A tin paste printing device for PCB

Abstract

The utility model discloses a kind of tin paste printing devices for PCB, it is related to printing device technical field, the tin paste printing device for PCB, including printing machine body and be set on the linear drive of the printing machine body, printing mechanism is set on the linear drive, the printing mechanism includes: mounting bracket, the mounting bracket is connected on the linear drive;Scraper structure, the scraper structure is located mounting bracket, to carry out the operation of scraping tin paste;The utility model has realized the efficient scraping of tin paste and concentrated collection, in printing process, device utilizes motor-driven gear transmission system, accurately controls the lifting action of scraper structure, so that first blade plate can be flexibly switched according to printing direction, ensure that tin paste is evenly distributed on steel net, simultaneously, collection structure is driven under the drive bevel gear, through the synergic effect of transmission assembly and push away component, dispersed tin paste generated in the action process of scraper structure is effectively pushed away and concentrated.

Description

Technical Field

[0001] This utility model relates to the field of printing equipment technology, specifically to a solder paste printing device for PCB boards. Background Technology

[0002] A PCB solder paste printing device is a specialized device for printing solder paste onto PCB substrates. Its working principle is to first place the substrate on the positioning stage of the printing device, and then use a stencil to print solder paste onto the pads of the PCB. The holes on the stencil correspond to the pads on the substrate. A scraper is used to evenly scrape the solder paste across the stencil so that the solder paste falls onto the pads through the holes of the stencil.

[0003] Currently used solder paste printing equipment has some problems that urgently need to be solved in actual use. Specifically, the solder paste on the stencil usually needs to be added in time intervals. When the amount of solder paste gradually decreases, the operator needs to replenish the solder paste in a timely manner to ensure the continuity of the printing process. However, during this process, when the squeegee pushes the solder paste on the stencil, the solder paste near the two ends of the squeegee often disperses to the outer edge of the two ends of the squeegee, or even crosses the printing area. This dispersion phenomenon makes it impossible for the solder paste to be effectively concentrated in the printing area, thus leaving the effective range of pushing and printing.

[0004] Because the solder paste cannot be effectively utilized after it disperses to both ends of the squeegee, this not only wastes the solder paste but also increases production costs. More seriously, this dispersion directly affects the printing quality of the solder paste. During the printing process, uneven distribution of solder paste can lead to incomplete or uneven printed patterns, which in turn affects the overall performance and reliability of the PCB board. In addition, the dispersed solder paste may also contaminate the printing equipment, increasing the maintenance costs and cleaning difficulty of the equipment. Utility Model Content

[0005] This invention provides a solder paste printing device for PCB boards, which has the advantages of efficient centralized dispersion of solder paste, improved solder paste utilization, and ensured printing quality, thereby solving the problems of waste and unstable printing quality caused by solder paste dispersion in the prior art.

[0006] To achieve efficient printing, reduce solder paste waste, and improve printing quality, this utility model provides the following technical solution: a solder paste printing device for PCB boards, comprising a printing machine body and a linear drive component mounted on the printing machine body, wherein a printing mechanism is mounted on the linear drive component, and the printing mechanism includes:

[0007] Mounting bracket, the mounting bracket being connected to the linear drive;

[0008] A scraper structure, located on a mounting bracket, for performing solder paste scraping operations;

[0009] A collection structure is located at both ends of the scraper structure and is mounted on a mounting bracket;

[0010] The drive structure, mounted on the mounting bracket, provides power to drive two sets of collection structures to center and push the collection of excess solder paste on the stencil. The drive structure also drives the scraper structure to rise and fall.

[0011] As a preferred embodiment of this utility model, the mounting bracket includes:

[0012] A mounting plate is mounted on the linear drive component, which is used to drive the mounting plate to move laterally.

[0013] A mounting base is installed on the mounting plate to fix the drive structure and the scraper structure.

[0014] As a preferred embodiment of this utility model, the mounting bracket further includes:

[0015] A connecting seat is fixed on the fixed seat and is used to connect the drive structure, the scraper structure, and the collection structure.

[0016] As a preferred embodiment of this utility model, the driving structure includes:

[0017] An electric motor, mounted on the connecting bracket, is used to provide power;

[0018] A drive gear is fixed on the output shaft of the motor, and a drive helical gear is concentrically fixed on the drive gear to transmit power to the scraper structure and the collecting structure.

