A bonding device between the outer casing and the base of a hemispherical resonant gyroscope

Abstract

This invention discloses a bonding device for a hemispherical resonator gyroscope housing and its base, comprising a worktable, a three-axis moving module, a clamping module, and a bonding module. The clamping module clamps the base on the worktable and releases it after reaching the lower heating platform under the drive of the three-axis moving module. It also clamps the housing on the worktable and releases it after reaching the lower heating platform or the base under the drive of the three-axis moving module. A second Z-axis sliding mechanism allows the upper heating platform to move in the Z-axis direction. The upper heating platform, driven by the three-axis moving module, abuts against the housing on the lower heating platform to preheat the housing or perform bonding heating on the assembly of the housing and the base. This invention, through the design of the clamping module and heating module, and in conjunction with a specific motion mechanism, achieves automated heating and pressure bonding of the micro-hemispherical housing and the electrode base. It is applicable not only to conventional pressureless gold-indium bonding but also to high-pressure copper-tin bonding.

Description

Technical Field

[0001] This utility model relates to the field of hemispherical resonant gyroscope manufacturing technology, specifically to a bonding device for a hemispherical resonant gyroscope outer cover and base. Background Technology

[0002] The hemispherical resonator gyroscope is a high-precision inertial sensor. Compared to current laser and fiber optic gyroscopes, it has fewer components, longer continuous operating time, better stability, and superior radiation resistance, making it one of the most promising devices for next-generation inertial navigation equipment. The micro-hemispherical resonator gyroscope's external structure mainly consists of an outer casing and a base. Since the micro-hemispherical resonator needs to operate under a certain vacuum environment, the assembly process of the gyroscope head requires sealing the base, which contains the micro-hemispherical resonator and electrodes, to the outer casing while maintaining the internal vacuum. The conventional sealing method for the electrode base and outer casing is eutectic bonding. This involves depositing a suitable metal film layer for eutectic bonding at the connection point of the electrode base and outer casing, and then allowing these two films to eutecticly bond under appropriate temperature and pressure, thus establishing a reliable sealed connection. Because the micro-hemispherical resonator gyroscope is still in the research and development stage, there are currently no reports of automated equipment for bonding the outer casing and base. Utility Model Content

[0003] To address the problems in the background art, this utility model proposes a low-cost, automated bonding device for the outer casing and base of a hemispherical resonant gyroscope.

[0004] The present invention adopts the following technical solution:

[0005] A bonding device for a hemispherical resonator gyroscope housing and base includes a worktable, a three-axis moving module, a clamping module, and a bonding module. The three-axis moving module includes an X-axis sliding mechanism, a Y-axis sliding mechanism, and a Z-axis sliding assembly. The X-axis sliding mechanism is placed on the worktable to support the Y-axis sliding mechanism and allow the Y-axis sliding mechanism to move in the X-axis direction. The Z-axis sliding assembly is placed on the Y-axis sliding mechanism, and the Y-axis sliding mechanism allows the Z-axis sliding assembly to move in the Y-axis direction.

[0006] The Z-axis sliding assembly includes a first Z-axis sliding mechanism and a second Z-axis sliding mechanism. The clamping module is located at the lower end of the first Z-axis sliding mechanism. The bonding module includes an upper heating stage and a lower heating stage. The lower heating stage is located on the worktable, and the upper heating stage is located at the lower end of the second Z-axis sliding mechanism. The first Z-axis sliding mechanism allows the clamping module to move in the Z-axis direction.

[0007] The clamping module is used to clamp the base on the worktable and release the base after reaching the lower heating platform under the drive of the three-axis moving module. It is also used to clamp the outer cover on the worktable and release the outer cover after reaching the lower heating platform or the base under the drive of the three-axis moving module.

