Optical signal transmission device

Abstract

The application relates to an optical signal transmission device. The optical signal transmission device comprises an optical emission module, an optical fiber connection module and an optical receiving module; the optical emission module is integrated on a silicon optical chip; the optical emission module comprises a modulator and a plurality of lasers; the modulator couples received electrical signals and optical signals emitted by the lasers; the modulated optical signals are sent to the optical fiber connection module; the optical fiber connection module sends the modulated optical signals to the optical receiving module; and the optical receiving module outputs to-be-recovered electrical signals based on the modulated optical signals. The optical signal transmission device can save chip manufacturing costs, realize high-bandwidth transmission, and balance transmission performance and costs.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to an optical signal transmission device. Background Technology

[0002] With the development of communication technology, optical communication technology has been widely used in various fields due to its characteristics of large communication capacity and low loss.

[0003] In related technologies, external modulation is typically used to increase the modulation speed of optical signals during transmission, thereby achieving high-speed transmission. However, further increasing the bandwidth in this case would complicate the device structure and lead to higher costs.

[0004] Therefore, in high-speed transmission scenarios, how to provide an optical transmission device that can balance transmission performance and cost is an urgent technical problem to be solved. Utility Model Content

[0005] Therefore, it is necessary to provide an optical signal transmission device that can balance transmission performance and cost to address the aforementioned technical problems.

[0006] In a first aspect, this application provides an optical signal transmission device, which includes: an optical transmitting module, an optical fiber connection module, and an optical receiving module; the optical transmitting module is integrated on a silicon photonics chip;

[0007] The optical transmitting module includes a modulator and multiple lasers. The modulator couples the received electrical signal with the optical signal emitted by each laser and sends the resulting multi-channel modulated optical signal to the fiber optic connection module.

[0008] The fiber optic connection module transmits multiple modulated optical signals to the optical receiving module;

[0009] The optical receiving module outputs the electrical signal to be restored based on multi-channel modulated optical signals.

[0010] In one embodiment, the light receiving module includes: a photoelectric converter and an amplifier;

[0011] The photoelectric converter is connected to the optical fiber connection module and the amplifier respectively, and outputs a current signal based on multi-channel modulated optical signals.

[0012] An amplifier that outputs the electrical signal to be restored based on a current signal.

[0013] In one embodiment, the photoelectric converter includes a lens and a photodetector;

[0014] The lens focuses the multi-channel modulated optical signals output from the fiber optic connection module onto the photodetector.

[0015] A photodetector outputs a current signal based on a multi-channel modulated optical signal obtained by focusing.

[0016] In one embodiment, the amplifier includes a voltage converter and a voltage amplification circuit;

[0017] A voltage converter that outputs a voltage signal based on a current signal;

[0018] A voltage amplifier circuit outputs the electrical signal to be restored based on the voltage signal.

[0019] In one embodiment, the fiber optic connection module includes: a first fiber optic array, a connector, and a second fiber optic array;

[0020] The first fiber array is connected to the optical transmitting module and the connector respectively, and sends multi-modulated optical signals to the fiber optic inlet of the connector;

[0021] The second fiber array is connected to the connector and the optical receiving module respectively, and sends the multi-modulated optical signals output from the fiber outlet of the connector to the optical receiving module.

[0022] In one embodiment, the optical signal transmission device further includes: a digital signal processor and a signal source; the digital signal processor is connected to the signal source and the optical transmitting module respectively;

[0023] The signal source sends the initial electrical signal to the signal processor;

[0024] A digital signal processor outputs an electrical signal based on an initial electrical signal; the electrical signal is used to drive the optical emission module.

[0025] In one embodiment, the optical signal transmission device further includes: a driver; the driver is connected to a digital signal processor and an optical transmitting module, respectively;

[0026] The driver sends electrical signals to the optical emission module.

[0027] In one embodiment, the optical signal transmission device further includes: a digital signal processor; the digital signal processor is connected to the optical receiving module;

[0028] The digital signal processor outputs an initial electrical signal based on the electrical signal to be restored output from the optical receiving module.

[0029] In one embodiment, each laser corresponds to a thermistor and a cooler; both the thermistor and the cooler are connected to the laser.

[0030] Thermistor outputs a temperature feedback electrical signal based on the laser's operating temperature;

[0031] The cooler outputs a temperature regulation signal based on a temperature feedback electrical signal; the temperature regulation signal is used to adjust the operating temperature of the laser.

