High-precision dip-coating patching machine
By installing a baffle between the nozzle socket and the air passage to isolate the vacuum suction, and combining it with a flip adjustment module and a tilt adjustment component, the problem of chip displacement caused by vacuum suction in the adhesive application machine is solved, thereby improving the placement accuracy and positioning precision of the materials.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 中科光智(重庆)科技有限公司
- Filing Date
- 2025-06-10
- Publication Date
- 2026-06-23
Smart Images
Figure CN224401981U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip mounting technology, specifically to a high-precision adhesive-dipped chip mounting machine. Background Technology
[0002] A chip mounter is a device used to precisely mount chips onto printed circuit boards (or other materials). It works by applying adhesive (usually epoxy resin or conductive silver paste) to the material and then mounting the chip onto it to secure and electrically connect the chip.
[0003] The adhesive-coated chip mounter mainly includes a loading / unloading module, a substrate motion platform module, a material transfer module, an adhesive-coating module, and a mounting module. During operation, the loading / unloading module transports the substrate requiring adhesive coating to the substrate motion platform module. The substrate motion platform module then transports the substrate to the material transfer module. The material transfer module's nozzles transfer the material from the substrate to the adhesive coating station. The adhesive-coating module then coats the material with adhesive, and the mounting module performs the bonding process. After bonding, the material is picked up by the nozzles of the material transfer module and transported back to the substrate motion platform module. The substrate motion platform module then transports the material to the loading / unloading module, completing the adhesive coating and bonding process.
[0004] In existing adhesive-coated chip mounters, after the material is coated and mounted, the material transfer module's nozzle needs to transfer the chip-attached material out. During the transfer process, the nozzle of the material transfer module needs to exert a certain force on the chip on the material. In existing technology, the nozzle uses vacuum suction to pick up the material. Since the chip has just been coated and mounted and is not yet firmly attached to the material, the vacuum suction at this time will cause the chip on the material to shift, resulting in a decrease in the placement accuracy of the chip on the material. Utility Model Content
[0005] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is: how to provide a high-precision adhesive application machine that can both ensure the adsorption effect on materials and reduce the probability of chip displacement caused by vacuum suction.
[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0007] A high-precision adhesive applicator includes a machine body with a material transfer module mounted on it. The material transfer module includes a mounting frame fixedly mounted on the machine body. A first power component is also mounted on the mounting frame. The power output end of the first power component is connected to a suction nozzle. The suction nozzle includes a nozzle seat, a tube seat, and a partition. The nozzle seat has a vacuum hole and an air passage. The air passage communicates with the vacuum hole, which is used to connect to an external vacuuming device. The partition is connected to the tube seat and installed inside the air passage. There is a gap between the partition and the air passage, and the other end of the tube seat connected to the partition extends out of the nozzle seat.
[0008] The working principle of this utility model is as follows: When the adhesive-coated chip-mounting machine of this solution is in use, after the material has been coated and plated, the material transfer module needs to transfer the material with the chip attached through the suction nozzle. At the same time, the external vacuum device performs vacuum treatment on the inside of the suction nozzle through the vacuum hole and air channel. Simultaneously, the first power component drives the suction nozzle to move and pick up the material. Under atmospheric pressure, the material is adsorbed on the suction nozzle. Since this solution sets a partition between the tube seat and the air channel, the partition isolates the vacuum air channel from the tube seat that directly adsorbs the material. This not only ensures the adsorption effect of the tube seat on the material, but also greatly reduces the force generated by the vacuum on the tube seat. This also greatly reduces the possibility of the chip on the material being displaced by the vacuum suction, thus improving the placement accuracy of the chip on the material.
[0009] Preferably, the machine body is further provided with a flip adjustment module, which includes a flip component and a tilt adjustment component. The flip component is mounted on the tilt adjustment component. The flip component includes a flip motor and a flip block. The flip motor is mounted on the tilt adjustment component through a motor mounting base, and the flip block is connected to the rotating shaft of the flip motor so that the flip block can be rotated by the rotation of the flip motor. A material placement slot is provided on the flip block for placing materials.
[0010] In this way, by setting up a flipping component, when adhesive patching is required on the side of the material, the material transfer module first transfers the material to the flipping adjustment module. The rotation of the flipping motor drives the flipping block to rotate, and the rotation of the flipping block further rotates the material, ensuring that the side of the material to be adhesive patched faces the adhesive component. The material placement slot on the flipping block prevents the material from falling off after flipping. Since the material may have different angular errors in the X direction when placed on the flipping adjustment module, a tilting adjustment component is added to this solution, and the flipping component is installed on the tilting adjustment component. The tilting movement of the tilting adjustment component is used to adjust the angular error of the material, thereby correcting the placement error during the material transfer process.
[0011] Preferably, the first power component is a linear motor, which is mounted at an angle on the mounting bracket.
[0012] Preferably, the machine body is further provided with a substrate motion platform module, which includes a mounting base, a substrate axial motion component, a substrate first longitudinal motion component, a substrate second longitudinal motion component, a movable base, and a placement platform. The mounting base is connected to the machine body. The flip adjustment module, the placement platform, and the substrate second longitudinal motion component are all disposed on the movable base. The placement platform is used to place the substrate.
