Wire bonding apparatus for chip packaging
By installing a dust cover and a negative pressure extraction device in the wire bonding equipment, combined with chip identification technology, the problem of chip contamination in the wire bonding process has been solved, achieving a highly efficient and clean packaging process, and improving product quality and production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI INTEGRATED CIRCUIT RESEARCH & DEVELOPMENT CENTER CO LTD
- Filing Date
- 2025-07-09
- Publication Date
- 2026-06-26
AI Technical Summary
In the wire bonding process of semiconductor packaging, the chip surface is easily contaminated by particles, which leads to a decrease in product quality and an increase in production costs.
Design a wire bonding equipment that includes a dust cover. By isolating the wire bonding mechanism from the external environment, the transparent cover allows the visual positioning component to acquire images, and a negative pressure extraction device maintains a vacuum inside the accommodating cavity. Combined with a chip recognition device, automatic process switching is achieved.
It effectively avoids particulate contamination, improves chip packaging quality, reduces defect rates, increases production efficiency, and lowers costs.
Smart Images
Figure CN224419273U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip packaging technology, specifically to a wire bonding device for chip packaging. Background Technology
[0002] In semiconductor packaging, WB (wire bonding) is a process used to achieve electrical connections between the chip (die) and the substrate or leadframe. This connection is accomplished using extremely fine metal wires (such as gold, aluminum, or copper wires), a process known as "bonding." WB employs a wire bonding device that uses a precise alignment system to bond one end of the metal lead to the chip's pads, forming the first solder joint. Then, the other end of the metal lead is pulled out and bonded to a pin on the leadframe or substrate, forming the second solder joint, thus achieving the electrical connection between the chip and external circuitry.
[0003] In the wire bonding process, particle contamination caused by the production environment, personnel movement, and wire bonding actions easily adheres to the chip surface and is difficult to remove by subsequent processes after the heating during wire bonding. If the packaged chip is an image sensor, due to the characteristics of image sensors, the adhered particles can cause the chip to be deemed defective in the subsequent Final Inspection (FT) and Outgoing Quality Control (OQC) stages, increasing production costs and risks.
[0004] Therefore, a wire bonding device is needed to avoid particle contamination of the chip surface during the wire bonding process. Utility Model Content
[0005] The technical problem to be solved by this application is to provide a wire bonding device for chip packaging, which can avoid particle contamination of the chip surface during the wire bonding process and affect product quality.
[0006] According to a first aspect of the present application, a wire bonding apparatus for chip packaging is provided, comprising: a machine base, a dust cover, and a wire bonding mechanism disposed on the machine base, wherein the dust cover is connected to the machine base to form a receiving cavity, and the wire bonding mechanism is located in the receiving cavity; the machine base is provided with a visual positioning component, and the dust cover is a transparent cover that enables the visual positioning component to acquire an image of the wire bonding mechanism.
[0007] In some embodiments, the dust cover includes a body, a top cover, and an opening and closing mechanism. The top cover is connected to the body and the opening and closing mechanism. The top cover moves relative to the body under the action of the opening and closing mechanism, so that the dust cover is in an open or closed state.
[0008] In some embodiments, the opening and closing mechanism is a handle provided on the top cover, and one of the top cover and the cover body has a raised edge and the other has a groove, with the raised edge and the groove sealingly engaged.
[0009] In some embodiments, the opening and closing mechanism includes a telescopic rod and a drive mechanism for driving the telescopic rod to extend and retract. The telescopic rod is located in the accommodating cavity, and the fixed end of the telescopic rod is connected to the machine base, while the movable end of the telescopic rod is connected to the top cover.
[0010] In some embodiments, a sealing element is provided at the connection between the top cover and the cover body.
[0011] In some embodiments, a negative pressure extraction device is also included, which is connected to the dust cover via an air pipe for evacuating the accommodating cavity.
[0012] In some embodiments, the system also includes input and output devices located on both sides of the machine, wherein the input device is used to transport the chip to the wire bonding mechanism, and the output device is used to remove the wire-bonded chip from the wire bonding mechanism.