[0019] As a preferred technical solution of this utility model, the scraper structure includes two sets of scraper components arranged symmetrically;

[0020] Each set of the scraper assemblies includes:

[0021] A lifting plate, on which a rack is fixed, the rack meshing with the drive gear for transmitting power;

[0022] A first blade, detachably mounted on the lifting plate, is used to scrape and apply the solder paste.

[0023] As a preferred embodiment of this utility model, slide rails are installed on both sides of the lifting plate, and the slide rails are adapted to slide and connect with the track provided on the connecting seat to guide the up and down movement of the lifting plate.

[0024] As a preferred technical solution of this utility model, it also includes:

[0025] A transmission assembly is disposed on the connecting seat and is connected to the driving helical gear.

[0026] A pushing and pushing assembly, which is disposed on the transmission assembly, is used to push and push the dispersed solder paste.

[0027] As a preferred embodiment of this utility model, the transmission assembly includes:

[0028] A horizontal sliding rod, on which two sliding frames are symmetrically fixed, and on which mounting heads for connecting with the connecting seat are fixed;

[0029] A follower disk is rotatably disposed between the two sliding frames, and a first connecting post and a second connecting post are respectively fixed on the follower disk;

[0030] A driven helical gear is fixed between the driven helical gear and the follower disk, and the rotating shaft is rotatably mounted on the connecting seat. The driven helical gear meshes with the driving helical gear to transmit power to the pushing assembly.

[0031] As a preferred embodiment of this utility model, the pushing and shoving component includes:

[0032] Two sliding seats are symmetrically slidably disposed at both ends of the transverse rod, and the two sliding seats are arranged in a cross shape with the two lifting plates;

[0033] The second blade is connected to the sliding seat. A connector is fixed to the top of the sliding seat, and a transmission rod is rotatably mounted on the connector. The horizontal lines of the two transmission rods are staggered. One transmission rod is rotatably connected to the first connecting column, and the other transmission rod is rotatably connected to the second connecting column.

[0034] As a preferred technical solution of this utility model, a control unit is provided on the printing machine body, and the control unit is electrically connected to each component to control the operation of the printing mechanism;

[0035] The printing press body is also equipped with a rotatable and adjustable protective cover, which is used to fasten onto the printing press body during the printing process.

[0036] Compared with the prior art, the present invention provides a solder paste printing device for PCB boards, which has the following advantages:

[0037] 1. This PCB board solder paste printing device achieves efficient scraping and centralized collection of solder paste. During the printing process, the device uses a motor-driven gear transmission system to precisely control the lifting and lowering of the squeegee structure, allowing the first blade to switch flexibly according to the printing direction, ensuring uniform distribution of solder paste on the stencil. At the same time, the collection structure, driven by the helical gear, effectively pushes and collects the dispersed solder paste generated during the squeegee structure's movement through the coordinated action of the transmission and pushing components, avoiding solder paste waste and maintaining the cleanliness of the printing area.

[0038] 2. The PCB board solder paste printing device has a centralized collection function that not only improves the utilization rate of solder paste and reduces production costs, but also significantly improves the stability and uniformity of printing quality. It effectively solves the problems of waste and unstable printing quality caused by solder paste dispersion in traditional printing devices, and significantly improves the efficiency and quality of PCB board solder paste printing. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0040] Figure 2 This is a schematic diagram showing another state of the present invention;

[0041] Figure 3 This is a schematic diagram of the printing mechanism of this utility model;

[0042] Figure 4 This is a partial schematic diagram of the printing mechanism of this utility model;

[0043] Figure 5 This is a schematic diagram of the scraper structure and drive structure of this utility model;

[0044] Figure 6 for Figure 5 A schematic diagram after removing the connector;

[0045] Figure 7 This is a schematic diagram of the scraper structure 8 of this utility model;

[0046] Figure 8 This is a schematic diagram of the driving structure and the collecting structure of this utility model;

[0047] Figure 9 This is a schematic diagram of the transverse sliding rod of this utility model;

[0048] Figure 10 This is a schematic diagram of the pushing and shoving component of this utility model;

[0049] Figure 11 This is a schematic diagram of the follower disk of this utility model;

[0050] Figure 12This is a schematic diagram of the sliding seat and the second blade of this utility model.

