A tin brushing device for chip production and processing

Abstract

The utility model provides a kind of tin brushing device for chip production and processing, including tin brushing platform assembly, the tin brushing platform assembly includes the tin brushing platform support of vertical installation setting, the outer wall of tin brushing platform support is equipped with the tin brushing rotating platform that can rotate around its own axis horizontally, it is evenly provided with several tin brushing disc stabilizing components along the circumferential direction at the outer edge of the tin brushing rotating platform, tin brushing disc body is embedded in the tin brushing disc stabilizing component and is set, and the chip to be brushed tin is set on the tin brushing disc body;Technical scheme is loaded in the rotating tin brushing rotating platform, multiple stations are set on tin brushing rotating platform, multiple stations are sequentially loaded, and tin paste is loaded on subsequent station, effectively improve processing efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip processing equipment technology, specifically to a tin-brushing device for chip production and processing. Background Technology

[0002] With the development of the times, integrated circuit technology has been continuously improved and developed, and the integration level of chips has been further enhanced. In the current process of chip packaging, a mold with several through holes is placed on the surface of the chip, and then solder paste is applied to the mold to heat the individual chip. This traditional solder paste printing process requires a lot of time and manpower, and the soldering efficiency is low. In view of the problems exposed in the current chip production and processing soldering process, it is necessary to improve and optimize the structure of the soldering equipment used in chip production and processing. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides a soldering device for chip manufacturing and processing, which has the feature of facilitating rapid soldering of chips.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a soldering device for chip manufacturing and processing, comprising a soldering platform assembly, wherein the soldering platform assembly comprises a vertically installed soldering platform bracket, and a soldering rotating platform that can rotate horizontally around its own axis is sleeved on the outer wall of the soldering platform bracket. A plurality of soldering disk stabilizing components are uniformly arranged along the circumferential direction at the outer edge of the soldering rotating platform, wherein a soldering disk body is embedded in the soldering disk stabilizing component, and a chip to be soldered is arranged on the soldering disk body;

[0005] A soldering module motion assembly is also fixedly installed on the soldering platform support. The soldering module motion assembly includes a vertically arranged soldering up and down motion guide rail. A height-adjustable soldering component is slidably sleeved on the soldering up and down motion guide rail. The soldering component includes a height-adjustable soldering knife up and down motion lead screw. A soldering knife fixing component is fixedly connected to the bottom end of the soldering knife up and down motion lead screw. A soldering knife body is connected to the bottom end of the soldering knife fixing component.

[0006] Below the solder brushing assembly is a solder brushing stencil assembly whose height is adjusted synchronously with it. The solder brushing stencil assembly includes a horizontally arranged solder brushing stencil, with solder paste placed inside the solder brushing stencil. When the solder brushing stencil is attached to the chip to be soldered, the solder brushing blade brushes the solder paste on the solder brushing stencil, so that the solder paste is evenly attached to the surface of the chip to be soldered.

[0007] As a preferred technical solution of the solder brushing device for chip manufacturing and processing according to this utility model, the solder brushing tray stabilization component includes a negative pressure vacuum chamber fixedly installed on the solder brushing rotation platform, a solder brushing tray body is fitted on the negative pressure vacuum chamber, a negative pressure connecting pipe is connected to one end of the negative pressure vacuum chamber, the other end of the negative pressure connecting pipe is connected to a vacuum device, and a vibrator is also provided on one side of the negative pressure vacuum chamber. The vibrator is fixed on the solder brushing rotation platform and is connected to the solder brushing tray body and drives the solder brushing tray body to vibrate.

[0008] A soldering tray positioning mechanism is also connected to the outer edge of the soldering rotating platform. One end of the soldering tray positioning mechanism contacts the side wall of the soldering tray body and positions it.