[0013] In some embodiments, the machine includes a controller and a chip identification device, the chip identification device being located above the dust cover;
[0014] The chip identification device is connected to the controller and is used to identify the type of chip to be soldered and output the identified type information to the controller.
[0015] The controller is used to control the wire bonding mechanism to complete the wire bonding action according to the type information, and to control the negative pressure extraction device to evacuate the accommodating cavity.
[0016] In some embodiments, the chip identification device includes a connected image acquisition component and an image processor. The image acquisition component is used to acquire an image of the chip to be bonded, and the image processor is used to process and analyze the image to obtain the type of the chip to be bonded.
[0017] In some embodiments, a seal is provided between the dust cover and the machine base.
[0018] Compared with the prior art, the beneficial effects of this application are as follows: by setting a dust cover on the machine, the wire bonding mechanism is located in the cavity formed by the dust cover and the machine, so that the chip to be wire bonded is located in the cavity and isolated from the environment of the machine, avoiding particles from adhering to the chip surface and causing defective products; this application also sets a chip identification device to identify the type of chip to be wire bonded, so that the controller controls the wire bonding mechanism to complete the corresponding wire bonding action according to the type information. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of wire bonding equipment in the prior art;
[0020] Figure 2 This is a schematic diagram of a wire bonding apparatus according to an exemplary embodiment;
[0021] Figure 3 This is a schematic diagram of a dust cover according to an exemplary embodiment;
[0022] Figure 4 This is a schematic diagram of a dust cover according to another exemplary embodiment.
[0023] In the diagram, 1 is the machine tool; 2 is the human-machine interface; 3 is the input device; 4 is the output device; and 5 is the wire bonding mechanism.
[0024] 6. Visual positioning component; 7. Dust cover; 71. Top cover; 72. Cover body; 73. Seal; 74. Handle; 75. Telescopic rod; 76. Air duct port; 8. Negative pressure extraction device; 9. Chip recognition device. Detailed Implementation
[0025] Unless otherwise defined, the technical or scientific terms used in this specification and claims shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. Specific embodiments of this application will be described below in conjunction with the accompanying drawings. It should be noted that, in order to provide a concise description, this specification cannot exhaustively describe all features of the actual embodiments. Without departing from the spirit and scope of this application, those skilled in the art can modify and substitute the embodiments of this application, and the resulting embodiments are also within the protection scope of this application.
[0026] Wire bonding equipment, also known as wire bonding machines, is an indispensable key piece of equipment in semiconductor packaging processes. For example... Figure 1As shown, the wire bonding equipment includes a machine base 1 and the following core components: a control console (not shown), which is mainly responsible for overall operation; a wire conveying mechanism (not shown), which ensures smooth wire feeding and output; a human-machine interface 2, which provides an intuitive operating experience; and input devices 3 and 4, a vision positioning component 6, and a wire bonding mechanism 5, which work together to complete efficient and precise wire bonding operations. The working process of each core component is as follows: During the bonding process, input devices 3 and 4 (also known as the Material System, MHS) are responsible for loading, moving, and removing the chips to be packaged, ensuring accurate and smooth bonding operations. When loading and removing chips, the MHS efficiently transfers the chip-loaded cassette from the feed port to the bonding area. Within the bonding area, the MHS precisely transfers the chips to the bonding position, and the bonding pins (not shown) move back and forth according to a pre-set program to perform precise bonding operations. After bonding is complete, it quickly removes the chips to prepare for the next batch of bonding. The vision positioning component 6 mainly acquires images of the bonding area to display the electronic crosshairs in the video window in real time, thereby accurately positioning the bonding pins above the chips. The wire bonding mechanism 5 includes an XYZ stage (not shown) and a wire bonding device (not shown). The wire bonding device can move in three-dimensional space and works in conjunction with the XYZ stage to bond one end of a metal lead to the chip's pad to form a first solder joint. Then, the other end of the metal lead is pulled out and bonded to the lead frame or the pin of the package substrate to form a second solder joint. For ease of inspection and positioning, the wire bonding mechanism 5 is exposed on the wire bonding equipment, meaning it is located in the environment where the wire bonding equipment is located. This exposed configuration also facilitates the replacement and maintenance of the wire bonding mechanism, such as the soldering head, and makes cleaning easier. However, during the chip bonding process, particles in the environment can easily fall and adhere to the chip with the movement of the workers, causing contamination of the chip surface. This contamination, combined with the heating during bonding, can create defects that are difficult to remove through cleaning processes, resulting in a decrease in chip quality.