[0032] In one embodiment, the modulator is an amplitude modulator.

[0033] The aforementioned optical signal transmission device includes: an optical transmitting module, an optical fiber connection module, and an optical receiving module. The optical transmitting module is integrated on a silicon photonics chip. The optical transmitting module includes a modulator and multiple lasers. The modulator couples the received electrical signal with the optical signals emitted by each laser, sending the resulting multi-channel modulated optical signals to the optical fiber connection module. The optical fiber connection module sends the multi-channel modulated optical signals to the optical receiving module. The optical receiving module outputs the electrical signal to be reconstructed based on the multi-channel modulated optical signals. Thus, based on the optical transmitting module including multiple laser modulators, parallel signal transmission by the optical transmitting module is supported. Furthermore, the modulator couples the electrical signal with the optical signals emitted by each laser, achieving high-bandwidth transmission. In addition, the optical transmitting module in the optical signal transmission device is integrated on a silicon photonics chip, facilitating the co-manufacturing of optoelectronic devices and circuits on the silicon photonics chip. Silicon photonics technology is based on mature semiconductor manufacturing processes, resulting in lower manufacturing costs. In summary, using the aforementioned optical signal transmission device can save on chip manufacturing costs while achieving high-bandwidth transmission in high-speed signal transmission scenarios. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of an optical signal transmission device in one embodiment;

[0036] Figure 2 This is a schematic diagram illustrating the optical signal modulation principle of the modulator in one embodiment;

[0037] Figure 3 This is a schematic diagram of the optical signal transmission device in another embodiment;

[0038] Figure 4 This is a schematic diagram of the optical signal transmission device in another embodiment;

[0039] Figure 5 This is a schematic diagram of the optical signal transmission device in another embodiment;

[0040] Figure 6This is a schematic diagram of the optical signal transmission device in another embodiment;

[0041] Figure 7 This is a schematic diagram of the signal transmission direction of an optical signal transmission device in one embodiment;

[0042] Figure 8 This is a front view of an optical signal transmission device in one embodiment;

[0043] Figure 9 This is a top view of an optical signal transmission device in one embodiment;

[0044] Figure 10 This is a top view of an optical signal transmission device in one embodiment;

[0045] Figure 11 This is a schematic diagram of the signal transmission direction of an optical signal transmission system in one embodiment.

[0046] The attached figures are labeled as follows:

[0047] Optical transmitting module 10; laser 11; modulator 12; thermistor 13; cooler 14; optical fiber connection module 20; first optical fiber array 21; connector 22; second optical fiber array 23; optical receiving module 30; photoelectric converter 31; lens 311; photodetector 312; transimpedance amplifier 32; digital signal processor 40; signal source 50; driver 60; base 70; printed circuit board 80; silicon photonics chip 90. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0050] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0052] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0053] In the field of communications, with the continuous increase in data traffic and the ever-increasing demands for transmission speed, the bandwidth requirements for optical signal transmission systems are becoming increasingly higher. In related technologies, external modulation is typically used to increase the modulation speed of optical signals during transmission, thereby achieving high-speed transmission. However, further increasing bandwidth in this case would complicate the device structure and lead to higher costs. Therefore, this application provides an optical signal transmission device that balances transmission performance and cost.

[0054] The technical solution of this application and how it solves the above-mentioned technical problems will be described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.

[0055] Please see Figure 1 , Figure 1This is a schematic diagram of the structure of an optical signal transmission device in an exemplary embodiment. The optical signal transmission device includes: an optical transmitting module 10, an optical fiber connection module 20, and an optical receiving module 30; the optical transmitting module 10 is integrated on a silicon photonics chip 90.

[0056] The optical transmitting module 10 includes a modulator 12 and multiple lasers 11. The modulator 12 couples the received electrical signal with the optical signal emitted by each laser 11 and sends the coupled multi-channel modulated optical signal to the optical fiber connection module 20.

[0057] The fiber optic connection module 20 transmits multiple modulated optical signals to the optical receiving module 30;

[0058] The optical receiving module 30 outputs the electrical signal to be restored based on the multi-channel modulated optical signal.

[0059] exist Figure 1 The optical signal transmission device shown includes an optical transmitting module 10, an optical fiber connection module 20, and an optical receiving module 30. The optical transmitting module 10 is connected to the optical receiving module 30 via the optical fiber connection module 20. The optical transmitting module 10 is integrated onto a silicon photonics chip 90, while the optical fiber connection module 20 is not deployed on the silicon photonics chip 90. In practical applications, the optical transmitting module 10 and the optical receiving module 30 can be collectively referred to as an optical module.

