Positioning navigation mainboard
By designing a heat dissipation enhancement structure and an anti-detachment structure on the positioning and navigation motherboard, the problems of poor chip heat dissipation and unstable antenna connector connection are solved, achieving more efficient heat dissipation and signal transmission.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN ZHUO CHUANG INTELLIGENT TECH CO LTD
- Filing Date
- 2025-06-26
- Publication Date
- 2026-06-23
AI Technical Summary
Existing positioning and navigation motherboard chips have poor heat dissipation and insufficient antenna connector connection stability, which affects equipment operation and signal transmission.
A heat dissipation enhancement structure and an anti-detachment structure were designed to improve the chip heat dissipation effect and the connection stability of the antenna connector through components such as mounting brackets and fixing brackets.
It improves the chip's heat dissipation, preventing high temperatures from affecting operation, and enhances the connection stability of the antenna connector, ensuring the stability of signal transmission.
Smart Images

Figure CN224401739U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of motherboards, and in particular to a positioning and navigation type motherboard. Background Technology
[0002] A positioning and navigation motherboard is a motherboard specifically designed for positioning and navigation systems. It typically integrates satellite navigation modules such as GPS, BeiDou, and GLONASS, as well as related communication interfaces and processing chips. This positioning and navigation motherboard is mainly used in scenarios that require precise location services, such as vehicle navigation, drone positioning, intelligent transportation systems, and IoT devices.
[0003] This positioning and navigation motherboard has a built-in high-precision positioning module, supports multiple satellite navigation systems, integrates multiple communication interfaces for easy connection with other devices, features a low-power design suitable for mobile devices, supports real-time positioning data acquisition and processing, and some models also support map display and route planning functions. Sometimes it includes an IMU (Inertial Measurement Unit) sensor to improve positioning accuracy and stability.
[0004] This positioning and navigation motherboard is a hardware platform specifically developed to achieve precise positioning and navigation functions, and it is the core component of positioning and navigation devices.
[0005] However, existing positioning and navigation motherboards have certain drawbacks. First, the heat dissipation of the chips on the motherboard is poor, which can easily affect the operation of the chips. Second, the connection stability of the antenna connector on the motherboard is poor, and the antenna connector is easy to fall off the motherboard.
[0006] Therefore, it is necessary to propose a positioning and navigation motherboard to solve the above problems. Utility Model Content
[0007] The main objective of this invention is to provide a positioning and navigation motherboard that can effectively solve the problems in the background technology.
[0008] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0009] A positioning and navigation motherboard includes a motherboard body, an mounting hole on the outer wall of the motherboard body, a wiring groove on one side of the front end of the motherboard body, an antenna connector on the other side of the front end of the motherboard body, an anti-detachment structure on the outer wall of the antenna connector, a chip in the middle of the front end of the motherboard body, and a heat dissipation enhancement structure on the outer surface of the front end of the chip.
[0010] Preferably, the heat dissipation enhancement structure includes a protective pad, a heat sink, a connecting frame, a mounting frame, a heat dissipation base, a thermally conductive pad, and mounting screws. The mounting frame has mounting screws on its outer wall, a connecting frame is provided on one outer surface of the mounting frame, a heat dissipation base is provided on one outer surface of the connecting frame, a heat sink is provided on the front outer surface of the heat dissipation base, a protective pad is provided on the outer wall of the heat sink, and a thermally conductive pad is provided on the rear outer surface of the heat dissipation base.
[0011] Preferably, the anti-fall-off structure includes a clamping frame, a fixing rod, a fixing bracket, a fixing bolt, an anti-slip pad, and a connecting rod. The inner wall of the clamping frame is provided with an anti-slip pad, one outer surface of the clamping frame is provided with a connecting rod, the outer wall of the connecting rod is provided with a fixing bolt, the outer rear end of the connecting rod is provided with a fixing rod, and the outer wall of the fixing rod is provided with a fixing bracket.