[0027] To address the aforementioned technical problems, this application provides a wire bonding apparatus for chip packaging, which uses a machine base and a dust cover to form a cavity for accommodating the wire bonding mechanism, thereby isolating the wire bonding mechanism from the external environment. (Reference) Figure 2 In one specific embodiment, it includes: a machine base 1, a dust cover 7, and a wire bonding mechanism disposed on the machine base 1. The dust cover 7 is connected to the machine base 1 to form a receiving cavity, and the wire bonding mechanism is located in the receiving cavity. The machine base 1 is provided with a visual positioning component 6, and the dust cover 7 is a transparent cover that enables the visual positioning component 6 to acquire an image of the wire bonding mechanism.
[0028] This application includes a transparent dust cover 7 on the machine tool 1, which covers the wire bonding mechanism. This isolates the wire bonding mechanism from the external environment of the machine tool without affecting its operation, replacement, or maintenance. The area within the dust cover serves as the wire bonding area, preventing particles from the external environment from adhering to the chip in the bonding area, reducing chip contamination, and improving chip packaging quality. The dust cover 7 is transparent, allowing the light path of the vision positioning component 6 to pass through. The vision positioning component 6 is generally located above the wire bonding mechanism and the dust cover 7 to acquire an image of the wire bonding mechanism, i.e., an image of the chip in the bonding area. This allows for real-time display of the electronic crosshairs in the chip image, enabling real-time monitoring of the wire bonding process by the control console.
[0029] The specific structure of the wire bonding mechanism in this embodiment is not detailed here. It mainly includes an XY stage and a bonding head to complete wire bonding and realize the electrical connection between the chip and the external circuit. The dust cover in this embodiment is not limited in its specific shape or material. It only needs to be fixed on the machine base, cover the wire bonding mechanism inside, and allow light to pass through so that the vision positioning component 6 can obtain an image of the wire bonding area.
[0030] In some embodiments, see Figure 3 and Figure 4 As shown, the dust cover 7 includes a cover body 72, a top cover 71, and an opening and closing mechanism. The top cover 71 is connected to the cover body 72 and the opening and closing mechanism. The top cover 71 moves relative to the cover body 72 under the action of the opening and closing mechanism, so that the dust cover 7 is in an open or closed state. In this embodiment, the dust cover 7 is set into two parts. The top cover 71 can be opened by moving away from the cover body 72, so as to facilitate the operation of the operator when the wire bonding mechanism is replaced, maintained or cleaned. When bonding wires, the top cover 71 can be sealed and connected to the cover body 72 to be in a closed state, so as to cover the wire bonding mechanism and isolate it from the external environment.
[0031] In some embodiments, see Figure 3 As shown, the opening and closing mechanism is a handle 74 located on the top cover 71. One of the top cover 71 and the cover body 72 has a raised edge, and the other has a groove. The raised edge and the groove are sealed and engaged. In this embodiment, the operator can open the top cover 71 or lock the top cover 71 onto the cover body 72 by gripping the handle 74. The handle 74 can be set in any way; it can be a raised structure on the surface of the top cover or a raised structure on both sides of the top cover, as long as it is easy to grip and easy for the operator to operate the top cover.
[0032] In some embodiments, see Figure 4As shown, the opening and closing mechanism includes a telescopic rod 75 and a drive mechanism for driving the telescopic rod to extend and retract. The telescopic rod 75 is located in the accommodating cavity, and the fixed end of the telescopic rod 75 is connected to the machine base 1, while the movable end of the telescopic rod 75 is connected to the top cover 71. In this embodiment, the telescopic rod 75 can be controlled to extend and retract via the drive mechanism, thereby lifting the top cover 71. Additionally, the telescopic rod 75 can apply a pulling force to the top cover 71, pressing it firmly against the cover body 72 when closed. Specifically, the drive mechanism can be hydraulically driven or pneumatically driven; the opening and closing structure is not limited to these and can take other structural forms.