[0060] It should be noted that, based on the integration of the optical emitting module 10 onto the silicon photonics chip 90, this application embodiment does not limit the packaging location of the optical receiving module 30. For example, both the optical emitting module 10 and the optical receiving module 30 may be packaged on a circuit board, with the optical emitting module 10 integrated onto the silicon photonics chip 90 and the optical receiving module 30 not integrated onto the silicon photonics chip 90; or, both the optical emitting module 10 and the optical receiving module 30 may be integrated onto the silicon photonics chip 90, with the silicon photonics chip 90 packaged on a circuit board.

[0061] The optical transmitting module 10 includes multiple lasers 11 and multiple modulators 12. Each laser 11 corresponds to one modulator 12. Each laser 11 emits an optical signal with a different wavelength, and the modulator 12 corresponding to each laser 11 operates in parallel and independently. Each modulator 12 couples the received electrical signal with the optical signal emitted by the corresponding laser 11, outputting a modulated optical signal to the fiber optic connection module 20, such as... Figure 2 As shown, Figure 2 This is a schematic diagram of signal transmission for a single modulator 12. Figure 2 In this process, modulator 12 receives an electrical signal and a corresponding optical signal emitted by laser 11, and outputs a modulated optical signal.

[0062] Optionally, the modulator 12 is an amplitude modulator 12. In this embodiment, the amplitude modulator 12 can be a modulator 12 that realizes the phase difference change of the optical signal based on the electro-optic effect, thereby realizing the amplitude change, or it can be a modulator 12 that uses the electroabsorption effect of semiconductor materials to control the absorption rate of light by current to realize amplitude modulation.

[0063] The optical transmitting module 10 includes four lasers 11 and four modulators 12. Each modulator 12 couples the received electrical signal with the optical signal emitted by the corresponding laser 11 and outputs one modulated optical signal to the optical fiber connection module 20. In this way, the optical transmitting module 10 can receive four electrical signals and output four modulated optical signals to the optical fiber connection module 20.

[0064] The fiber optic connection module 20 transmits the multi-channel modulated optical signals output from the optical transmitting module 10 to the optical receiving module 30. The optical receiving module 30 outputs multiple electrical signals with restoration based on the multi-channel modulated optical signals from the fiber optic connection module 20.

[0065] Optionally, the optical receiving module 30 includes multiple photodiodes arranged in parallel, such as PIN photodiodes, with one photodiode corresponding to each modulated optical signal. For any given photodiode, when the modulated optical signal illuminates the semiconductor PN junction, electron-hole pairs are excited, and a photocurrent is output under an applied bias voltage.

[0066] In a practical transmission scenario, the optical transmitting module 10 receives the electrical signal to be transmitted and outputs an electrical signal; the optical fiber connection module 20 receives the optical signal and outputs an optical signal; and the optical receiving module 30 receives the optical signal and outputs the electrical signal to be restored. It should be noted that both the electrical signal received by the optical transmitting module 10 and the electrical signal output by the optical receiving module 30 contain the content of the original electrical signal, but they are not the same and neither is the original electrical signal. This is because the electrical signal received by the optical transmitting module 10 is a signal transmission-friendly signal, which can be considered as the optical transmission adaptation signal corresponding to the original electrical signal; while the electrical signal transmitted by the optical receiving module 30 is a signal content acquisition-friendly signal, which can be considered as the mapped electrical signal corresponding to the original electrical signal.

[0067] The aforementioned optical signal transmission device includes: an optical transmitting module 10, an optical fiber connection module 20, and an optical receiving module 30. The optical transmitting module 10 is integrated on a silicon photonics chip 90. The optical transmitting module 10 includes a modulator 12 and multiple lasers 11. The modulator 12 couples the received electrical signal with the optical signals emitted by each laser 11, and sends the resulting multi-channel modulated optical signals to the optical fiber connection module 20. The optical fiber connection module 20 sends the multi-channel modulated optical signals to the optical receiving module 30. The optical receiving module 30 outputs the electrical signal to be restored based on the multi-channel modulated optical signals. Thus, based on the optical transmitting module 10 including multiple laser modulators 12, parallel signal transmission of the optical transmitting module 10 is supported. On this basis, the modulator 12 couples the electrical signal with the optical signals emitted by each laser 11 to achieve high-bandwidth transmission. In addition, the optical transmitting module 10 in the optical signal transmission device is integrated on the silicon photonics chip 90, which facilitates the co-manufacturing of optoelectronic devices and circuits on the silicon photonics chip 90. Furthermore, silicon photonics technology is based on mature semiconductor manufacturing processes, resulting in lower manufacturing costs. In summary, by using the aforementioned optical signal transmission device, chip manufacturing costs can be saved while high-bandwidth transmission can be achieved in scenarios requiring high-speed signal transmission.