[0051] In the diagram: 1. Printing machine body; 2. Control unit; 3. Protective cover; 4. Linear drive component; 5. Mounting plate; 6. Fixed base; 7. Connecting base; 8. Squeegee structure; 9. Lifting plate; 10. Rack; 11. Slide rail; 12. First blade; 13. Motor; 14. Drive gear; 15. Drive helical gear; 16. Horizontal movement rod; 17. Sliding frame; 18. Mounting head; 19. Follower plate; 20. First connecting column; 21. Second connecting column; 22. Rotating shaft; 23. Driven helical gear; 24. Sliding base; 25. Second blade; 26. Connecting head; 27. Transmission rod. Detailed Implementation

[0052] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0053] Please see Figures 1-12 This utility model discloses a solder paste printing device for PCB boards, including a printing machine body 1 and a linear drive 4 disposed on the printing machine body 1. The linear drive 4 is provided with a printing mechanism, which includes a mounting frame mounted on the linear drive 4, a drive structure disposed on the mounting frame, a scraper structure 8, and a collection structure.

[0054] The drive structure here provides power to drive the various parts of the printing mechanism to perform corresponding actions. The squeegee structure 8 is used to scrape solder paste during the printing process. The collection structure is also connected to the drive structure. When the squeegee structure 8 is in operation, the drive structure can drive the collection structure to center and push the excess solder paste on the stencil for collection.

[0055] The working principle and usage process of this utility model are as follows: First, the stencil for the PCB board to be printed is placed on the corresponding position of the printing machine body 1, ensuring it is fixed and flat so that subsequent printing operations can proceed smoothly. At this time, the linear drive 4 is in its initial position on the printing machine body 1, and the printing mechanism is in a ready-to-start state. When the printing device is started, the drive structure begins to work, providing power to each component of the printing mechanism. The mounting frame, acting as a bridge connecting the linear drive 4 and other components of the printing mechanism, stably bears the weight of the entire printing mechanism and ensures tight cooperation between each component. Under the drive of the drive structure, the squeegee structure 8 moves along the surface of the stencil, uniformly scraping the solder paste. During the movement of the squeegee structure 8, it maintains a certain contact pressure with the surface of the stencil, allowing the solder paste to accurately fill the printing pattern area on the stencil, while simultaneously scraping off excess solder paste to ensure printing quality.

[0056] When the squeegee structure 8 switches its moving direction, the collection structure promptly centers and pushes the excess solder paste to collect it. This process not only effectively avoids solder paste waste but also maintains the amount of solder paste filling in the printing area, preventing scattered solder paste from affecting subsequent printing processes. Through the centering and pushing action of the collection structure, excess solder paste is collected and can be easily reused, further improving the utilization rate of solder paste and reducing production costs.

[0057] Throughout the printing process, the various components of the printing mechanism cooperate with each other under the coordinated drive of the drive structure to complete the solder paste scraping and collection work in an orderly manner. The linear drive component 4 moves smoothly along the predetermined track on the printing machine body 1 according to the printing requirements, ensuring that the printing mechanism can accurately align with each printing position on the stencil, and achieve efficient and high-quality solder paste printing operation.

[0058] Preferably, the linear drive component 4 is a lead screw type linear guide.

[0059] Please see Figures 3-5 The aforementioned mounting bracket includes a mounting plate 5, a fixing seat 6, and a connecting seat 7. The mounting plate 5 is mounted on the linear drive component 4, which is used to drive the mounting plate 5 to move laterally. The fixing seat 6 is mounted on the mounting plate 5 and is used to fix the drive structure and the scraper structure 8.

[0060] In addition, the mounting bracket also includes a connecting seat 7, which is fixed on the fixing seat 6. The connecting seat 7 is used to connect the drive structure, the scraper structure 8, and the collection structure.

