A silicon wafer variable pitch runway

Abstract

The utility model discloses a silicon wafer variable distance runway, including silicon wafer feeding mechanism, silicon wafer runway mechanism still including two ends respectively with silicon wafer feeding mechanism and silicon wafer runway mechanism butt joint's variable distance mechanism, the silicon wafer runway mechanism includes a mounting bracket, one direct current runway of along Y direction delivery and along X direction arrangement and set on a mounting bracket for drive one direct current runway movement one drive assembly, the silicon wafer feeding mechanism includes a plurality of along Y direction delivery and along X column's two direct current runways, and the interval of two two direct current runways is greater than the interval of two one direct current runways, the variable distance mechanism includes two inclined runways and two respectively drive two inclined runways movement's second drive assembly, and the interval of two inclined runways close one end of one direct current runway is less than the interval close two direct current runway one end. Advantage: prevent two silicon wafers and assemble in the same layer of flower basket with the scratch of flower basket and cause the side damage of silicon wafer.

Description

Technical Field

[0001] This utility model relates to the field of BC solar cell equipment, specifically a silicon wafer variable pitch racetrack. Background Technology

[0002] In the processing of BC solar cells, the cells need to be transferred from the chain conveyor to baskets. Each basket can hold two silicon wafers. The transfer mechanism transfers two silicon wafers from the chain conveyor to the baskets in one go and conveys them along the conveyor track. Traditionally, the two conveyor tracks are set in parallel. After the two silicon wafers are transferred from the chain conveyor to the two conveyor tracks and then into the baskets, due to the size limitations of the baskets, if the two silicon wafers are kept at the distance between the conveyor tracks, the outer side of the silicon wafer is prone to rubbing against the basket, resulting in damage to the silicon wafer.

[0003] Therefore, it is necessary to provide a silicon wafer variable pitch racetrack. Summary of the Invention

[0004] This utility model provides a silicon wafer pitch-changing track, which effectively solves the problem that existing two silicon wafers cannot change pitch in a timely manner on the conveying track.

[0005] The technical solution adopted in this utility model is:

[0006] The silicon wafer variable pitch track includes a silicon wafer feeding mechanism, a silicon wafer track mechanism, and a variable pitch mechanism with its two ends respectively connected to the silicon wafer feeding mechanism and the silicon wafer track mechanism. The silicon wafer track mechanism includes a first mounting frame, two first DC tracks that are conveyed along the Y direction and arranged along the X direction, and a first drive assembly mounted on the first mounting frame for driving the first DC tracks. The silicon wafer feeding mechanism includes several second DC tracks that are conveyed along the Y direction and arranged along the X direction. The distance between two second DC tracks is greater than the distance between two first DC tracks. The variable pitch mechanism includes two inclined tracks and two second drive assemblies that drive the two inclined tracks respectively. The distance between the two inclined tracks near the first DC track is smaller than the distance near the second DC track.

[0007] Furthermore, the silicon wafer feeding mechanism also includes a mounting base, a horizontal material transfer component mounted on the mounting base, and two or more receiving conveyor lines mounted on the mounting base. The structure of the receiving conveyor lines is the same as that of the second DC track, and the spacing between the two receiving conveyor lines is the same as the spacing between the two second DC track conveyor lines.

[0008] Furthermore, the horizontal material transfer assembly includes a linear module fixedly mounted on the mounting base along the X direction, a cylinder mounted on the output end of the linear module along the Z-axis, a first plate mounted on the output end of the cylinder, and two sets of tray supports mounted on the first plate, each set of tray supports including two trays.

[0009] Furthermore, the distance between the two trays is greater than the width of the second DC runway.

[0010] Furthermore, the width of the inclined runway is the same as the width of DC runway No. 1 and DC runway No. 2.

[0011] Furthermore, the pitch-changing mechanism also includes a base plate, two sets of mounting and adjusting components arranged along the X direction on the base plate, two inclined tracks and a second drive component corresponding to the inclined tracks mounted on one of the mounting and adjusting components, the base plate having two strip-shaped through holes extending along the X direction, the two mounting and adjusting components corresponding one-to-one with the two strip-shaped through holes, the mounting and adjusting components including a first mounting plate, a second mounting plate, a support mounted on the second mounting plate, a first locking element connecting the first mounting plate and the base plate through the strip-shaped through holes, a first bolt, and a second bolt, the first mounting plate having a first screw hole and a second screw hole at its two ends in the Y direction, the second mounting plate having a first arc-shaped hole and a second arc-shaped hole at its two ends in the Y direction, the first arc-shaped hole and the second arc-shaped hole being centrally symmetrical, the first bolt passing through the first arc-shaped hole and threadedly connected to the first screw hole, and the second bolt passing through the second arc-shaped hole and connected to the second screw hole.