[0013] The fixing member of the substrate axial movement component is disposed on the mounting base, and the moving member of the substrate axial movement component is connected to the moving base so as to drive the moving base to move axially through the substrate axial movement component. The fixing member of the substrate first longitudinal movement component is connected to the moving base, and the moving member of the substrate first longitudinal movement component is connected to the flipping adjustment module so as to drive the flipping adjustment module to move axially and longitudinally through the substrate axial movement component and the substrate first longitudinal movement component.
[0014] The fixing member of the second longitudinal motion component of the substrate is connected to the movable seat, and the movable member of the second longitudinal motion component of the substrate is connected to the placement platform, so that the placement platform can be driven to move along the axial and longitudinal directions by the substrate axial motion component and the substrate second longitudinal motion component.
[0015] In this way, by setting up an axial motion component and a first longitudinal motion component on the substrate to drive the flip-adjustment module to move axially and longitudinally, respectively, the substrate on the flip-adjustment module is moved to the corresponding position. Simultaneously, multiple materials are placed on each substrate. After one material has completed the adhesive application process, the second longitudinal motion component on the substrate moves the placement platform longitudinally a predetermined distance to move the next material requiring adhesive application to the position corresponding to the material transfer module, so that the next material can be applied for adhesive application. This completes the continuous adhesive application process for materials at different positions on the substrate, further improving the efficiency of adhesive application.
[0016] Preferably, the machine body is further provided with a loading and unloading module, which includes a feeding component, a first axial movement component and a first vertical movement component. The feeding component includes a feeding plate and a plurality of feeding boxes arranged along the axial direction. The feeding boxes are provided with a plurality of feeding slots in the vertical direction. The feeding slots are used to place a substrate, and a plurality of materials are placed on the substrate.
[0017] The fixing part of the first axial motion component is connected to the machine body, the moving part of the first axial motion component is connected to the fixing part of the first vertical motion component, and the moving part of the first vertical motion component is connected to the feeding component, so that the feeding component can be driven to move axially and vertically by the first axial motion component and the first vertical motion component respectively.
[0018] In this way, the unloading module's feeding assembly is used to place substrates. The design of multiple feeding boxes and multiple feeding slots on the feeding boxes can achieve the purpose of placing multiple substrates. When it is necessary to move a substrate to the substrate motion platform module, it is only necessary to align the corresponding substrate with the position of the feeding module. Since multiple substrates are placed on the feeding assembly, a first vertical motion assembly and a first axial motion assembly are provided. When it is necessary to move substrates at different positions to the feeding module, the movement of the first vertical motion assembly and the first axial motion assembly drives the movement of the feeding assembly, thereby aligning the substrates at different positions on the feeding assembly with the positions of the feeding module, achieving the purpose of conveying substrates at different positions to the substrate motion platform module for adhesive application and bonding.
[0019] Preferably, the machine body is further provided with a feeding module, which includes a push rod and a first longitudinal motion component. The fixing part of the first longitudinal motion component is connected to the machine body, and the moving part of the first longitudinal motion component is connected to the push rod, so that the push rod can be driven to move longitudinally through the first longitudinal motion component. During the longitudinal movement, the push rod can extend into the feeding groove and abut against the substrate at the corresponding position. The longitudinal movement of the push rod will transport the substrate at the corresponding position in the feeding groove to the substrate motion platform module.
[0020] In this way, the push rod is used to abut against the substrate at the corresponding position. After the push rod abuts against the substrate at the corresponding position, the first longitudinal motion component drives the push rod to move continuously in the longitudinal direction, so that the push rod pushes the substrate at the corresponding position away from the feeding component and moves to the substrate motion platform module. Attached Figure Description
[0021] Appendix Figure 1 This is a schematic diagram of the overall structure of the high-precision adhesive applicator of this utility model;
[0022] Appendix Figure 2 This is a top view of the high-precision adhesive applicator of this utility model;
[0023] Appendix Figure 3 This is a schematic diagram of the material transfer module in the high-precision adhesive applicator of this utility model;
[0024] Appendix Figure 4 This is a cross-sectional view of the nozzle in the high-precision adhesive applicator of this utility model;
[0025] Appendix Figure 5 This is a schematic diagram of the loading and unloading module in the high-precision adhesive applicator of this utility model;
[0026] Appendix Figure 6 This is a partially enlarged schematic diagram of the material feeding box in the high-precision adhesive applicator of this utility model;
[0027] Appendix Figure 7 This is a schematic diagram of the feeding module in the high-precision adhesive applicator of this utility model;
[0028] Appendix Figure 8 This is a schematic diagram of the substrate motion platform module and the flipping adjustment module in the high-precision adhesive application machine of this utility model;
[0029] Appendix Figure 9 This is a schematic diagram of the structure of the flipping component in the high-precision adhesive applicator of this utility model after it has been flipped at a certain angle;
[0030] Appendix Figure 10 This is a schematic diagram of the wafer motion platform in the high-precision adhesive-coating and bonding machine of this utility model;
[0031] Appendix Figure 11 This is a schematic diagram of the adjustment mechanism in the high-precision adhesive applicator of this utility model;
[0032] Appendix Figure 12 for Figure 11 Enlarged diagram of point A in the middle.