[0009] As a preferred technical solution of the solder brushing device for chip manufacturing and processing according to this utility model, a rotating slip ring is fitted into the outer wall of the solder brushing platform bracket, the solder brushing rotating platform is sleeved on the outer wall of the rotating slip ring and rotates, a solder brushing platform motor is also provided below the solder brushing platform bracket, a gear is sleeved on the output shaft of the solder brushing platform motor, and a driven gear ring is also nested at the bottom end of the solder brushing rotating platform, and the driven gear ring meshes with the gear for transmission.

[0010] As a preferred technical solution of the soldering device for chip manufacturing and processing according to this utility model, the soldering module motion component includes a soldering mechanism mounting frame fixedly mounted on a soldering platform support. A soldering up-and-down motion guide rail is vertically fixedly mounted on the side of the soldering mechanism mounting frame. A soldering up-and-down motion servo motor is mounted at the top of the soldering up-and-down motion guide rail. A drive screw is mounted inside the soldering up-and-down motion guide rail and is connected to the output shaft of the soldering up-and-down motion servo motor. A soldering left-and-right motion module is mounted on one side of the soldering up-and-down motion guide rail. The end of the soldering left-and-right motion module facing the soldering mechanism mounting frame is nested on the drive screw, and its height is adjusted by the drive of the soldering up-and-down motion servo motor.

[0011] As a preferred technical solution of the solder brushing device for chip manufacturing and processing according to this utility model, the solder brushing assembly includes a solder brushing motor fixing plate that is horizontally embedded in the solder brushing left and right motion module and can slide along the solder brushing left and right motion module. The solder brushing motor fixing plate is also provided with a solder brushing motor mounting support. A solder brushing knife motor is fixedly installed on the solder brushing motor mounting support. The telescopic end of the solder brushing knife motor passes through the solder brushing motor mounting support and the solder brushing motor fixing plate and presses against the solder brushing knife's up and down moving lead screw to adjust its height.

[0012] A soldering knife pressure sensor is also provided above the soldering knife fixing component. The top of the soldering knife pressure sensor is in contact with the soldering knife's vertical movement lead screw, and the pressure value is detected during the downward displacement of the soldering knife's vertical movement lead screw.

[0013] As a preferred technical solution of the solder brushing device for chip manufacturing and processing according to this utility model, the solder brushing assembly further includes a solder spreading blade body. Two sets of solder brushing motor mounting supports are provided. One set of solder brushing motor mounting supports is connected to the solder brushing blade motor, and the other set of solder brushing motor mounting supports is connected to the solder spreading blade motor. A set of solder spreading blade up-and-down moving lead screws are also connected to the bottom end of the solder spreading blade motor. A solder spreading blade fixing component is connected to the bottom end of the solder spreading blade up-and-down moving lead screws. The solder spreading blade fixing component is also provided with a solder spreading blade pressure sensor for detecting the pressure value of the solder spreading blade up-and-down moving lead screws.

[0014] Both the solder brushing knife's up-and-down movement lead screw and the solder spreading knife's up-and-down movement lead screw are equipped with photoelectric sensors for controlling the solder brushing knife's lifting stroke on one side.

[0015] As a preferred technical solution of the chip manufacturing and processing tin-brushing device of this utility model, the tin-brushing stencil assembly includes a tin-brushing stencil mounting arm fixed on the tin-brushing left and right motion module. The inner side of the tin-brushing stencil mounting arm is horizontally fitted with a separable tin-brushing stencil. Tin-brushing stencil clamping nuts for reinforcing the tin-brushing stencil are also provided through the upper surfaces on both sides of the tin-brushing stencil mounting arm.

[0016] The bottom two outer edges of the solder stencil mounting arm are also equipped with photoelectric sensors for chip anti-sticking stencil detection.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: In this technical solution, a rotating solder brushing platform is used for material feeding. Multiple stations are set on the solder brushing platform, and materials are fed sequentially at the multiple stations. Solder paste is then applied at the subsequent stations, effectively improving processing efficiency. The equipment is equipped with a solder brushing assembly, each of which is equipped with a set of solder brushing blade motors and solder spreading blade motors. These motors control the height of the solder brushing blade and the solder spreading blade, respectively, to brush and spread the solder paste. This facilitates fast and uniform soldering of the chip, effectively improving processing accuracy and efficiency. Attached Figure Description

[0018] To make the contents of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the structure of this utility model.

