Semiconductor package module with elastic buffer protection structure

Abstract

The utility model relates to the technical field of semiconductor packaging module discloses a semiconductor packaging module with elastic buffer protection structure, including shell one, the both sides of shell one inner wall all rotatory connection have knob, the knob bottom all have shell two through buckle assembly connection, to be used for the dismounting between shell one and shell two, shell one and shell two inner wall all sliding connection have clamping plate, the inner wall of clamping plate all is linked with shell one and shell two through buffer assembly, to be used for the semiconductor buffer protection of clamping. In the utility model, through being provided with buffer assembly in shell one and shell two inside, through double elastic buffer enhancement to the protection of semiconductor, effectively absorb the vibration and impact in transportation, avoid pin deformation, circuit damage, can adapt to different specifications module simultaneously, reduce the demand of customization, reduce the logistics cost, still can pass through two -way clamping and promote module fixed stability, guarantee transportation safety and efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging module technology, and in particular to a semiconductor packaging module with an elastic buffer protection structure. Background Technology

[0002] The main function of semiconductor packaging modules during transportation is to protect the internal precision chips from external environmental factors such as vibration, impact, temperature and humidity changes, and static electricity, preventing physical damage or performance degradation. At the same time, the standardized packaging structure facilitates batch loading and unloading, warehousing management, and logistics turnover, ensuring the safe and efficient transmission of chips from the production end to the application end, and guaranteeing their integrity and functional stability before assembly. It is a key protective and logistics adaptation link connecting production and application in the semiconductor industry chain.

[0003] Existing transportation protection relies heavily on external packaging such as anti-static bags and foam boxes. However, during batch stacking or long-distance transportation, modules are prone to displacement and friction due to mutual squeezing, which can lead to pin deformation and solder joint detachment. At the same time, it is difficult to buffer high-frequency vibrations during transportation, which can easily cause micro-damage to internal circuits.

[0004] In response to the technical problem of difficulty in reducing the damage to semiconductors caused by vibration during transportation, this application proposes a semiconductor packaging module with an elastic buffer protection structure. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies that struggle to reduce vibration damage to semiconductors during transportation. This invention proposes a semiconductor packaging module with an elastic buffer protection structure. By incorporating buffer components inside both outer shell one and outer shell two, the double elastic buffer enhances the protection of the semiconductor, effectively absorbing vibrations and impacts during transportation, preventing pin deformation and circuit damage. It can also adapt to modules of different specifications, reducing customization requirements and lowering logistics costs. Furthermore, bidirectional clamping improves module stability, ensuring transportation safety and efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A semiconductor packaging module with an elastic buffer protection structure includes a first housing. Knobs are rotatably connected to both sides of the inner wall of the first housing. The bottom of each knob is connected to a second housing via a snap-fit ​​assembly for disassembly and assembly between the first and second housings. Clamping plates are slidably connected to the inner walls of both the first and second housings. The inner walls of the clamping plates are connected to the first and second housings via a buffer assembly for buffer protection of the clamped semiconductor.

[0008] Furthermore, the buffer assembly includes rotating rods rotatably connected to the four sides of the inner wall of the clamping plate, and each rotating rod has a connecting ring rotatably connected to its other end, with a spring fixedly connected to the inward end of each connecting ring.

[0009] Furthermore, connecting blocks are fixedly connected to the four sides of the inner walls of both the outer shell 1 and the outer shell 2, and guide rails are fixedly connected to the inward ends of the connecting blocks. The inner walls of the connecting rings are slidably connected to the inner walls of the guide rails.

[0010] Furthermore, each of the connecting blocks has a damping rod fixedly connected to one inward end, and the other end of each damping rod is fixedly connected to one outward end of the clamping plate.

[0011] Furthermore, the buckle assembly includes slots formed on both sides of the inner wall of the second outer shell, each slot having a locking block on its inner wall. The locking blocks are shaped to fit the slots, and their outer walls are slidably connected to the inner wall of the first outer shell.

[0012] Furthermore, each knob has a threaded rod fixedly connected to its bottom end, and each threaded rod has a sliding frame threadedly connected to its outer wall. The outer wall of each sliding frame is slidably connected to an inner wall of the outer casing.

[0013] Furthermore, protrusions are fixedly connected to both sides of the outer wall of the sliding frame, and grooves are provided on the inner wall of the card block. The outer walls of the protrusions are slidably connected to the inner walls of the grooves.

