013] The second guide structure is formed on the side wall of the terminal bracket;

[0014] The guide groove and the guide component are positioned and matched in shape to form a linear conductor pair, so that the terminal bracket can be slidably assembled along the housing axis.

[0015] In conjunction with the first aspect, the first guiding structure is a guide rail, and the second guiding structure is a dovetail groove that matches the interface of the guide rail.

[0016] In conjunction with the first aspect, a viewing port is also provided on the terminal bracket, which corresponds to the potting area within the receiving cavity.

[0017] In conjunction with the first aspect, the viewing port is a window that penetrates the side wall of the terminal bracket, and the inner edge of the viewing port is provided with a flow guide slope.

[0018] In conjunction with the first aspect, the thermally and electrically conductive component includes a first plane, a connecting portion, and a second plane connected in sequence; the end of the second plane extends through the side wall of the housing to the receiving cavity;

[0019] The connecting part is bent at a right angle to the first plane and the second plane.

[0020] In conjunction with the first aspect, the end of the second plane is provided with a welding plane, and the signal input terminal of the thermistor is welded to the welding plane.

[0021] In conjunction with the first aspect, the radius of the transition arc corresponding to a right-angle bend should be at least 1mm.

[0022] In conjunction with the first aspect, the insulating encapsulation body is made of thermally conductive resin adhesive.

[0023] Secondly, embodiments of this application also provide a battery pack temperature monitoring system, including a resistive patch sensor as described above, wherein the thermally conductive and electrically conductive components of the resistive patch sensor are welded to the battery pack.

[0024] The present invention provides the following beneficial effects: The resistive patch sensor and battery pack temperature monitoring system provided in this application include: a housing with an internal cavity; and a thermally and electrically conductive component that passes through the housing and is fixedly connected to the housing to form an integral structure.

[0025] A thermistor is housed in a housing cavity; the signal input terminal of the thermistor is electrically connected to a thermally conductive component, and the signal output terminal is electrically connected to a conductive terminal; a terminal bracket is fixedly connected to the conductive terminal to form an integral structure; the terminal bracket is fitted with the housing; wherein, the electrical connection part between the thermistor and the thermally conductive component is provided with an insulating covering layer, and the housing cavity is filled with an insulating encapsulation to seal the thermistor.

[0026] The resistive patch sensor provided in this application has its thermally conductive and conductive components, housing, conductive terminals, and terminal brackets all integrally injection molded and fixed, eliminating the risk of loosening. After filling with an insulating encapsulation, the thermistor is sealed based on the cooperation between the terminal bracket and the housing, thereby adding physical protection and improving structural stability.

[0027] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description, claims, and drawings.

[0028] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0029] To more clearly illustrate the specific embodiments of this application or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the external structure of a resistive patch sensor provided in an embodiment of this application;

[0031] Figure 2 A cross-sectional schematic diagram of a resistive patch sensor provided in an embodiment of this application;

[0032] Figure 3 This is a schematic diagram of the mounting structure of the housing and terminal bracket in a resistive patch sensor provided in an embodiment of this application;

[0033] Figure 4 This is a schematic diagram of a terminal bracket structure for a resistive patch sensor provided in an embodiment of this application;

[0034] Figure 5 This is a schematic diagram of the conductive and heat-conducting component structure of a resistive patch sensor provided in an embodiment of this application.

[0035] The attached figures are labeled as follows:

[0036] 1-Conductive terminal, 2-Terminal bracket, 3-Thermistor, 4-Housing, 5-Heat-conducting and conductive component, 51-First plane, 52-Connecting part, 53-Second plane, 6-First guide structure, 7-Second guide structure, 8-Viewing port. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] To facilitate understanding of this embodiment, the application scenarios and design concepts of this application embodiment will be briefly introduced below.

[0039] Existing battery pack temperature monitoring requires manual wiring, occupies a large space, lacks physical protection, and exposes solder joints to electrolyte or vibration environments, resulting in high failure rates and insufficient insulation reliability.

[0040] Based on this, this application provides a resistive patch sensor and a battery pack temperature monitoring system to improve performance.

[0041] Example 1

[0042] In view of the above, the purpose of this utility model is to provide a resistive patch sensor and a battery pack temperature monitoring system.

[0043] In a first aspect, this utility model embodiment provides a resistive patch sensor, combined with Figure 1 , Figure 2 , Figure 3 It includes: housing 4, thermally and electrically conductive component 5, thermistor 3 and terminal bracket 2.

[0044] The housing 4 has an internal cavity.

