Wafer edge trimming mechanism

Abstract

The utility model belongs to photovoltaic silicon wafer degumming technical field, concretely relates to a crystal support edge skin removing mechanism, include: degumming subassembly, degumming subassembly include: the scraper, heat conduction plate and heater of horizontal arrangement, the lower surface of scraper is connected with the upper surface of heat conduction plate, and the heater is through the middle two ends of the scraper and heat conduction plate, support subassembly, support subassembly is vertically arranged in the bottom end of degumming subassembly through the connecting plate coaxial with scraper, transmission subassembly, transmission subassembly include: the slide rail of horizontal arrangement in the bottom end of support subassembly, and the drive arrangement of slide rail connection, drive arrangement is connected with support subassembly, and drive arrangement is used for driving degumming subassembly and support subassembly along the slide rail sliding, the utility model discloses through setting scraper and heater, make scraper even heat and thus improve degumming efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of photovoltaic silicon wafer debonding technology, specifically relating to a crystal tray edge removal mechanism. Background Technology

[0002] In the photovoltaic industry, the cut silicon wafers need to undergo thermal debinding, cleaning, and sorting before being packaged in different grades. After cutting, since the silicon rods are attached to the crystal trays, they need to be peeled off. After the crystal trays with the silicon wafers attached are debinded by the debinding machine, multiple crystal trays are stacked on top of each other on the crystal tray unloading trolley.

[0003] However, in the actual debonding process, due to incomplete debonding, a small amount of silicon wafers still adheres to the bottom of the wafer tray after the entire debonding process is completed, which makes it impossible to stack the wafer tray on the wafer tray unloading trolley; currently, the heated scraper in the edge removal mechanism is commonly used to further remove the adhesive.

[0004] However, due to the slender shape of the scraper and the uneven heating of different parts of the scraper when the single heating tube is mounted on the side, the scraper can achieve the purpose of removing adhesive when it is near the heating tube. However, the scraper is not hot enough at the other end, resulting in poor adhesive removal. It is often necessary to manually break off the silicon wafer. Utility Model Content

[0005] The purpose of this invention is to provide a chip tray edge removal mechanism to solve the technical problems of uneven heating, poor adhesive removal effect, increased labor costs, and reduced adhesive removal efficiency when using a scraper to remove adhesive from the chip tray. The goal is to achieve uniform heating of the entire scraper so that the chip tray can be uniformly heated and de-adhesive removed.

[0006] To solve the above-mentioned technical problems, this utility model provides a crystal tray edge removal mechanism, comprising:

[0007] A degumming assembly, comprising: a scraper, a heat-conducting plate, and a heater, all horizontally arranged; the lower surface of the scraper is connected to the upper surface of the heat-conducting plate; and the heater passes through both ends of the middle portion of the scraper and the heat-conducting plate.

[0008] A support assembly is vertically mounted at the bottom end of the degumming assembly via a connecting plate coaxially arranged with the scraper.

[0009] A transmission assembly, comprising: a slide rail horizontally disposed at the bottom end of the support assembly, and a driving device connected to the slide rail; the driving device is connected to the support assembly and is used to drive the degumming assembly and the support assembly to slide along the slide rail.

[0010] Furthermore, there are two heaters, which are arranged parallel to each other in the vertical direction and are in the shape of pipes;

[0011] The heater is detachably mounted on the degumming assembly after passing through the degumming component and the support assembly at both ends.

[0012] Furthermore, it also includes: a disassembly assembly, which includes: a limiting screw connected to the bottom end of the heat-conducting plate and a limiting screw movably connected to the top end of the connecting plate.

[0013] Furthermore, multiple limiting screws are provided, and the multiple limiting screws are arranged along the axis of the heater. The limiting screws pass through the heat-conducting plate and abut against the heater.

[0014] Furthermore, the disassembly assembly also includes: a second heat insulation plate connected to the sidewall of the scraper and the heat-conducting plate, and a cable tray connected to the second heat insulation plate.

[0015] Furthermore, there are two of each of the second heat insulation plate and the wire harness, with the two second heat insulation plates and the wire harness respectively located at both ends of the scraper and the heat-conducting plate, and both ends of the heater passing through the wire harness.