[0008] The second Z-axis sliding mechanism allows the upper heating platform to move in the Z-axis direction. The upper heating platform is used to abut against the outer cover on the lower heating platform under the drive of the three-axis moving module, so as to cooperate with the lower heating platform to preheat the outer cover or to bond and heat the assembly of the outer cover and the base.

[0009] Optionally, the lower end of the upper heating platform is provided with a lever arm to facilitate contact with the outer cover.

[0010] Optionally, a pressure sensor is provided between the lower heating stage and the worktable.

[0011] Optionally, heating rods and thermocouples are installed in both the upper and lower heating stages.

[0012] Optionally, the first Z-axis sliding mechanism and the second Z-axis sliding mechanism have a set distance and are rigidly connected by a connecting member.

[0013] Optionally, both the worktable and the lower heating table are equipped with sample placement chambers for suspending the outer cover or base.

[0014] Optionally, the upper surface of the sample placement chamber is provided with a support groove that matches the base, the bottom of the support groove is provided with a receiving groove for accommodating the electrode needle at the bottom of the base, and the two ends of the radial side wall of the sample placement chamber are provided with clearance grooves to facilitate the clamping module to clamp the outer cover or the base.

[0015] Optionally, the clamping module includes a drive mechanism and two sliders that are connected to the drive mechanism in a transmission manner. The drive mechanism is used to drive the two sliders to open and close, and the lower end of the slider is provided with a gripper that cooperates with the clearance groove.

[0016] Optionally, it also includes a vacuum chamber, in which the worktable, three-axis moving module, clamping module and bonding module are all placed.

[0017] Optionally, the X-axis sliding mechanism, the Y-axis sliding mechanism, the first Z-axis sliding mechanism, and the second Z-axis sliding mechanism all include a drive motor and a lead screw and nut pair structure that is connected to the drive motor for transmission.

[0018] Compared with the prior art, the advantages of this utility model are:

[0019] This invention provides a low-cost, automated bonding device for the outer casing and base of a hemispherical resonator gyroscope. By designing a clamping module and a heating module, and cooperating with a specific motion mechanism, it achieves automated heating and pressure bonding of the micro-hemispherical casing and the electrode base. It is suitable not only for conventional pressureless gold-indium bonding, but also for high-pressure copper-tin bonding. Attached Figure Description

[0020] To facilitate understanding of this invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of this invention and should not be considered as limiting the scope of protection of this invention.

[0021] Figure 1 This is a three-dimensional structural diagram of the bonding device between the outer casing and the base of the hemispherical resonant gyroscope according to an embodiment of the present invention.

[0022] Figure 2 This is a three-dimensional structural schematic diagram of the bonding device between the outer casing and the base of the hemispherical resonant gyroscope according to another embodiment of the present invention.

[0023] Figure 3 This is a front view structural schematic diagram of the bonding device between the outer cover and the base of the hemispherical resonant gyroscope according to an embodiment of the present invention.

[0024] Figure 4 for Figure 3 AA cross-section view.

[0025] Figure 5 This is a three-dimensional structural diagram of the bonding device between the outer casing and the base of the hemispherical resonant gyroscope according to an embodiment of the present invention (including the vacuum cavity and control module).

[0026] Figure 6 This is a three-dimensional structural diagram of the clamping module and the bonding module.

[0027] Figure 7 This is a three-dimensional structural diagram of the clamping module.

[0028] Figure 8 This is a three-dimensional structural diagram of the lower heating platform.

[0029] Figure 9 This is a schematic diagram of the structure before the outer cover and base are bonded together.

[0030] Figure 10 This is a schematic diagram of a three-dimensional structure in which the base is suspended in the sample placement chamber.

[0031] Figure 11 for Figure 9 A schematic diagram of the half-section structure.

[0032] Figure 12 This is a schematic diagram of the three-dimensional structure of the sample placement chamber.

[0033] Figure 13 This is a diagram showing the initial working state of the bonding device between the outer casing and the base of the hemispherical resonant gyroscope.