[0014] This utility model has the following beneficial effects:

[0015] 1. In this utility model, buffer components are provided inside both the outer shell and the outer shell. The double elastic buffer enhances the protection of the semiconductor, effectively absorbs vibration and impact during transportation, avoids pin deformation and circuit damage, and can adapt to modules of different specifications, reduce customization requirements, reduce logistics costs, and improve the module fixation stability through bidirectional clamping, ensuring transportation safety and efficiency.

[0016] 2. In this utility model, the outer shell 1 and outer shell 2 can be separated or installed by rotating the knob. The operation is simple and convenient, without the need for complicated tools. It can quickly complete the loading, unloading and packaging of the module, greatly improving the loading and unloading efficiency. This method does not require a complicated connection structure, can flexibly adapt to different working scenarios, reduce operation steps, and ensure the stable handling of the module during loading and unloading. Attached Figure Description

[0017] Figure 1 This is a perspective view of a semiconductor packaging module with an elastic buffer protection structure proposed in this utility model;

[0018] Figure 2 This is a cross-sectional view of the outer shell of a semiconductor packaging module with an elastic buffer protection structure proposed in this utility model;

[0019] Figure 3 This is a structural diagram of a clamping plate for a semiconductor packaging module with an elastic buffer protection structure proposed in this utility model;

[0020] Figure 4 This is a two-section view of the outer shell of a semiconductor packaging module with an elastic buffer protection structure proposed in this utility model;

[0021] Figure 5 This is a cross-sectional view of the sliding frame of a semiconductor packaging module with an elastic buffer protection structure proposed in this utility model.

[0022] Legend:

[0023] 1. Outer shell one; 2. Outer shell two; 3. Knob; 4. Threaded rod; 5. Sliding frame; 6. Protrusion block; 7. Locking block; 8. Slide groove; 9. Locking groove; 10. Clamping plate; 11. Rotating rod; 12. Connecting ring; 13. Spring; 14. Guide rail; 15. Connecting block; 16. Damping rod. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Reference Figure 1-3 This utility model provides an embodiment of a semiconductor packaging module with an elastic buffer protection structure, including a housing 1, a clamping plate 10 slidably connected to the inner walls of both the housing 1 and the housing 2, a rotating rod 11 rotatably connected to the four sides of the inner wall of the clamping plate 10, a connecting ring 12 rotatably connected to the other end of each rotating rod 11, a spring 13 fixedly connected to the inward end of each connecting ring 12, a connecting block 15 fixedly connected to the four sides of the inner walls of both the housing 1 and the housing 2, a guide rail 14 fixedly connected to the inward end of each connecting block 15, a sliding connection between the inner walls of the connecting ring 12 and the inner walls of the guide rail 14, a damping rod 16 fixedly connected to the inward end of each connecting block 15, and a damping rod 16 fixedly connected to the other end of each damping rod 16 fixedly connected to the outward end of the clamping plate 10 for buffer protection of the clamped semiconductor.

[0026] Specifically, the clamping plate 10 is made of silicone, which is not prone to aging with long-term use and is suitable for reusable transport modules. The damping rod 16 utilizes the friction, viscosity, or elastic deformation characteristics of the damping material to convert the kinetic energy of the object's motion into heat energy or other forms of energy and dissipate it, thereby slowing down or suppressing the vibration, impact, or rapid movement of the object, achieving the effects of shock absorption, buffering, or stabilizing the motion state. By setting buffer components inside both the outer shell 1 and the outer shell 2, the protection of semiconductors is enhanced through double elastic buffering, effectively absorbing vibration and impact during transportation, avoiding pin deformation and circuit damage. At the same time, it can adapt to modules of different specifications, reduce customization requirements, reduce logistics costs, and improve the module's fixing stability through bidirectional clamping, ensuring transportation safety and efficiency.

[0027] Both sides of the inner wall of outer casing 1 are rotatably connected to knobs 3. Both sides of the inner wall of outer casing 2 are provided with multiple slots 9. Each slot 9 has a locking block 7 on its inner wall. The shape of the locking block 7 matches the slot 9. The outer wall of the locking block 7 is slidably connected to the inner wall of outer casing 1. Each knob 3 is fixedly connected to a threaded rod 4. Each threaded rod 4 has a sliding frame 5 threadedly connected to its outer wall. The outer wall of the sliding frame 5 is slidably connected to the inner wall of outer casing 1. Both sides of the outer wall of the sliding frame 5 are fixedly connected to protrusions 6. Each locking block 7 has a sliding groove 8 on its inner wall. The outer wall of the protrusions 6 is slidably connected to the inner wall of the sliding groove 8 for disassembly and assembly between outer casing 1 and outer casing 2.