[0016] Furthermore, the support assembly includes: a first heat insulation plate whose upper surface is connected to the lower surface of the connecting plate, a support plate vertically disposed at the bottom end of the first heat insulation plate, and a base plate horizontally disposed at the bottom end of the support plate.

[0017] Furthermore, the base plate is disposed on the slide rail and slidably connected to the slide rail, and the driving device is connected to the base plate.

[0018] Furthermore, a temperature sensor is provided on the middle sidewall of the scraper, and the temperature sensor is electrically connected to the driving device, which drives the driving device to start.

[0019] The beneficial effects of this utility model are:

[0020] 1. This utility model incorporates a heater located in the center of the scraper to ensure uniform heating of the scraper. The heater simultaneously heats a heat-conducting plate, and the surface of the heat-conducting plate adheres to the surface of the scraper, allowing the heat-conducting plate to further heat the scraper evenly. This results in uniform degumming of the crystal substrate, improving degumming efficiency and reducing labor costs.

[0021] 2. This utility model, by setting a first heat insulation plate and a second heat insulation plate, protects the transmission component and heater wire through the heat insulation properties of the first heat insulation plate and the second heat insulation plate. The first heat insulation plate isolates the heat of the heater, scraper and heat conduction plate, preventing heat from being conducted to the support component and the conduction component and damaging the components. The heater wires at both ends of the heater are inserted into the wire harness. The second heat insulation plate isolates the heat of the heater, scraper and heat conduction plate, preventing heat from being conducted to the wire harness and thus damaging the heater wires.

[0022] 3. This utility model sets a limit screw and an adjustment screw. Tightening the limit screw abuts against the heater, keeping the heater fixed and horizontal, and preventing the heater from shaking and affecting the uniform heating of the scraper. By tightening the adjustment screw, since one end of the scraper is connected to the support component, tightening or loosening the adjustment screw can adjust the horizontality of the scraper, so that the scraper can better heat and de-adhede the crystal tray.

[0023] 4. This utility model improves the automation and accuracy of crystal tray degumming by setting a temperature sensor to measure the temperature of the scraper. When the heater heats the scraper to the specified temperature, the temperature sensor transmits the signal to the drive device. The drive device drives the scraper to slide along the slide rail along the bottom of the crystal tray to perform scraping, heating and degumming.

[0024] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a crystal holder edge removal mechanism according to this utility model;

[0027] Figure 2 yes Figure 1 A magnified view of a portion of the image.

[0028] In the picture:

[0029] 1. Degumming assembly; 11. Scraper; 12. Heat-conducting plate; 13. Heater; 2. Support assembly; 21. Connecting plate; 22. First heat insulation plate; 23. Support plate; 24. Base plate; 3. Transmission assembly; 31. Slide rail; 32. Drive device; 4. Temperature sensor; 5. Disassembly assembly; 51. Limit screw; 52. Adjusting screw; 53. Second heat insulation plate; 54. Cable tie. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0031] Example 1:

[0032] like Figures 1 to 2 As shown, a crystal tray edge removal mechanism includes: a debonding assembly 1, a support assembly 2, a transmission assembly 3, and a disassembly assembly 5.

[0033] The debonding assembly 1 includes: a horizontally arranged scraper 11, a heat-conducting plate 12, and a heater 13. The lower surface of the scraper 11 is connected to the upper surface of the heat-conducting plate 12, and the heater 13 passes through both ends of the middle of the scraper 11 and the heat-conducting plate 12. The heater 13 is located in the middle of the scraper 11 and the heat-conducting plate 12 to uniformly heat the scraper 11 and the heat-conducting plate 12. The surface of the heat-conducting plate 12 is attached to the surface of the scraper 11, and the heat-conducting plate 12 uniformly introduces the temperature into the scraper 11, so that the temperature is consistent throughout the scraper 11, and avoids the effect of inconsistent temperature on the debonding of the crystal holder.

[0034] It should be noted that there are two heaters 13, which are arranged parallel to each other in the vertical direction. The heaters 13 are in the shape of pipes. The two heaters 13 are in contact with the scraper 11 and the heat-conducting plate 12 respectively, heating the scraper 11 and the heat-conducting plate 12. The heat-conducting plate 12 provides uniform heat to the scraper 11 as a whole, so that the temperature of the scraper 11 is uniform throughout. The two ends of the heater 13 pass through the degumming component 1 and the support component 2 respectively and are detachably installed on the degumming component 1. There are heater wires at both ends of the heater 13, and the heater wires are wound on the degumming component 1.

