An ultrasonic-assisted chemical plating device for diamond wire saws

Abstract

This invention provides an ultrasonic-assisted chemical plating device for diamond wire saws, comprising: a frame, a circulation device, a dropper bottle holder, a chemical plating tank, and an ultrasonic component. The circulation device, the chemical plating tank, and the dropper bottle holder are respectively positioned at the top, middle, and bottom of the frame. The ultrasonic component is fixedly connected to the bottom of the chemical plating tank. The circulation device drives the plating solution to circulate between the chemical plating tank and the circulation device. The dropper bottle holder holds the dropper bottle to add plating solution components into the chemical plating tank. The ultrasonic component emits ultrasonic waves into the plating solution in the chemical plating tank during the chemical plating process. This invention solves the core problems of particle agglomeration, uneven plating solution, and low production efficiency in traditional chemical plating processes through the synergistic effect of ultrasonic cavitation, plating solution circulation and purification, and precise mechanical control, achieving a comprehensive improvement in the plating quality, production efficiency, and equipment reliability of diamond wire saws.

Description

Technical Field

[0001] This utility model relates to the field of wire saw manufacturing, and in particular to an ultrasonic-assisted chemical plating device for diamond wire saws. Background Technology

[0002] Diamond wire saws, as efficient and precise cutting tools, are widely used in the processing of hard and brittle materials such as photovoltaic silicon wafers, sapphire, and magnetic materials. Their core manufacturing process involves bonding diamond abrasive grains to the surface of a metal wire substrate using chemical plating or electroplating methods, forming a uniform and highly bonded abrasive layer. Chemical plating technology, due to its advantages such as requiring no external current and being suitable for complex-shaped substrates, has become one of the mainstream processes for manufacturing diamond wire saws. However, during the preparation of the chemical plating coating, methods such as stirring or using magnetic stirrers are needed to improve the uniformity and quality of the coating. These methods often consume a lot of energy and time, and it is difficult to achieve completely uniform results.

[0003] Existing technology CN202022464333.3 discloses a device for improving the uniformity of chemical plating of diamond micron powder for wire saws, including a stirring tank, a stirring device, and a constant temperature water bath; the stirring tank is positioned above the constant temperature water bath; the stirring device is positioned above the stirring tank, with the stirring head extending into the stirring tank; a baffle is provided inside the stirring tank. Although this invention can make the nickel layer plated on the diamond surface more uniform, it still has the following problems:

[0004] 1. This device relies solely on mechanical stirring to mix the plating solution, which has limited effect on mixing diamond micro powder with the plating solution. Especially when dealing with high-concentration or large-volume plating solutions, it is prone to local deposition or uneven dispersion, affecting the consistency of the coating thickness.

[0005] 2. Hydrogen bubbles generated during the electroless plating process are easily adsorbed on the edges of diamond abrasive grains and the gaps of wire saws, forming a gas film that hinders the diffusion of the plating solution. Simply relying on stirring is not enough to effectively break up micron-sized bubbles. As a result, during the electroless plating process, metal ions can only be deposited on the surface of the aggregates, and the internal abrasive grains cannot be effectively plated, forming a "hollow plating" defect. Utility Model Content

[0006] In view of this, the purpose of this utility model is to provide an ultrasonic-assisted chemical plating device for diamond wire saws. Through the synergistic effect of ultrasonic cavitation, plating solution circulation and purification, and precise mechanical control, it solves the core problems of particle agglomeration, uneven plating solution, and low production efficiency in traditional chemical plating processes, and achieves a comprehensive improvement in the plating quality, production efficiency, and equipment reliability of diamond wire saws.

[0007] The technical solution adopted by this utility model to solve its technical problem is:

[0008] An ultrasonic-assisted chemical plating device for diamond wire saws is provided, comprising: a frame, a circulation device, a dropper holder, a chemical plating tank, and an ultrasonic component. The circulation device is located at the lower end of the frame, the chemical plating tank is located in the middle of the frame, and the dropper holder is correspondingly located on the frame above the chemical plating tank.