[0028] Specifically, when disassembling outer casing 1 and outer casing 2, simply rotate knob 3 in the opposite direction to pull the two side clips 7 inwards and remove them from the slots 9. This will allow you to separate outer casing 1 and outer casing 2, remove the semiconductor, and then separate or install outer casing 1 and outer casing 2 by rotating knob 3. The operation is simple and convenient, requiring no complicated tools, and can quickly complete the loading, unloading, and packaging of modules, greatly improving loading and unloading efficiency. This method does not require a complex connection structure, can flexibly adapt to different operating scenarios, reduce operating steps, and ensure stable handling of modules during loading and unloading.

[0029] Working principle: First, when installing the semiconductor, place it in the groove on the clamping plate 10 inside the outer casing 2. After placement, insert the outer casing 1 into the outer casing 2, so that the clamping plates 10 on both sides clamp the semiconductor and move them outward a certain distance. The semiconductor is then clamped by the spring 13. After installation, turn the knob 3. The knob 3 drives the threaded rod 4 to rotate, and the threaded rod 4 drives the sliding frame 5 to slide downward. The sliding frame 5 drives the protrusions 6 on both sides to slide in the groove. 8. The inner wall slides, and drives the two side blocks 7 to push outwards. The blocks 7 are inserted into the slots 9, thus completing the installation of the outer shell 1 and the outer shell 2. The shaking generated during transportation will cause the internal semiconductor to shake synchronously. When the semiconductor shakes to one side, it will drive the clamping plate 10 on one side to move, and drive the rotating rods 11 on all four sides to rotate. This will drive the connecting rings 12 on both sides to push inwards, and the spring 13 and damping rod 16 will absorb the shaking force and reset it, thus protecting the semiconductor.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor package module with an elastic cushioning protection structure, characterized by, Includes a first outer shell (1), with knobs (3) rotatably connected to both sides of the inner wall of the first outer shell (1), and the bottom of each knob (3) is connected to a second outer shell (2) via a snap-fit ​​assembly for disassembly and assembly between the first outer shell (1) and the second outer shell (2). The inner walls of the first outer shell (1) and the second outer shell (2) are slidably connected to clamping plates (10), and the inner walls of the clamping plates (10) are connected to the first outer shell (1) and the second outer shell (2) via a buffer assembly for buffering and protecting the clamped semiconductor.

2. A semiconductor packaging module with an elastic buffer protection structure according to claim 1, characterized in that: The buffer assembly includes rotating rods (11) rotatably connected to the four sides of the inner wall of the clamping plate (10). Each rotating rod (11) is rotatably connected to a connecting ring (12) at the other end. Each connecting ring (12) is fixedly connected to a spring (13) at one end inward.

3. A semiconductor packaging module with an elastic buffer protection structure according to claim 2, characterized in that: Connecting blocks (15) are fixedly connected to the four sides of the inner walls of the outer shell 1 (1) and the inner walls of the outer shell 2 (2). A guide rail (14) is fixedly connected to the inner end of each connecting block (15). The inner wall of the connecting ring (12) is slidably connected to the inner wall of the guide rail (14).

4. A semiconductor packaging module with an elastic buffer protection structure according to claim 3, characterized in that: Each connecting block (15) is fixedly connected to a damping rod (16) at one end inward, and the other end of each damping rod (16) is fixedly connected to the clamping plate (10) at one end outward.

5. A semiconductor packaging module with an elastic buffer protection structure according to claim 1, characterized in that: The buckle assembly includes slots (9) on both sides of the inner wall of the second outer shell (2). Each slot (9) has a block (7) on its inner wall. The shape of the block (7) matches the slot (9). The outer wall of the block (7) is slidably connected to the inner wall of the first outer shell (1).

6. A semiconductor packaging module with an elastic buffer protection structure according to claim 5, characterized in that: Each knob (3) has a threaded rod (4) fixedly connected to its bottom end. Each threaded rod (4) has a sliding frame (5) threadedly connected to its outer wall. The outer wall of the sliding frame (5) is slidably connected to the inner wall of the outer shell (1).

7. A semiconductor packaging module with an elastic buffer protection structure according to claim 6, characterized in that: Both sides of the outer wall of the sliding frame (5) are fixedly connected with protrusions (6), and the inner wall of the card block (7) is provided with a sliding groove (8). The outer wall of the protrusions (6) is slidably connected to the inner wall of the sliding groove (8).

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