[0033] Appendix Figure 13 This is a schematic diagram of the installation structure of the material handling head and the patching head in the high-precision adhesive-coating patch machine of this utility model;
[0034] Appendix Figure 14 This is a schematic diagram of the structure of the patch head in the high-precision adhesive patch machine of this utility model;
[0035] Appendix Figure 15 This is a schematic diagram of the adhesive application module in the high-precision adhesive application machine of this utility model;
[0036] Appendix Figure 16 This is a structural schematic diagram of the adhesive dispensing tray assembly and the adhesive scraper head assembly in the high-precision adhesive dispensing and patching machine of this utility model from one perspective.
[0037] Appendix Figure 17 This is a structural schematic diagram of the adhesive dispensing tray assembly and the adhesive scraper head assembly in the high-precision adhesive dispensing and patching machine of this utility model from another perspective.
[0038] Appendix Figure 18 This is a schematic diagram of the movement of the adhesive dispensing head in the high-precision adhesive dispensing and patching machine of this utility model.
[0039] Explanation of reference numerals in the attached drawings: 1. Body; 2. Adhesive application module; 2. Adhesive application head; 201. Adhesive application head moving parts; 202. Adhesive disc rotation motor; 203. Drive wheel; 204. Transmission belt; 205. Driven wheel; 206. Adhesive disc rotation shaft; 207. Adhesive disc; 208. Adhesive scraper head; 209. Adhesive scraper head linear guide rail; 210. Preload spring; 211. Adjustment knob; 212. Substrate motion platform module; 3. Mounting base; 301. Moving base; 302. Substrate axial motion assembly; 303. Substrate first longitudinal motion assembly; 304. Substrate second longitudinal motion assembly; 305. Placement platform; 306. Patch module; 4. Wafer motion platform; 401. Wafer motion platform longitudinal motion assembly; 402. Wafer motion platform axial motion assembly; 403. Adjustment motor; 404. Transfer platform. 405. Pick-up head; 406. Placement head; 407. Second axial motion assembly; 408. Second vertical motion assembly; 409. Linear micro motor; 410. Spring sheet; 411. Feeding module; 5. First longitudinal motion assembly; 501. Push rod; 502. Loading / unloading module; 6. First axial motion assembly; 601. First vertical motion assembly; 602. Discharge plate; 603. Discharge box; 604. Material transfer module; 7. Mounting bracket; 701. Downward vision module; 702. Suction nozzle; 703. Suction nozzle seat; 7031. Vacuum hole; 7032. Air passage; 7033. Partition; 7034. Tube seat; 7035. Tilting adjustment module; 8. Tilt adjustment assembly; 801. Tilting assembly; 802. Tilting motor; 8021. Tilting block; 8022. Substrate; 9. Material; 10. Detailed Implementation
[0040] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0041] As attached Figure 1 and attached Figure 2 As shown in the figure, a high-precision adhesive-dip bonding machine is provided in this specific embodiment, including a machine body 1. The machine body 1 is provided with a substrate motion platform module 3, a material transfer module 7, a flip adjustment module 8, an adhesive-dip module 2, a bonding module 4, a loading and unloading module 6, and a feeding module 5.
[0042] The substrate motion platform module 3 is used to place the substrate to be dipped in adhesive and to transport the material on the substrate to the corresponding position of the material transfer module 7; the material transfer module 7 is used to obtain the material from the substrate of the substrate motion platform module 3 and place the material on the flip adjustment module 8; the flip adjustment module 8 is used to flip the material and transport the material to the corresponding positions of the adhesive dipping module 2 and the patching module 4; the adhesive dipping module 2 is used to dip the material on the flip adjustment module 8 in adhesive; the patching module 4 is used to patch the material on the flip adjustment module 8; the loading and unloading module 6 is used to place multiple substrates to be dipped in adhesive or substrates that have been dipped in adhesive and patched; the feeding module 5 is used to sequentially transport the substrates on the loading and unloading module 6, which contains multiple substrates to be dipped in adhesive and patched, to the substrate motion platform module 3.
[0043] The specific structure of each module is explained in detail below:
[0044] In this specific embodiment, as shown in the appendix Figure 3 and attached Figure 4 As shown, the material transfer module 7 includes a mounting frame 701, which is fixedly mounted on the machine body 1. A first power component is also provided on the mounting frame 701. In this specific embodiment, the first power component is a linear motor, which is tilted and mounted on the mounting frame 701. A downward vision module 702 is also provided on the mounting frame 701. The power output end of the first power component is connected to a suction nozzle 703. The first power component is used to drive the suction nozzle 703 to absorb material. The suction nozzle 703 includes a suction nozzle seat. 7031, tube seat 7035, and partition plate 7034. The nozzle seat 7031 has a vacuum hole 7032 and an air passage 7033. The air passage 7033 communicates with the vacuum hole 7032. The vacuum hole 7032 is used to connect with an external vacuuming device. The partition plate 7034 is installed in the air passage 7033 after being connected to the tube seat 7035. There is a gap between the partition plate 7034 and the air passage 7033. The other end of the tube seat 7035 connected to the partition plate 7034 extends out of the nozzle seat 7031. Thus, when the material with the chip attached needs to be transferred out by the suction nozzle 703 of the material transfer module 7, the external vacuum device performs vacuuming treatment on the inside of the suction nozzle through the vacuum hole 7032 and the air channel 7033. At the same time, the first power component drives the suction nozzle 703 to move and suck up the material. Under atmospheric pressure, the material is adsorbed on the suction nozzle 703. Since this solution sets a partition 7034 between the tube seat 7035 and the air channel 7033, the partition 7034 is used to isolate the vacuuming air channel from the tube seat 7035 that directly adsorbs the material. This can not only ensure the adsorption effect of the tube seat 7035 on the material, but also greatly reduce the force generated by the vacuuming on the tube seat 7035. This also greatly reduces the possibility of the chip on the material being displaced by the vacuum suction, and improves the placement accuracy of the chip on the material.
