A milk frother capable of rapid cooling

Abstract

The utility model discloses a kind of milk frother that can realize rapid cooling, including kettle body, base, semiconductor refrigeration module and fan, the accommodating groove for accommodating kettle body is opened in this base, the annular air duct that is around the outer periphery of accommodating groove is equipped in the inside of this base, the side wall of this accommodating groove is annular and is equipped with several air outlet holes that are communicated with annular air duct;The semiconductor refrigeration module is set in base and includes semiconductor chip and the fin that is attached with the heating end of semiconductor chip, the refrigeration end of semiconductor chip is communicated with annular air duct;The fan is set in base and its air outlet is located at the air inlet end of annular air duct;Air blown from the air outlet of fan is cooled after the refrigeration end of semiconductor chip, flows along annular air duct and is discharged through several air outlet holes to cool kettle body. Thus, using this cooling mode, not only cooling efficiency is higher, time-consuming is shorter, simultaneously, it will not produce larger noise, greatly improve user experience.

Description

Technical Field

[0001] This utility model relates to the field of household appliance technology, and in particular to a milk warmer that can achieve rapid cooling. Background Technology

[0002] A bottle warmer is a device used to regulate water temperature for preparing formula or for direct drinking. Its main function is to maintain a constant water temperature, allowing parents to quickly and accurately prepare formula at the right temperature for their baby. Some bottle warmers are equipped with a single fan; when the temperature of the container needs to be lowered, the fan activates, accelerating airflow over the container's surface. Based on the principle of heat exchange, the flowing air can more quickly remove heat from the container, thus achieving cooling.

[0003] However, in actual use, it has been found that cooling with only a single fan is inefficient and time-consuming. To address this, some manufacturers have incorporated multiple fans around the outside of the bottle for cooling. While this improves heat dissipation, it also complicates the bottle's structure and generates more noise, significantly reducing the user experience. Utility Model Content

[0004] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a milk warmer that can achieve rapid cooling. By setting a semiconductor cooling module in the base, the air blown out by the fan is cooled by the cooling end of the semiconductor chip and can flow along the annular air channel and be discharged through several air outlets to cool the kettle body. Thus, this cooling method not only has high cooling efficiency and short time, but also does not generate much noise, greatly improving the user experience.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A formula warmer capable of rapid cooling includes:

[0007] The body of the pot;

[0008] The base has a receiving groove for accommodating the kettle body; the base has an annular air duct surrounding the outer periphery of the receiving groove, and the side wall of the receiving groove has a plurality of air outlet holes communicating with the annular air duct.

[0009] A semiconductor cooling module is disposed within the base and includes a semiconductor chip and a heat sink that is attached to the heating end of the semiconductor chip. The cooling end of the semiconductor chip is connected to the annular air duct.

[0010] A fan is installed inside the base and its air outlet is located at the air inlet of the annular air duct. The air blown out from the air outlet of the fan is cooled by the cooling end of the semiconductor chip, flows along the annular air duct and is discharged through a plurality of the air outlet holes to cool the kettle body.

[0011] As an optional implementation, the semiconductor cooling module further includes a heat insulation bracket for separating the heat sink from the annular air duct.

[0012] As an optional implementation, the base is provided with several heat dissipation holes that connect the heat sink to the outside air.

[0013] As an optional implementation, it also includes a cooling plate that is attached to the cooling end of the semiconductor chip and extends into the annular air duct.

[0014] As an optional implementation, the base includes an upper body, the middle portion of which is recessed to form the receiving groove;

[0015] It also includes a partition disposed in the upper body and arranged circumferentially, the interior of the upper body and the partition forming the annular air duct.

[0016] As an alternative implementation, the partition is either planar or spirally ascending in the circumferential direction.

[0017] As an optional implementation, the partition has a notch, and the semiconductor cooling module is disposed on the notch.

[0018] As an optional implementation, the base also includes a lower body, the upper body is connected to the lower body vertically, the lower body has a plurality of air inlets communicating with its interior, and the air inlet of the fan is connected to the interior of the lower body.

[0019] As an optional implementation, a lower coupler is also included, wherein the lower seat body has a mounting boss inside, and the lower coupler is mounted on the mounting boss and passes through the bottom of the receiving groove;

[0020] The bottom of the kettle body is also provided with an upper coupler. When the kettle body is placed in the receiving groove, the upper coupler is coupled to the lower coupler.

[0021] As an optional implementation, the air blown out from the fan outlet enters the annular air duct tangentially.

[0022] In summary, this utility model has the following technical effects:

[0023] (1) The milk warmer of this utility model can achieve rapid cooling. By setting a semiconductor cooling module in the base, the air blown out from the fan outlet is cooled by the cooling end of the semiconductor chip and can flow along the annular air channel and be discharged through several air outlets to cool the kettle body. Therefore, this cooling method not only has high cooling efficiency and short time, but also does not generate much noise, which greatly improves the user experience.

