A piezoelectric ceramic packaging member

Abstract

The utility model provides a piezoelectric ceramic packaging component relates to piezoelectric ceramic packaging technical field, including workstation, still include base, the base sets up in the middle part of workstation, the base includes fixed ring, the bottom fixed ring has the mounting panel, the mounting panel is fixed in the bottom of workstation, is equipped with the mounting hole on the mounting panel, and the mounting panel is fixed in the bottom of workstation through bolt, still include linkage component. This piezoelectric ceramic packaging component is when packing to the ceramic, first will be placed in the top of the locating disc ceramic, then starts the motor, and the motor will drive the locating disc rotation, and the locating disc will push the slider to move on the guide rod through the arc hole, and then make multiple rod body, pressure sensor and contact block move towards, when the pressure that pressure sensor detected reaches the set value, realize the clamping of ceramic, the device can be quickly positioned to the ceramic of different size, so as to carry out welding packaging subsequently.

Description

Technical Field

[0001] This utility model relates to a packaging component, specifically a piezoelectric ceramic packaging component, belonging to the field of piezoelectric ceramic packaging technology. Background Technology

[0002] Piezoelectric ceramics are functional ceramic materials that exhibit the piezoelectric effect. They generate an electric charge when mechanical force is applied and deform when an electric field is applied; this electromechanical conversion characteristic makes them widely applicable. They are commonly used in sensors, transducers, ultrasonic equipment, precision controllers, etc., playing a vital role in electronics, medical, and industrial fields, and are one of the key functional materials in modern electronic technology.

[0003] Piezoelectric ceramic encapsulation is a crucial process for protecting its performance, requiring isolation from environmental influences such as humidity and temperature to prevent mechanical damage. Existing encapsulation methods include soldering and bonding to ensure reliable device operation.

[0004] Currently, the welding and encapsulation of piezoelectric ceramics typically involves using a pneumatic welding machine to weld the ceramics, attaching the wires one by one. The welding process requires positioning using an encapsulation component. Positioning errors can lead to incomplete welds, short circuits, or insufficient weld strength. Existing encapsulation components are often custom-made, resulting in poor applicability and requiring manual adjustment, leading to low efficiency. Therefore, this paper proposes a piezoelectric ceramic encapsulation component. Utility Model Content

[0005] This invention proposes a piezoelectric ceramic encapsulation component that can quickly position ceramics of different sizes for subsequent welding and encapsulation.

[0006] This utility model is achieved through the following technical solution: a piezoelectric ceramic encapsulation component, including a worktable and a base, the base being disposed in the middle of the worktable, the base including a fixing ring, the bottom of the fixing ring being fixed with a mounting plate, the mounting plate being fixed to the bottom of the worktable, the mounting plate having mounting holes, and the mounting plate being fixed to the bottom of the worktable by bolts.

[0007] It also includes a linkage component, which is mounted on the base. The linkage component includes a positioning plate with an arc-shaped hole. A slider is slidably connected inside the arc-shaped hole, and a guide rod is slidably connected to the slider. The guide rod is fixed between the mounting plate and the fixed cylinder. When the positioning plate rotates, it will drive the slider to move on the guide rod through the arc-shaped hole.

[0008] It also includes a drive component, which is disposed between the base and the linkage component. The drive component includes a connecting plate, which is fixed to the mounting plate. A fixing cylinder is fixed on the connecting plate, and a motor is fixed on the fixing cylinder. The output end of the motor is fixed to the positioning plate, and the start of the motor can drive the positioning plate to rotate.

[0009] It also includes positioning rods, which are mounted on the slider. Each positioning rod consists of a rod body. Activation of the slider will cause multiple rod bodies to move closer together, facilitating the positioning of ceramics of different sizes. The rod body is fixed to the top of the slider, and a pressure sensor is mounted on the rod body. A contact block is fixed to the pressure sensor. Furthermore, to save costs, only one pressure sensor can be set. The pressure sensor can detect the pressure on the contact block. The pressure sensor is connected to the motor through a controller. When a set value is reached, the controller will control the motor to shut off.

[0010] This utility model provides a piezoelectric ceramic encapsulation component, which has the following beneficial effects:

[0011] 1. When encapsulating ceramics, the piezoelectric ceramic encapsulation component first places the ceramic on top of the positioning plate, then starts the motor, which drives the positioning plate to rotate. The positioning plate pushes the slider on the guide rod through the arc-shaped hole, thereby causing multiple rods, pressure sensors and contact blocks to move towards each other. When the pressure detected by the pressure sensor reaches the set value, the ceramic is clamped. This device can quickly position ceramics of different sizes for subsequent welding and encapsulation. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0013] Figure 2 This is a schematic diagram of the base structure of this utility model;

[0014] Figure 3 This is a schematic diagram of the linkage component and drive component of this utility model;

[0015] Figure 4 For the present utility model Figure 2 Enlarged schematic diagram of the structure at point A in the middle.