[0009] The ultrasonic component is fixedly connected to the bottom of the chemical plating tank. The circulation device is used to drive the plating solution to circulate between the chemical plating tank and the circulation device. The dropper bottle holder is used to hold the dropper bottle to add plating solution components into the chemical plating tank. The ultrasonic component is used to emit ultrasonic waves into the plating solution in the chemical plating tank during the chemical plating process.

[0010] It should be noted that the frame, as the main supporting structure of the device, provides a stable mounting foundation for all components and bears loads such as the weight of the plating solution in the electroless plating tank and the vibration of the circulation device. The electroless plating tank contains the plating solution and the diamond wire saw, providing the reaction site for electroless plating, and is connected to the circulation device to achieve plating solution circulation. The circulation device is located at the lower end of the frame, which not only lowers the overall center of gravity of the device and improves stability, but also drives the plating solution to circulate between the electroless plating tank and the circulation device, avoiding excessive consumption of local components of the plating solution, ensuring uniform metal ion concentration, and reducing defects such as uneven coating thickness. The drip bottle holder is used to hold the drip bottle and add plating solution components (such as reducing agents, complexing agents, etc.) to the electroless plating tank. The ultrasonic component is fixed at the bottom of the electroless plating tank and emits ultrasonic waves into the plating solution. The continuous vibration of the ultrasonic waves counteracts the gravitational settling of diamond micropowder, making it uniformly suspended in the plating solution, avoiding uneven plating solution concentration caused by accumulation at the bottom of the tank, and assisting the electroless plating process.

[0011] Preferably, the frame is a vertical layered structure, including a lower support section, a middle mounting platform, and an upper cantilever frame; the circulation device is installed on the lower support section, the chemical plating tank and ultrasonic components are installed on the middle mounting platform, and the dropper bottle holder is installed on the upper cantilever frame corresponding to the chemical plating tank.

[0012] It should be noted that the frame adopts a vertical, layered design, consisting of a lower support section, a middle mounting platform, and an upper cantilever frame. This achieves vertical integration of functional modules, solving the problems of chaotic layout and inconvenient operation inherent in traditional chemical plating equipment. Since the circulation unit is typically heavy, placing it in the lower support section lowers the center of gravity, further improving stability. This is especially beneficial when the ultrasonic components vibrate, effectively reducing the impact of vibration on the overall system. The middle mounting platform provides a horizontal and stable mounting surface for the chemical plating tank and ultrasonic components. Connecting to the lower support section and upper cantilever frame, it acts as a crucial link, ensuring accurate installation of the chemical plating tank and ultrasonic components. Installed in a predetermined position and maintaining the correct relative position with other components, the system allows operators easier access to the electroless plating tank and ultrasonic components for operation, observation, and maintenance. For example, during electroless plating, operators can directly observe the plating solution and the working status of the ultrasonic components from the middle mounting platform, facilitating timely detection and adjustment of problems. The upper cantilever extends above the electroless plating tank to install a drip bottle holder, ensuring the holder accurately aligns with the tank. This allows the plating solution to be directly dripped into the tank, reducing the possibility of dripping and thus preventing waste and environmental pollution.

[0013] Preferably, the ultrasonic component includes an ultrasonic generator and a plurality of ultrasonic transducers uniformly distributed at the bottom of the chemical plating tank. The ultrasonic transducers are electrically connected to the ultrasonic generator and are used to convert electrical energy into high-frequency mechanical vibration and transmit it to the plating solution to generate a cavitation effect to break up particle agglomeration in the plating solution.