[0068] Next, the optical receiving module 30 in the optical signal transmission device will be further described.

[0069] Please see Figure 3 , Figure 3 This is a schematic diagram of the structure of an optical signal transmission device in an exemplary embodiment. The optical receiving module 30 includes: a photoelectric converter 31 and an amplifier;

[0070] The photoelectric converter 31 is connected to the optical fiber connection module 20 and the amplifier respectively, and outputs a current signal based on the multi-channel modulated optical signal.

[0071] An amplifier that outputs the electrical signal to be restored based on a current signal.

[0072] Figure 3 In this embodiment, the optical receiving module 30 includes a photoelectric converter 31 and an amplifier. The input end of the photoelectric converter 31 is connected to the output port of the optical fiber connection module 20, and the output end of the photoelectric converter 31 is connected to the input end of the amplifier. In this embodiment, the photoelectric converter 31 sends a corresponding current signal to the amplifier based on the optical signal output from the output port of the optical fiber connection module 20; the amplifier outputs the electrical signal to be restored based on the current signal output by the photoelectric converter 31.

[0073] Figure 3The amplifier in the circuit can be a transimpedance amplifier (TIA), whose core circuit is based on the negative feedback structure of an operational amplifier (op-amp). Utilizing the characteristics of virtual short and virtual open circuits, the potential of the inverting input terminal (virtual ground) of the op-amp is close to 0V, and all the current flows through the feedback resistor to generate the output voltage.

[0074] In this embodiment, the photoelectric converter 31 in the optical receiving module 30 outputs a current signal based on the multi-channel modulated optical signal, and the amplifier outputs the electrical signal to be restored based on the current signal, so as to ensure the consistency of the form of the output signal of the optical receiving module 30 and the received signal of the optical transmitting module 10.

[0075] Please continue reading Figure 3 The photoelectric converter 31 includes a lens 311 and a photodetector 312;

[0076] Lens 311 focuses the multi-channel modulated optical signal output from fiber optic connection module 20 onto photodetector 312;

[0077] The photodetector 312 outputs a current signal based on the multi-channel modulated optical signal obtained by focusing.

[0078] Considering that the optical modulation signal may diverge during transmission, the multi-channel modulated optical signal output by the fiber optic connection module 20 is converged by the lens 311 and presented to the photodetector 312. The lens 311 has positive optical power and can be a single lens or a group of lenses 311 comprising multiple lenses. This application, based on the focusing function of the lens 311, does not limit the number or position of the lenses in the lens 311.

[0079] The photoelectric converter 31 can be equipped with multiple photodetectors 312. Each photodetector 312 outputs a current signal based on a modulated light signal obtained by focusing.

[0080] Optionally, the photodetector 312 can be a photodiode made of a semiconductor PN junction. Its working principle is as follows: when a photon is incident on the PN junction and the energy of the optical signal exceeds the bandgap, electron-hole pairs are excited; under reverse bias, the photogenerated carriers are separated by the electric field to form a photocurrent.

[0081] In this embodiment, lens 311 focuses the multi-channel modulated optical signal output by fiber optic connection module 20 onto photodetector 312, avoiding loss of modulated optical signal during the entire optical signal transmission process, and providing photodetector 312 with a complete modulated optical signal so that photodetector 312 can output a complete and effective current signal based on the multi-channel modulated optical signal obtained by focusing.

[0082] In one exemplary embodiment, the amplifier includes a voltage converter and a voltage amplification circuit;

[0083] A voltage converter that outputs a voltage signal based on a current signal;

[0084] A voltage amplifier circuit outputs the electrical signal to be restored based on the voltage signal.

[0085] In this embodiment, the amplifier includes a voltage converter and a voltage amplification circuit. The input terminal of the voltage converter is connected to the output terminal of the photoelectric converter 31, and the output terminal of the voltage converter is connected to the input terminal of the voltage amplification circuit. The output of the voltage amplification circuit is the output of the light receiving module 30.