[0045] The heat-conducting and electrical-conducting component 5 is inserted into the housing 4 and fixedly connected to the housing 4 to form an integral structure.

[0046] Thermistor 3 is located in the receiving cavity; the signal input terminal of thermistor 3 is electrically connected to the thermally conductive component 5, and the signal output terminal is electrically connected to the conductive terminal 1.

[0047] Terminal bracket 2 is fixedly connected to conductive terminal 1 to form an integral structure; terminal bracket 2 is fitted with housing 4.

[0048] The thermistor 3 is provided with an insulating coating at the electrical connection between it and the thermally conductive component 5, and the cavity is filled with an insulating encapsulation to seal the thermistor 3.

[0049] The resistive patch sensor provided in this application has a high degree of structural integration, is easy and reliable to assemble, has a fast temperature measurement response, and high accuracy.

[0050] Specifically, by integrally fixing the thermally conductive and conductive component 5 to the housing 4 and integrally molding the conductive terminal 1 and the terminal bracket 2, the number of parts and assembly steps are greatly reduced. The integrated injection molding structure avoids problems such as loosening and falling off, enhances mechanical strength, and improves structural stability. Through the double sealing of the insulating encapsulation and the insulating coating layer, an internal sealed structure is formed, which makes the resistive patch sensor highly integrated, easy and reliable to assemble, and has good moisture-proof, dust-proof, and shock-proof performance. Compared with traditional patch resistors, the failure rate is significantly reduced, making it more suitable for BMS systems with high reliability requirements and applicable to harsh working environments such as new energy vehicle battery packs. The thermally conductive and conductive component 5 is directly electrically connected to the thermistor 3 and is filled and sealed by the insulating encapsulation (such as thermally conductive resin glue), which enhances heat conduction efficiency and improves temperature response speed. An insulating coating layer is provided at the connection between the thermistor 3 and the thermally conductive and conductive component 5 to avoid short circuit risk, ensure stable signal transmission, and improve temperature measurement accuracy.

[0051] In conjunction with the first aspect, the resistive patch sensor provided in this application further includes: a first guiding structure 6 and a second guiding structure 7, combined with Figure 3 , Figure 4 As shown.

[0052] The first guide structure 6 is located on the inner wall of the housing 4.

[0053] The second guide structure 7 is formed on the side wall of the terminal bracket 2;

[0054] The first guide structure 6 and the second guide structure 7 are positioned and matched in shape to form a linear conductor pair, so that the terminal bracket 2 can be slidably assembled along the housing 4.

[0055] In this embodiment, the guide pair composed of the first guide structure 6 and the second guide structure 7 provides a clear physical path. Operators or automated equipment can easily push the terminal bracket into the housing 4 along a predetermined direction (axial direction of the housing 4) without complex adjustments, thereby significantly improving production assembly efficiency. This is particularly beneficial for the large-scale application of automated production lines, reducing labor costs and assembly time, and avoiding assembly errors such as tilting and misalignment caused by manual operation. This ensures the uniformity and reliability of product performance.

[0056] As one feasible approach, the guide rail-guide groove structure composed of the first guide structure 6 and the second guide structure 7 is the most typical implementation method. For example, the first guide structure 6 is a guide rail or rib provided on the inner wall of the housing 4; the second guide structure 7 is a guide groove or recess provided on the side wall of the terminal bracket 2.

[0057] Specifically, two or more protruding, axially extending elongated protrusions (i.e., the aforementioned guide rails or ribs) are provided on the inner sidewall of the plastic housing 4. Simultaneously, guide grooves or recesses are machined on the outer sidewall of the terminal bracket 2, perfectly matching the shape of the elongated protrusions (i.e., the aforementioned guide rails or ribs) inside the housing 4, with a slight gap in size. During assembly, the operator or robot lifts the terminal bracket 2, aligning the opening of the guide groove on its sidewall with the tip of the guide rail inside the housing 4; after alignment, a straight pushing force is applied along the axial direction of the housing 4 (i.e., the direction of the guide rail). The guide rail will naturally slide into the guide groove; throughout the insertion process, the sidewalls of the guide rail and the guide groove remain in contact and interact. This structure strictly limits the movement trajectory to the axis to prevent rotation and skew; finally, when the terminal bracket 2 reaches the preset position (for example, when the end of the guide groove touches the end of the guide rail, or when a structure on the terminal bracket 2 contacts the housing 4, the assembly is completed, and at this time the internal circuit connection point (such as the solder joint between the conductive terminal 1 and the thermistor 3) is also in a precise docking state.

