Circuit board aluminum alloy heat sink

Abstract

The utility model discloses a circuit board aluminum alloy cooling fin, including the heat dissipation fin board, the top of heat dissipation fin board is provided with the detachable heat dissipation fin of equidistance arrangement's several, the bottom fixedly connected with heat dissipation fin of heat dissipation fin board installs dovetail, the position of heat dissipation fin board and corresponding dovetail is equipped with dovetail groove matched with dovetail, the utility model discloses a dovetail groove on heat dissipation fin bottom setting dovetail and the cooperation of heat dissipation fin board, has realized the convenient sliding installation and dismounting, has greatly promoted the dismounting convenience, simultaneously, utilizes the cooperation of the clamping assembly on heat dissipation fin board and dovetail groove bottom draw -in slot, through connecting spring drive sliding card bar, ensures the stability of heat dissipation fin installation, in addition, through opening the sealing decoration cover of accommodation groove bottom and pull the connecting slide bar can easily dismount heat dissipation fin, has simplified maintenance process, has improved the maintainability and service life of equipment.

Description

Technical Field

[0001] This utility model relates to the field of circuit board heat sink technology, and in particular to an aluminum alloy heat sink for circuit boards. Background Technology

[0002] In the field of electronic devices, circuit boards are core components, and their stability and heat dissipation performance directly affect the operating efficiency and lifespan of the entire device. With the rapid development of electronic technology, the integration of components on circuit boards is becoming increasingly higher, leading to a corresponding increase in heat generation. Therefore, effective heat dissipation solutions are crucial for ensuring the stable operation of circuit boards.

[0003] Aluminum alloy heat sinks are a common heat dissipation component, widely used in circuit board heat dissipation due to their excellent thermal conductivity and processing performance. However, existing aluminum alloy heat sink designs often have some shortcomings, especially in the assembly and disassembly of the heat sink fins. Traditionally, heat sink fins are fixedly connected to the heat sink substrate using methods such as welding or riveting. While this connection method is robust, in actual use, when the heat sink fins become dusty, damaged, or require upgrades, the assembly and disassembly process becomes extremely cumbersome and may even damage the heat sink substrate or circuit board, increasing maintenance costs and time. Utility Model Content

[0004] The purpose of this invention is to provide an aluminum alloy heat sink for a circuit board. By setting a dovetail tenon at the bottom of the heat sink fins and engaging it with a dovetail groove on the heat sink fin plate, convenient sliding installation and disassembly are achieved, greatly improving the ease of assembly and disassembly. At the same time, by utilizing the engagement component on the heat sink fin plate and the engagement groove at the bottom of the dovetail groove, a connecting spring drives the sliding rod to engage with the groove, ensuring the stability of the heat sink fin installation. In addition, the heat sink fins can be easily disassembled by opening the sealing decorative cover at the bottom of the receiving groove and pulling the connecting slide rod, simplifying the maintenance process and improving the maintainability and service life of the equipment.

[0005] To achieve the above objectives, the main technical solutions adopted by this utility model include:

[0006] An aluminum alloy heat sink for a circuit board includes:

[0007] The heat dissipation fins are provided with a number of detachable heat dissipation fins arranged at equal intervals on the top of the heat dissipation fins, and dovetail tenons for mounting the heat dissipation fins and the heat dissipation fins are fixedly connected to the bottom of the heat dissipation fins. A dovetail groove matching the dovetail tenon is provided on the heat dissipation fins at the position corresponding to the position of the dovetail tenon.

[0008] The aforementioned aluminum alloy heat sink for the circuit board includes a snap-fit ​​assembly for locking the dovetail tenon on the heat sink fin, and a slot at the bottom of the dovetail tenon that cooperates with the snap-fit ​​assembly.

[0009] In the aforementioned aluminum alloy heat sink for circuit boards, the snap-fit ​​assembly includes a receiving groove formed at the bottom of the heat sink fins, and a sliding latch rod that matches the snap-fit ​​groove is slidably connected to the top of the receiving groove.