[0016] Explanation of reference numerals in the attached figures

[0017] 1. Workbench;

[0018] 2. Base; 201. Retaining ring; 202. Mounting plate;

[0019] 3. Linkage components; 301. Positioning plate; 302. Arc-shaped hole; 303. Slider; 304. Guide rod;

[0020] 4. Drive components; 401. Connecting plate; 402. Fixing cylinder; 403. Motor;

[0021] 5. Positioning rod; 501. Rod body; 502. Pressure sensor; 503. Contact block. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0023] Please see Figures 1-4 The present invention proposes the following implementation scheme: a piezoelectric ceramic encapsulation component, including a workbench 1 and a base 2, the base 2 being disposed in the middle of the workbench 1, the base 2 including a fixing ring 201, and a mounting plate 202 being fixed to the bottom of the fixing ring 201.

[0024] Please refer to this carefully. Figure 1 , Figure 2 and Figure 3 The mounting plate 202 is fixed to the bottom of the workbench 1. The mounting plate 202 has mounting holes and is fixed to the bottom of the workbench 1 by bolts.

[0025] Please refer to this carefully. Figure 1 , Figure 2 and Figure 3 It also includes a linkage component 3, which is set on the base 2. The linkage component 3 includes a positioning plate 301, an arc-shaped hole 302 is provided on the positioning plate 301, a slider 303 is slidably connected in the arc-shaped hole 302, and a guide rod 304 is slidably connected on the slider 303.

[0026] Please refer to this carefully. Figure 1 , Figure 2 and Figure 3 The guide rod 304 is fixed between the mounting plate 202 and the fixed cylinder 402. When the positioning plate 301 rotates, the positioning plate 301 will drive the slider 303 to move on the guide rod 304 through the arc hole 302.

[0027] Please refer to this carefully. Figure 1 , Figure 2 and Figure 3 It also includes a drive component 4, which is disposed between the base 2 and the linkage component 3. The drive component 4 includes a connecting plate 401, which is fixed on the mounting plate 202.

[0028] Please refer to this carefully. Figure 1 , Figure 2 and Figure 3 A fixed cylinder 402 is fixed on the connecting plate 401, and a motor 403 is fixed on the fixed cylinder 402. The output end of the motor 403 is fixed to the positioning plate 301. The start of the motor 403 can drive the positioning plate 301 to rotate.

[0029] Please refer to this carefully. Figure 2 and Figure 4 It also includes a positioning rod 5, which is set on the slider 303. The positioning rod 5 includes a rod body 501. The activation of the slider 303 will drive multiple rod bodies 501 to move closer to each other, which is convenient for positioning ceramics of different sizes.

[0030] Please refer to this carefully. Figure 2 and Figure 4 The rod 501 is fixed to the top of the slider 303. A pressure sensor 502 is installed on the rod 501. A contact block 503 is fixed on the pressure sensor 502. The contact block 503 is in direct contact with the ceramic. The contact block 503 can be made of flexible material.

[0031] Please refer to this carefully. Figure 2 and Figure 4 Furthermore, to save costs, only one pressure sensor 502 can be set. The pressure sensor 502 can detect the pressure on the contact block 503. The pressure sensor 502 is connected to the controller and the motor 403. When the set value is reached, the controller will control the motor 403 to shut down.

[0032] Working principle: When encapsulating ceramics, the ceramics are first placed on top of the positioning disk 301. Then, the motor 403 is started, which will drive the positioning disk 301 to rotate. The positioning disk 301 will push the slider 303 to move on the guide rod 304 through the arc hole 302, thereby causing multiple rods 501, pressure sensor 502 and contact block 503 to move towards each other.

[0033] When multiple contact blocks 503 are in contact with the ceramic, multiple pressure sensors 502 detect the pressure. When the pressure reaches a set value, the ceramic is clamped. This device can quickly position ceramics of different sizes for subsequent welding and encapsulation.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A piezoelectric ceramic encapsulation component, comprising a worktable (1), characterized in that: It also includes a base (2), which is located in the middle of the workbench (1); It also includes a linkage component (3), which is mounted on the base (2); The linkage component (3) includes a positioning disk (301), an arc-shaped hole (302) is provided on the positioning disk (301), a slider (303) is slidably connected in the arc-shaped hole (302), and a guide rod (304) is slidably connected on the slider (303). It also includes a drive component (4), which is disposed between the base (2) and the linkage component (3); It also includes a positioning rod (5), which is disposed on the slider (303).

2. The piezoelectric ceramic encapsulation component according to claim 1, characterized in that: The base (2) includes a fixing ring (201), and a mounting plate (202) is fixed to the bottom of the fixing ring (201). The mounting plate (202) is fixed to the bottom of the workbench (1).

3. The piezoelectric ceramic encapsulation component according to claim 2, characterized in that: The driving component (4) includes a connecting plate (401), which is fixed on the mounting plate (202). A fixing cylinder (402) is fixed on the connecting plate (401), and a motor (403) is fixed on the fixing cylinder (402). The output end of the motor (403) is fixed to the positioning plate (301).

4. The piezoelectric ceramic encapsulation component according to claim 1, characterized in that: The guide rod (304) is fixed between the mounting plate (202) and the fixing cylinder (402).

5. A piezoelectric ceramic encapsulation component according to claim 1, characterized in that: The positioning rod (5) includes a rod body (501), which is fixed to the top of the slider (303). A pressure sensor (502) is installed on the rod body (501), and a contact block (503) is fixed on the pressure sensor (502).

6. A piezoelectric ceramic encapsulation component according to claim 2, characterized in that: The mounting plate (202) has mounting holes.

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