[0020] Figure 2In this utility model Figure 1 Another perspective structural diagram.

[0021] Figure 3 In this utility model Figure 1 The front view is a structural diagram.

[0022] Figure 4 In this utility model Figure 3 A schematic diagram of the AA line structure.

[0023] Figure 5 In this utility model Figure 3 A schematic diagram of the BB line structure.

[0024] Figure 6 This is a schematic diagram of the solder brushing component structure in this utility model.

[0025] Figure 7 In this utility model Figure 6 Another perspective structural diagram.

[0026] Figure 8 This is a schematic diagram of the solder brushing platform component in this utility model.

[0027] Figure 9 In this utility model Figure 8 Another perspective structural diagram.

[0028] In the diagram: 1. Soldering platform assembly; 101. Soldering platform bracket; 102. Soldering rotating platform; 103. Soldering platform motor; 104. Rotary slip ring;

[0029] 2. Soldering tray stabilization assembly; 201. Negative pressure vacuum chamber; 202. Negative pressure connecting pipe; 203. Soldering tray body; 204. Soldering tray positioning mechanism; 205. Vibrator; 206. Chip to be soldered;

[0030] 3. Soldering module motion components; 301. Soldering mechanism mounting bracket; 302. Soldering up-and-down motion guide rail; 303. Soldering up-and-down motion servo motor; 304. Soldering left-and-right motion module;

[0031] 4. Soldering stencil assembly; 401. Soldering stencil mounting arm; 402. Soldering stencil clamping nut; 403. Soldering stencil; 404. Chip anti-sticking stencil detection photoelectric sensor;

[0032] 5. Soldering assembly; 501. Soldering motor mounting plate; 502. Soldering motor mounting support; 503. Soldering knife motor; 504. Soldering knife up-and-down movement lead screw; 505. Soldering knife fixing component; 506. Soldering knife body; 507. Soldering knife pressure sensor; 508. Soldering knife lifting stroke control photoelectric sensor; 510. Soldering knife motor; 511. Soldering knife fixing component; 512. Soldering knife pressure sensor; 513. Soldering knife body. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0034] like Figure 1-9 As shown, the present invention provides a soldering device for chip manufacturing and processing, including a soldering platform assembly 1. The soldering platform assembly 1 includes a vertically installed soldering platform bracket 101. The outer wall of the soldering platform bracket 101 is fitted with a soldering rotating platform 102 that can rotate horizontally around its own axis. A plurality of soldering disk stabilizing components 2 are evenly arranged along the circumferential direction at the outer edge of the soldering rotating platform 102. A soldering disk body 203 is embedded in the soldering disk stabilizing component 2. A chip 206 to be soldered is arranged on the soldering disk body 203.

[0035] A soldering module motion component 3 is also fixedly installed on the soldering platform bracket 101. The soldering module motion component 3 includes a vertically arranged soldering up and down motion guide rail 302. A height-adjustable soldering component 5 is slidably sleeved on the soldering up and down motion guide rail 302. The soldering component 5 includes a height-adjustable soldering knife up and down motion lead screw 504. A soldering knife fixing part 505 is fixedly connected to the bottom end of the soldering knife up and down motion lead screw 504. A soldering knife body 506 is connected to the bottom end of the soldering knife fixing part 505.

[0036] Below the soldering component 5, there is also a soldering stencil component 4 whose height is adjusted synchronously with it. The soldering stencil component 4 includes a horizontally arranged soldering stencil 403. Solder paste is placed inside the soldering stencil 403. When the soldering stencil 403 is attached to the chip 206 to be soldered, the soldering blade 506 brushes the solder paste on the soldering stencil 403, so that the solder paste is evenly attached to the surface of the chip 206 to be soldered.