[0034] Figure 14 This is a diagram showing the heating state of the outer casing of the hemispherical resonant gyroscope and the bonding device between the outer casing and the base.

[0035] Figure 15 This is a diagram showing the base transfer state of the bonding device between the outer casing and the base of the hemispherical resonant gyroscope.

[0036] Figure 16 This is a bonding diagram of the bonding state between the outer casing and the base of the hemispherical resonant gyroscope. Detailed Implementation

[0037] The embodiments of the present invention are described below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0038] like Figures 1-16 As shown, this embodiment provides a bonding device for a hemispherical resonator gyroscope housing and its base, including a worktable 1, a three-axis moving module, a clamping module 6, and a bonding module. The three-axis moving module includes an X-axis sliding mechanism 3, a Y-axis sliding mechanism 2, and a Z-axis sliding assembly. The X-axis sliding mechanism 3 is placed on the worktable 1 and supports the Y-axis sliding mechanism 2, allowing the Y-axis sliding mechanism 2 to move in the X-axis direction. The Z-axis sliding assembly is placed on the Y-axis sliding mechanism 2, allowing the Z-axis sliding assembly to move in the Y-axis direction.

[0039] The Z-axis sliding assembly includes a first Z-axis sliding mechanism and a second Z-axis sliding mechanism. The clamping module 6 is located at the lower end of the first Z-axis sliding mechanism. The bonding module includes an upper heating stage 7 and a lower heating stage 9. The lower heating stage 9 is located on the worktable 1, and the upper heating stage 7 is located at the lower end of the second Z-axis sliding mechanism. The first Z-axis sliding mechanism allows the clamping module 6 to move in the Z-axis direction.

[0040] The clamping module 6 is used to clamp the base 13 on the worktable 1, and releases the base 13 after reaching the lower heating platform 9 under the drive of the three-axis moving module. It is also used to clamp the outer cover 12 on the worktable 1, and releases the outer cover 12 after reaching the lower heating platform 9 or the base 13 under the drive of the three-axis moving module.

[0041] The second Z-axis sliding mechanism allows the upper heating platform 7 to move in the Z-axis direction. The upper heating platform 7 is used to abut against the outer cover 12 on the lower heating platform 9 under the drive of the three-axis moving module, so as to cooperate with the lower heating platform 9 to preheat the outer cover 12 or to bond and heat the assembly of the outer cover 12 and the base 13.

[0042] In this embodiment, the lower end of the upper heating platform 7 is provided with a lever arm 72 that facilitates contact with the outer cover 12.

[0043] Four ceramic pillars are installed above the upper heating platform 7 and connected to the pressure transfer seat to prevent the heat generated by the upper heating platform during heating from affecting the stable operation of the pressure motor. The upper heating platform is designed with corresponding grooves according to the outer contour of the outer cover 12, which can completely wrap the outer cover 12, improve heat transfer efficiency, and reduce degassing time.

[0044] In this embodiment, a pressure sensor 91 is provided between the lower heating stage 9 and the worktable 1 to provide real-time feedback on the bonding pressure applied by the motor. The pressure can be adjusted according to the displayed value. The maximum pressure of this mechanism can reach 200 kgf.

[0045] In this embodiment, heating rods 70 and thermocouples 92 are installed in both the upper heating platform 7 and the lower heating platform 9.

[0046] Both the upper heating platform 7 and the lower heating platform 9 are equipped with two heating rods 70 and a K-type thermocouple 92, which are used for heating and temperature detection, respectively. First, the lever arm 72 is fastened to the upper heating platform 7 with screws. Then, four threaded ceramic columns 71 are fixed to the upper heating platform 7 and then fixed to the motor 11 through the mounting plate 73 to realize pressure control driven by the motor.

[0047] A bonding chamber is fixed on the lower heating stage 9. Three threaded ceramic pillars 71 are installed between the lower heating stage 9 and the pressure sensor 91 to achieve heat insulation between the lower heating stage and the pressure sensor. Finally, it is fixed to the bottom of the vacuum tank by the base plate 93.