[0086] The voltage converter takes a current signal as input and outputs a voltage signal.

[0087] Optionally, the voltage converter may include a current transformer (iron core + primary and secondary windings) and a sampling resistor. Its conversion principle is as follows: the current signal generates a proportional current on the secondary side through electromagnetic induction, which flows through the sampling resistor and is converted into a voltage signal (secondary side sampling), thus realizing the conversion of current signal to voltage signal.

[0088] Optionally, the voltage converter may include an excitation coil, a Hall element, and a sampling resistor. Its conversion principle is as follows: the current signal generates a magnetic field, which acts on the Hall element, and the Hall element outputs a voltage signal based on the Hall effect.

[0089] In this embodiment, the input of the voltage amplifier circuit is a voltage signal, and the output is the electrical signal to be restored (voltage signal). The voltage amplifier circuit can be a non-inverting amplifier circuit based on an operational amplifier, with the voltage signal connected to the input terminal, the inverting input terminal grounded through a resistor, and the output terminal connected to the inverting input terminal through a feedback resistor to obtain the electrical signal to be restored with an amplification factor of 1; or it can be an emitter follower, with the voltage signal input from the base, and the voltage across the emitter resistor being the electrical signal to be restored.

[0090] In this embodiment, the voltage converter outputs a voltage signal based on the current signal, and the voltage amplifier circuit outputs the electrical signal to be restored based on the voltage signal, so that the electrical signal to be restored output by the optical receiving module 30 is compatible with the form of the electrical signal received by the optical transmitting module 10, while increasing the amplitude of the electrical signal, filtering out signal noise, and improving signal transmission performance.

[0091] Next, the fiber optic connection module 20 in the optical signal transmission device will be further explained.

[0092] Please see Figure 4 , Figure 4 This is a schematic diagram of the structure of an optical signal transmission device in an exemplary embodiment. The optical fiber connection module 20 includes: a first optical fiber array 21, a connector 22, and a second optical fiber array 23.

[0093] The first fiber array 21 is connected to the optical transmitting module 10 and the connector 22 respectively, and sends multi-channel modulated optical signals to the fiber optic inlet of the connector 22;

[0094] The second fiber array 23 is connected to the connector 22 and the optical receiving module 30 respectively, and sends the multi-channel modulated optical signal output from the fiber outlet of the connector 22 to the optical receiving module 30.

[0095] A fiber optic array (FA) is an optical device formed by arranging and fixing optical fibers at a certain spacing. It serves as a channel for light to enter and exit the optical device. Common types of fiber optic arrays include conventional FAs, 45° fiber-out FAs, and fiber-to-90° FAs. In the embodiments of this application, the first fiber optic array 21 and the second fiber optic array 23 are of the same type, both being 45° fiber-out arrays.

[0096] The first fiber array 21 receives the multi-channel modulated optical signal output by the optical transmitting module 10 and sends the multi-channel modulated optical signal to the connector 22; the connector 22 sends the multi-channel modulated optical signal from the first fiber array 21 to the second fiber array 23; the second fiber array 23 sends the multi-channel modulated optical signal output by the connector 22 to the optical receiving module 30.

[0097] It should be noted that the number of channels in the first fiber array 21 and the second fiber array 23 is the same, and also the same as the number of channels in the modulated optical signal. Taking the example that the electrical signal includes four channels, that is, the modulated optical signal includes four channels, the first fiber array 21 and the second fiber array 23 are both four-channel fiber arrays.

[0098] Connector 22 refers to a connector 22 used to connect a large number of optical fibers. In the embodiments of this application, connector 22 can be a (Multi-fiber Push On, MPO) multi-core fiber push-pull connector 22 used to connect the first fiber array 21 and the second fiber array 23.

[0099] In this embodiment, the first fiber array 21 sends multiple modulated optical signals to the fiber inlet of the connector 22, and the second fiber array 23 sends multiple modulated optical signals output from the fiber outlet of the connector 22 to the optical receiving module 30. This high-density integrated design converts the complex multi-channel signal transmission into a standardized transmission in the form of an array, simplifying the complexity of the entire optical signal transmission device.

[0100] The foregoing embodiments have explained the conversion principle between optical signals and electrical signals and the transmission process of optical signals in the optical signal transmission device. Next, the source device corresponding to the electrical signal received by the optical transmitter and the transmitting device corresponding to the electrical signal transmitted by the optical receiver will be described.