[0012] Preferably, the outer wall of the mounting bracket is detachably connected to the outer wall of the mounting screw; one outer surface of the mounting bracket is fixedly connected to one outer surface of the connecting bracket; the other outer surface of the connecting bracket is fixedly connected to the outer wall of the heat sink base; the front outer surface of the heat sink base is fixedly connected to the rear outer surface of the heat sink; the outer wall of the heat sink is fixedly connected to the outer wall of the protective pad; the rear outer surface of the heat sink base is fixedly connected to the front outer surface of the thermal pad; and the rear outer surface of the mounting bracket is detachably connected to the front outer surface of the motherboard body via mounting screws.
[0013] Preferably, the inner wall of the clamping frame is fixedly connected to the outer wall of the anti-slip pad, one side of the outer surface of the clamping frame is fixedly connected to one end of the outer surface of the connecting rod, one end of the outer surface of the fixing bolt passes through the inner wall of the connecting rod and is detachably connected to the outer wall of the fixing rod, the rear end of the connecting rod is detachably connected to the front end of the fixing rod, the outer wall of the fixing rod is fixedly connected to one end of the outer surface of the fixing frame, and the rear end of the fixing frame is detachably connected to one side of the front end of the main board body.
[0014] Preferably, one front end of the motherboard body is fixedly connected to the outer surface of the rear end of the wiring slot, the other front end of the motherboard body is fixedly connected to the outer surface of one end of the antenna connector, and the middle front end of the motherboard body is fixedly connected to the outer surface of the rear end of the chip.
[0015] Compared with the prior art, the present invention provides a positioning and navigation motherboard, which has the following beneficial effects:
[0016] This positioning and navigation motherboard features a heat dissipation enhancement structure. When in use, the heat sink can be mounted to the front of the chip using a mounting bracket and screws, ensuring the thermal pad is in close contact with the outer wall of the chip. Heat from the outer wall of the chip can be transferred to the heat sink through the thermal pad and the heat sink. This heat dissipation enhancement structure increases the chip's heat dissipation area, thereby improving the chip's heat dissipation effect and preventing high temperatures from affecting the chip's operation.
[0017] This positioning and navigation motherboard features an anti-detachment structure. During installation, a fixing rod can be mounted onto the motherboard body using a fixing bracket, and a connecting rod can be mounted onto the fixing rod using fixing bolts. This clamping bracket is then secured to the outer wall of the antenna connector, limiting and fixing the antenna connector. This anti-detachment structure improves the connection stability of the antenna connector on the motherboard, preventing the antenna connector from falling off the motherboard and affecting the transmission of motherboard signals. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0019] Figure 2 This is a partial structural schematic diagram of the present invention.
[0020] Figure 3 This utility model Figure 1 A schematic diagram of the heat dissipation enhancement structure 5.
[0021] Figure 4 This utility model Figure 1 A schematic diagram of the anti-detachment structure 7.
[0022] In the diagram: 1. Mainboard body; 2. Wiring slot; 3. Mounting hole; 4. Chip; 5. Heat dissipation reinforcement structure; 6. Antenna connector; 7. Anti-drop structure; 51. Protective pad; 52. Heat sink; 53. Connecting bracket; 54. Mounting bracket; 55. Heat dissipation base; 56. Thermal pad; 57. Mounting screw; 71. Clamping bracket; 72. Fixing rod; 73. Fixing bracket; 74. Fixing bolt; 75. Anti-slip pad; 76. Connecting rod. Detailed Implementation
[0023] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0024] like Figure 1-4As shown, a positioning and navigation motherboard includes a motherboard body 1, an mounting hole 3 on the outer wall of the motherboard body 1, a wiring groove 2 on one side of the front end of the motherboard body 1, an antenna connector 6 on the other side of the front end of the motherboard body 1, an anti-detachment structure 7 on the outer wall of the antenna connector 6, a chip 4 in the middle of the front end of the motherboard body 1, and a heat dissipation enhancement structure 5 on the outer surface of the front end of the chip 4.