[0024] (2) When the partition is arranged in a spiral upward direction along the circumference, the air blown out from the fan outlet will form a spiral upward vortex when it flows along the annular air duct. This ensures that the cold air blown towards the side wall of the pot has a high and uniform wind speed and wind pressure, so that the heat of the pot can be taken away quickly, thus achieving the effect of rapid cooling. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of the milk maker of this utility model;

[0027] Figure 2 This is an exploded view of the milk maker of this utility model;

[0028] Figure 3 for Figure 2 An illustration of the explosion from another perspective;

[0029] Figure 4 This is an exploded view of some structures in the milk maker of this utility model;

[0030] Figure 5 This is a cross-sectional schematic diagram of the semiconductor cooling module in the milk warmer of this utility model;

[0031] Figure 6 This is a schematic diagram of some of the structures in the milk maker of this utility model;

[0032] Figure 7 for Figure 6 A structural diagram with the upper body hidden.

[0033] The meanings of the reference numerals in the attached figures are as follows:

[0034] 1. Kettle body; 2. Base; 21. Upper seat; 211. Receiving groove; 2111. Air outlet; 212. Heat dissipation hole; 22. Lower seat; 221. Mounting boss; 3. Upper coupler; 4. Lower coupler; 5. Fan; 6. Semiconductor cooling module; 61. Semiconductor chip; 62. Heat sink; 63. Heat insulation bracket; 7. Control board; 8. Partition; 81. Notch; 82. Baffle. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0037] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0038] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0039] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0040] The technical solution of this utility model will be further described below with reference to the embodiments and accompanying drawings.

[0041] See Figures 1 to 7 This application discloses a milk warmer capable of rapid cooling, including a pot body 1 and a base 2. The base 2 has a receiving groove 211 for accommodating the pot body 1, and the pot body 1 can be detachably placed in the receiving groove 211. The base 2 also has an annular air duct surrounding the outer periphery of the receiving groove 211, and the side wall of the receiving groove 211 is provided with a plurality of air outlet holes 2111 communicating with the annular air duct. In addition, it also includes a semiconductor cooling module 6 and a fan 5. The semiconductor cooling module 6 is disposed in the base 2 and includes a semiconductor chip 61, a heat sink 62 that is attached to the heating end of the semiconductor chip 61, and a heat insulation bracket 63 for separating the heat sink 62 from the annular air duct. The cooling end of the semiconductor chip 61 is connected to the annular air duct. The fan 5 is disposed in the base 2 and its air outlet is located at the air inlet of the annular air duct.

[0042] Therefore, when it is necessary to cool down the kettle body 1, the fan 5 and the semiconductor cooling module 6 can be started. The air blown out from the air outlet of the fan 5 is cooled by the cooling end of the semiconductor chip 61 and can flow along the annular air channel and be discharged through several air outlets 2111 to cool down the kettle body 1.

[0043] Therefore, this cooling method not only has high cooling efficiency and short cooling time, but also does not generate much noise, greatly improving the user experience.

[0044] Preferably, the base 2 has several heat dissipation holes 212 that connect the heat sink 62 to the outside air, forming a heat dissipation grid. Thus, when the semiconductor cooling module 6 is activated, the heat sink 62 can dissipate heat from the semiconductor chip 61 and discharge it through the heat dissipation holes 212, thereby ensuring the normal operation of the semiconductor cooling module 6.

[0045] See Figure 5 The heat insulation bracket 63 surrounds the heat sink 62 at one end and around the annular air duct to provide heat insulation, thereby preventing it from communicating with the annular air duct and transferring heat into the annular air duct. The heat insulation bracket 63 also has a through hole that connects to the cooling end of the semiconductor chip 61. The cold energy emitted from the cooling end of the semiconductor chip 61 can flow out through the through hole and then flow into the annular air duct.

[0046] Of course, in other embodiments, a heat sink can also be provided on the cooling end of the semiconductor chip 61. This heat sink can be attached to the cooling end of the semiconductor chip 61 to achieve heat transfer. By providing a heat sink, the cooling efficiency of the air in the annular air duct can be improved, thereby accelerating the cooling of the kettle body 1.

[0047] See Figure 4 The base 2 includes an upper body 21, the middle of which is recessed to form the aforementioned receiving groove 211; it also includes a partition 8 disposed inside the upper body 21 and extending circumferentially, the interior of the upper body 21 and the partition 8 enclosing the aforementioned annular air duct. The partition 8 is planar in the circumferential direction.

[0048] Of course, in other embodiments, the partition 8 can also be arranged in a spiral upward shape along the circumference. When the partition 8 is arranged in a spiral upward shape along the circumference, the air blown out from the air outlet of the fan 5 flows along the annular air duct, forming a spiral upward vortex. This ensures that the cold air blown towards the side wall of the kettle body 1 in all directions has a high and uniform wind speed and wind pressure, so that the heat of the kettle body 1 can be quickly carried away, achieving a rapid cooling effect.