[0014] It should be noted that an ultrasonic generator is an electronic device that converts input electrical energy into a high-frequency electrical signal (usually 20-40kHz). Through internal circuit adjustment, it outputs an AC signal of a specific frequency and power to drive the ultrasonic transducer. The generator usually has a power adjustment function, which can adjust the intensity of the output electrical signal according to process requirements, precisely control the ultrasonic energy input, and avoid insufficient energy leading to incomplete agglomeration removal or excessive energy causing overheating and decomposition of the plating solution. The ultrasonic transducer is an energy conversion element, usually made of piezoelectric ceramic materials (such as barium titanate and lead zirconate titanate). It uses the piezoelectric effect to realize the conversion of electrical energy into mechanical energy. The transducers are distributed in an array at the bottom of the chemical plating tank, with equal spacing between each transducer. The generated mechanical vibration is transmitted to the plating solution through the metal wall at the bottom of the plating tank, forming longitudinal wave propagation. The vibration energy causes periodic pressure changes in the plating solution, resulting in the formation of cavitation bubbles in local low-pressure areas of the liquid. Subsequently, the bubbles collapse violently in the high-pressure areas, effectively breaking up diamond particle agglomeration, ensuring uniform particle suspension, and accelerating metal ion diffusion, thus shortening the chemical plating time.

[0015] Preferably, the dropper bottle holder includes a fixed plate, a tray, and an adjusting cylinder. The fixed plate and the tray are connected on one side by a hinge. The adjusting cylinder is disposed between the fixed plate and the tray on the other side and can drive the tray to rotate around the hinge axis to adjust the tilt angle between the tray and the fixed plate. The tray is provided with a limiting frame for fixing the dropper bottle corresponding to the chemical plating tank.

[0016] It should be noted that the hinge, as a connecting component, allows the fixed plate and the support plate to rotate relative to each other around the hinge axis. When the piston rod of the adjusting cylinder extends or retracts, it drives the support plate to rotate around the hinge axis, thereby changing the tilt angle between the support plate and the fixed plate. The adjusting cylinder drives the piston rod by controlling the air pressure inside the cylinder. When the air pressure inside the cylinder changes, the piston rod extends or retracts, thereby pushing the support plate to rotate around the hinge axis, achieving precise control of the tilt angle of the support plate. The limiting bracket, through a certain structural design, such as a slot, fixes the dripping bottle to the support plate. The shape and size of the limiting bracket are adapted to the dripping bottle, ensuring that the dripping bottle remains stable during the dripping process and accurately adding plating solution components into the electroless plating tank.

[0017] Preferably, the circulation device includes a circulating water tank, a circulating water pump, and connecting pipes. The circulating water tank is fixed on the lower support of the frame, and its top is connected to the bottom of the electroless plating tank through the connecting pipes. The circulating water pump is located at the outlet end of the circulating water tank and is used to pump the plating solution from the circulating water tank to the electroless plating tank. A return pipe is provided at the overflow port of the plating tank so that the plating solution returns to the circulating water tank through the overflow port, forming a closed circulation loop.

[0018] It should be noted that the circulating water tank, as the core container for storing and regulating the plating solution, maintains the uniformity of the plating solution composition through built-in pipelines or filtration devices. The circulating water pump is installed at the outlet of the circulating water tank, and the impeller is driven by a motor to rotate, pressurizing the plating solution and pumping it to the chemical plating tank. The connecting pipeline uses a pipeline system made of corrosion-resistant materials (such as PVC or titanium alloy) to connect the circulating water tank, water pump, chemical plating tank and overflow port, forming a flow path for the plating solution. The plating solution is pumped from the water tank into the chemical plating tank by the water pump. After the chemical plating reaction is completed, the plating solution carrying impurities and heat flows back to the water tank through the overflow port. After filtration and temperature control in the water tank, it participates in the circulation again, forming a closed-loop process of "pumping-reaction-recirculation-purification-re-pumping".

[0019] Preferably, the circulating water tank is equipped with a constant temperature heating pipe, which is correspondingly located at the bottom inner side of the circulating water tank and can control the temperature of the plating solution in the circulating water tank.

