A transfer valve and semiconductor apparatus

By designing vacuum transfer valves, valve boxes, and valve plates in semiconductor equipment, and combining them with first and second nitrogen purging mechanisms, the problem of frequent replacements caused by seal failure was solved, thereby extending seal life, shortening maintenance time, and reducing costs and downtime.

CN224414385UActive Publication Date: 2026-06-26PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO LTD
Filing Date
2025-06-23
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Vacuum transfer valves in existing semiconductor equipment require frequent replacement of the entire valve plate due to seal failure, resulting in high costs and long downtime.

Method used

A transfer valve is designed, including a vacuum transfer valve, a valve box and a valve plate. The valve box is provided with a first nitrogen purging mechanism on the side near the reaction chamber to form an isolation gas curtain, and a rotatable second nitrogen purging mechanism on the side near the transfer module. Gas is supplied through a gas path control mechanism to achieve dynamic nitrogen barrier and non-disassembly cleaning.

Benefits of technology

It significantly extends the sealing life of the valve plate and valve box, reduces maintenance frequency and downtime, isolates corrosive substances through a dynamic nitrogen barrier, and the rotary design enables full-area cleaning of the valve box without disassembling the actuator.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224414385U_ABST
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Abstract

The utility model discloses a transmission valve and semiconductor equipment, including vacuum transmission valve, valve box and valve plate, and the valve box fixed mounting is in the butt joint end of vacuum transmission valve door, and the valve plate slidingly inserts in the slot of valve box, the one side of valve box is equipped with first nitrogen gas purging mechanism close to reaction chamber, and the one side of valve box is equipped with rotatable second nitrogen gas purging mechanism close to transmission module, and first nitrogen gas purging mechanism and second nitrogen gas purging mechanism are supplied with gas through gas path control mechanism, and gas path control mechanism is connected in the gas passage entrance of valve box. First nitrogen gas purging mechanism is located between valve box and reaction chamber, and through the continuous purging isolation corrosive material contact sealing interface, prolongs the sealing life of valve plate and valve box, and the rotatable design of second nitrogen gas purging mechanism realizes non - dismantling type cleaning, and the operator can cover valve box bottom corner dead angle directly rotating spout. Gas path control mechanism manages through centralized gas supply, ensures that two sets of protection system operate efficiently as needed, and the overall maintenance frequency and downtime are reduced.
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