[0101] Please see Figure 5 , Figure 5 This is a schematic diagram of the structure of an optical signal transmission device in an exemplary embodiment. The optical signal transmission device further includes: a digital signal processor 40 and a signal source 50; the digital signal processor 40 is connected to the signal source 50 and the optical transmitting module 10, respectively.

[0102] Signal source 50 sends the initial electrical signal to the signal processor;

[0103] The digital signal processor 40 outputs an electrical signal based on the initial electrical signal; the electrical signal is used to drive the optical emitting module 10 to work.

[0104] Figure 5 In this circuit, signal source 50 is a device that generates an initial electrical signal. The output of signal source 50 is connected to the port of digital signal processor 40. Signal source 50 sends the initial electrical signal to digital signal processor 40. Digital signal processor 40 sends an electrical signal to optical emitting module 10 based on the initial electrical signal as an electrical signal to be transmitted. This electrical signal is also an indication signal of optical emitting module 10, used to drive optical emitting module 10 to work.

[0105] In practical applications, the digital signal processor 40 (DSP) includes a first filter, which filters the initial electrical signal and outputs an electrical signal to eliminate noise in the initial electrical signal.

[0106] In this embodiment of the application, for the initial electrical signal in the digital processing domain, the signal source 50 sends the initial electrical signal to the signal processor, and the digital signal processor 40 outputs an electrical signal based on the initial electrical signal to drive the optical transmission module 10 to work, so that the electrical signal domain and the electrical transmission domain are more matched.

[0107] Please see Figure 6 , Figure 6 The following is a schematic diagram of the structure of the optical signal transmission device in another exemplary embodiment. The optical signal transmission device further includes: a driver 60; the driver 60 is connected to the digital signal processor 40 and the optical transmitting module 10 respectively; the driver 60 sends electrical signals to the optical transmitting module 10.

[0108] Figure 6 The driver 60 receives electrical signals sent by the digital signal processor 40 and sends electrical signals to the optical transmitting module 10. In this way, the method of sending electrical signals from the digital signal processor 40 to the optical transmitting module 10 via the driver 60 is equivalent to decoupling the signal generation and signal transmission processes compared to the method of the digital signal processor 40 directly sending electrical signals to the optical transmitting module 10. This method is more suitable for long-distance transmission scenarios.

[0109] In one exemplary embodiment, the optical signal transmission device further includes: a digital signal processor 40; the digital signal processor 40 is connected to the optical receiving module 30;

[0110] The digital signal processor 40 outputs an initial electrical signal based on the electrical signal to be restored output by the optical receiver module 30.

[0111] Please continue reading Figure 5 or Figure 6 The schematic diagram shows that the electrical signal to be restored sent by the optical receiving module 30 is sent to the digital signal processor 40. The digital signal processor outputs an initial electrical signal based on the electrical signal to be restored, so as to realize the signal transmission closed loop of the initial electrical signal.

[0112] In practical applications, the digital signal processor 40 includes a second filter. The second filter filters the electrical signal to be restored and outputs the original electrical signal to eliminate noise in the electrical signal to be restored. The digital signal processor 40 may also include a clock recovery circuit. The phase-locked loop circuit in the clock recovery circuit extracts the clock from the electrical signal to be restored, eliminates jitter, and outputs the initial electrical signal.

[0113] In this embodiment, the digital signal processor 40 outputs an initial electrical signal based on the electrical signal to be restored output by the optical receiving module 30, so as to eliminate the loss and distortion of the signal to be restored during the optical signal transmission process and improve the transmission quality of the electrical signal.

[0114] In an exemplary embodiment, each laser 11 corresponds to a thermistor 13 and a cooler 14; the thermistor 13 and the cooler 14 are both connected to the laser 11.

[0115] Thermistor 13 outputs a temperature feedback electrical signal based on the operating temperature of laser 11;

[0116] The cooler 14 outputs a temperature regulation signal based on the temperature feedback electrical signal; the temperature regulation signal is used to regulate the operating temperature of the laser 11.

[0117] The thermistor 13 is a monitoring element whose resistance decreases as the temperature increases. In this embodiment, the thermistor 13 outputs a temperature feedback signal based on the operating temperature of the laser 11, and the temperature feedback signal can be a voltage signal.