[0020] It should be noted that the constant temperature heating pipes are located at the bottom inner side of the circulating water tank, and are usually made of corrosion-resistant metal (such as stainless steel). They are distributed in a serpentine or grid pattern to increase the contact area with the plating solution and ensure heating uniformity. The bottom installation method conforms to the principle of heat conduction, and utilizes the heat convection effect to allow the heated plating solution to naturally diffuse upwards, forming a uniform temperature circulation system with the circulation device. Driven by the circulation device, the plating solution is heated by the heating pipes and then pumped into the chemical plating tank. After the reaction is completed, it carries the heat back to the water tank, forming a temperature control closed loop of "heating-reaction-reflux-reheating". Traditional chemical plating devices mostly use water bath heating or in-tank heating rods, which have problems such as poor temperature uniformity and temperature control lag. This solution achieves dynamic and precise control of the plating solution temperature by using a constant temperature heating pipe built into the circulating water tank and a closed-loop circulation system. It solves the pain points of large temperature fluctuations and local overheating in the existing technology, and significantly improves the stability and reliability of the chemical plating process.

[0021] The beneficial effects of this utility model are:

[0022] This utility model provides an ultrasonic-assisted chemical plating device for diamond wire saws. Through a vertical, layered frame structure, functional modules are vertically integrated. A circulation device drives the plating solution to circulate and precisely controls the temperature via a constant-temperature heating pipeline. An adjustable drip bottle holder allows for precise addition of plating solution components. The ultrasonic component, through an ultrasonic generator and transducer, generates a cavitation effect to break up particle agglomeration and accelerate metal ion diffusion. This device synergistically solves problems such as particle agglomeration, uneven plating solution, and delayed temperature control in traditional chemical plating processes. It improves coating uniformity and adhesion, shortens chemical plating time, reduces "hollow plating" defects, and enhances equipment stability and ease of operation, achieving a comprehensive improvement in coating quality, production efficiency, and equipment reliability. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural schematic diagram of an ultrasonic-assisted chemical plating device for a diamond wire saw according to Embodiment 1 of this utility model.

[0024] Figure 2 This is a schematic diagram of the installation structure of an ultrasonic-assisted chemical plating device for a diamond wire saw according to Embodiment 1 of this utility model.

[0025] Figure 3 This is a three-dimensional structural diagram of the frame of Embodiment 1 of this utility model.

[0026] Figure 4 This is a schematic diagram of the structure of the dropper bottle holder in Embodiment 1 of this utility model.

[0027] In the diagram: 1. Frame; 11. Lower support; 12. Middle mounting platform; 13. Upper cantilever; 2. Circulation device; 21. Circulating water tank; 22. Circulating water pump; 23. Connecting pipeline; 3. Dropper holder; 31. Fixing plate; 32. Support plate; 33. Adjusting cylinder; 4. Chemical plating tank; 5. Ultrasonic component; 51. Ultrasonic generator; 52. Ultrasonic transducer; 6. Limiting frame; 7. Constant temperature heating pipeline.

[0028] It should be noted that these accompanying drawings and textual descriptions are not intended to limit the scope of the present invention in any way, but rather to illustrate the concept of the present invention to those skilled in the art by referring to specific embodiments. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0030] Example 1

[0031] like Figures 1-4 As shown, an ultrasonic-assisted chemical plating device for diamond wire saws includes: a frame 1, a circulation device 2, a dropper bottle holder 3, a chemical plating tank 4, and an ultrasonic component 5. The circulation device 2 is located at the lower end of the frame 1, the chemical plating tank 4 is located in the middle of the frame 1, and the dropper bottle holder 3 is correspondingly located on the frame 1 above the chemical plating tank 4.

[0032] The ultrasonic component 5 is fixedly connected to the bottom of the chemical plating tank 4. The circulation device 2 is used to drive the plating solution to circulate between the chemical plating tank 4 and the circulation device 2. The dropper bottle holder 3 is used to carry the dropper bottle to add plating solution components into the chemical plating tank 4. The ultrasonic component 5 is used to emit ultrasonic waves into the plating solution in the chemical plating tank 4 during the chemical plating process.