[0010] In the aforementioned aluminum alloy heat sink for the circuit board, a connecting slide rod is fixedly connected to the bottom of the sliding lever, and connecting springs are fixedly connected to both sides of the top of the connecting slide rod, with the other end of the connecting springs fixedly connected to the inner wall of the receiving groove.

[0011] In the aforementioned aluminum alloy heat sink for circuit boards, both sides of the connecting slide rod are fixedly connected to limit sliders, and the inner wall of the receiving groove is provided with a limit groove that matches the limit slider at the position corresponding to the limit slider.

[0012] In the aforementioned aluminum alloy heat sink for the circuit board, the limiting slider moves through the limiting groove on the side near the limiting groove and extends into the interior of the limiting groove, where it is slidably connected to the inner wall of the limiting groove.

[0013] In the aforementioned aluminum alloy heat sink for circuit boards, a sealing decorative cover matching the receiving groove is provided at the bottom of the heat sink fins and at the position corresponding to the receiving groove.

[0014] This utility model has at least the following beneficial effects:

[0015] 1. This utility model realizes an aluminum alloy heat sink for circuit boards. By setting a dovetail tenon at the bottom of the heat sink fins and cooperating with the dovetail groove on the heat sink fin plate, convenient sliding installation and disassembly are realized, which greatly improves the convenience of disassembly and assembly. At the same time, by utilizing the cooperation between the snap-fit ​​component on the heat sink fin plate and the snap-fit ​​groove at the bottom of the dovetail groove, the sliding snap rod is driven by the connecting spring to snap into the snap-fit ​​groove, ensuring the stability of the heat sink fin installation. In addition, the heat sink fins can be easily removed by opening the sealing decorative cover at the bottom of the receiving groove and pulling the connecting slide rod, simplifying the maintenance process and improving the maintainability and service life of the equipment.

[0016] 2. This utility model features a dovetail tenon at the bottom of the heat dissipation fins, which, together with the dovetail groove on the heat dissipation fin plate, enables convenient sliding installation between the heat dissipation fins and the heat dissipation fin plate. This design simplifies and speeds up the installation and removal of the heat dissipation fins, eliminating the need for complex tools or operations and significantly reducing maintenance costs and time.

[0017] 3. A snap-fit ​​assembly is installed on the heat dissipation fins. This assembly works with the slots at the bottom of the dovetail groove. The connecting spring on the snap-fit ​​assembly drives the sliding latch to snap into the corresponding slot, thus ensuring the stability of the heat dissipation fins installation. This design not only ensures the stability of the heat dissipation fins during normal use, but also prevents loosening or detachment due to vibration or external forces.

[0018] 4. When it is necessary to disassemble the heat sink fins for cleaning, replacement, or upgrade, simply open the sealed decorative cover at the bottom of the receiving slot and pull the sliding lever using the connecting slide rod. This will disengage the sliding lever from the corresponding slot, allowing the dovetail tenon at the bottom of the heat sink fin to be easily slid off from the dovetail groove on the heat sink fin plate. This design simplifies the maintenance process of the heat sink fins, improving the maintainability and service life of the equipment. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0020] Figure 1 This is a schematic diagram of the aluminum alloy heat sink for the circuit board of this utility model;

[0021] Figure 2 This is a cross-sectional structural diagram of the aluminum alloy heat sink for the circuit board of this utility model.

[0022] Figure 3 This is a schematic diagram of the heat dissipation fins in the aluminum alloy heat sink of the circuit board of this utility model;

[0023] Figure 4 This is a schematic diagram of the heat dissipation fins in the aluminum alloy heat sink of the circuit board of this utility model;

[0024] Figure 5 This utility model Figure 3 A magnified schematic diagram of the structure at point A in the middle.