[0118] The cooler 14 includes multiple P-type and N-type semiconductor thermocouple pairs. When a direct current flows through it, one end of the thermocouple pair absorbs heat (cold end) and the other end releases heat (hot end). The direction of the current determines the position of the cold / hot ends. Specifically, when the current flows from the P-type to the N-type, the cold end absorbs heat and the hot end dissipates heat, which is the cooling mode; when the current flows from the N-type to the P-type, the cold end becomes the hot end and the hot end becomes the cold end, which is the heating mode.

[0119] In practical applications, the thermistor 13 is mounted on the laser 11 to sense the operating temperature of the laser 11 in real time. Based on the operating temperature of the laser 11, it sends a temperature feedback electrical signal to the cooler 14. The laser 11 is mounted on the cooler 14, and the cooler 14 outputs a temperature regulation signal based on the temperature feedback electrical signal output by the thermistor 13. The temperature regulation signal can be in the direction of current. For example, if the current direction is positive, the junction between the cooler 14 and the laser 11 absorbs heat, reducing the operating temperature of the laser 11; if the current direction is positive, the junction between the cooler 14 and the laser 11 heats up, increasing the operating temperature of the laser 11.

[0120] In this embodiment, the thermistor 13 outputs a temperature feedback electrical signal based on the operating temperature of the laser 11 to sense the operating temperature of the laser 11 in real time, and the cooler 14 outputs a temperature adjustment signal based on the temperature feedback electrical signal to achieve precise control of the operating temperature of the laser 11 and ensure the normal operation of the laser 11.

[0121] In one exemplary embodiment, such as Figure 7 As shown, Figure 7 This is a schematic diagram of the signal transmission direction of an optical signal transmission device in one embodiment. The original electrical signal can be a 4-channel PAM4 (4-Level Pulse Amplitude Modulation) electrical signal. The gold finger sends the original electrical signal to the digital signal processor 40. The digital signal processor 40 outputs the electrical signal to be transmitted based on the original electrical signal. The driver 60 sends the electrical signal to be transmitted to the modulator 12 in the optical transmitting module 10. Multiple modulators 12 couple the electrical signal to be transmitted with the optical signal emitted by the corresponding laser 11 to output multiple modulated optical signals. The first fiber array 21 sends the multiple modulated optical signals to the connector 22. The connector 22 sends the multiple modulated optical signals to the second fiber array 23. The lens 311 in the optical receiving module 30 focuses the multiple modulated optical signals output by the second fiber array 23. The photodetector 312 outputs multiple current signals based on the focused multiple modulated optical signals. The transimpedance amplifier 32 outputs the electrical signal to be restored based on the multiple current signals. The digital signal processing unit outputs the original electrical signal based on the electrical signal to be restored, completing the signal transmission closed loop.

[0122] In one exemplary embodiment, the silicon photonics chip 90 in the optical signal transmission device is deployed on a printed circuit board (PCB), which is connected to a tungsten copper base 70, such as... Figure 8 As shown, Figure 8 This is a schematic diagram showing the positions of the tungsten copper base 70 and the printed circuit board 80.

[0123] Further, see Figure 9 , Figure 9 This is a three-dimensional schematic diagram of an optical signal transmission device. Figure 9 The system includes a printed circuit board 80, a digital signal processor 40 (DSP), a silicon photonics chip 90, a thermistor 13, a laser 11 (Chip On Carrier, COC), a cooler 14 (Thermo Electric Cooler, TEC), a transimpedance amplifier 32 (Transimpedance Amplifier, TIA), and a photodetector 312. The photodetector 312 can be a photodiode (PD), a first fiber array 21, a second fiber array 23, a tungsten copper base 70, etc. The tungsten copper base 70 is bonded to the printed circuit board 80. The cooler 14 and the silicon photonics chip 90 are mounted on the tungsten copper base 70. The thermistor 13 is mounted on the laser 11, and the laser 11 is mounted on the cooler 14. The lens 311 couples light onto the silicon photonics chip 90. The transimpedance amplifier 32 and the photodiode are mounted on the printed circuit board 80. The optical signal from the optical transmitting module 10 (TX end) is coupled through the first fiber array 21 to the fiber-to-connector 22 (MPO), and the optical signal from the optical receiving module 30 (RX end) is coupled to the photodiode through the second fiber array 23 at a 45-degree angle. Please refer to [link to relevant documentation]. Figure 10 , Figure 10 This is a partial enlarged view of the optical signal transmission device. Figure 10 The lens 311 in the optical signal transmission device described herein is used to couple the multi-channel modulated optical signal output from the fiber optic array assembly to the photodiode.