[0033] The frame 1 is a vertical layered structure, including a lower support 11, a middle mounting platform 12 and an upper cantilever 13; the circulation device 2 is installed on the lower support 11, the chemical plating tank 4 and the ultrasonic component 5 are installed on the middle mounting platform 12, and the dropper bottle holder 3 is installed on the upper cantilever 13 corresponding to the chemical plating tank 4.

[0034] The ultrasonic component 5 includes an ultrasonic generator 51 and a plurality of ultrasonic transducers 52 uniformly distributed at the bottom of the chemical plating tank 4. The ultrasonic transducers 52 are electrically connected to the ultrasonic generator 51 and are used to convert electrical energy into high-frequency mechanical vibration and transmit it to the plating solution to generate a cavitation effect to break up particle agglomeration in the plating solution.

[0035] The dropper bottle holder 3 includes a fixing plate 31, a support plate 32, and an adjusting cylinder 33. The fixing plate 31 and the support plate 32 are connected on one side by a hinge. The adjusting cylinder 33 is located between the fixing plate 31 and the support plate 32 on the other side and can drive the support plate 32 to rotate around the hinge axis to adjust the tilt angle between the support plate 32 and the fixing plate 31. The support plate 32 is provided with a limiting frame 6 for fixing the dropper bottle corresponding to the chemical plating tank 4.

[0036] The circulation device 2 includes a circulating water tank 21, a circulating water pump 22, and a connecting pipe 23. The circulating water tank 21 is fixed on the lower support part 11 of the frame 1, and its top is connected to the bottom of the chemical plating tank 4 through the connecting pipe 23. The circulating water pump 22 is located at the outlet end of the circulating water tank 21 and is used to pump the plating solution from the circulating water tank 21 to the chemical plating tank 4. A return pipe is set at the overflow port of the plating tank so that the plating solution returns to the circulating water tank 21 through the overflow port, forming a closed circulation loop.

[0037] The circulating water tank 21 is equipped with a constant temperature heating pipe 7, which is located at the bottom inner side of the circulating water tank 21 and can control the temperature of the plating solution in the circulating water tank 21.

[0038] This embodiment describes the working principle and usage of an ultrasonic-assisted chemical plating device for diamond wire saws:

[0039] This embodiment provides an ultrasonic-assisted chemical plating device for diamond wire saws. The frame 1 includes a lower support section 11, a middle mounting platform 12, and an upper cantilever frame 13. The vertical layered design optimizes the spatial layout, separates functional modules, reduces vibration transmission, and improves operational convenience. The lower support section 11 supports the circulation device 2 (circulating water tank 21, water pump, etc.), lowering the device's center of gravity to improve overall stability and reduce the interference of ultrasonic vibration on the structure. The middle mounting platform 12 provides a horizontal support surface to fix the chemical plating tank 4 and the ultrasonic components 5, ensuring precise alignment between the plating tank and the transducer. The upper cantilever frame 13 is equipped with a drip bottle holder 3 to ensure the drip bottle is vertically aligned with the center of the plating tank, preventing the plating solution from dripping off-center. The circulation device 2 includes a circulating water tank 21, a circulating water pump 22, and a connecting pipe 23. The circulating water pump 22 pumps the plating solution from the water tank into the electroless plating tank 4, driving the plating solution to flow and preventing local component consumption or uneven temperature. The connecting pipe 23 connects the water tank and the plating tank, forming a closed loop. The plating solution flows back to the water tank through the overflow port, achieving continuous circulation. The ultrasonic generator 51 converts industrial frequency electrical energy into high frequency electrical signals to drive the piezoelectric generator at the bottom of the electroless plating tank 4. The ceramic transducer generates high-frequency mechanical vibration; the vibration is transmitted to the plating solution in the form of longitudinal waves, causing periodic pressure changes and localized cavitation bubbles to form in the liquid. These bubbles collapse violently in the high-pressure zone, generating instantaneous high temperature, high pressure, and strong shock waves. The shock waves disrupt the agglomeration of diamond micropowder, causing it to disperse and suspend uniformly. Simultaneously, they impact bubbles adsorbed on the abrasive grains and wire saw surfaces, eliminating gas film obstruction. The micro-jet effect enhances plating solution turbulence, accelerates the diffusion of metal ions to the diamond abrasive grains and wire saw substrate surfaces, shortens the electroless plating time, and improves coating adhesion. The drip bottle holder 3 is connected to the fixing plate 31 via a hinge. The extension and retraction of the piston rod of the adjusting cylinder 33 can drive the plate 32 to rotate around the hinge shaft, thereby changing the tilt angle between the plate 32 and the fixed plate 31. The limiting frame 6 on the plate 32 fixes the dropper bottle through the slot or strap, so that its bottle mouth is vertically aligned with the center of the chemical plating tank 4. The larger the tilt angle, the faster the plating solution components (such as reducing agents and complexing agents) in the dropper bottle drip due to gravity. The quantitative addition of plating solution components can be achieved by precisely controlling the air pressure of the cylinder (or manually adjusting), avoiding concentration fluctuations caused by manual operation. It is especially suitable for chemical plating processes that require gradient addition or precise speed control.