[0037] Specifically, the solder brushing tray stabilization assembly 2 includes a negative pressure vacuum chamber 201 fixedly mounted on the solder brushing rotating platform 102, a solder brushing tray body 203 fitted onto the negative pressure vacuum chamber 201, a negative pressure connecting pipe 202 connected to one end of the negative pressure vacuum chamber 201, and the other end of the negative pressure connecting pipe 202 connected to a vacuum device. A vibrator 205 is also provided on one side of the negative pressure vacuum chamber 201. The vibrator 205 is fixed on the solder brushing rotating platform 102 and is connected to the solder brushing tray body 203, causing the solder brushing tray body 203 to vibrate, so that each chip 206 to be soldered remains horizontal.

[0038] A soldering tray positioning mechanism 204 is also connected to the outer edge of the soldering rotating platform 102. One end of the soldering tray positioning mechanism 204 contacts the side wall of the soldering tray body 203 and positions it. In this embodiment, the soldering tray positioning mechanism 204 is an L-shaped component used to accurately position the soldering tray body 203.

[0039] Specifically, a rotating slip ring 104 is fitted into the outer wall of the solder brushing platform bracket 101, and a solder brushing rotating platform 102 is mounted on the outer wall of the rotating slip ring 104 and rotates. A solder brushing platform motor 103 is also provided below the solder brushing platform bracket 101. A gear is mounted on the output shaft of the solder brushing platform motor 103, and a driven gear ring is also nested at the bottom of the solder brushing rotating platform 102. The driven gear ring meshes with the gear for transmission. In this embodiment, a gas pipe is also connected to the rotating slip ring 104. By pumping gas into the slip ring, the frictional resistance can be effectively reduced.

[0040] Specifically, the solder brushing module motion component 3 includes a solder brushing mechanism mounting bracket 301 fixedly mounted on the solder brushing platform support 101. A solder brushing up-and-down motion guide rail 302 is vertically fixedly mounted on the side of the solder brushing mechanism mounting bracket 301. A solder brushing up-and-down motion servo motor 303 is mounted at the top of the solder brushing up-and-down motion guide rail 302. A drive screw is mounted inside the solder brushing up-and-down motion guide rail 302 and is connected to the output shaft of the solder brushing up-and-down motion servo motor 303. A solder brushing left-and-right motion module 304 is mounted on one side of the solder brushing up-and-down motion guide rail 302. The end of the solder brushing left-and-right motion module 304 facing the solder brushing mechanism mounting bracket 301 is nested on the drive screw. The height is adjusted by driving the solder brushing up-and-down motion servo motor 303. In this embodiment, the height of the solder brushing left-and-right motion module 304 is adjusted when the servo motor 303 is running.

[0041] Specifically, the solder brushing assembly 5 includes a solder brushing motor fixing plate 501 that is horizontally fitted onto the solder brushing left and right motion module 304 and can slide along the solder brushing left and right motion module 304. The solder brushing motor fixing plate 501 is also provided with a solder brushing motor mounting support 502. A solder brushing knife motor 503 is fixedly installed on the solder brushing motor mounting support 502. The telescopic end of the solder brushing knife motor 503 passes through the solder brushing motor mounting support 502 and the solder brushing motor fixing plate 501 and presses against the solder brushing knife up and down motion lead screw 504 to adjust its height. The solder brushing left and right motion module 304 can also be provided with a drive lead screw to drive the solder brushing motor fixing plate 501 to move horizontally on the solder brushing left and right motion module 304.

[0042] A soldering knife pressure sensor 507 is also provided above the soldering knife fixing component 505. The top of the soldering knife pressure sensor 507 is in contact with the soldering knife up-and-down moving lead screw 504. The pressure value is detected during the downward displacement of the soldering knife up-and-down moving lead screw 504. In this embodiment, the soldering knife pressure sensor 507 can be a conventional sensor in the prior art.