[0045] In this specific embodiment, as shown in the appendix Figure 5 and attached Figure 6 As shown, the loading / unloading module 6 includes a feeding assembly, a first axial motion assembly 601, and a first vertical motion assembly 602. The feeding assembly includes a feeding plate 603 and multiple feeding boxes 604 arranged axially. Multiple feeding slots are arranged vertically on the feeding boxes 604, and the feeding slots are used to place substrates 9, on which multiple materials 10 are placed. The first vertical motion assembly 602 drives the feeding assembly to move vertically, and the first axial motion assembly 601 drives the feeding assembly to move axially. Through the vertical and axial movements of the feeding assembly, the feeding module 5 is aligned with substrates 9 at different positions, and the feeding module 5 transports substrates 9 from different positions to the substrate motion platform module 3. The feeding assembly of the loading / unloading module 6 is used to place substrates. The design of multiple feeding boxes 604 and multiple feeding slots on the feeding boxes 604 can achieve the purpose of placing multiple substrates. When it is necessary to move a substrate to the substrate motion platform module 3, it is only necessary to align the corresponding substrate with the position of the feeding module 5. Since multiple substrates are placed on the feeding assembly, a first vertical motion assembly 602 and a first axial motion assembly 601 are provided. When substrates at different positions need to be moved to the feeding module 5, the movement of the first vertical motion assembly 602 and the first axial motion assembly drives the movement of the feeding assembly, thereby aligning the substrates at different positions on the feeding assembly with the positions of the feeding module 5, achieving the purpose of conveying substrates at different positions to the substrate motion platform module 3 for adhesive application and mounting. The first axial motion assembly 601 and the first vertical motion assembly 602 respectively achieve linear motion in the axial and vertical directions. This linear motion can be achieved using a linear motor and linear guide rail structure, or a slider and guide rail structure, etc. These structural forms for achieving linear motion are all existing technologies. For those skilled in the art, the specific structure can be selected according to actual design needs. Moreover, the implementation of this linear structure does not have a substantial impact on the solution of this utility model and is not a technical solution that needs to be protected by this utility model. Therefore, it will not be discussed in detail in this utility model.
[0046] In this embodiment, as shown in the appendix Figure 7As shown, the feeding module 5 includes a guide block, a push rod 502, and a first longitudinal motion component 501. The push rod 502 is connected to the first longitudinal motion component 501 and passes through the guide block. The first longitudinal motion component 501 drives the push rod 502 to move longitudinally under the guidance of the guide block. During the longitudinal movement, the push rod 502 can extend into the feeding slot and abut against the substrate at the corresponding position. The longitudinal movement of the push rod 502 transports the substrate at the corresponding position in the feeding slot to the substrate motion platform module 3. The push rod 502 abuts against the substrate at the corresponding position. After the push rod 502 abuts against the substrate at the corresponding position, the first longitudinal motion component 501 drives the push rod 502 to continue moving in the longitudinal direction, so that the push rod 502 pushes the substrate at the corresponding position away from the feeding component and moves it to the substrate motion platform module 3. During the longitudinal movement, the guide block can guide the push rod 502, so that the push rod 502 moves in a set direction. The first longitudinal motion component 501 realizes linear motion in the longitudinal direction. Its specific structural form can also be selected from the existing technology according to the design needs, so it will not be described in detail in this solution.
[0047] In this embodiment, as shown in the appendix Figure 8As shown, the substrate motion platform module 3 includes a mounting base 301, a substrate axial motion component 303, a substrate first longitudinal motion component 304, a substrate second longitudinal motion component 305, a moving base 302, and a placement platform 306. The flip adjustment module 8, the placement platform 306, and the substrate second longitudinal motion component 305 are all mounted on the moving base 302, and the placement platform 306 is used to place the substrate. The substrate axial motion component 303 is used to drive the moving base 302 to move axially, and the substrate first longitudinal motion component 304 is used to drive the flip adjustment module 8 on the moving base 302 to move longitudinally. The substrate axial motion component 303 and the substrate first longitudinal motion component 304 jointly drive the flip adjustment module 8 to move axially and longitudinally. The substrate second longitudinal motion component 305 is connected to the placement platform 306 and is used to drive the placement platform 306 to move vertically. The substrate axial motion component 303 and the substrate second longitudinal motion component 305 jointly drive the placement platform 306 to move axially and longitudinally. By setting the substrate axial motion component 303 and the substrate first longitudinal motion component 304 to drive the flip adjustment module 8 to perform axial and longitudinal movements respectively, the substrate on the flip adjustment module 8 is moved to the corresponding position. Simultaneously, multiple materials are placed on each substrate. After one material completes the adhesive application process, the substrate second longitudinal motion component 305 drives the placement platform 306 to move longitudinally a set distance, moving the next material on the substrate that needs adhesive application to the position corresponding to the material transfer module 7, so that the next material can be applied. This completes the continuous adhesive application process for materials at different positions on the substrate, further improving the efficiency of adhesive application. Similarly, as mentioned above, the substrate axial motion component 303, substrate first longitudinal motion component 304, and substrate second longitudinal motion component 305 can also be selected from existing technologies based on actual design needs, using relevant linear motion structures.