[0049] In this embodiment, the first end of the partition 8 is provided with a notch 81, the heat insulation bracket 63 of the semiconductor cooling module 6 is mounted on the notch 81, and the other end face of the heat insulation bracket 63 is connected to a plurality of heat dissipation holes 212 on the upper seat 21; the end of the partition 8 is bent upward to form a baffle part 82, which can block the airflow in the annular air duct.

[0050] Furthermore, the base 2 also includes a lower body 22, the upper body 21 is connected to the lower body 22 vertically, and the lower body 22 is provided with a number of air inlets (not shown in the figure) that communicate with its interior. The air inlet of the fan 5 is connected to the interior of the lower body 22.

[0051] Therefore, when the fan 5 is started, external air can enter the lower body 22 through several air inlets and enter the air inlet of the fan 5, and finally flow out from the air outlet of the fan 5.

[0052] See also Figure 2-3 The formula maker also includes an upper coupler 3 and a lower coupler 4. The lower base 22 has a mounting boss 221 at its inner bottom. The lower coupler 4 is mounted on the mounting boss 221 and passes through the bottom of the receiving groove 211. The bottom of the pot body 1 is also provided with an upper coupler 3. When the pot body 1 is placed in the receiving groove 211, the upper coupler 3 and the lower coupler 4 are coupled to achieve electrical conduction.

[0053] Additionally, a control board 7 is installed within the base 2, which is electrically connected to both the lower coupler 4 and the fan 5. The start and stop of the fan 5 and the power supply to the lower coupler 4 are both controlled by the control board 7.

[0054] In addition, the air blown out from the air outlet of fan 5 enters the annular air duct tangentially, which can further reduce the loss of wind speed and wind pressure when the cold air blown out by fan 5 enters the annular air duct, so as to ensure that the airflow has higher wind speed and wind pressure when flowing in the entire air duct.

[0055] In summary, this utility model has the following technical effects:

[0056] (i) The milk warmer of this utility model that can achieve rapid cooling has a semiconductor cooling module 6 installed in the base 2. The air blown out from the air outlet of the fan 5 is cooled by the cooling end of the semiconductor chip 61 and can flow along the annular air channel and be discharged through several air outlets 2111 to cool the kettle body 1. Therefore, the cooling method is not only highly efficient and takes less time, but also does not generate much noise, which greatly improves the user experience.

[0057] (II) The milk warmer of this utility model can achieve rapid cooling. When the partition 8 is arranged in a spiral upward shape along the circumference, the air blown out from the air outlet of the fan 5 will form a spiral upward vortex when it flows along the annular air channel. This ensures that the cold air blown towards the side wall of the pot body 1 in all directions has a high and uniform wind speed and wind pressure. In this way, the heat of the pot body 1 can be quickly taken away, so as to achieve the effect of rapid cooling.

[0058] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A formula warmer capable of rapid cooling, characterized in that, include: The body of the pot; The base has a receiving groove for accommodating the kettle body; the base has an annular air duct surrounding the outer periphery of the receiving groove, and the side wall of the receiving groove has a plurality of air outlet holes communicating with the annular air duct. A semiconductor cooling module is disposed within the base and includes a semiconductor chip and a heat sink that is attached to the heating end of the semiconductor chip. The cooling end of the semiconductor chip is connected to the annular air duct. A fan is installed inside the base and its air outlet is located at the air inlet of the annular air duct. The air blown out from the air outlet of the fan is cooled by the cooling end of the semiconductor chip, flows along the annular air duct and is discharged through a plurality of the air outlet holes to cool the kettle body.

2. The formula maker according to claim 1, characterized in that: The semiconductor cooling module also includes a heat insulation bracket, which is used to separate the heat sink from the annular air duct.

3. The formula maker according to claim 1, characterized in that: The base has several heat dissipation holes that connect the heat sink to the outside air.

4. The formula maker according to claim 1, characterized in that: It also includes a cooling plate that is attached to the cooling end of the semiconductor chip and extends into the annular air duct.

5. The formula maker according to any one of claims 1-4, characterized in that: The base includes an upper body, the middle portion of which is recessed to form the receiving groove; It also includes a partition disposed in the upper body and arranged circumferentially, the interior of the upper body and the partition forming the annular air duct.

6. The formula maker according to claim 5, characterized in that: The partition is either planar or spirally ascending along the circumference.

7. The formula maker according to claim 5, characterized in that: The partition has a notch, and the semiconductor cooling module is disposed on the notch.

8. The formula maker according to claim 5, characterized in that: The base also includes a lower body, and the upper body is connected to the lower body vertically. The lower body has several air inlets that communicate with its interior, and the air inlet of the fan communicates with the interior of the lower body.

9. The formula maker according to claim 8, characterized in that: It also includes a lower coupler, the lower seat body has a mounting boss inside, the lower coupler is mounted on the mounting boss and passes through the bottom of the receiving groove; The bottom of the kettle body is also provided with an upper coupler. When the kettle body is placed in the receiving groove, the upper coupler is coupled to the lower coupler.

10. The formula maker according to claim 1, characterized in that: The air blown out from the fan outlet enters the annular air duct tangentially.

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