[0043] Specifically, the solder brushing assembly 5 also includes a solder-laying blade body 513. Two sets of solder brushing motor mounting supports 502 are provided. One set of solder brushing motor mounting supports 502 is connected to the solder brushing blade motor 503, and the other set of solder brushing motor mounting supports 502 is connected to a solder-laying blade motor 510. A set of solder-laying blade up-and-down movement leadscrews is also connected to the bottom of the solder-laying blade motor 510. A solder-laying blade fixing component 511 is connected to the bottom of the solder-laying blade up-and-down movement leadscrews. The solder-laying blade fixing component 511 is connected to the top of the solder-laying blade body 513. A solder-laying blade pressure sensor 512 is also provided on the solder-laying blade fixing component 511 to detect the pressure value of the solder-laying blade up-and-down movement leadscrews. All sensors in this technical solution are connected to mains power via cables.

[0044] Both the solder brushing knife's up-and-down movement lead screw 504 and the solder spreading knife's up-and-down movement lead screw are equipped with a solder brushing knife lifting stroke control photoelectric sensor 508 on one side. This embodiment includes... Figure 6 and appendix Figure 7 The photoelectric sensor 508 for controlling the lifting stroke of the solder brush disclosed in the article is equipped with two sets. The two sets of photoelectric switches determine whether the device remains horizontal during the height displacement process.

[0045] Specifically, the soldering stencil assembly 4 includes a soldering stencil mounting arm 401 fixed on the soldering left and right motion module 304. A separable soldering stencil 403 is horizontally fitted inside the soldering stencil mounting arm 401. Soldering stencil clamping nuts 402 for reinforcing the soldering stencil 403 are also provided through the upper surfaces on both sides of the soldering stencil mounting arm 401.

[0046] Chip anti-sticking stencil detection photoelectric sensors 404 are also provided on the outer edges of both sides of the bottom end of the solder stencil mounting arm 401. In this embodiment, the chip anti-sticking stencil detection photoelectric sensors 404 can adopt the conventional structure in the existing technology.

[0047] The working principle and usage process of this utility model: In the implementation of this technical solution, the worker places the chip 206 to be soldered on the upper surface of the soldering tray 203. During the operation of the vibrator 205, the soldering tray 203 is driven to vibrate, so that the chip 206 to be soldered is flattened on the soldering tray 203. The negative pressure connecting pipe 202 is connected to the external vacuum device, so that the inside of the negative pressure vacuum chamber 201 is kept vacuum, thereby making the chip 206 to be soldered stably adsorbed on the upper surface of the soldering tray 203, preventing the chip 206 to be soldered from being displaced.

[0048] During operation, the solder brushing platform motor 103 drives the solder brushing rotating platform 102 to rotate horizontally, causing the solder brushing disk stabilizing component 2 to rotate below the solder brushing mesh disk component 4;

[0049] When the servo motor 303 for brushing solder is powered on, it drives the left and right brushing module 304 to slide on the brushing soldering guide rail 302. The height of the left and right brushing module 304 is adjusted so that the bottom of the brushing soldering disk assembly 4 contacts the upper surface of the chip 206 to be brushed.

[0050] Then the soldering assembly 5 operates, causing the soldering knife motor 503 to operate, which causes the soldering knife up-and-down movement screw 504, the soldering knife fixing part 505, and the soldering knife body 506 to sink in height, thereby causing the bottom end of the soldering knife body 506 to adhere to the upper surface of the soldering stencil 403. The upper surface of the soldering stencil 403 is provided with solder paste, and the upper surface of the soldering stencil 403 is provided with mesh through holes to facilitate the passage of solder paste. Then the soldering motor fixing plate 501 moves horizontally along the soldering left and right movement module 304, which will drive the soldering knife body 506 to move horizontally on the upper surface of the soldering stencil 403, scraping the paste back and forth.

