Heat dissipation recycling structure and electronic device

Abstract

The utility model discloses a heat dissipation recycling structure and electronic equipment relates to domestic appliance heat dissipation technical field, and heat dissipation recycling structure includes heat dissipation part and conducting part, and heat dissipation part partially extends into the inside of electronic equipment, and is connected with the contact of the heating part in the inside of electronic equipment, and the conducting part is connected with heat dissipation part, and the one end of conducting part is formed with the installation portion away from heat dissipation part, and the installation portion is used to connect the heat absorption part.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for household appliances, and in particular to a heat dissipation recovery structure and electronic device. Background Technology

[0002] Existing home electronic products (such as routers and set-top boxes) generate a significant amount of heat from high-power components (such as CPUs and power modules) during operation. Especially with the development of AI technology, many new products, particularly AI-powered intelligent devices, will enter a high-computation, high-energy-consumption state. Traditional heat dissipation solutions typically include passive and active cooling. Passive cooling relies on heat sinks, plastic casings, etc., to dissipate heat through natural convection; active cooling uses fans to force airflow. Both passive and active cooling only focus on cooling the device itself and cannot recycle the expelled heat. Utility Model Content

[0003] The main purpose of this invention is to propose a heat dissipation recovery structure and electronic device, which aims to achieve heat dissipation of electronic devices and the recovery and reuse of heat.

[0004] To achieve the above objectives, the present invention proposes a heat dissipation and recovery structure, which includes a heat dissipation component and a conductive component. The heat dissipation component extends into the interior of the electronic device and is in contact with the heat-generating component inside the electronic device. The conductive component is connected to the heat dissipation component, and a mounting portion is formed at the end of the conductive component away from the heat dissipation component. The mounting portion is used to connect a heat-absorbing component.

[0005] In one embodiment, the heating element is a chip and / or a battery within the electronic device.

[0006] In one embodiment, a heat-conducting component is provided on the side of the heat sink that contacts the electronic device.

[0007] In one embodiment, the thermally conductive component is one of thermally conductive grease, thermally conductive silicone, or a thermally conductive sheet.

[0008] In one embodiment, the mounting portion encloses to form a mounting groove, and the heat-absorbing element is engaged in the mounting groove.

[0009] In one embodiment, the heat sink and the conductive element are an integral structure.

[0010] In one embodiment, the heat sink has a connecting post on the side facing the heat-generating component, and the connection is used for positioning and connecting with the PCB board on the electronic device.

[0011] In one embodiment, a threaded hole is formed in the connecting post for inserting a connecting screw.

[0012] This utility model also proposes an electronic device, which includes the heat dissipation and recovery structure described above and a housing. The housing includes an upper cover and a lower cover. The upper cover and the lower cover together form a mounting cavity for mounting chips and PCB boards. The connection between the upper cover and the lower cover forms a through hole for the heat dissipation component to extend into the mounting cavity.

[0013] This invention proposes a heat dissipation and recovery structure, which consists of a heat dissipation component and a conductive component. The heat dissipation component extends deep into the electronic device and is in contact with the internal heat-generating components, allowing heat generated inside the electronic device to be quickly conducted to the heat dissipation component. The conductive component is connected to the heat dissipation component, with its end furthest from the heat dissipation component forming a mounting part for connecting a heat-absorbing component. This structure allows heat to be conducted from the heat source inside the electronic device to the heat-absorbing component, effectively guiding the direction of heat and dissipating the heat inside the electronic device. This helps control the internal temperature of the electronic device, improves the stability of device operation, and prevents performance degradation or damage due to overheating. Furthermore, by setting the conductive component to connect to the heat-absorbing component, heat can be recovered and reused. For example, the heat-absorbing component can be a drinking cup, breast milk bottle, or other daily necessities. The heat dissipation and recovery structure conducts heat from the electronic device to heat and insulate these daily necessities, achieving heat dissipation while simultaneously utilizing the heat, thus improving energy efficiency. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0015] Figure 1 A schematic diagram of the structure of an embodiment of the electronic device provided by this utility model;

[0016] Figure 2 for Figure 1 A cross-sectional schematic diagram of an electronic device in China;

[0017] Figure 3 for Figure 1 A schematic diagram of the internal structure of electronic devices in China;

[0018] Figure 4 for Figure 3 Schematic diagram of the middle and lower cover;

[0019] Figure 5 for Figure 3 Schematic diagram of the heat dissipation and recovery structure;

[0020] Figure 6 for Figure 5 A schematic diagram of the heat dissipation recovery structure from another perspective.