[0048] In this embodiment, the first Z-axis sliding mechanism and the second Z-axis sliding mechanism have a set distance and are rigidly connected by a connecting member.

[0049] In this embodiment, both the workbench 1 and the lower heating stage 9 are provided with sample placement chambers 14 for suspending the outer cover 12 or the base 13.

[0050] This equipment's sample placement chamber 14 consists of two independent placement areas: a placement chamber and a bonding chamber. There are two placement chambers, one for placing the electrode base and the other for the outer casing. There is one bonding chamber for the independent operation of a single component. Individual components undergo heating, degassing, getter activation, or bonding in the bonding chamber. After completing the designated function, the component in the bonding chamber is moved to the placement chamber for cooling. Thermocouple temperature displays in the placement chamber help the operator understand the cooling rate of the electrode base or casing placed there. Upper and lower heating platforms are located on the upper and lower sides of the bonding chamber, each containing built-in thermocouples for controlling the heating temperature of the heating blocks. When the casing is placed in the bonding area, both the upper and lower heating platforms must operate simultaneously. First, the casing is degassed at a suitable temperature (150℃~180℃). Then, the temperature is increased (up to 500℃) to the activation temperature of the getter film on the casing. After activating the getter for the specified heating time, the casing is moved to the placement chamber. When the electrode base is placed in the bonding area, only the lower heating platform is used for heating and degassing.

[0051] When the electrode base and the housing are eutectic bonded, first place the electrode base in the bonding chamber, then clamp the housing above the electrode base. After the installation and alignment are completed, move the upper heating stage to cover the housing. At this time, control the pressurization module and heat up the lower heating stage. When the temperature and pressure reach the conditions required for eutectic bonding, the bonding will occur.

[0052] In this embodiment, the upper surface of the sample chamber 14 is provided with a support groove 141 that matches the base 13. The bottom of the support groove 141 is provided with a receiving groove 142 for accommodating the electrode needle at the bottom of the base. Both ends of the side wall of the sample chamber 14 in the radial direction are provided with clearance grooves 142 to facilitate the clamping module 6 to clamp the outer cover 12 or the base 13.

[0053] Two sample placement chambers, one for the housing and the other for the electrode base, are fixed to a sample placement base 81. The sample placement base 81 is secured with a certain distance from the base plate 91 to prevent heat from the bonding area from reaching the sample placement chambers. This design facilitates the removal of vented housings and activated getter, as well as the movement of bonded products to the sample placement area for heat dissipation. A type K thermocouple is installed on the sample placement base plate 81, which feeds real-time temperature feedback to the host computer, allowing operators to monitor the heat dissipation temperature and perform component placement and removal operations. The sample placement base plate 81 is fixed to the base plate 83 by two support rods 82 and is then fixed to the bottom of the vacuum tank.

[0054] Both the lofting chamber and the bonding chamber are slotted to facilitate the clamping module 6 in placing and removing parts from the chamber.

[0055] In this embodiment, the clamping module 6 includes a drive mechanism 61 and two sliders 63 that are connected to the drive mechanism 61 in a transmission manner. The drive mechanism 61 is used to drive the two sliders 63 to open and close. The lower end of the sliders 63 is provided with a gripper 64 that cooperates with the clearance groove.