[0035] It should be noted that the support component 2 is vertically mounted at the bottom of the degumming component 1 via a connecting plate 21 coaxially arranged with the scraper 11, and the connecting plate 21 is horizontally mounted at the end of the scraper 11. The support component 2 is mounted at the bottom end of the degumming component 1, so that the degumming component 1 and the support component 2 are in the shape of a hanger. Since only one end of the scraper 11 and the heat-conducting plate 12 is supported, the other end will have a downward movement tendency.

[0036] In this embodiment, the support assembly 2 includes: a first heat insulation plate 22 whose upper surface is connected to the lower surface of the connecting plate 21, a support plate 23 vertically disposed at the bottom end of the first heat insulation plate 22, and a base plate 24 horizontally disposed at the bottom end of the support plate 23; the first heat insulation plate 22 is made of bakelite board, which has the characteristics of insulation, no static electricity generation, wear resistance and high temperature resistance. The first heat insulation plate 22 isolates the heat generated by the heater 13, preventing heat from being transferred to the support assembly 2 and damaging the components. At the same time, it prevents the heat from the scraper 11 and the heat-conducting plate 12 from being transferred to the support assembly 2, which would cause the temperature of the scraper 11 to drop, thereby affecting the crystal tray debonding efficiency and increasing resource consumption.

[0037] In this embodiment, the transmission component 3 includes: a slide rail 31 horizontally disposed at the bottom end of the support component 2, and a drive device 32 connected to the slide rail 31; the drive device 32 is connected to the support component 2 and is used to drive the degumming component 1 and the support component 2 to slide along the slide rail 31; the base plate 24 is disposed on the slide rail 31 and is slidably connected to the slide rail 31, and the drive device 32 is connected to the base plate 24.

[0038] It should be noted that the drive device 32 drives the support component 2, which in turn drives the debonding component 1 to move along the direction of the crystal tray. The crystal tray is placed in the frame by a robot arm. The debonding component 1 is installed on the frame. The robot arm places the crystal tray on the scraper 11. Under the action of the drive device 32, the scraper 11 scrapes along the bottom of the crystal tray, thereby realizing the removal of the silicon wafer. A through-beam sensor is set on the frame. After the through-beam sensor detects that all the silicon wafers on the crystal tray have been removed, it sends a signal to the drive device 32. The drive device 32 drives the scraper 11 back to its original position and repeats the above steps to perform debonding operations on subsequent crystal trays.

[0039] Example 2:

[0040] Based on Embodiment 1, the disassembly assembly 5 includes: a limiting screw 51 connected to the bottom end of the heat-conducting plate 12, and an adjusting screw 52 movably connected to the top end of the connecting plate 21. Since one end of the scraper 11 is connected to the support assembly 2, tightening or loosening the adjusting screw 52 can adjust the level of the scraper 11, so that the scraper 11 can better heat and remove the adhesive from the crystal tray. Multiple limiting screws 51 are provided, and multiple limiting screws 51 are arranged along the axis of the heater 13. The limiting screws 51 pass through the heat-conducting plate 12 and abut against the heater 13. Tightening the limiting screws 51 abuts against the heater 13, keeping the heater 13 fixed and level, and preventing the heater 13 from shaking and affecting the uniform heating of the scraper 11.

[0041] In this embodiment, the disassembly assembly 5 further includes: a second heat insulation plate 53 connected to the side wall of the scraper 11 and the heat-conducting plate 12, and a wire harness 54 connected to the second heat insulation plate 53; two second heat insulation plates 53 and two wire harnesses 54 are provided, and the two second heat insulation plates 53 and two wire harnesses 54 are respectively provided at both ends of the scraper 11 and the heat-conducting plate 12, and both ends of the heater 13 pass through the wire harness 54; the wire harness 54 is provided with wire harnessing holes, and the heater wire is passed through the wire harnessing holes for fixing; the second heat insulation plate 53 is made of bakelite board, and the second heat insulation plate 53 blocks the heat from being transferred to the wire harness 54 to avoid damaging the heater wire.