[0048] In this embodiment, as shown in the appendix Figure 8 and attached Figure 9As shown, the tilt adjustment module 8 includes a tilt component 802 and a tilt adjustment component 801. The tilt component 802 is mounted on the tilt adjustment component 801, and the tilt adjustment component 801 adopts a mature slide module in the prior art. The tilt component 802 includes a tilt motor 8021 and a tilt block 8022. The tilt motor 8021 is mounted on the tilt adjustment component 801 through a motor mounting bracket, and the tilt block 8022 is connected to the rotating shaft of the tilt motor 8021 so that the rotation of the tilt motor 8021 drives the tilt block 8022 to rotate. A material placement groove is provided on the tilt block 8022. The material placement groove is used to place materials, and the materials are always kept in the material placement groove during the rotation of the tilt block 8022. When adhesive patching is required on the side of the material, the material transfer module first transfers the material to the flipping adjustment module 8. The rotation of the flipping motor 8021 drives the flipping block 8022 to rotate, further rotating the material so that the side of the material requiring adhesive patching faces the adhesive application component. The material placement slot on the flipping block 8022 prevents the material from falling after flipping. Since the material may have different angle errors in the X direction when placed on the flipping adjustment module 8, a tilt adjustment component 801 is added to this solution, and the flipping component 802 is installed on the tilt adjustment component 801. The tilting movement of the tilt adjustment component 801 is used to adjust the angle error of the material, thereby correcting the placement error during the material transfer process.
[0049] In this embodiment, as shown in the appendix Figure 10 To the attached Figure 13As shown, the chip mounting module 4 includes a pick-up mechanism, an adjustment mechanism, and a chip mounting mechanism. The pick-up mechanism includes a pick-up head 406, a wafer motion platform 401, a wafer motion platform axial motion component 403, a wafer motion platform longitudinal motion component 402, and a wafer positioning vision system. The wafer motion platform 401 is used to place the chip to be mounted. The wafer motion platform axial motion component 403 is used to drive the wafer motion platform 401 to move axially, and the wafer motion platform longitudinal motion component 402 is used to drive the wafer motion platform 401 to move longitudinally, so as to drive the chip to move axially and longitudinally through the wafer motion platform 401. The pick-up head 406 is used to pick up the chip from the wafer motion platform 401 and place it at the adjustment mechanism. The wafer positioning vision system is used to perform visual positioning of the chip on the wafer motion platform 401, and the adjustment mechanism is used to adjust the position of the chip placed by the pick-up head 406. The chip mounting mechanism is used to pick up the chip after position adjustment from the adjustment mechanism and move the chip to the material position of the flip adjustment module 8 for chip mounting. A wafer motion platform 401 is used to place the chip to be mounted. The axial motion component 403 and the longitudinal motion component 402 of the wafer motion platform drive the platform 401 to move axially and longitudinally, respectively, facilitating position adjustment and thus enabling chip positioning on the platform 401 to better meet usage requirements in different situations. Simultaneously, after the pick-up head 406 retrieves the chip from the wafer motion platform 401, it is first placed at the adjustment mechanism. The adjustment mechanism adjusts the chip's position to ensure accuracy before the mounting mechanism moves the chip to the material area of the flip adjustment module 8 for mounting. This ensures accurate chip positioning during mounting.
[0050] In this embodiment, the adjustment mechanism includes a transfer platform 405, an adjustment motor 404, a vision component on the transfer platform, and a vision component below the transfer platform. The transfer platform 405 is used to place the chip. The shaft of the adjustment motor 404 is connected to the transfer platform 405 so that the rotation of the adjustment motor 404 drives the transfer platform 405 to rotate, thereby adjusting the position of the chip. The vision component on the transfer platform is located directly above the transfer platform 405 and is used to acquire visual images of the chip on the transfer platform 405 from directly above. The vision component below the transfer platform is located directly below the transfer platform 405 and is used to acquire visual images of the chip on the transfer platform 405 from directly below. When the pick-up head 406 moves the chip onto the transfer platform 405, the chip's position may be slightly off. In this case, the rotation of the motor 404 is adjusted to drive the transfer platform 405 to rotate, thereby adjusting the chip's position and ensuring that the chip mounting module 4 can acquire the chip in the correct position, guaranteeing proper bonding to the material. By setting up vision components on and below the transfer platform, visual images of the chip on the transfer platform 405 are captured. These images are then sent to the backend image processing program. By comparing the captured image with a standard image, the chip's position can be determined. When a deviation exists between the captured image and the standard image, the rotation of the motor 404 is controlled to drive the transfer platform 405, thereby adjusting the chip's position.