[0033] In some embodiments, a sealing element 73, such as a sealing ring, is provided at the connection between the top cover 71 and the cover body 72 to further improve the sealing of the accommodating cavity and prevent particles from entering the accommodating cavity.
[0034] In other embodiments, the dust cover can be detachably connected to the machine tool to allow for the replacement, maintenance, or cleaning of the wire bonding mechanism. Specifically, the dust cover is snapped into the machine tool; for example, a groove is fixed on the machine tool, and the dust cover is directly snapped into the groove. The method of detachable connection between the dust cover and the machine tool is not limited here, as long as it achieves a seal. Specifically, a sealing element is provided between the dust cover and the machine tool.
[0035] In some embodiments, see Figure 2 As shown, it also includes a negative pressure extraction device 8, which is connected to the dust cover 7 via an air pipe for evacuating the accommodating cavity. In this embodiment, the negative pressure extraction device 8 can evacuate the accommodating cavity, thereby creating a vacuum environment in the soldering area. This avoids airflow disturbance during wire bonding, effectively reduces the introduction of particles, and improves chip packaging quality. Figure 4 As shown, an air pipe hole 76 is provided on the cover body 72, and the end of the air pipe can be sealed and connected in the air pipe hole 76 to realize the connection between the negative pressure extraction device 8 and the dust cover 7.
[0036] In some embodiments, see Figure 2 As shown, the machine also includes an input device 3 and an output device 4 located on both sides of the machine. The input device 3 is used to transport the chip to the wire bonding mechanism, and the output device 4 is used to remove the chip after wire bonding from the wire bonding mechanism. The specific structure of the input device 3 and the output device 4 will not be described in detail here. They are symmetrically arranged on the left and right sides of the machine 1 to facilitate the transfer of chips, lead frames, etc.
[0037] During wire bonding operations, different products have varying requirements for production processes and parameters, necessitating the differentiation and targeted production control for each product. This production model results in the equipment's inability to simultaneously handle the production tasks of specific chips (such as special-purpose chips, rework chips, and prototyping chips) and other chips (i.e., regular chips). This disrupts the continuous and efficient production process, significantly reducing production efficiency, increasing production costs, and wasting time and equipment resources. To address this technical problem, in some embodiments, see... Figure 2 As shown, the aforementioned machine 1 may further include a controller (which may be called a control console) and a chip identification device 9. The chip identification device 9 is located above the dust cover 7. The chip identification device 9 is connected to the controller and is used to identify the type of chip to be bonded and output the identified type information to the controller. The controller is used to control the bonding mechanism to complete the bonding action according to the type information, and to control the negative pressure extraction device 8 to evacuate the accommodating cavity. In this embodiment, by setting the chip identification device 9, the type of the chip to be bonded can be identified. This type information indicates whether it is a specified chip or another chip. The controller can select the corresponding production control according to the type information, such as selecting the corresponding bonding process to complete the bonding action. The controller can also control the negative pressure extraction device 8 according to the type information, so that the negative pressure extraction device 8 can be linked to select whether to evacuate the accommodating cavity (i.e., inside the dust cover 7). If the chip to be bonded is a conventional chip, the controller controls the negative pressure extraction device to operate and evacuate the accommodating cavity. If the chip to be bonded is a prototyping chip, the controller controls the negative pressure extraction device not to start and does not evacuate the accommodating cavity. This embodiment can automatically switch between processes during the production of a specified chip and other chips, enabling the production process to proceed continuously and efficiently, which can greatly increase production efficiency and reduce production costs.
[0038] Specifically, the aforementioned chip identification device 9 may include a connected image acquisition component and an image processor. The image acquisition component is used to acquire an image of the chip to be bonded, and the image processor is used to process and analyze the image to obtain the type of the chip to be bonded. This embodiment utilizes image acquisition and processing technology to obtain the chip type, which is easy to implement. For example, if a specific chip has a special mark, such as a groove-shaped mark, chip corner mark, notch position, or code, serial number, etc., the chip identification device 9 acquires an image of the chip to be bonded and analyzes it using image processing software. For example, the image of the specific chip can be pre-stored as a standard image. Only the currently acquired image needs to be analyzed and compared with the standard image. When a groove-shaped mark is identified, the chip to be bonded is determined to be the specified chip, and the type information is fed back to the controller. The controller then calls the pre-stored bonding control program for the specified chip to perform the bonding action. Other chips may not have any marking settings. That is, if the image acquired by the chip identification device does not have a special mark, the chip to be bonded is determined to be another chip, and the controller calls the pre-stored bonding control program for other chips to perform the bonding action. This embodiment enables automatic replacement of welding control programs, allowing the production process to proceed continuously and efficiently, thereby improving production efficiency.