[0021] Explanation of icon numbers:

[0022] 100. Electronic equipment; 1. Heat dissipation and recovery structure; 11. Heat sink; 111. Connecting column; 12. Conducting component; 121. Mounting slot; 2. Housing; 21. Top cover; 22. Bottom cover; 23. PCB board; 24. Chip; 200. Heat absorption component.

[0023] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0025] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0026] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0027] Existing home electronic products (such as routers and set-top boxes) generate a significant amount of heat from high-power components (such as CPUs and power modules) during operation. Especially with the development of AI technology, many new products, particularly AI-powered intelligent devices, will enter a high-computation, high-energy-consumption state. Traditional heat dissipation solutions typically include passive and active cooling. Passive cooling relies on heat sinks, plastic casings, etc., to dissipate heat through natural convection; active cooling uses fans to force airflow. Both passive and active cooling only focus on cooling the device itself and cannot recycle the expelled heat.

[0028] To solve the above problems, please refer to... Figures 1 to 6 The present invention proposes a heat dissipation recovery structure 1, including a heat dissipation component 11 and a conductive component 12. The heat dissipation component 11 extends into the interior of the electronic device 100 and is in contact with the heat-generating component inside the electronic device 100. The conductive component 12 is connected to the heat dissipation component 11. A mounting portion is formed at the end of the conductive component 12 away from the heat dissipation component 11. The mounting portion is used to connect the heat-absorbing component 200.

[0029] In an optional embodiment, to improve the heat dissipation effect of the heat dissipation recovery structure 1, the heat-generating element is the chip 24 and / or the battery in the electronic device 100.

[0030] As a core component of the electronic device 100, chip 24 typically generates a significant amount of heat during high-speed operation, processing large amounts of data, and performing complex calculations. Batteries also generate heat during charging and discharging. For example, in home appliances such as routers or set-top boxes, high-power components (such as CPUs and power modules) generate substantial amounts of heat. By precisely designing the heat dissipation layout for these heat-prone critical components using the heat recovery structure 1, the most significant heat-generating areas within the electronic device 100 can be effectively dissipated, thereby improving the overall heat dissipation efficiency of the electronic device 100. This prevents chip 24 from overheating and affecting its operating speed, and avoids safety hazards such as battery bulging due to excessive temperature.

[0031] In an optional embodiment, to further improve the heat dissipation effect, a heat-conducting component is provided on the side of the heat sink 11 that contacts the electronic device 100.

[0032] On the one hand, the heat-conducting component has excellent thermal conductivity, which can quickly transfer the heat generated by the heat-generating component to the heat sink 11, reducing thermal resistance and improving heat transfer efficiency. On the other hand, the heat-conducting component can fill any tiny gaps that may exist between the heat sink 11 and the heat-generating component of the electronic device 100, further improving the heat conduction effect, avoiding local heat accumulation, and further optimizing the performance of the entire heat dissipation and recovery structure 1, so that the heat inside the electronic device 100 can be dissipated more efficiently, ensuring the stable operation of the electronic device 100.

[0033] Specifically, the thermally conductive component is one of the following: thermal grease, thermal silicone, or thermal pad.