[0058] As another feasible structure, the guide pair composed of the first guide structure 6 and the second guide structure 7 is a key-keyway structure. This method is very common in mechanical designs that require the transmission of torque or strict prevention of relative rotation, and is mainly used here for anti-rotation.

[0059] Specifically, the first guide structure 6 is a key, located on the inner wall of the housing 4; the second guide structure 7 is a keyway, located on the side wall of the terminal bracket 2.

[0060] Specifically, a protruding block-shaped structure with a rectangular or trapezoidal cross-section (i.e., the aforementioned "key") is provided at a specific location on the inner wall of the housing 4; an opening groove (i.e., the aforementioned "keyway") matching the shape of the "key" but slightly larger in size is formed on the side wall of the terminal bracket 2. Before assembly, the keyway on the terminal bracket 2 must be rotated to the same angular orientation as the key inside the housing 4; then, after aligning the angle, it is inserted axially, and the key enters the keyway. At this point, the terminal bracket 2 is completely restricted and cannot rotate any further; guided by the key, the terminal bracket 2 can only perform purely linear motion until it reaches the final designed position.

[0061] It is understandable that wedge-shaped surface mating, elastic buckle and limit mating, etc. can also be used to achieve a stable and reliable connection. This is only an example and is not a limitation.

[0062] As can be seen, a guide pair consisting of a first guide structure and a second guide structure is provided between the terminal bracket 2 and the housing 4, which facilitates quick and accurate positioning and installation, and improves the efficiency of automated assembly.

[0063] In conjunction with the first aspect, the first guide structure 6 is a guide rail, and the second guide structure 7 is a dovetail groove that matches the guide rail.

[0064] In this embodiment, a stable and reliable connection is achieved by using a combination of guide rails and dovetail grooves (i.e., guide grooves).

[0065] In conjunction with the first aspect, the terminal bracket 2 is also provided with a viewing port 8, which communicates with the receiving cavity (in conjunction with...). Figure 2 , Figure 4 (as shown), and directly opposite the potting area of ​​the insulating package.

[0066] In this way, operators or industrial cameras can directly observe the filling process of the insulating encapsulant (such as thermally conductive resin) through the viewing port. This includes: A. Whether the filling is complete: whether the adhesive can be seen to have reached the predetermined height, ensuring no gaps. B. Whether there are air bubbles: whether large air bubbles can be observed in the adhesive, especially in critical areas (such as around thermistors), as these air bubbles can affect thermal conductivity and insulation performance.

[0067] Furthermore, the viewing port 8 also serves as a venting channel to ensure the integrity of the potting compound. Specifically, during the potting process, air within the containment cavity needs to be expelled. The viewing port 8 acts as a natural venting channel, allowing air to escape smoothly during colloid injection. This avoids defects such as incomplete potting and internal voids caused by trapped air forming "air pockets," thereby ensuring the continuity and integrity of the insulating encapsulation and further improving the product's sealing performance and long-term reliability.

[0068] In conjunction with the first aspect, the viewing port 8 is a window that penetrates the side wall of the terminal bracket 2, and the inner edge of the viewing port 8 is provided with a flow guide slope.

[0069] Understandably, the guide ramp is used to optimize the potting process, guide the adhesive flow, and avoid vortices. Specifically, during high-pressure potting, the high-speed injection of the adhesive into a sealed cavity easily generates turbulence and air bubbles. The guide ramp can smoothly guide the adhesive flow through the window area, reducing flow resistance and preventing the formation of vortices that could entrain air, thus reducing the probability of air bubble formation at the source. Furthermore, the ramp structure provides a smoother escape path for air. Air can be concentrated and discharged along the ramp guide window, further ensuring the integrity of the cavity filling and avoiding the "air trap" phenomenon.

[0070] Furthermore, the flow-guiding bevel also serves to protect internal components and the structure. Understandably, a sharp window edge can create a stress concentration point, potentially becoming the starting point for cracking of the housing 4 or terminal bracket 2 when the potting compound cures and shrinks or when the product is subjected to vibration and impact. The smooth transition of the flow-guiding bevel significantly improves stress distribution, enhancing the mechanical strength and long-term reliability of the structure. Moreover, during assembly or subsequent operations, any cables passing through the housing cavity (such as signal output lines) may scrape against the window edge; the flow-guiding bevel provides a smooth surface, effectively avoiding the risk of cable insulation being scratched by sharp edges, thus improving electrical safety.

[0071] Furthermore, compared to a small viewing hole, the window extending through the side wall provides an unobstructed, wide viewing angle. Operators or visual inspection systems can directly and clearly observe the glue's fill height, flow front, and air bubbles from the side, making quality assessment more accurate and easier.