[0025] like Figure 1 , Figure 3 As shown, the heat dissipation enhancement structure 5 includes a protective pad 51, a heat sink 52, a connecting bracket 53, a mounting bracket 54, a heat dissipation base 55, a thermally conductive pad 56, and mounting screws 57. The mounting bracket 54 has mounting screws 57 on its outer wall, a connecting bracket 53 on one outer surface of the mounting bracket 54, a heat dissipation base 55 on one outer surface of the connecting bracket 53, a heat sink 52 on the front outer surface of the heat dissipation base 55, a protective pad 51 on the outer wall of the heat sink 52, and a thermally conductive pad 56 on the rear outer surface of the heat dissipation base 55.
[0026] like Figure 1 , Figure 4 As shown, the anti-fall-off structure 7 includes a clamping frame 71, a fixing rod 72, a fixing bracket 73, a fixing bolt 74, an anti-slip pad 75, and a connecting rod 76. The inner wall of the clamping frame 71 is provided with an anti-slip pad 75, one outer surface of the clamping frame 71 is provided with a connecting rod 76, the outer wall of the connecting rod 76 is provided with a fixing bolt 74, the outer surface of the rear end of the connecting rod 76 is provided with a fixing rod 72, and the outer wall of the fixing rod 72 is provided with a fixing bracket 73.
[0027] like Figure 1 , Figure 3 As shown, the outer wall of the mounting bracket 54 is detachably connected to the outer wall of the mounting screw 57. One outer surface of the mounting bracket 54 is fixedly connected to one outer surface of the connecting bracket 53. The other outer surface of the connecting bracket 53 is fixedly connected to the outer wall of the heat sink base 55. The front outer surface of the heat sink base 55 is fixedly connected to the rear outer surface of the heat sink 52. The outer wall of the heat sink 52 is fixedly connected to the outer wall of the protective pad 51. The rear outer surface of the heat sink base 55 is fixedly connected to the front outer surface of the thermal pad 56. The rear outer surface of the mounting bracket 54 is detachably connected to the front outer surface of the motherboard body 1 via the mounting screw 57.
[0028] like Figure 1 , Figure 4As shown, the inner wall of the clamping frame 71 is fixedly connected to the outer wall of the anti-slip pad 75, one side of the outer surface of the clamping frame 71 is fixedly connected to one end of the outer surface of the connecting rod 76, one end of the outer surface of the fixing bolt 74 passes through the inner wall of the connecting rod 76 and is detachably connected to the outer wall of the fixing rod 72, the rear end of the outer surface of the connecting rod 76 is detachably connected to the front end of the fixing rod 72, the outer wall of the fixing rod 72 is fixedly connected to one end of the outer surface of the fixing frame 73, and the rear end of the outer surface of the fixing frame 73 is detachably connected to one side of the front end of the main board body 1.
[0029] like Figure 1 , Figure 2 As shown, one front side of the main board body 1 is fixedly connected to the outer surface of the rear end of the wiring slot 2, the other front side of the main board body 1 is fixedly connected to the outer surface of one end of the antenna connector 6, and the middle front part of the main board body 1 is fixedly connected to the outer surface of the rear end of the chip 4.
[0030] Working principle
[0031] This utility model is a positioning and navigation motherboard. During installation, the motherboard body 1 is installed into a fixed area through the mounting holes 3, and then the wiring and antenna are connected to the wiring slot 2 and antenna connector 6 respectively, thus completing the installation of the entire positioning and navigation motherboard. Its heat dissipation enhancement structure 5 allows the heat sink 55 to be installed onto the front end of the chip 4 using the mounting bracket 54 and mounting screws 57, ensuring the thermal pad 56 is in close contact with the outer wall of the chip 4. Heat from the outer wall of the chip 4 can be transferred to the heat sink 52 through the thermal pad 56 and the heat sink 55. This heat dissipation enhancement... The robust structure 5 increases the heat dissipation area of the chip 4, thereby improving the heat dissipation effect of the chip 4 and preventing high temperature from affecting the operation of the chip. The anti-detachment structure 7 is set up so that when installing the positioning and navigation motherboard, the fixing rod 72 can be installed on the motherboard body 1 through the fixing bracket 73, and then the connecting rod 76 can be installed on the fixing rod 72 through the fixing bolt 74, so that the clamping bracket 71 is stuck on the outer wall of the antenna connector 6, and the antenna connector 6 is limited and fixed. This anti-detachment structure 7 can improve the connection stability of the antenna connector 6 on the motherboard and prevent the antenna connector 6 from falling off the motherboard and affecting the transmission of the motherboard signal.