[0025] Explanation of icon numbers:

[0026] 1. Heat dissipation fins; 2. Heat dissipation plates;

[0027] 201. Dovetail tenon; 2011. Dovetail groove;

[0028] 3. Snap-fit ​​assembly; 301. Snap-fit ​​slot;

[0029] 202. Receiving groove; 2021. Connecting spring; 2022. Connecting slide rod; 2023. Sliding latch;

[0030] 203. Limiting slider; 2031. Limiting groove; 204. Sealing decorative cover. Detailed Implementation

[0031] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0032] Please refer to Figures 1 to 5 As shown, an embodiment of the present invention provides a circuit board aluminum alloy heat sink, comprising: a heat sink 1, a plurality of detachable heat sink fins 2 arranged at equal intervals on the top of the heat sink fin 1, a dovetail tenon 201 for mounting the heat sink fins 2 and the heat sink fin 1 fixedly connected to the bottom of the heat sink fins 2, and a dovetail groove 2011 matching the dovetail tenon 201 is provided on the heat sink fin 1 at the position corresponding to the position of the dovetail tenon 201.

[0033] By adopting the above technical solution, the dovetail tenon 201 at the bottom of the heat dissipation fin 2 cooperates with the dovetail groove 2011 on the heat dissipation fin plate 1, realizing convenient sliding installation and disassembly, greatly improving the ease of assembly and disassembly; at the same time, by utilizing the cooperation between the snap-fit ​​component 3 on the heat dissipation fin plate 1 and the snap-fit ​​groove 301 at the bottom of the dovetail groove 2011, the sliding snap-fit ​​rod 2023 is driven by the connecting spring 2021 to snap into the snap-fit ​​groove 301, ensuring the stability of the heat dissipation fin 2 installation; in addition, the heat dissipation fin 2 can be easily disassembled by opening the sealing decorative cover 204 at the bottom of the receiving groove 202 and pulling the connecting slide rod 2022, simplifying the maintenance process and improving the maintainability and service life of the equipment.

[0034] To ensure a secure installation between the heat dissipation fins 2 and the heat dissipation plate 1, in this embodiment: a locking assembly 3 for locking the dovetail tenon 201 is installed on the heat dissipation plate 1. The bottom of the dovetail tenon 201 has a slot 301 that cooperates with the locking assembly 3. The locking assembly 3 includes a receiving groove 202 at the bottom of the heat dissipation plate 1. A sliding locking rod 2023 matching the slot 301 is slidably connected to the top of the receiving groove 202. The bottom of the sliding locking rod 2023 is fixedly connected to... The connecting slide rod 2022 has connecting springs 2021 fixedly connected to both sides of its top. The other end of the connecting spring 2021 is fixedly connected to the inner wall of the receiving groove 202. When the dovetail tenon 201 of the heat dissipation fin 2 slides into the dovetail groove 2011 of the heat dissipation fin plate 1, the sliding locking rod 2023 of the locking assembly 3 can be locked into the locking groove 301, thereby ensuring the stable installation of the heat dissipation fin 2 on the heat dissipation fin plate 1 and preventing loosening or falling off due to vibration or external force.

[0035] To improve the sliding stability and durability of the snap-fit ​​assembly 3, in this embodiment: both sides of the connecting slide rod 2022 are fixedly connected to limit sliders 203. The inner wall of the receiving groove 202 is provided with a limit groove 2031 that matches the limit slider 203. The side of the limit slider 203 near the limit groove 2031 moves through the limit groove 2031 and extends into the interior of the limit groove 2031, slidingly connecting with the inner wall of the limit groove 2031. Through the cooperation between the limit slider 203 and the limit groove 2031, the sliding trajectory of the sliding snap rod 2023 is restricted, improving its sliding stability and durability, and reducing wear or displacement caused by long-term use.

[0036] To facilitate the maintenance and repair of the snap-fit ​​assembly 3, in this embodiment, a sealing decorative cover 204 matching the receiving groove 202 is provided at the bottom of the heat dissipation fin plate 1 and at the position corresponding to the receiving groove 202. By providing the sealing decorative cover 204, the snap-fit ​​assembly 3 in the receiving groove 202 can be easily maintained and repaired, while protecting the snap-fit ​​assembly 3 from external factors such as dust and moisture, thus extending its service life.