[0040] In use, the frame 1 is vertically fixed on a flat ground, and anchor bolts are used to ensure stability of the center of gravity. The lower support 11 is used to install the circulating water tank 21. After the middle mounting platform 12 is calibrated with a level, the ultrasonic component 5 is fixed to the chemical plating tank 4, ensuring that the ultrasonic transducer 52 is in close contact with the bottom of the plating tank. The drip bottle bracket 3 is bolted to the upper cantilever frame 13 of the frame 1, and the position of the drip bottle bracket 3 is adjusted so that the drip tube of the drip bottle is aligned with the center of the chemical plating tank 4. Then, the outlet of the circulating water tank 21 is connected to the inlet of the circulating water pump 22, and the outlet of the water pump is connected to the bottom inlet of the chemical plating tank 4. The overflow port of the plating tank returns to the water tank through the return pipeline, forming a closed loop. Clean water is injected into the circulating water tank 21, the water pump is started to test whether the pipeline leaks, the angle of the drip bottle bracket 3 is adjusted to check whether the mechanical linkage is smooth, the ultrasonic generator 51 is turned on to test whether the transducer vibrates evenly, and then the clean water is discharged.

[0041] After the equipment installation is completed, the output power is set using the ultrasonic generator 51 according to the diamond micron powder particle size and plating solution concentration. The pre-prepared chemical plating solution is added to the circulating water tank 21, and the target temperature is input into the control system. The constant temperature heating pipe 7 is controlled to heat the plating solution, and the circulating water pump 22 is started to circulate the plating solution between the plating tank and the water tank, ensuring uniform mixing and heating to the set temperature. Then, the ultrasonic generator 51 is turned on to uniformly suspend the diamond micron powder in the plating solution, and the uniformity of the plating solution's turbidity is observed. Next, the diamond wire saw is slowly placed into the chemical plating tank 4, ensuring complete immersion in the plating solution. During the process, the ultrasonic and circulation systems are kept running continuously. A replenishing solution (such as a reducing agent) is added to the plating tank through the dropper holder 3 to maintain the required concentration for the reaction. The plating time is set according to the required plating thickness. The color change of the plating solution (such as gradually lightening from green when plating nickel) and the gloss of the plating layer on the wire saw surface are observed regularly. The pH value of the plating solution is monitored by pH test paper or online sensor. If necessary, a regulator is added to maintain the stability of the process parameters. After the wire saw completes the chemical plating, the ultrasonic generator 51 and the circulating water pump 22 are turned off. The diamond wire saw is removed, and the surface residual plating solution is rinsed with clean water. After drying, the plating thickness and adhesion are tested.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of this utility model and is used only to illustrate the technical solution of this utility model, and is not intended to limit the protection scope of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the protection scope of this utility model.