[0061] In this embodiment, the mounting plate 5, as the basic component of the entire mounting frame, is firmly mounted on the linear drive 4. The linear drive 4, through its own driving mechanism, can drive the mounting plate 5 to move precisely laterally, thereby ensuring that the printing mechanism can accurately align with each printing position on the stencil during the printing process. This lateral movement function is crucial for achieving high-precision solder paste printing because it ensures that the squeegee structure 8 can cover every area on the stencil that needs to be printed during the printing process. This achieves the solder paste application operation on the PCB board.

[0062] The mounting base 6 is installed on the mounting plate 5 and plays a key role in fixing it. It not only provides a stable mounting position for the drive structure, but also ensures that the squeegee structure 8 can maintain a stable working state during the printing process. Through the fixing effect of the mounting base 6, the drive structure and the squeegee structure 8 can work together during the printing process to achieve precise application of solder paste.

[0063] The connecting seat 7 further enhances the functionality of the mounting bracket. It is fixed to the fixed seat 6 and, through its design, tightly connects the drive structure, the squeegee structure 8, and the collection structure together. This connection method not only ensures the power transmission and coordinated action between the various components, but also enables the entire printing mechanism to operate efficiently as a whole during operation. The presence of the connecting seat 7 allows the drive structure to simultaneously drive the squeegee structure 8 to perform the squeegee action and drive the collection structure to center and push the dispersed solder paste to collect it, thereby realizing the synchronous squeegee and collection during the printing process, further improving printing efficiency and printing quality.

[0064] In actual use, the mounting bracket ensures that the printing mechanism moves smoothly along the predetermined trajectory under the drive of the linear drive component 4. At the same time, the various components can work closely together to complete the high-precision solder paste printing task. Through the synergistic effect of the mounting plate 5, the fixing seat 6 and the connecting seat 7, the printing mechanism can achieve efficient and stable printing operation while ensuring printing quality, meeting the high requirements for solder paste printing in the PCB board production process.

[0065] Please see Figure 6 and Figure 8 As a technical optimization of this utility model, the drive structure includes a motor 13 and a drive gear 14. The motor 13 is mounted on the connecting seat 7 to provide power. The drive gear 14 is fixed on the output shaft of the motor 13. A drive helical gear 15 is concentrically fixed on the drive gear 14 to transmit power to the scraper structure 8 and the collecting structure.

[0066] In this embodiment, the motor 13, as the core power source of the drive structure, is firmly mounted on the connecting seat 7. The start of the motor 13 provides the initial power for the operation of the entire printing mechanism. Its stable output ensures the smooth progress of the printing process. A drive gear 14 is fixed on the output shaft of the motor 13. The gear transmits the power of the motor 13 efficiently through a tight connection with the motor 13.

[0067] A drive helical gear 15 is concentrically fixed on the drive gear 14. This concentric design makes the power transmission more stable and efficient. The function of the drive helical gear 15 is to further transmit the power of the motor 13 to the squeegee structure 8 and the collection structure. Through this gear transmission, the power of the motor 13 is precisely distributed to each key component of the printing mechanism, ensuring that the squeegee structure 8 can perform precise squeegeeing action, while the collection structure can effectively center and push the dispersed solder paste for collection.

[0068] In the actual printing process, the start of motor 13 drives the drive gear 14 to rotate, and then transmits power to the squeegee structure 8 and the collection structure through the drive helical gear 15. This power transmission method not only ensures the coordination of the actions between the components, but also ensures the continuity and efficiency of the entire printing process. Through the coordinated work of motor 13, drive gear 14 and drive helical gear 15, the printing mechanism can achieve efficient and stable solder paste printing operation while ensuring printing quality, meeting the strict requirements for printing accuracy and efficiency in the PCB board production process.

[0069] Please see Figures 5-7 As a technical optimization of this utility model, the scraper structure 8 includes two sets of scraper assemblies arranged symmetrically. Each set of scraper assemblies includes a lifting plate 9 and a first blade plate 12. A rack 10 is fixed on the lifting plate 9 and meshes with a drive gear 14 to transmit power. The first blade plate 12 is detachably installed on the lifting plate 9 and is used to scrape solder paste. Slide rails 11 are installed on both sides of the lifting plate 9 and are adapted to slide on the track provided on the connecting seat 7 to guide the up and down movement of the lifting plate 9.