[0042] Example 3:

[0043] Based on Embodiment 1, a temperature sensor 4 is provided on the middle side wall of the scraper 11. The temperature sensor 4 is electrically connected to the drive device 32. The temperature sensor 4 drives the drive device 32 to start. The temperature sensor 4 measures the temperature of the scraper 11. When the heater 13 heats the scraper 11 to the specified temperature, the temperature sensor 4 transmits the signal to the drive device 32. The drive device 32 drives the scraper 11 to slide on the slide rail 31 and perform scraping, heating and degumming along the bottom end of the crystal tray, which improves the automation and accuracy of crystal tray degumming.

[0044] In summary, the heater 13 is powered on to heat the scraper 11 and the heat-conducting plate 12. During the heating process, the heat-conducting plate 12 heats the scraper 11 evenly, causing the scraper 11 to reach the specified temperature. After the temperature sensor 4 detects the temperature of the scraper 11, it sends a signal to the drive device 32 to start. The drive device 32 drives the scraper 11 to move along the bottom of the crystal tray. The scraper 11 scrapes at the bottom of the crystal tray. At high temperature, the scraper 11 removes all the silicon wafers on the crystal tray, completing the debonding of the crystal tray.

[0045] All the devices selected in this application are general standard parts or components known to those skilled in the art. Their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0046] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0047] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0048] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A wafer edge trimming mechanism, characterized by comprising: include: Degumming assembly (1), the degumming assembly (1) includes: a scraper (11) arranged horizontally, a heat-conducting plate (12) and a heater (13), the lower surface of the scraper (11) is connected to the upper surface of the heat-conducting plate (12), and the heater (13) passes through the middle two ends of the scraper (11) and the heat-conducting plate (12); Support component (2), which is vertically mounted at the bottom end of the degumming component (1) via a connecting plate (21) coaxially arranged with the scraper (11); The transmission assembly (3) includes: a slide rail (31) horizontally disposed at the bottom end of the support assembly (2), and a drive device (32) connected to the slide rail (31); the drive device (32) is connected to the support assembly (2) and is used to drive the degumming assembly (1) and the support assembly (2) to slide along the slide rail (31).

2. The crystal tray edge removal mechanism as described in claim 1, characterized in that, There are two heaters (13), which are arranged in parallel in the vertical direction and are in the shape of pipes; The heater (13) is detachably mounted on the degumming assembly (1) after passing through the degumming assembly (1) and the support assembly (2) at both ends.

3. The crystal tray edge removal mechanism as described in claim 1, characterized in that, It also includes a disassembly assembly (5), which includes a limiting screw (51) connected to the bottom of the heat-conducting plate (12) and an adjusting screw (52) movably connected to the top of the connecting plate (21).

4. The crystal tray edge removal mechanism as described in claim 3, characterized in that, Multiple limiting screws (51) are provided, and the multiple limiting screws (51) are arranged along the axis of the heater (13). The limiting screws (51) pass through the heat-conducting plate (12) and abut against the heater (13).

5. The crystal tray edge removal mechanism as described in claim 3, characterized in that, The disassembly assembly (5) further includes: a second heat insulation plate (53) connected to the side wall of the scraper (11) and the heat-conducting plate (12), and a cable tray (54) connected to the second heat insulation plate (53).

6. The crystal tray edge removal mechanism as described in claim 5, characterized in that, There are two of the second heat insulation plate (53) and the wire harness (54). The two second heat insulation plates (53) and the wire harness (54) are respectively located at the two ends of the scraper (11) and the heat-conducting plate (12). The two ends of the heater (13) pass through the wire harness (54).

7. The crystal tray edge removal mechanism as described in claim 1, characterized in that, The support assembly (2) includes: a first heat insulation plate (22) whose upper surface is connected to the lower surface of the connecting plate (21), a support plate (23) vertically disposed at the bottom end of the first heat insulation plate (22), and a base plate (24) horizontally disposed at the bottom end of the support plate (23).

8. A crystal tray edge removal mechanism as described in claim 7, characterized in that, The base plate (24) is disposed on the slide rail (31) and slidably connected to the slide rail (31), and the driving device (32) is connected to the base plate (24).

9. A crystal tray edge removal mechanism as described in claim 1, characterized in that, A temperature sensor (4) is provided on the middle side wall of the scraper (11). The temperature sensor (4) is electrically connected to the drive device (32), and the temperature sensor (4) drives the drive device (32) to start.

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