[0051] After the solder paste is applied to the chip 206 to be soldered, the soldering blade body 506 rises under the drive of the soldering blade motor 503. Then, the soldering blade motor 510 drives the soldering blade up and down movement screw and the soldering blade fixing part 511 and the soldering blade body 513 to sink, so that the soldering blade body 513 contacts the upper surface of the soldering stencil 403. Then, the soldering blade body 513 also moves back and forth on the soldering left and right movement module 304 under the drive of the soldering blade motor 510, repeatedly scraping the solder paste on the upper surface of the soldering left and right movement module 304.

[0052] After the solder paste is applied to the entire surface of the chip 206 to be soldered, gas is introduced into the negative pressure connecting pipe 202, which releases the negative pressure in the negative pressure vacuum chamber 201, allowing the soldering tray 203 to be separated from the chip 206 to be soldered. The rotary table rotates to the next station, and at the same time, each module in the soldering assembly 5 rises. The chip anti-sticking stencil detection photoelectric sensor 404 detects whether there are solder paste fragments stuck to the bottom of the stencil. If so, an alarm is triggered and manual handling is performed to prevent abnormal chip feeding in subsequent stations.

[0053] The above description is only a preferred embodiment of the present utility model and is not intended to further limit the present utility model. All equivalent changes made based on the description and drawings of the present utility model are within the protection scope of the present utility model.

Claims

1. A soldering device for chip manufacturing, comprising a soldering platform assembly (1), characterized in that: The soldering platform assembly (1) includes a vertically installed soldering platform bracket (101). The outer wall of the soldering platform bracket (101) is fitted with a soldering rotating platform (102) that can rotate horizontally around its own axis. A plurality of soldering disk stabilizing components (2) are evenly arranged along the circumferential direction at the outer edge of the soldering rotating platform (102). A soldering disk body (203) is embedded in the soldering disk stabilizing component (2). A chip (206) to be soldered is arranged on the soldering disk body (203). A soldering module motion assembly (3) is also fixedly installed on the soldering platform bracket (101). The soldering module motion assembly (3) includes a vertically installed soldering up and down motion guide rail (302). A height-adjustable soldering component (5) is slidably sleeved on the soldering up and down motion guide rail (302). The soldering component (5) includes a height-adjustable soldering knife up and down motion lead screw (504). A soldering knife fixing piece (505) is fixedly connected to the bottom end of the soldering knife up and down motion lead screw (504). A soldering knife body (506) is connected to the bottom end of the soldering knife fixing piece (505). Below the solder brushing assembly (5) is a solder brushing stencil assembly (4) whose height is synchronously adjusted. The solder brushing stencil assembly (4) includes a horizontally arranged solder brushing stencil (403). Solder paste is placed inside the solder brushing stencil (403). When the solder brushing stencil (403) is attached to the chip (206) to be soldered, the solder brushing blade (506) brushes the solder paste on the solder brushing stencil (403) so that the solder paste is evenly attached to the surface of the chip (206) to be soldered.

2. The tin-brushing device for chip manufacturing and processing according to claim 1, characterized in that: The solder brushing tray stabilization assembly (2) includes a negative pressure vacuum chamber (201) fixedly mounted on the solder brushing rotating platform (102), a solder brushing tray body (203) fitted onto the negative pressure vacuum chamber (201), a negative pressure connecting pipe (202) connected to one end of the negative pressure vacuum chamber (201), and the other end of the negative pressure connecting pipe (202) connected to a vacuum device. A vibrator (205) is also provided on one side of the negative pressure vacuum chamber (201). The vibrator (205) is fixed on the solder brushing rotating platform (102), and the vibrator (205) is connected to the solder brushing tray body (203) and drives the solder brushing tray body (203) to vibrate. A soldering tray positioning mechanism (204) is also connected to the outer edge of the soldering rotating platform (102). One end of the soldering tray positioning mechanism (204) contacts the side wall of the soldering tray body (203) and positions it.