[0012] Furthermore, the No. 1 mounting plate is also provided with No. 3 bolts on both sides for laterally fixing one end of the No. 2 mounting plate.

[0013] The beneficial effects of the utility model are as follows: By setting two inclined runways, the spacing between the silicon wafers in the two No. 2 DC runways can be shortened, and after the spacing is changed, they are transported by the two No. 1 DC runways. This improves the accuracy of the subsequent loading of the two silicon wafers into the basket and prevents the two silicon wafers from rubbing against the basket and causing damage to the side of the silicon wafers after they are assembled on the same layer of the basket. Attached Figure Description

[0014] Figure 1 A top view of a silicon wafer variable pitch raceway provided for an embodiment of this application.

[0015] Figure 2 A perspective view of a silicon wafer variable pitch racetrack provided for an embodiment of this application.

[0016] Figure 3 This is a schematic diagram of a silicon wafer feeding mechanism for a variable-pitch silicon wafer raceway provided in an embodiment of this application.

[0017] Figure 4 This is a schematic diagram from one perspective of the pitch mechanism of the silicon wafer pitch racetrack provided in an embodiment of this application.

[0018] Figure 5 This is a schematic diagram from another perspective of the pitch mechanism of the silicon wafer pitch racetrack provided in an embodiment of this application.

[0019] The diagram is labeled as follows: 1. Silicon wafer feeding mechanism; 2. Silicon wafer track mechanism; 3. Variable pitch mechanism; 21. Mounting bracket No. 1; 22. DC track No. 1; 23. Drive assembly No. 1; 11. DC track No. 2; 31. Inclined track; 32. Drive assembly No. 2; 12. Mounting base; 13. Horizontal material transfer assembly; 14. Receiving conveyor line; 131. Linear module; 132. Cylinder; 133. Plate No. 1; 134. Wafer support bracket; 33. Base plate; 34. Mounting adjustment assembly; 330. Strip-shaped through hole; 341. Mounting plate No. 1; 342. Mounting plate No. 2; 343. Support; 302. Arc-shaped hole No. 1; 302. Arc-shaped hole No. 2; 344. Bolt No. 3; Detailed Implementation

[0020] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0021] like Figure 1 and Figure 2 As shown, the silicon wafer variable pitch track provided in the embodiment of this application includes a silicon wafer feeding mechanism 1 and a silicon wafer track mechanism 2. Its characteristic is that it further includes a variable pitch mechanism 3 with both ends respectively connected to the silicon wafer feeding mechanism 1 and the silicon wafer track mechanism 2. The silicon wafer track mechanism 2 includes a first mounting frame 21, two first DC tracks 22 conveyed along the Y direction and arranged along the X direction, and a first drive assembly 23 disposed on the first mounting frame 21 for driving the first DC tracks 22. The silicon wafer feeding mechanism 1 includes several second DC tracks 11 conveyed along the Y direction and arranged along the X direction. The distance between two second DC tracks 11 is greater than the distance between two first DC tracks 22. The variable pitch mechanism 3 includes two inclined tracks 31 and two second drive assemblies 32 respectively driving the two inclined tracks 31. The distance between the ends of the two inclined tracks 31 near the first DC track 22 is less than the distance between the ends near the second DC tracks 11.

[0022] In actual use, two silicon wafers are simultaneously transported to two inclined tracks 31 via two second DC tracks 11, so that the two silicon wafers are transported to two first DC tracks 22 along the two inclined tracks 31 respectively.

[0023] In the above design, by setting two inclined runways 31, the spacing between the silicon wafers in the two second DC runways 11 can be shortened, and after the spacing is changed, they are transported by the two first DC runways 22. This improves the accuracy of the subsequent loading of the two silicon wafers into the basket and prevents the two silicon wafers from rubbing against the basket after being assembled on the same layer of the basket, which would cause damage to the side of the silicon wafers.