[0051] As attached Figure 14As shown, in this embodiment, the patching mechanism includes a patching head 407 and a second vertical motion component 409. The patching head 407 is mounted on the second vertical motion component 409, and the second vertical motion component 409 is mounted on the body 1 via a second axial motion component 408, so that the patching head 407 can perform vertical and axial movements respectively under the action of the second vertical motion component 409 and the second axial motion component 408. Inside the patching head 407, there is also a linear micro motor 410 and two spring sheets 411 parallel to each other in the vertical direction, and the linear micro motor 410 can drive the spring sheets 411 to deform in the vertical direction. In this way, when the chip placement mechanism is working, the placement head 407 first picks up the chip from the transfer platform 405 through axial movement, then obtains the position data of the material through vision, and controls the placement head 407 to move axially to directly above the material through the second axial movement component 408. Then, the second vertical movement component 409 controls the placement head 407 to slide vertically, so that the placement head 407 quickly approaches the material. When the distance between the chip picked up by the placement head 407 and the material reaches the set micro distance, the second vertical movement component 409 stops moving. At this point, the linear micro-motor 410 drives the spring sheet 411 to deform. Since the two parallel spring sheets 411 inside the patch head 407 are equivalent to two springs with specific stiffness, the magnitude of the bonding force can be controlled by the vertical displacement of the linear micro-motor 410. In addition, the two parallel spring sheets 411 can ensure that the displacement direction of the patch head 407 remains unchanged in the vertical direction, and the vertical micro-motion is achieved by the deformation of the spring sheets 411, which can avoid the uneven wear of the traditional slide rail rolling elements under micro-motion.
[0052] In this embodiment, as shown in the appendix Figure 15 To the attached Figure 18 As shown, the adhesive dipping module 2 includes an adhesive dipping mounting base, an adhesive dipping head assembly, an adhesive dipping tray assembly, and an adhesive scraper head assembly. All three assemblies are mounted on the adhesive dipping mounting base. The adhesive dipping tray assembly holds the adhesive, the adhesive scraper head assembly adjusts the thickness of the adhesive in the tray assembly, and the adhesive dipping head assembly applies the adhesive from the tray assembly to the material application area for adhesive treatment. In use, the adhesive dipping module 2 holds the required amount of adhesive in the tray assembly. The adhesive scraper head assembly adjusts the thickness of the adhesive in the tray assembly according to the material's adhesive requirements, and then the adhesive dipping head assembly applies the adhesive from the tray assembly to the material to complete the adhesive dipping process.
[0053] In this embodiment, the adhesive dipping head assembly includes an adhesive dipping head 201 and an adhesive dipping head moving component 202. The adhesive dipping head moving component 202 is used to drive the adhesive dipping head 201 to move between the adhesive dipping tray assembly and the material, so that the adhesive dipping head 201 can dip the adhesive in the adhesive dipping tray assembly onto the material patch. The adhesive dipping tray assembly includes an adhesive tray 208 and an adhesive tray rotating component. The adhesive tray 208 is used to hold adhesive, and the adhesive tray rotating component is used to drive the adhesive tray 208 to rotate, so that the adhesive dipping head 201 can pick up adhesive from different positions in the adhesive tray 208 by rotating the adhesive tray 208. The adhesive scraping head assembly includes an adhesive scraping head 209 and an adhesive scraping head adjusting component. The adhesive scraping head 209 extends into the adhesive tray 208 to limit the thickness of the adhesive in the adhesive tray 208. The adhesive scraping head adjusting component is used to adjust the position of the adhesive scraping head 209 extending into the adhesive tray 208, so that the thickness of the adhesive in the adhesive tray 208 can be adjusted by adjusting the position of the adhesive scraping head 209. The glue tray 208 within the glue tray assembly is used to hold glue, while the glue tray rotating component drives the glue tray 208 to rotate. During the glue dipping process, the glue tray rotating component drives the glue tray 208 to rotate, allowing the glue dipping head 201 to pick up glue from different positions within the glue tray 208, thus meeting the glue dipping requirements of the glue dipping head 201. When dipping different types of materials, the required glue thickness varies. In this case, the glue scraper head adjusting component adjusts the position of the scraper head 209 within the glue tray 208, thereby adjusting the glue thickness within the glue tray 208 to better meet the glue dipping needs of different materials. The adhesive dipping head moving component 202 drives the adhesive dipping head 201 to move. First, it moves the adhesive dipping head 201 to the adhesive tray 208 for dipping. Then, it moves upwards away from the adhesive tray 208 and towards the material. When it reaches above the material, it moves downwards to dip the material again. Therefore, the adhesive dipping head moving component 202 drives the adhesive dipping head 201 in a U-shaped reciprocating motion to complete the adhesive dipping process. In this specific embodiment, the adhesive dipping head moving component 202 uses a mature module from the prior art. Any module that meets the movement requirements of the adhesive dipping head 201 in this solution can be selected. Therefore, this specific embodiment does not provide a detailed description of the adhesive dipping head moving component 202. Those skilled in the art, knowing the movement requirements of the adhesive dipping head 201, can make a reasonable selection of the adhesive dipping head moving component 202 as needed.