[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A positioning and navigation type main plate comprising a main plate body (1), characterized in that: The outer wall of the main body (1) of the motherboard is provided with mounting holes (3), a wiring groove (2) is provided on one side of the front end of the main body (1), an antenna connector (6) is provided on the other side of the front end of the main body (1), an anti-detachment structure (7) is provided on the outer wall of the antenna connector (6), a chip (4) is provided in the middle of the front end of the main body (1), and a heat dissipation enhancement structure (5) is provided on the outer surface of the front end of the chip (4).
2. The positioning and navigation motherboard according to claim 1, characterized in that: The heat dissipation enhancement structure (5) includes a protective pad (51), a heat sink (52), a connecting frame (53), a mounting frame (54), a heat dissipation base (55), a thermally conductive pad (56), and mounting screws (57). The mounting frame (54) has mounting screws (57) on its outer wall. The mounting frame (54) has a connecting frame (53) on one side of its outer surface. The connecting frame (53) has a heat dissipation base (55) on one side of its outer surface. The heat dissipation base (55) has a heat sink (52) on its front outer surface. The heat sink (52) has a protective pad (51) on its outer wall. The heat dissipation base (55) has a thermally conductive pad (56) on its rear outer surface.
3. The positioning and navigation motherboard according to claim 1, characterized in that: The anti-fall-off structure (7) includes a clamping frame (71), a fixing rod (72), a fixing bracket (73), a fixing bolt (74), an anti-slip pad (75), and a connecting rod (76). The inner wall of the clamping frame (71) is provided with an anti-slip pad (75). A connecting rod (76) is provided on one outer surface of the clamping frame (71). A fixing bolt (74) is provided on the outer wall of the connecting rod (76). A fixing rod (72) is provided on the outer surface of the rear end of the connecting rod (76). A fixing bracket (73) is provided on the outer wall of the fixing rod (72).
4. The positioning and navigation motherboard according to claim 2, characterized in that: The outer wall of the mounting bracket (54) is detachably connected to the outer wall of the mounting screw (57). One side of the outer surface of the mounting bracket (54) is fixedly connected to one side of the outer surface of the connecting bracket (53). The other side of the outer surface of the connecting bracket (53) is fixedly connected to the outer wall of the heat sink base (55). The front end outer surface of the heat sink base (55) is fixedly connected to the rear end outer surface of the heat sink (52). The outer wall of the heat sink (52) is fixedly connected to the outer wall of the protective pad (51). The rear end outer surface of the heat sink base (55) is fixedly connected to the front end outer surface of the thermal pad (56). The rear end outer surface of the mounting bracket (54) is detachably connected to the front end outer surface of the motherboard body (1) via the mounting screw (57).
5. The positioning and navigation motherboard according to claim 3, characterized in that: The inner wall of the clamping frame (71) is fixedly connected to the outer wall of the anti-slip pad (75). One side of the outer surface of the clamping frame (71) is fixedly connected to one end of the outer surface of the connecting rod (76). One end of the outer surface of the fixing bolt (74) passes through the inner wall of the connecting rod (76) and is detachably connected to the outer wall of the fixing rod (72). The rear end outer surface of the connecting rod (76) is detachably connected to the front end outer surface of the fixing rod (72). The outer wall of the fixing rod (72) is fixedly connected to one end of the outer surface of the fixing frame (73). The rear end outer surface of the fixing frame (73) is detachably connected to one side of the front end of the main board body (1).
6. The positioning and navigation motherboard according to claim 1, characterized in that: The front end of the main body (1) is fixedly connected to the outer surface of the rear end of the wiring slot (2), the other front end of the main body (1) is fixedly connected to the outer surface of one end of the antenna connector (6), and the middle front end of the main body (1) is fixedly connected to the outer surface of the rear end of the chip (4).