[0024] Specifically: such as Figure 2As shown, the silicon wafer feeding mechanism 1 also includes a mounting base 12, a horizontal material transfer component 13 disposed on the mounting base 12, and two or more receiving conveyor lines 14 disposed on the mounting base 12. The structure of the receiving conveyor line 14 is the same as that of the second DC track 11 conveyor line, and the spacing between the two receiving conveyor lines 14 is the same as the spacing between the two second DC track 11 conveyor lines.

[0025] In actual use, two silicon wafers from an external mechanism are received by two receiving conveyor lines 14, and then the two silicon wafers in the two receiving conveyor lines 14 are transferred to two second DC tracks 11 by the horizontal transfer assembly 13, so that the two silicon wafers are transported to two inclined tracks 31 along the second DC tracks 11.

[0026] In the above design, the silicon wafer feeding mechanism 1 is designed to quickly receive silicon wafers from external mechanisms and transfer them to the second DC track 11, thereby improving the operating efficiency of the silicon wafers.

[0027] Specifically: such as Figure 2 and Figure 3 As shown, the horizontal material transfer assembly 13 includes a linear module 131 fixedly mounted on the mounting base 12 along the X direction, a cylinder 132 mounted on the output end of the linear module 131 along the Z-axis direction, a first plate 133 mounted on the output end of the cylinder 132, and two sets of tray supports 134 mounted on the first plate 133. Each set of tray supports 134 includes two trays.

[0028] In actual use, the wafer support 134 supports the silicon wafer. The linear module 131 drives the cylinder 132 to drive the first plate 133 and the wafer support 134 to reciprocate between the receiving conveyor line 14 and the second DC track 11. The cylinder 132 drives the first plate 133 and the wafer support 134 to lift and lower, thereby realizing the picking and placing of silicon wafers.

[0029] In the above design, the structural design and specific implementation of the horizontal transfer component 13 enable rapid transfer of silicon wafers.

[0030] Specifically, the distance between the two trays is greater than the width of the second DC track 11. It should be noted that the width of the silicon wafer is greater than the width of the second DC track 11.

[0031] In actual use, when the pallet places the silicon wafer on the second DC runway 11 or lifts the silicon wafer from the receiving conveyor line 14, the contact point with the silicon wafer is located on the side of the second DC runway 11.

[0032] In the above design, the spacing between the two trays and the width of the second DC track 11 are designed to ensure that the trays can smoothly place the silicon wafers after they are supported.

[0033] Specifically, the width of the inclined runway 31 is the same as the width of the first DC runway 22 and the width of the second DC runway 11.

[0034] The above design facilitates the transfer of silicon wafers of the same width.

[0035] Specifically: such as Figure 2 , Figure 5 and Figure 4 As shown, the pitch mechanism 3 further includes a base plate 33 and two sets of mounting adjustment components 34 arranged along the X direction on the base plate 33. The two inclined runways 31 and the second drive component 32 corresponding to the inclined runways 31 are mounted on one of the mounting adjustment components 34. The base plate 33 is provided with two strip-shaped through holes 330 extending along the X direction. The two mounting adjustment components 34 correspond one-to-one with the two strip-shaped through holes 330. The mounting adjustment component 34 includes a first mounting plate 341, a second mounting plate 342, and a mounting plate 342 for mounting the inclined runways 31 and the second drive component. The support 343 of component 32, the first locking element, the first bolt and the second bolt connected to the first mounting plate 341 and the base plate 33 through the strip-shaped through hole 330, the first mounting plate 341 is provided with a first screw hole and a second screw hole at both ends in the Y direction, and the second mounting plate 342 is provided with a first arc hole 302 and a second arc hole 302 at both ends in the Y direction. The first arc hole 302 and the second arc hole 302 are centrally symmetrical. The first bolt passes through the first arc hole 302 and is threaded to the first screw hole, and the second bolt passes through the second arc hole 302 and is threaded to the second screw hole.

[0036] In actual use, when it is necessary to adjust the interval between the two inclined runways 31, the first locking element is loosened, causing the first mounting plate 341 to move along the strip-shaped through hole 330. After moving to the predetermined position, the first locking element is re-locked to adjust the interval between the two inclined runways 31. When it is necessary to adjust the opening angle of the two inclined runways 31, the first bolt and the second bolt are loosened, and the second mounting plate 342 is rotated. This changes the corresponding positions of the first screw hole and the first arc-shaped hole 302, and the corresponding positions of the second screw hole and the second arc-shaped hole 302. This causes the support 343 to drive the inclined runway 31 and the corresponding second drive assembly 32 to shift. Then, the first bolt and the second bolt are locked.