[0034] Thermal grease possesses excellent high and low temperature resistance, thermal conductivity, and electrical insulation, enabling it to operate in various temperature environments. Its paste-like properties allow it to effectively fill gaps of various complex shapes, ensuring a more thorough and tighter contact between the heat sink 11 and the heat-generating component. Thermal silicone combines flexibility and thermal conductivity, allowing for cutting and installation according to actual gap conditions, facilitating application to heat dissipation interfaces of different sizes and shapes. Thermal conductive sheets are relatively thin and possess a certain degree of rigidity, making them easy to install in specific shapes and locations, providing mechanical support and fixation while ensuring thermal conductivity. This selection of specific thermal conductive components allows the heat dissipation recovery structure 1 to flexibly choose suitable components based on different electronic devices 100, cost budgets, and heat dissipation requirements, thereby achieving more efficient heat dissipation and ensuring the long-term stable operation of the electronic device 100.

[0035] In an optional embodiment, to ensure the heating and heat preservation effect of the conductive element 12 on the heat-absorbing element 200, please refer to... Figures 1 to 6 The mounting section encloses and forms a mounting groove 121, and the heat-absorbing component 200 is fitted into the mounting groove 121.

[0036] By setting the mounting part as a semi-enclosed cavity, the heat absorber 200 is secured in the mounting groove 121. This design makes the connection between the heat absorber 200 and the conductor 12 tighter and more stable. The shape of the mounting groove 121 matches the heat absorber 200, and once it is secured, the heat absorber 200 will not easily loosen or shift, ensuring that heat can be continuously and stably transferred from the conductor 12 to the heat absorber 200, thereby ensuring the continuity and efficiency of heat transfer and guaranteeing the heating and heat preservation effect of the heat absorber 200. This further optimizes the reliability of the entire heat dissipation and recovery structure 1, and ensures that the heat dissipation system can always function normally during long-term use of the electronic device 100, effectively controlling the device temperature. In this embodiment, the conductor 12 has a square structure with a circular mounting groove 121 formed on it, and the heat absorber 200 is disposed in the mounting groove 121. In other embodiments, the conductor 12 can be a circular or other shaped structure, which can be selected according to actual needs.

[0037] In an alternative embodiment, please refer to Figures 1 to 6 The heat sink 11 and the conductive component 12 are integrated into one structure.

[0038] On the one hand, the integrated structure facilitates the molding and fabrication of the heat dissipation and recovery structure 1, reducing its processing steps. On the other hand, compared to a split structure, the integrated structure has higher integrity and stability, reducing the thermal resistance that may arise from the connection and splicing of different components. In a split structure, there may be poor contact or insufficient tightness at the connection between the heat sink 11 and the conductive component 12, while the integrated structure does not have this problem, allowing for smoother heat transfer between the heat sink 11 and the conductive component 12. The integrated structure avoids intermediate connection steps and potential connection problems, improving heat transfer efficiency and ensuring that the heat inside the electronic device 100 can be quickly and efficiently conducted to the heat absorber 200, thereby achieving a good heat dissipation effect and improving the safety and stability of the equipment operation.

[0039] In an optional embodiment, to improve the stability of the heat dissipation recovery structure 1 connected to the electronic device 100, please refer to... Figures 2 to 4 The heat sink 11 has a connecting post 111 on the side facing the heat-generating component, which is used to connect and position with the PCB board 23 on the electronic device 100.

[0040] This positioning connection design ensures that the heat sink 11 is precisely aligned with the heat-generating component during installation, preventing misalignment and ensuring effective contact. For example, inside the electronic device 100, the PCB board 23 has predetermined mounting holes or fixing points. The connecting post 111 can be inserted into these holes or connected with the fixing points, thus stably fixing the heat sink 11 in the correct position. This allows the heat sink 11 to fit tightly against the heat-generating component such as the chip 24, ensuring good heat conduction. Simultaneously, this positioning connection facilitates the assembly and maintenance of the electronic device 100. The heat sink 11 can be installed quickly and accurately on the production line, improving production efficiency. Furthermore, it allows for easy disassembly and reinstallation during subsequent equipment maintenance or replacement of the heat sink 11, ensuring continuous and normal operation of the equipment's heat dissipation function.

[0041] Furthermore, a threaded hole is formed inside the connecting post 111 for inserting a connecting screw.