[0070] Please see Figures 8-12 The aforementioned collection structure includes a transmission component and a pushing component. The transmission component is mounted on the connecting seat 7 and is connected to the drive helical gear 15. The pushing component is mounted on the transmission component and is used to push the dispersed solder paste.

[0071] The aforementioned transmission assembly includes a transverse rod 16, a follower plate 19, and a driven helical gear 23. Two sliding frames 17 are symmetrically fixed on the transverse rod 16. Mounting heads 18 for connecting to the connecting seat 7 are fixed on the sliding frames 17. The follower plate 19 is rotatably disposed between the two sliding frames 17. A first connecting post 20 and a second connecting post 21 are fixed on the follower plate 19, respectively. A rotating shaft 22 is fixed between the driven helical gear 23 and the follower plate 19. The rotating shaft 22 is rotatably disposed on the connecting seat 7. The driven helical gear 23 meshes with the driving helical gear 15 to transmit power to the pushing assembly.

[0072] The aforementioned pushing and pushing assembly includes two sliding seats 24 and two second blades 25. The two sliding seats 24 are symmetrically slidably arranged at both ends of the transverse rod 16. The two sliding seats 24 are arranged in a cross shape with the two lifting plates 9. The second blades 25 are connected to the sliding seats 24. A connector 26 is fixed to the top of the sliding seat 24. A transmission rod 27 is rotatably mounted on the connector 26. The horizontal lines of the two transmission rods 27 are staggered. One transmission rod 27 is rotatably connected to the first connecting column 20, and the other transmission rod 27 is rotatably connected to the second connecting column 21. One end of the transmission rod 27 is eccentrically mounted on the follower plate 19.

[0073] In this embodiment, the collection structure is designed to efficiently handle the solder paste that is dispersed to both ends of the stencil during the printing process due to the scraping action of the squeegee structure 8. This process is crucial for ensuring the cleanliness of the printing area and the full utilization of the solder paste. The transmission component, as the core part of the collection structure, is installed on the connecting seat 7 and transmits the power of the motor 13 through the meshing of the driven helical gear 23 and the driving helical gear 15, thereby driving the entire collection structure to move.

[0074] The transverse rod 16 is an important component of the transmission assembly. Two sliding frames 17 are symmetrically fixed on it. The sliding frames 17 are connected to the connecting seat 7 through the mounting head 18. This connection method ensures the stability of the transmission assembly and allows the transverse rod 16 to move laterally within a certain range. The follower plate 19 is rotatably disposed between the two sliding frames 17. The first connecting column 20 and the second connecting column 21 fixed on it play a key role in power transmission. The driven helical gear 23 is connected to the follower plate 19 through the rotating shaft 22 and meshes with the driving helical gear 15, thereby transmitting power from the drive structure to the pushing assembly.

[0075] The pushing and pushing assembly directly participates in the collection of dispersed solder paste. Two sliding seats 24 are symmetrically slidably arranged at both ends of the transverse rod 16 and are arranged in a cross shape with the two lifting plates 9. This special layout allows the pushing and pushing assembly to effectively push the dispersed solder paste after the scraper structure 8 completes the scraping action. The second blade 25 is connected to the sliding seat 24, and its main function is to directly contact and push the solder paste. A transmission rod 27 is rotatably installed on the connector 26 at the top of the sliding seat 24. The two transmission rods 27 are horizontally staggered, one of which is rotatably connected to the first connecting post 20 and the other is rotatably connected to the second connecting post 21. This staggered transmission rod 27 can convert the rotation of the follower plate 19 into the lateral movement of the sliding seat 24, thereby driving the second blade 25 to perform the pushing and pushing action.

[0076] In the actual printing process, after the squeegee structure 8 completes the application of solder paste, the solder paste dispersed at both ends of the stencil is collected by the pushing component. Specifically, after the motor 13 starts, the power is transmitted to the driven helical gear 23 through the driving helical gear 15, which in turn drives the follower plate 19 to rotate. The rotation of the follower plate 19 is transmitted to the transmission rod 27 through the first connecting post 20 and the second connecting post 21, causing the sliding seat 24 to move laterally on the transverse rod 16. The second blade 25 then moves, pushing the dispersed solder paste toward the center of the printing area, ultimately achieving centralized collection of the dispersed solder paste. This process not only avoids waste of solder paste but also keeps the printing area clean, providing good conditions for subsequent printing processes. Through this collection structure design, the PCB board solder paste printing device of this utility model improves printing efficiency while ensuring the stability of printing quality.