[0054] In this embodiment, the glue tray rotating component includes a glue tray rotating motor 203, a driving wheel 204, and a driven wheel 206. The glue tray rotating motor 203 is mounted on the glue dipping mounting base. The driving wheel 204 is connected to the rotating shaft of the glue tray rotating motor 203 so that the glue tray rotating motor 203 drives the driving wheel 204 to rotate. The driving wheel 204 and the driven wheel 206 are connected by a transmission belt 205 so that the driving wheel 204 drives the driven wheel 206 to rotate via the transmission belt 205. The driven wheel 206 and the glue tray 208 are connected by a glue tray rotating shaft 207 so that the rotation of the driven wheel 206 drives the glue tray 208 to rotate. The glue tray 208 is also provided with an annular groove for placing glue. The glue dipping head 201 and the glue scraping head 209 both extend into the annular groove. When applying adhesive, the adhesive tray rotation motor 203 is activated, causing the motor to drive the drive wheel 204 to rotate. The drive wheel 204 drives the driven wheel 206 to rotate via the transmission belt 205. The driven wheel 206 further drives the adhesive tray 208 to rotate via the adhesive tray rotation shaft 207. This allows the adhesive application head 201 to pick up adhesive from different positions within the adhesive tray 208, meeting the adhesive requirements during the application process. An annular groove is provided to hold the adhesive, and the adhesive application head 201 and the adhesive scraper head 209 extend into the annular groove for convenient storage and adjustment of the adhesive.
[0055] In this embodiment, the scraper head adjustment component includes a scraper head linear guide 210, a preload spring 211, and an adjustment knob 212. The guide rail portion of the scraper head linear guide 210 is mounted on the adhesive mounting base, and the slider portion of the scraper head linear guide 210 is connected to the scraper head 209 so that the position of the scraper head 209 can be adjusted by the movement of the slider portion of the scraper head linear guide 210 along its guide rail. One end of the adjustment knob 212 passes through the adhesive mounting base and is connected to the slider portion of the scraper head linear guide 210. The preload spring 211 is sleeved on the adjustment knob 212 between the adhesive mounting base and the slider portion of the scraper head linear guide 210 so that the slider portion of the scraper head linear guide 210 can be driven to move along its guide rail by the rotation of the adjustment knob 212. When different types of materials require different thicknesses of adhesive, rotating the adjustment knob 212 causes the slider of the linear guide rail 210 of the adhesive scraper head to move along its guide rail. This slider, in turn, adjusts the position of the adhesive scraper head 209. The part of the adhesive scraper head 209 that extends into the annular groove applies force to the adhesive in the adhesive tray 208 under the action of the pre-compression spring 211, thereby adjusting the thickness of the adhesive in the adhesive tray 208 to better meet the adhesive application requirements of different types of materials.
[0056] In this embodiment, the portion of the scraper head 209 that extends into the annular groove has an arc-shaped structure adapted to the annular groove, and an inverted U-shaped groove is also provided in the portion of the scraper head 209 that extends into the annular groove, with the opening end of the inverted U-shaped groove communicating with the annular groove. The arc-shaped structure of the portion of the scraper head 209 that extends into the annular groove allows for better cooperation between the scraper head 209 and the annular groove to adjust the thickness of the adhesive. The inverted U-shaped groove, when the position of the scraper head 209 is adjusted, provides space to accommodate excess adhesive in the adhesive tray 208, thereby better achieving the effect of adjusting the thickness of the adhesive in the adhesive tray 208.
[0057] The working principle of this utility model will be explained in detail below:
[0058] In operation, the adhesive-coating and patching machine of this invention places multiple substrates in each feeding slot of the loading and unloading module 6. Then, the push rod 502 of the feeding module 5 aligns with the position of one of the substrates in the feeding slot. The first longitudinal motion component 501 drives the push rod 502 to move longitudinally, pushing the substrate in the feeding slot to the placement platform 306 of the substrate motion platform module 3. The substrate axial motion component 303 then drives the placement platform 306 to move, so that one of the substrates on the placement platform 306 is directly opposite the bottom of the suction nozzle 702 in the material transfer module 7. The material is then transferred to the flipping adjustment module 8 by suction from the suction nozzle 702. A downward vision module 702 is added to correct rotation errors along the X-axis through real-time visual judgment. After the vision system in the material transfer module 7 detects the tilt angle of the material placed at the material placement position of the flip adjustment module 8 along the X-axis, it guides the tilt adjustment component at the bottom of the flip adjustment module 8 to fine-tune the X-axis angle so that the material is perpendicular to the camera. Then, the flip adjustment module 8 flips a certain angle along its rotation axis so that the surface of the material that needs to be dipped and attached is facing the dip head 201 of the dip module 2. Then, the first longitudinal movement component 304 of the substrate moves longitudinally, so that the flip adjustment module 8 moves the material to the set endpoint of the movement trajectory of the dip module 2 and the attachment module 4, that is, the dip and attachment station. The adhesive dispensing module 2 completes the adhesive dispensing process via a U-shaped motion trajectory. While the dispensing head 201 of the adhesive dispensing module 2 is dispensing adhesive, the pick-up head 406 of the placement module 4 picks up the chip from the wafer motion platform 401 through a vision module and transfers it to the transfer platform 405. The vision system of the transfer platform 405 then picks up the chip from the wafer stage through a vision module and transfers it to the transfer platform. The vision positioning system of the transfer platform 405 then performs a second precise positioning of the chip, compensating for the angle through the adjustment motor 404 below the transfer platform 405. While the dispensing head 201 is dispensing adhesive, the placement head 407 picks up the chip from the transfer platform 405 and attaches it to the material surface, completing the adhesive dispensing and placement process. After the adhesive dispensing and placement process is completed, the flip adjustment module 8 returns to its original position, and the suction nozzle 702 of the material transfer module 7 sucks the material back to the substrate. Then, the substrate second longitudinal motion component 305 pushes the material to be attached on the substrate forward to a specific position, and continues to repeat the above actions until all the material on the entire substrate is dipped in adhesive and attached. Finally, the loading and unloading module 6 collects the substrate that has been dipped in adhesive and attached, and then the feeding module 5 transports the new substrate to the placement platform 306, repeating the above actions to dip the material on the new substrate in adhesive and attach it.