[0037] The above design enables the adjustment of the interval and opening angle of the two inclined runways 31, making it easy to adapt to different working conditions.

[0038] Specifically: such as Figure 4 As shown, the first mounting plate 341 is also provided with third bolts 344 on both sides for laterally fixing one end of the second mounting plate 342.

[0039] In the above design, by setting bolt No. 344 to limit the two sides of mounting plate No. 2 342, it is possible to prevent mounting plate No. 2 342 from shaking during use.

[0040] In further detail, it should be understood that the above description is only a specific embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A silicon wafer variable pitch racetrack, comprising a silicon wafer feeding mechanism (1) and a silicon wafer racetrack mechanism (2), characterized in that: It also includes a pitch mechanism (3) that is connected at both ends to the silicon wafer feeding mechanism (1) and the silicon wafer track mechanism (2). The silicon wafer track mechanism (2) includes a first mounting frame (21), two first DC tracks (22) that are conveyed along the Y direction and arranged along the X direction, and a first drive assembly (23) set on the first mounting frame (21) for driving the first DC track (22) to move. The silicon wafer feeding mechanism (1) includes several second DC tracks (11) that are conveyed along the Y direction and arranged along the X direction. The distance between two second DC tracks (11) is greater than the distance between two first DC tracks (22). The pitch mechanism (3) includes two inclined tracks (31) and two second drive assemblies (32) that drive the two inclined tracks (31) to move respectively. The distance between the two inclined tracks (31) near the first DC track (22) is less than the distance near the second DC track (11).

2. The silicon wafer variable pitch runway according to claim 1, characterized in that: The silicon wafer feeding mechanism (1) also includes a mounting base (12), a horizontal material transfer component (13) disposed on the mounting base (12), and two receiving conveyor lines (14) disposed on the mounting base (12). The structure of the receiving conveyor line (14) is the same as that of the second DC track (11), and the distance between the two receiving conveyor lines (14) is the same as the distance between the two conveyor lines of the second DC track (11).

3. The silicon wafer variable pitch runway according to claim 1, characterized in that: The horizontal material transfer assembly (13) includes a linear module (131) fixedly mounted on the mounting base (12) along the X direction, a cylinder (132) mounted on the output end of the linear module (131) along the Z-axis, a first plate (133) mounted on the output end of the cylinder (132), and two sets of tray supports (134) mounted on the first plate (133). Each set of tray supports (134) includes two trays.

4. The silicon wafer variable pitch runway according to claim 1, characterized in that: The distance between the two trays is greater than the width of the second DC runway (11).

5. The silicon wafer variable pitch runway according to claim 1, characterized in that: The width of the inclined runway (31) is the same as the width of the first DC runway (22) and the width of the second DC runway (11).

6. The silicon wafer variable pitch runway according to claim 1, characterized in that: The pitch-changing mechanism (3) further includes a base plate (33) and two sets of mounting adjustment components (34) arranged along the X direction on the base plate (33). The two inclined tracks (31) and the second drive component (32) corresponding to the inclined tracks (31) are mounted on one of the mounting adjustment components (34). The base plate (33) is provided with two strip-shaped through holes (330) extending along the X direction. The two mounting adjustment components (34) correspond one-to-one with the two strip-shaped through holes (330). The mounting adjustment component (34) includes a first mounting plate (341), a second mounting plate (342), and a support set on the second mounting plate (342). The base (343) is connected to the first mounting plate (341) and the base plate (33) through the strip-shaped through hole (330) by the first locking element, the first bolt, and the second bolt. The first mounting plate (341) is provided with a first screw hole and a second screw hole at both ends in the Y direction. The second mounting plate (342) is provided with a first arc hole (302) and a second arc hole (302) at both ends in the Y direction. The first arc hole (302) and the second arc hole (302) are centrally symmetrical. The first bolt passes through the first arc hole (302) and is threaded to the first screw hole. The second bolt passes through the second arc hole (302) and is threaded to the second screw hole.

7. The silicon wafer variable pitch runway according to claim 6, characterized in that: The first mounting plate (341) is also provided with third bolts (344) on both sides for laterally fixing one end of the second mounting plate (342).

Images