Wafer surface defect detection apparatus
By integrating a primary inspection camera, a secondary inspection camera, and a depth detection sensor, the wafer surface defect detection equipment solves the problems of long inspection time, low accuracy, and secondary contamination of traditional inspection equipment, and achieves efficient and accurate wafer surface defect detection.
CN224416696UActive Publication Date: 2026-06-26HANGZHOU GUANGYAN TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU GUANGYAN TECH CO LTD
- Filing Date
- 2025-07-02
- Publication Date
- 2026-06-26
Smart Images
Figure CN224416696U_ABST
Abstract
The utility model relates to wafer defect detection technical field especially a kind of wafer surface defect detection equipment, it includes second fixed frame, and install detection light source, wafer support mechanism and surface detection device on second fixed frame, wafer support mechanism is used to place wafer to be detected, the light illumination direction of detection light source is towards wafer to be detected, surface detection device includes primary inspection camera, re-inspection camera and depth detection sensor sequentially acting and along X direction arrangement;Wafer support mechanism includes second sliding rail and second sliding frame, the second sliding rail extends along X direction, second sliding frame is slidably arranged on the second sliding rail, and wafer is carried sequentially into the shooting range of primary inspection camera, re-inspection camera and depth detection sensor.This utility model integrates primary inspection camera, re-inspection camera and depth detection sensor in the same set of equipment, so that wafer can complete three rounds of detection of rapid rough detection, fine re-inspection and defect depth detection on a set of equipment.
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