[0077] Please see Figure 1 and Figure 2 As a technical optimization of this utility model, a control unit 2 is provided on the printing machine body 1. The control unit 2 is electrically connected to each component and is used to control the operation of the printing mechanism. A rotatable and adjustable protective cover 3 is also provided on the printing machine body 1 for fastening onto the printing machine body 1 during the printing process.

[0078] In this embodiment, the control unit 2 on the printing press body 1 is the control core of the entire printing device. Through electrical connection with each component, it achieves precise control of the printing mechanism's movements. The control unit 2 can precisely adjust the speed of the motor 13, the lifting and lowering of the squeegee structure 8, and the movement of the collecting structure according to preset programs and parameters, thereby ensuring the automation and efficiency of the entire printing process. This intelligent control method not only improves production efficiency but also reduces errors caused by human operation, further enhancing the stability of printing quality.

[0079] Meanwhile, the rotatable and adjustable protective cover 3 installed on the printing press body 1 provides additional safety for the entire printing process. During the printing process, the protective cover 3 can be fastened to the printing press body 1 to isolate the printing area from the external environment. This design not only prevents external factors such as dust and impurities from affecting the printing quality, but also effectively prevents operators from accidentally coming into contact with the operating printing mechanism during the printing process, thereby ensuring the safety of the operators. The rotatable and adjustable function of the protective cover 3 makes it easy to open when equipment maintenance or printing material replacement is required, improving the ease of use of the equipment.

[0080] In summary, when the PCB board solder paste printing device applies solder paste to the PCB board, the core power of the device comes from the motor 13. After it starts, it drives the drive gear 14 to rotate. Since the drive gear 14 is tightly meshed with the two racks 10 on both sides, this gear and rack transmission method can accurately control the lifting and lowering adjustment of the two lifting plates 9. This lifting and lowering adjustment function is crucial for the switching of the first blade plate 12 when it moves laterally in different directions to apply solder paste.

[0081] When the drive gear 14 rotates one revolution, the height of the two lifting plates 9 will be adjusted accordingly. This height adjustment function allows the first blade plate 12 to be adjusted to the necessary position when moving in the reverse direction after applying solder paste in the forward direction, thereby ensuring the continuity and stability of the printing process. At the same time, the rotation of the drive gear 14 will also drive the drive helical gear 15 to rotate one revolution. Since the drive helical gear 15 meshes with the driven helical gear 23, the driven helical gear 23 will also rotate one revolution.

[0082] The rotation of the driven helical gear 23 further drives the follower disk 19 to rotate. The follower disk 19 is connected to two transmission rods 27 through the first connecting post 20 and the second connecting post 21 on it. When the follower disk 19 rotates, the two transmission rods 27 will drive the sliding seats 24 on both sides and the second blade plate 25 to complete a complex motion process: starting from the separated state, after adjustment, to the closed state, and then separated again. This motion process is not only synchronized with the change of the height position of the lifting plate 9, but also can effectively concentrate the pushed and dispersed solder paste again through the closing action of the second blade plate 25.

[0083] This concentrating effect is of great significance for improving the printing quality of solder paste on PCB boards. In the traditional printing process, the solder paste may be dispersed to both ends of the first blade 12 under the push of the squeegee, resulting in solder paste waste and affecting the uniformity and accuracy of printing. However, through the closing action of the second blade 25, the dispersed solder paste is reconcentrated in the center of the printing area, which not only avoids solder paste waste, but also ensures that the solder paste is more evenly distributed on the PCB board, thereby improving the printing quality.

[0084] In addition, this design also solves the common problem of solder paste dispersion in traditional printing devices. Without a centralized collection mechanism, solder paste may be dispersed outside the printing area during the printing process due to the movement of the squeegee, resulting in incomplete or uneven printed patterns. This device effectively solves this problem through the pushing and concentrating function of the second blade 25, ensuring that the solder paste is always concentrated in the printing area, further improving the stability and reliability of printing.