[0037] The working principle of this utility model is as follows: a dovetail tenon 201 is provided at the bottom of the heat dissipation fin 2, and a dovetail groove 2011 is correspondingly provided on the heat dissipation fin plate 1, realizing convenient sliding installation between the heat dissipation fin 2 and the heat dissipation fin plate 1. At the same time, a snap-fit ​​component 3 is innovatively provided on the heat dissipation fin plate 1. This component cooperates with the snap-fit ​​groove 301 at the bottom of the dovetail groove 2011. Utilizing the elasticity of the connecting spring 2021 inside the snap-fit ​​component 3, the sliding snap rod 2023 is driven into the snap-fit ​​groove 301, thereby ensuring a stable connection between the heat dissipation fin plate 1 and the heat dissipation fin 2. When it is necessary to disassemble the heat dissipation fin 2, simply open the sealing decorative cover 204 at the bottom of the receiving groove 202, and easily pull the sliding snap rod 2023 through the connecting slide rod 2022 to disengage it from the snap-fit ​​groove 301. Then, the dovetail tenon 201 at the bottom of the heat dissipation fin 2 can be easily slid out of the dovetail groove 2011 of the heat dissipation fin plate 1, completing the disassembly process. This design not only improves the ease of installation and removal of heat sink fins 2, but also ensures the stability of installation and the convenience of maintenance.

[0038] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the present invention's conception through the foregoing teachings or related technical or knowledge. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A circuit board aluminum alloy heat sink, comprising heat dissipation fins (1), characterized in that, The top of the heat dissipation fin (1) is provided with a plurality of detachable heat dissipation fins (2) arranged at equal intervals. The bottom of the heat dissipation fins (2) is fixedly connected with dovetail tenons (201) for installing the heat dissipation fins (2) and the heat dissipation fin (1). The heat dissipation fin (1) is provided with dovetail grooves (2011) that match the dovetail tenons (201) at the position corresponding to the dovetail tenons (201).

2. The aluminum alloy heat sink for a circuit board according to claim 1, characterized in that: The heat dissipation fins (1) are equipped with a locking assembly (3) for locking the dovetail tenon (201), and the bottom of the dovetail tenon (201) is provided with a slot (301) that cooperates with the locking assembly (3).

3. The aluminum alloy heat sink for the circuit board according to claim 2, characterized in that: The snap-fit ​​assembly (3) includes a receiving groove (202) formed at the bottom of the heat dissipation fin (1), and a sliding snap rod (2023) that matches the snap-fit ​​groove (301) is slidably connected to the top of the receiving groove (202).

4. The aluminum alloy heat sink for a circuit board according to claim 3, characterized in that: The bottom of the sliding lever (2023) is fixedly connected to a connecting slide rod (2022), and both sides of the top of the connecting slide rod (2022) are fixedly connected to connecting springs (2021), and the other end of the connecting springs (2021) is fixedly connected to the inner wall of the receiving groove (202).

5. The aluminum alloy heat sink for a circuit board according to claim 4, characterized in that: Both sides of the connecting slide rod (2022) are fixedly connected to limit sliders (203), and the inner wall of the receiving groove (202) is provided with a limit groove (2031) that matches the limit slider (203) at the position corresponding to the limit slider (203).

6. The aluminum alloy heat sink for a circuit board according to claim 5, characterized in that: The limiting slider (203) moves through the limiting groove (2031) on the side near the limiting groove (2031) and extends into the interior of the limiting groove (2031), where it is slidably connected to the inner wall of the limiting groove (2031).

7. The aluminum alloy heat sink for a circuit board according to claim 6, characterized in that: A sealing decorative cover (204) matching the receiving groove (202) is provided at the bottom of the heat dissipation fin (1) and at the position corresponding to the receiving groove (202).

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