3. The tin-brushing device for chip manufacturing and processing according to claim 1, characterized in that: A rotating slip ring (104) is fitted into the outer wall of the solder brushing platform bracket (101). The solder brushing rotating platform (102) is sleeved on the outer wall of the rotating slip ring (104) and rotates. A solder brushing platform motor (103) is also provided below the solder brushing platform bracket (101). A gear is sleeved on the output shaft of the solder brushing platform motor (103). A driven gear ring is also nested at the bottom of the solder brushing rotating platform (102). The driven gear ring meshes with the gear for transmission.

4. The tin-brushing device for chip manufacturing and processing according to claim 1, characterized in that: The solder brushing module motion assembly (3) includes a solder brushing mechanism mounting bracket (301) fixedly mounted on the solder brushing platform bracket (101). A solder brushing up-and-down motion guide rail (302) is vertically fixed on the side of the solder brushing mechanism mounting bracket (301). A solder brushing up-and-down motion servo motor (303) is provided at the top of the solder brushing up-and-down motion guide rail (302). A drive screw is provided inside the solder brushing up-and-down motion guide rail (302). The drive screw is connected to the output shaft of the solder brushing up-and-down motion servo motor (303). A solder brushing left-and-right motion module (304) is provided on one side of the solder brushing up-and-down motion guide rail (302). The end of the solder brushing left-and-right motion module (304) facing the solder brushing mechanism mounting bracket (301) is nested on the drive screw. The height is adjusted by the drive of the solder brushing up-and-down motion servo motor (303).

5. The tin-brushing device for chip manufacturing and processing according to claim 1, characterized in that: The solder brushing assembly (5) includes a solder brushing motor fixing plate (501) that is horizontally fitted onto the solder brushing left and right motion module (304) and can slide along the solder brushing left and right motion module (304). The solder brushing motor fixing plate (501) is also provided with a solder brushing motor mounting support (502). A solder brushing knife motor (503) is fixedly installed on the solder brushing motor mounting support (502). The telescopic end of the solder brushing knife motor (503) passes through the solder brushing motor mounting support (502) and the solder brushing motor fixing plate (501) and presses against the solder brushing knife up and down motion lead screw (504) to adjust its height. A soldering knife pressure sensor (507) is also provided above the soldering knife fixing component (505). The top of the soldering knife pressure sensor (507) is in contact with the soldering knife up-and-down moving lead screw (504) and detects its pressure value during the downward displacement of the soldering knife up-and-down moving lead screw (504).

6. The tin-brushing device for chip manufacturing and processing according to claim 5, characterized in that: The solder brushing assembly (5) also includes a solder spreading blade body (513). The solder brushing motor mounting support (502) is provided in two sets. One set of the solder brushing motor mounting support (502) is connected to the solder brushing blade motor (503). The other set of the solder brushing motor mounting support (502) is connected to a solder spreading blade motor (510). The bottom end of the solder spreading blade motor (510) is also connected to a set of solder spreading blade up and down moving lead screws. The bottom end of the solder spreading blade up and down moving lead screws is connected to a solder spreading blade fixing member (511). The solder spreading blade fixing member (511) is connected to the top end of the solder spreading blade body (513). The solder spreading blade fixing member (511) is also provided with a solder spreading blade pressure sensor (512) for detecting the pressure value of the solder spreading blade up and down moving lead screws. Both the solder brushing knife up-and-down movement lead screw (504) and the solder spreading knife up-and-down movement lead screw are equipped with a solder brushing knife lifting stroke control photoelectric device (508) on one side.

7. The tin-brushing device for chip manufacturing and processing according to claim 1, characterized in that: The soldering stencil assembly (4) includes a soldering stencil mounting arm (401) fixed on the soldering left and right motion module (304). A separable soldering stencil (403) is horizontally fitted inside the soldering stencil mounting arm (401). Soldering stencil clamping nuts (402) for reinforcing the soldering stencil (403) are also provided through the upper surfaces on both sides of the soldering stencil mounting arm (401). The bottom two outer edges of the solder stencil mounting arm (401) are also provided with chip anti-sticking stencil detection photoelectric devices (404).

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