[0072] In conjunction with the first aspect, the thermally and electrically conductive component 5 includes a first plane 51, a connecting portion 52, and a second plane 53 connected in sequence. Figure 5 As shown; the second plane 53 extends through the side wall of the housing 4 into the receiving cavity;

[0073] The connecting part 52 is bent at a right angle to the first plane 51 and the second plane 53.

[0074] Understandably, the right-angle bend structure securely "locks" the heat-conducting and conductive component 5 into the side wall of the housing 4. The second plane 53 is inside the housing 4, and the first plane 51 is outside the housing 4; the material of the housing 4 itself acts as a mechanical locking mechanism to prevent it from being pulled out. Simultaneously, the bend structure provides greater torque resistance, preventing rotation during welding of external wiring or exposure to vibration. As a natural flexible buffer, the bend structure effectively absorbs and releases stress caused by thermal expansion and contraction or external vibration, preventing stress from being directly transmitted to the fragile solder joints of the internal thermistor 3, greatly improving the long-term reliability of the solder joints.

[0075] Meanwhile, the second plane 53 extends directly into the receiving cavity and connects to the thermistor 3, forming a highly efficient heat flow path. This means that the heat conduction path from the surface of the battery cell to the thermistor 3 is very short and direct. The second plane 53 can form surface contact with the thermistor 3 (superior to point or line contact), and its surface can also be fully encapsulated with potting compound, greatly improving heat transfer efficiency and making the sensor respond faster and more sensitive to temperature changes.

[0076] In addition, the first plane 51 can serve as a positioning reference during injection molding, ensuring the positional accuracy of the thermally conductive and electrically conductive component 5 in the housing 4. The first plane 51 exposed outside the housing 4 provides a stable and flat welding platform, which is very suitable for automated equipment (such as welding robots) to perform precise and reliable welding operations. Compared with simple circular pins, the planar structure and its fit with the sidewall of the housing 4 can provide a larger and more stable contact area for injection molding sealing or post-sealing processes (such as dispensing), effectively preventing moisture or contaminants from entering along the interface and improving the overall sealing performance (IP rating) of the product.

[0077] In conjunction with the first aspect, the end of the second plane 53 is provided with a welding plane, and the signal input terminal of the thermistor 3 is welded to the welding plane.

[0078] Understandably, the flat "welding plane" provides a stable and wide connection base for the thermistor 3, allowing the solder to form a large-area, low-thermal-resistance welding layer. This ensures that heat can be efficiently and losslessly transferred from the thermally conductive components to the sensitive core of the thermistor 3. Compared to spot welding or wire welding, surface-to-surface welding provides stronger mechanical adhesion and shear stress resistance. This effectively resists the continuous vibration and impact during vehicle operation, prevents fatigue cracking of the solder joints, and fundamentally solves the problem of high failure rate of traditional surface mount resistors.

[0079] The presence of the solder plane provides a clear physical positioning reference for the thermistor, avoiding the misalignment or "tombstone effect" (one end of the component lifting up) that is prone to occur when soldering on smooth curved surfaces or small endpoints, significantly reducing production defects. After soldering, the thermistor 3 is firmly fixed to the solder plane by the large solder joint, forming a rigid integral structure. This provides a stable foundation for the subsequent potting process, preventing the component from shifting during the flow of the encapsulant.

[0080] In conjunction with the first aspect, the radius of the transition arc corresponding to a right-angle bend should be at least 1mm.

[0081] Understandably, sharp right-angle bends are typical stress concentration points. Under long-term vibration or temperature cycling, microcracks can easily develop at these points, eventually leading to fracture. In this embodiment, a pre-set arc radius of R≥1mm can smoothly disperse stress, avoiding high stress concentration and greatly enhancing the resistance to mechanical and thermal fatigue of the thermally and electrically conductive components. Structurally, this ensures the product's ultra-long lifespan and reliability. It also meets easily achievable and cost-controllable process requirements, ensuring the integrity and consistency of the material structure at the bending point, avoiding hidden damage during manufacturing, and improving yield.

[0082] In conjunction with the first aspect, the insulating encapsulation body is made of thermally conductive resin adhesive.