[0043] In the description of this utility model, it should be understood that the terms "upper", "lower", "upper end", "lower end", "upper surface", "lower surface", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0044] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

Claims

1. An apparatus for ultrasonic-assisted electroless plating of a diamond wire saw, comprising: The equipment comprises a frame (1), a circulation device (2), a dropper bottle holder (3), a chemical plating tank (4), and an ultrasonic component (5). The circulation device (2) is located at the lower end of the frame (1), the chemical plating tank (4) is located in the middle of the frame (1), and the dropper bottle holder (3) is correspondingly located on the frame (1) above the chemical plating tank (4). Its features include: The ultrasonic component (5) is fixedly connected to the bottom of the chemical plating tank (4). The circulation device (2) is used to drive the plating solution to circulate between the chemical plating tank (4) and the circulation device (2). The dropper bottle holder (3) is used to carry the dropper bottle to add plating solution components into the chemical plating tank (4). The ultrasonic component (5) is used to emit ultrasonic waves into the plating solution in the chemical plating tank (4) during the chemical plating process.

2. The apparatus for ultrasonic-assisted electroless plating of a diamond wire saw according to claim 1, wherein: The frame (1) is a vertical layered structure, including a lower support (11), a middle mounting platform (12) and an upper cantilever (13); the circulation device (2) is set on the lower support (11), the chemical plating tank (4) and the ultrasonic component (5) are set on the middle mounting platform (12), and the dropper bottle holder (3) is set on the upper cantilever (13) corresponding to the chemical plating tank (4).

3. The apparatus for ultrasonic-assisted electroless plating of a diamond wire saw according to claim 2, wherein: The ultrasonic component (5) includes an ultrasonic generator (51) and a plurality of ultrasonic transducers (52) uniformly distributed at the bottom of the chemical plating tank (4). The ultrasonic transducers (52) are electrically connected to the ultrasonic generator (51) and are used to convert electrical energy into high-frequency mechanical vibration and transmit it to the plating solution to generate a cavitation effect to break up particle agglomeration in the plating solution.

4. The apparatus for ultrasonic-assisted electroless plating of a diamond wire saw according to claim 2, wherein: The dropper bottle holder (3) includes a fixed plate (31), a tray (32), and an adjusting cylinder (33). The fixed plate (31) and the tray (32) are connected on one side by a hinge. The adjusting cylinder (33) is located between the fixed plate (31) and the tray (32) on the other side. The adjusting cylinder (33) can drive the tray (32) to rotate around the hinge axis to adjust the tilt angle between the tray (32) and the fixed plate (31). The tray (32) is provided with a limiting bracket (6) for fixing the dropper bottle corresponding to the chemical plating tank (4).

5. The apparatus for ultrasonic-assisted electroless plating of a diamond wire saw according to claim 2, wherein: The circulation device (2) includes a circulating water tank (21), a circulating water pump (22), and a connecting pipe (23). The circulating water tank (21) is fixed on the lower support part (11) of the frame (1), and its top is connected to the bottom of the chemical plating tank (4) through the connecting pipe (23). The circulating water pump (22) is set at the outlet end of the circulating water tank (21) to pump the plating solution from the circulating water tank (21) to the chemical plating tank (4), and a return pipe is set at the overflow port of the plating tank so that the plating solution returns to the circulating water tank (21) through the overflow port, forming a closed circulation loop.

6. The apparatus for ultrasonic-assisted electroless plating of a diamond wire saw according to claim 5, wherein: The circulating water tank (21) is equipped with a constant temperature heating pipe (7), which is located at the bottom of the inner side of the circulating water tank (21) and can control the temperature of the plating solution in the circulating water tank (21).

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