[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and not to limit the technical solutions. Those skilled in the art should understand that any modifications or equivalent substitutions to the technical solutions of this utility model that do not depart from the spirit and scope of this technical solution should be covered within the scope of the claims of this utility model.
Claims
1. A high-precision adhesive applicator, comprising a machine body, wherein a material transfer module is provided on the machine body; characterized in that, The material transfer module includes a mounting frame, which is fixedly mounted on the machine body. A first power component is also provided on the mounting frame. The power output end of the first power component is connected to a suction nozzle. The suction nozzle includes a suction nozzle seat, a tube seat, and a partition. The suction nozzle seat has a vacuum hole and an air passage. The air passage communicates with the vacuum hole. The vacuum hole is used to connect with an external vacuuming device. The partition is connected to the tube seat and installed in the air passage. There is a gap between the partition and the air passage. The other end of the tube seat connected to the partition extends out of the suction nozzle seat.
2. The high-precision adhesive applicator according to claim 1, characterized in that, The machine body is also provided with a flip adjustment module, which includes a flip component and a tilt adjustment component. The flip component is mounted on the tilt adjustment component. The flip component includes a flip motor and a flip block. The flip motor is mounted on the tilt adjustment component through a motor mounting base, and the flip block is connected to the rotating shaft of the flip motor so that the flip block can be rotated by the rotation of the flip motor. A material placement slot is provided on the flip block for placing materials.
3. The high-precision adhesive applicator according to claim 1, characterized in that, The first power component is a linear motor, which is mounted at an angle on the mounting bracket.
4. The high-precision adhesive applicator according to claim 1, characterized in that, The machine body is also provided with a substrate motion platform module. The substrate motion platform module includes a mounting base, a substrate axial motion component, a substrate first longitudinal motion component, a substrate second longitudinal motion component, a movable base, and a placement platform. The mounting base is connected to the machine body. The flip adjustment module, the placement platform, and the substrate second longitudinal motion component are all disposed on the movable base. The placement platform is used to place the substrate. The fixing member of the substrate axial movement component is disposed on the mounting base, and the moving member of the substrate axial movement component is connected to the moving base so as to drive the moving base to move axially through the substrate axial movement component. The fixing member of the substrate first longitudinal movement component is connected to the moving base, and the moving member of the substrate first longitudinal movement component is connected to the flipping adjustment module so as to drive the flipping adjustment module to move axially and longitudinally through the substrate axial movement component and the substrate first longitudinal movement component. The fixing member of the second longitudinal motion component of the substrate is connected to the movable seat, and the movable member of the second longitudinal motion component of the substrate is connected to the placement platform, so that the placement platform can be driven to move along the axial and longitudinal directions by the substrate axial motion component and the substrate second longitudinal motion component.
5. The high-precision adhesive applicator according to claim 4, characterized in that, The machine body is also provided with a loading and unloading module, which includes a feeding component, a first axial movement component and a first vertical movement component. The feeding component includes a feeding plate and a plurality of feeding boxes arranged along the axial direction. The feeding boxes are provided with a plurality of feeding slots in the vertical direction. The feeding slots are used to place a substrate, and a plurality of materials are placed on the substrate. The fixing part of the first axial motion component is connected to the machine body, the moving part of the first axial motion component is connected to the fixing part of the first vertical motion component, and the moving part of the first vertical motion component is connected to the feeding component, so that the feeding component can be driven to move axially and vertically by the first axial motion component and the first vertical motion component respectively.
6. The high-precision adhesive applicator according to claim 5, characterized in that, The machine body is also provided with a feeding module, which includes a push rod and a first longitudinal motion component. The fixing part of the first longitudinal motion component is connected to the machine body, and the moving part of the first longitudinal motion component is connected to the push rod, so that the push rod can be driven to move longitudinally through the first longitudinal motion component. During the longitudinal movement, the push rod can extend into the feeding groove and abut against the substrate at the corresponding position. The longitudinal movement of the push rod will transport the substrate at the corresponding position in the feeding groove to the substrate motion platform module.