[0083] The thermally conductive resin fills all the gaps around the thermistor 3, forming a highly efficient thermal path from the thermally conductive component 5, the solder joint, the adhesive, and the thermistor 3. It rapidly transfers temperature changes from the battery cell surface to the thermistor, significantly reducing the sensor's thermal response time (τ value) and improving the real-time performance and accuracy of temperature measurement. While achieving rapid heat transfer, it reliably isolates the electrodes of the thermistor 3 from surrounding metal components (such as the housing and terminals), preventing short circuits and ensuring signal purity and circuit safety. The cured thermally conductive resin encapsulates the internal components (thermistor, solder joint) into a single unit, effectively absorbing and buffering mechanical vibrations and impacts, preventing faults such as loose solder joints and broken wires.

[0084] Thermally conductive resin adhesives typically have good flowability, are easy to quantitatively fill using automated equipment, and have mature and stable processes, making them suitable for large-scale production.

[0085] Secondly, embodiments of this application also provide a battery pack temperature monitoring system, including a resistive patch sensor as described above, wherein the thermally conductive and electrically conductive components of the resistive patch sensor are welded to the battery pack.

[0086] This battery pack temperature monitoring system integrates the aforementioned resistive patch sensor and employs a soldered connection method. The thermally conductive component 5 of the resistive patch sensor is directly soldered to the battery pack (typically the terminal post or busbar of the battery cell), completely eliminating the contact thermal resistance present in traditional installation methods (such as the contact surface thermal resistance of screw connections, the thermal resistance of thermal grease, etc.). This allows the heat generated by the battery cell to be transferred almost without loss or delay to the thermistor 3 through the solder joint, the thermally conductive adhesive inside the thermally conductive component 5, and directly to the thermistor 3. The system can therefore capture instantaneous changes in battery cell temperature, providing the most real-time and accurate data foundation for the battery management system (BMS), which is crucial for implementing precise thermal management strategies and preventing thermal runaway.

[0087] The battery pack temperature monitoring system provided in this application is not simply a stacking of components, but rather a deep integration of "high-reliability sensors" and "high-reliability connection methods," which fundamentally solves the industry pain points of slow response, easy loosening, and poor reliability faced by new energy vehicle battery packs in temperature monitoring, and provides key technical support for improving the safety, lifespan, and energy density of battery packs.

[0088] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working process of the system and apparatus described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0089] Furthermore, in the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0090] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0091] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0092] Finally, it should be noted that the above embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the technical scope disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A resistive patch sensor, characterized in that, include: The shell has an internal cavity for receiving the contents; A thermally and electrically conductive component is inserted into the housing and fixedly connected to the housing to form an integral structure; A thermistor is disposed in the receiving cavity; the signal input terminal of the thermistor is electrically connected to the thermally and electrically conductive component, and the signal output terminal is electrically connected to the conductive terminal. A terminal bracket is fixedly connected to the conductive terminal to form an integral structure; the terminal bracket cooperates with the housing. The thermistor is provided with an insulating coating at the electrical connection between it and the thermally conductive component, and the cavity is filled with an insulating encapsulation to seal the thermistor.

2. The resistive patch sensor according to claim 1, characterized in that, Also includes: A first guide structure is disposed on the inner wall of the housing; The second guide structure is formed on the side wall of the terminal bracket; The first guide structure and the second guide structure are positioned and matched in shape to form a linear conductor pair, so that the terminal bracket can be slidably assembled along the axial direction of the housing.

3. The resistive patch sensor according to claim 2, characterized in that, The first guide structure is a guide rail, and the second guide structure is a dovetail groove that matches the guide rail.

4. The resistive patch sensor according to claim 1, characterized in that, The terminal bracket is also provided with a viewing port, which communicates with the receiving cavity and faces the potting area of ​​the insulating encapsulation.

5. The resistive patch sensor according to claim 4, characterized in that, The viewing port is a window that penetrates the side wall of the terminal bracket, and the inner edge of the viewing port is provided with a flow guide slope.

6. The resistive patch sensor according to claim 1, characterized in that, The thermally and electrically conductive component includes a first plane, a connecting portion, and a second plane connected in sequence; the end of the second plane extends through the side wall of the housing to the receiving cavity; The connecting part is bent at a right angle to the first plane and the second plane.

7. The resistive patch sensor according to claim 6, characterized in that, The second plane has a welding plane at its end, and the signal input terminal of the thermistor is welded to the welding plane.

8. The resistive patch sensor according to claim 6, characterized in that, The radius of the transition arc corresponding to the right-angle bend is at least 1 mm.

9. The resistive patch sensor according to claim 1, characterized in that, The insulating encapsulation body is made of thermally conductive resin adhesive.

10. A battery pack temperature monitoring system, characterized in that, Includes the resistive patch sensor as described in any one of claims 1-9, wherein the thermally conductive and electrically conductive components of the resistive patch sensor are welded to the battery pack.

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