[0056] Specifically, the clamping module 6 includes a motor 61, a slider 63, grippers 64, and a movable block limiting connector 62. Two grippers 64 are fixed to the corresponding sliders 63 by screws. The movable blocks are mounted on the movable block limiting connector 62 and form a sliding connection. The shaft of the motor 61 is connected to the sliders 63 and grippers 64 through an internal transmission mechanism, driving the grippers 64 to move and grip the workpiece. The clamping module 6 is connected to the first Z-axis lead screw and nut pair structure 4 via a connector. Driven by the first Z-axis motor 10, the clamping module 6 can achieve Z-axis movement. The upper heating platform 7 is an electrically controlled heating platform; the temperature of this module can be controlled by current. This module is connected to the second Z-axis lead screw and nut pair structure 5 via a connector, and the upper heating platform module is driven to move in the Z-axis by the second Z-axis motor 11. The lead screw motor motion mechanisms corresponding to the above two modules are rigidly connected by connectors, and their relative positions are fixed. The resulting integral fixing component is also connected to the lead screw in the Y-axis sliding mechanism 2. The Y-axis drive motor controls the translation of the clamp and the upper heating platform as a whole structure along the Y-axis. The Y-axis sliding mechanism 2 is connected to the lead screw in the X-axis sliding mechanism 3 via connectors, thereby driving the overall forward and backward movement. The bottom X-axis motion mechanism module is fixed to the support base plate 1. Both the clamping module and the upper heating module can achieve forward, backward, left, right, and up / down movement and control. In the initial state, the outer cover 12 to be packaged and the base 13 to be packaged are placed in their respective sample placement chambers 14, which are fixed to the support base plate 1 via an intermediate connecting platform and support rods. The bonding chamber, where the outer cover and base are bonded, is fixed to the lower heating platform 9. Through the action of the lower heating platform, heat is conducted to the bonding chamber, accelerating the bonding process.

[0057] In this embodiment, a vacuum chamber 8 is also included, and the worktable 1, the three-axis moving module, the clamping module 6 and the bonding module are all placed inside the vacuum chamber 8.

[0058] The bonding of the hemispherical resonant gyroscope base and outer casing needs to occur under certain vacuum conditions. Therefore, the placement and operation of the above-mentioned overall mechanism are all completed in a vacuum tank, and the vacuum tank is connected to a vacuum pump group to achieve working gas pressure regulation.

[0059] This device has a high vacuum capability, equipped with a molecular pump and a dry pump, and the vacuum level reaches 1E-5Pa. It can maintain a high vacuum inside the micro-hemispherical after eutectic bonding, avoiding the need to design a copper tube for vacuuming and venting on the electrode base, thus improving the simplicity and reliability of the structure.

[0060] In this embodiment, the X-axis sliding mechanism 3, the Y-axis sliding mechanism 2, the first Z-axis sliding mechanism, and the second Z-axis sliding mechanism all include a drive motor and a lead screw and nut pair structure that is connected to the drive motor for transmission.

[0061] This equipment uses simultaneous control from upper and lower computers to achieve automatic object picking, heating temperature and bonding pressure adjustment of the micro-hemispherical gyroscope. Combined with a maximum temperature of 500℃ and a pressure of 200kgf, it can achieve highly difficult copper-tin bonding.

[0062] The implementation process of the outer casing and base packaging bonding in this embodiment is as follows:

[0063] 1) Place the outer casing and base to be packaged and bonded into their respective sample placement chambers;

[0064] 2) The motors work together to drive the clamping module to move to the position of the outer cover 12 to be packaged. The electrically controlled clamping jaws work to hold the outer cover structure with clamping force. At the same time, the first Z-axis motor 10 works to lift the outer cover. Then, the X and Y-axis motion mechanisms work together to transfer the outer cover and place it in the bonding chamber. The upper heating platform moves to above this position and then descends. At this time, the upper and lower heating platforms pre-tighten the outer cover and begin heating.

[0065] 3) After heating for a certain period of time, the outer cover is preheated. The upper heating platform 7 is then driven to lift, and the clamping module 6 moves to the bonding chamber position, transferring the outer cover module to its initial sample placement chamber. Subsequently, the clamping module moves to the sample placement chamber position where the base is located, transferring the base 13 containing the assembled micro-hemispherical and electrode to the bonding chamber.