[0039] The chip identification device 9 is not limited to using image acquisition and processing technology, but can also be implemented through infrared technology, ultrasonic technology, etc., and requires marking specific marks on the chip surface.
[0040] In one specific embodiment, the input device 3 transports the chip to be bonded and the lead frame into the accommodating cavity, placing the chip in the bonding area. The chip identification device 9 identifies the chip and outputs the identified type information to the controller. The controller calls the corresponding control program based on the type information. Before bonding, the negative pressure extraction device 8 evacuates the accommodating cavity formed by the dust cover 7 and the machine 1. In the vacuum environment, the controller controls the bonding structure to complete the bonding of the current chip through the control program. The output device 4 outputs the chip after bonding.
[0041] The above description of the embodiments is intended to enable those skilled in the art to understand and apply this application. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without creative effort. Therefore, this application is not limited to the embodiments described herein, and any improvements and modifications made by those skilled in the art based on the disclosure of this application without departing from the scope and spirit of this application are within the scope of this application.
Claims
1. A wire bonding apparatus for chip packaging, comprising: The machine base, a dust cover, and a wire bonding mechanism mounted on the machine base are provided. The dust cover is connected to the machine base to form a receiving cavity, and the wire bonding mechanism is located in the receiving cavity. The machine base is provided with a visual positioning component, and the dust cover is a transparent cover that enables the visual positioning component to acquire an image of the wire bonding mechanism.
2. The wire bonding apparatus of claim 1, wherein, The dust cover includes a cover body, a top cover, and an opening and closing mechanism. The top cover is connected to the cover body and the opening and closing mechanism. The top cover moves relative to the cover body under the action of the opening and closing mechanism, so that the dust cover is in an open or closed state.
3. The wire bonding apparatus of claim 2, wherein, The opening and closing mechanism is a handle provided on the top cover. One of the top cover and the cover body has a raised edge, and the other has a groove. The raised edge and the groove are sealed and engaged.
4. The wire bonding apparatus of claim 2, wherein, The opening and closing mechanism includes a telescopic rod and a drive mechanism for driving the telescopic rod to extend and retract. The telescopic rod is located in the accommodating cavity, and the fixed end of the telescopic rod is connected to the machine base, while the movable end of the telescopic rod is connected to the top cover.
5. The wire bonding apparatus of claim 2, wherein, A sealing element is provided at the connection between the top cover and the body of the cover.
6. The wire bonding apparatus of any one of claims 1 to 5, wherein, It also includes a negative pressure extraction device, which is connected to the dust cover via an air pipe for evacuating the accommodating cavity.
7. The wire bonding apparatus of claim 6, wherein, It also includes input devices and output devices placed on both sides of the machine. The input devices are used to transport the chip to the wire bonding mechanism, and the output devices are used to remove the chip that has been wire bonded from the wire bonding mechanism.
8. The wire bonding apparatus of claim 6, wherein, The machine includes a controller and a chip identification device, with the chip identification device located above the dust cover; The chip identification device is connected to the controller and is used to identify the type of chip to be soldered and output the identified type information to the controller. The controller is used to control the wire bonding mechanism to complete the wire bonding action according to the type information, and to control the negative pressure extraction device to evacuate the accommodating cavity.
9. The wire bonding apparatus as claimed in claim 8, wherein The chip identification device includes a connected image acquisition component and an image processor. The image acquisition component is used to acquire an image of the chip to be bonded, and the image processor is used to process and analyze the image to obtain the type of the chip to be bonded.
10. The wire bonding apparatus as claimed in claim 1, wherein A sealing element is provided between the dust cover and the machine base.