[0124] In one exemplary embodiment, an O-Band DWDM system is used for network distribution, and silicon photonics technology is applied to O-Band DWDM modules, such as... Figure 11 As shown, Figure 11 This is a schematic diagram of a signal transmission system. Figure 11 The system comprises four optical modules (4*400G QSFP-DD DWDM4). Each module includes an optical transmitter and an optical receiver. The four optical signals emitted by the four modules (each optical signal consists of four optical signals) are transmitted through a multiplexer (MUX) via optical fiber, and then processed by a demultiplexer (DEMUX) before being delivered to the optical modules. Furthermore, before the demultiplexer processing, a semiconductor optical amplifier (SOA) can be configured to amplify the optical signals according to the specific requirements of the scenario.

[0125] Those skilled in the art will understand that Figure 1-11 The structure shown is merely a block diagram of a portion of the structure related to the solution of this application and does not constitute a limitation on the optical module product to which the solution of this application is applied. Specific optical module products may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0126] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0127] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. An optical signal transmission device, characterized in that, The optical signal transmission device includes: an optical transmitting module, an optical fiber connection module, and an optical receiving module; the optical transmitting module is integrated on a silicon photonic chip. The optical transmitting module includes a modulator and multiple lasers. The modulator couples the received electrical signal with the optical signal emitted by each of the lasers and sends the resulting multi-channel modulated optical signal to the optical fiber connection module. The optical fiber connection module transmits the multi-channel modulated optical signals to the optical receiving module; The optical receiving module outputs the electrical signal to be restored based on the multi-channel modulated optical signal.

2. The optical signal transmission device according to claim 1, characterized in that, The optical receiving module includes: a photoelectric converter and an amplifier; The photoelectric converter is connected to the optical fiber connection module and the amplifier respectively, and outputs a current signal based on the multi-channel modulated optical signal; The amplifier outputs the electrical signal to be restored based on the current signal.

3. The optical signal transmission device according to claim 2, characterized in that, The photoelectric converter includes: a lens and a photodetector; The lens focuses the multi-channel modulated optical signal output from the optical fiber connection module onto the photodetector; The photodetector outputs the current signal based on the multi-channel modulated optical signal obtained by focusing.

4. The optical signal transmission device according to claim 2, characterized in that, The amplifier includes a voltage converter and a voltage amplification circuit; The voltage converter outputs a voltage signal based on the current signal; The voltage amplification circuit outputs the electrical signal to be restored based on the voltage signal.

5. The optical signal transmission device according to any one of claims 1-4, characterized in that, The optical fiber connection module includes: a first optical fiber array, a connector, and a second optical fiber array; The first fiber array is connected to the optical transmitting module and the connector respectively, and transmits the multi-channel modulated optical signal to the fiber inlet of the connector; The second fiber array is connected to the connector and the optical receiving module respectively, and sends the multi-modulated optical signal output from the fiber outlet of the connector to the optical receiving module.

6. The optical signal transmission device according to any one of claims 1-4, characterized in that, The optical signal transmission device further includes: a digital signal processor and a signal source; the digital signal processor is connected to the signal source and the optical transmitting module respectively; The signal source sends the initial electrical signal to the signal processor; The digital signal processor outputs the electrical signal based on the initial electrical signal; the electrical signal is used to drive the optical emitting module to work.

7. The optical signal transmission device according to claim 6, characterized in that, The optical signal transmission device further includes a driver; the driver is connected to the digital signal processor and the optical transmitting module respectively. The driver sends the electrical signal to the optical emitting module.

8. The optical signal transmission device according to any one of claims 1-4, characterized in that, The optical signal transmission device further includes: a digital signal processor; the digital signal processor is connected to the optical receiving module; The digital signal processor outputs an initial electrical signal based on the electrical signal to be restored output by the optical receiving module.

9. The optical signal transmission device according to any one of claims 1-4, characterized in that, Each laser corresponds to a thermistor and a cooler; both the thermistor and the cooler are connected to the laser. The thermistor outputs a temperature feedback electrical signal based on the operating temperature of the laser. The cooler outputs a temperature adjustment signal based on the temperature feedback electrical signal; the temperature adjustment signal is used to adjust the operating temperature of the laser.

10. The apparatus according to any one of claims 1-4, characterized in that, The modulator is an amplitude modulator.

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