[0042] The use of threaded holes and connecting screws is a common mechanical connection method, providing a strong and reliable connection with high strength. When the heat sink 11 is connected to the PCB board 23 via the connecting post 111, screwing the connecting screw into the threaded hole secures the heat sink 11 firmly to the PCB board 23, ensuring a stable mechanical connection. This detachable connection also facilitates easy removal and replacement of the heat sink 11 during maintenance or replacement without damaging the PCB board 23 or other electronic components. Furthermore, the threaded connection allows for the application of appropriate torque to adjust the tightness of the connection, ensuring good contact pressure between the heat sink 11 and the heat-generating component for effective heat conduction, while avoiding unnecessary damage to components due to overly tight connections. This optimizes the installation and performance of the entire heat dissipation recovery structure 1, ensuring the stable and reliable operation of the electronic device 100's heat dissipation system during long-term use.

[0043] This utility model also proposes an electronic device 100, which includes a heat dissipation recovery structure 1 and a housing 2. The housing 2 includes an upper cover 21 and a lower cover 22. The upper cover 21 and the lower cover 22 form a mounting cavity for mounting a chip 24 and a PCB board 23. The connection between the upper cover 21 and the lower cover 22 forms a through hole for the heat sink 11 to extend into the mounting cavity. The specific structure of the heat dissipation recovery structure 1 is as described in the above embodiments. Since this electronic device 100 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The heat dissipation recovery structure 1 is effectively integrated into the housing 2 structure of the electronic device 100, so that the heat sink 11 can extend into the internal space of the chip 24 and the PCB board 23 from the outside through the through hole, and directly contact the heat-generating component for heat dissipation. The electronic device 100 achieves optimized heat dissipation in its structural design by incorporating specialized through-holes in the housing 2. This ensures both the compactness of the internal structure of the electronic device 100 and provides a suitable mounting channel for the heat sink 11, achieving a good fit between the heat dissipation recovery structure 1 and the main body of the electronic device 100. This improves the overall heat dissipation performance of the electronic device 100, ensuring that key internal components operate at stable temperatures, thereby extending the lifespan of the electronic device 100 and enhancing its reliability and operational stability. Specifically, the electronic device 100 can be a household appliance such as a router, set-top box, or computer case that generates a large amount of heat during operation. By incorporating the heat dissipation recovery structure 1, both heat dissipation for these devices and the recovery and reuse of this heat can be achieved, improving energy efficiency.

[0044] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heat dissipation recovery structure, characterized by, It includes a heat sink and a conductive component. The heat sink extends into the interior of the electronic device and is in contact with a heat-generating component inside the electronic device. The conductive component is connected to the heat sink. A mounting portion is formed at the end of the conductive component away from the heat sink, and the mounting portion is used to connect a heat-absorbing component.

2. The heat recovery structure according to claim 1, wherein The heating element is a chip and / or battery within the electronic device.

3. The heat recovery structure according to claim 1, wherein A heat-conducting component is provided on the side of the heat sink that contacts the electronic device.

4. The heat recovery structure according to claim 3, wherein The thermally conductive component is one of the following: thermally conductive grease, thermally conductive silicone, or thermally conductive sheet.

5. The heat recovery structure according to any one of claims 1 to 4, wherein The mounting portion encloses to form a mounting groove, and the heat-absorbing component is fitted into the mounting groove.

6. The heat recovery structure according to claim 1, wherein The heat dissipation component and the conductive component are an integral structure.

7. The heat recovery structure according to claim 1, wherein The heat sink has a connecting post on the side facing the heat-generating component, and the connection is used to position and connect with the PCB board on the electronic device.

8. The heat recovery structure according to claim 7, wherein The connecting post has a threaded hole for inserting a connecting screw.

9. An electronic device, comprising: Including the heat dissipation recovery structure as described in any one of claims 1 to 8, and The housing includes an upper cover and a lower cover. The upper cover and the lower cover together form a mounting cavity for mounting chips and PCB boards. The connection between the upper cover and the lower cover has a through hole for the heat sink to extend into the mounting cavity.

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