[0085] It should be noted that, in this document, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0086] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A solder paste printing apparatus for PCB boards, comprising a printing body (1) and a linear drive (4) disposed on the printing body (1), characterized in that, The linear drive (4) is provided with a printing mechanism, which includes: Mounting bracket, which is connected to the linear drive (4); A scraper structure (8) is located on a mounting bracket for scraping solder paste. A collection structure is located at both ends of the scraper structure (8) and is mounted on a mounting bracket; The drive structure, which is mounted on the mounting bracket, is used to provide power to drive the collection structure to center and push the collection of excess solder paste on the stencil. The drive structure is also used to drive the scraper structure (8) to rise and fall.

2. The PCB board solder paste printing apparatus according to claim 1, characterized in that: The mounting bracket includes: Mounting plate (5), which is mounted on the linear drive (4), and the linear drive (4) is used to drive the mounting plate (5) to move laterally; A fixing seat (6) is mounted on the mounting plate (5) for fixing the drive structure and the scraper structure (8).

3. The PCB board solder paste printing apparatus according to claim 2, characterized in that: The mounting bracket also includes: Connecting seat (7), which is fixed on the fixed seat (6), is used to connect the driving structure, the scraper structure and the collecting structure.

4. The PCB board solder paste printing apparatus according to claim 3, characterized in that: The driving structure includes: The motor (13) is mounted on the connecting seat (7) and is used to provide power; A drive gear (14) is fixed on the output shaft of the motor (13). A drive helical gear (15) is concentrically fixed on the drive gear (14) for transmitting power to the scraper structure (8) and the collection structure.

5. The PCB board solder paste printing apparatus according to claim 4, characterized in that: The scraper structure (8) includes two sets of scraper assemblies arranged symmetrically; Each set of the scraper assemblies includes: A lifting plate (9) is provided, on which a rack (10) is fixed. The rack (10) meshes with the drive gear (14) to transmit power. The first blade (12) is detachably mounted on the lifting plate (9) for scraping the solder paste.

6. The PCB solder paste printing apparatus according to claim 5, characterized in that: The lifting plate (9) is equipped with slide rails (11) on both sides. The slide rails (11) are adapted to slide and connected to the track on the connecting seat (7) to guide the lifting plate (9) to move up and down.

7. The PCB board solder paste printing apparatus according to claim 6, characterized in that: Also includes: A transmission assembly is disposed on the connecting seat (7) and is connected to the driving helical gear (15) in a transmission manner; A pushing and pushing assembly, which is disposed on the transmission assembly, is used to push and push the dispersed solder paste.

8. The PCB board solder paste printing apparatus according to claim 7, characterized in that: The transmission assembly includes: A transverse rod (16) is provided, on which two sliding frames (17) are symmetrically fixed, and on which a mounting head (18) for connecting to the connecting seat (7) is fixed. Follower disk (19), which is rotatably disposed between the two sliding frames (17), and a first connecting post (20) and a second connecting post (21) are fixed on the follower disk (19). Driven helical gear (23), a rotating shaft (22) is fixed between the driven helical gear (23) and the follower disk (19), the rotating shaft (22) is rotatably mounted on the connecting seat (7), the driven helical gear (23) meshes with the driving helical gear (15) to transmit power to the pushing assembly.

9. A solder paste printing apparatus for PCB boards according to claim 8, characterized in that: The pushing and shoving component includes: Two sliding seats (24) are symmetrically slidably disposed at both ends of the transverse rod (16), and the two sliding seats (24) are arranged in a cross shape with the two lifting plates (9); The second blade (25) is connected to the sliding seat (24). A connector (26) is fixed on the top of the sliding seat (24). A transmission rod (27) is rotatably mounted on the connector (26). The horizontal lines of the two transmission rods (27) are staggered. One of the transmission rods (27) is rotatably connected to the first connecting column (20), and the other transmission rod (27) is rotatably connected to the second connecting column (21).

10. A PCB board solder paste printing apparatus according to claim 1, characterized in that: The printing press body (1) is provided with a control unit (2), which is electrically connected to each component and is used to control the operation of the printing mechanism; The printing press body (1) is also provided with a rotatable and adjustable protective cover (3) for fastening to the printing press body (1) during the printing process.

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