[0066] 4) The clamping module moves again to the sample placement chamber where the outer cover 12 is located, and transfers the preheated outer cover in the sample placement chamber to the bonding chamber and places it on the base. At this time, the outer cover and the base complete the contact and engagement. Then the upper heating platform moves to this location and applies pressure to both components at the same time. The upper and lower heating platforms heat at the same time. After the outer cover and the base are subjected to the set pressure and heating temperature for a certain period of time, the bonding is completed.

[0067] Example 1

[0068] 1) Copper film and tin film are deposited on the outer surfaces of the outer cover 12 and the base 13 respectively by magnetron sputtering, with thicknesses of 200-400nm and 600-800nm ​​respectively. The surface roughness before film deposition should be maintained at 0.2-0.8um; the outer cover 12 needs to be coated with a thin film getter in advance.

[0069] 2) Place the outer cover 12 and base 13 into the sample placement chamber, close the vacuum chamber, and evacuate the chamber to 1E-5Pa. Then, use motor 61 to drive gripper 64 to pick up the outer cover 12 and place it into the bonding chamber. Use the second Z-axis motor 11 to drive the upper heating platform 7 with lever arm 72 to cover the outer cover 12. Then, control the heating through the host computer to achieve degassing of the parts at 180℃~280℃. The upper limit of this exhaust temperature depends on the minimum activation temperature of the getter used for coating the thin film. Taking TZC getter as an example, the minimum activation temperature of this thin film getter is 300℃, and the activation time is 30min. Therefore, the degassing temperature of the parts can be below 300℃. The degassing time is usually 24~48h, depending on the degassing temperature. The higher the temperature, the shorter the degassing time.

[0070] 3) After the outer cover 12 has been degassed, the upper heating platform 7 with lever arm 72 is reset, and the outer cover 12 is clamped to the sample placement chamber for cooling using the gripper 64.

[0071] 4) Place the base 13 in the bonding chamber 15, and use the host computer to control the heating stage 9 to degas the electrode base 13. The degassing temperature and time are set as needed, usually 180℃~280℃ for 24~48h.

[0072] 5) After the base 13 is degassed, the outer cover 12 is clamped to the bonding chamber area by the gripper 64 and installed on the electrode base 13 by the upper computer control assembly.

[0073] 6) The upper heating platform 7 with lever arm 72 is driven by motor 7 to cover the outer cover 12, and then the heating and pressurization are controlled by the host computer. A pre-pressure of 10-20 kgf is applied to the lever arm, and pre-baking is carried out at 150-180℃ for 2 hours. The temperature is increased to the getter activation temperature at a heating rate of 5° / min, and heated for the specified activation time until the getter is fully activated. Then, the temperature is increased to the copper-tin bonding temperature point at a heating rate of 5° / min, usually 360-380℃. At the same time, the second Z motor 11 drives the lever arm 72 to apply a pressure of 180-210 kgf to the outer cover 12. The pressure value is fed back by the pressure sensor and PID control is performed to ensure that the pressure is uniform and appropriate. The temperature and pressure are maintained for 2-3 hours, and then the heating and pressurization of the object are stopped. Throughout the bonding process, the lower heating platform 9 and the upper heating platform 7 maintain the same temperature and heating rate, and finally the bonding of the outer cover 12 and the electrode base 13 is completed.

[0074] 7) After bonding is completed, allow the micro-hemispherical gyroscope assembly to cool down naturally without heating. When the temperature drops to 200℃, use the gripper 64 to pick up the micro-hemispherical gyroscope assembly and place it in the sample placement chamber to allow it to cool down more quickly. When the temperature of the sample placement chamber drops to 25-35℃, turn off the pump set, break the vacuum in the tank, and then take out the micro-hemispherical gyroscope assembly.

[0075] 8) The motor motion control, heating temperature, and bonding pressure of the entire bonding process are all displayed and controlled by the host computer of the equipment, realizing automated bonding assembly.

[0076] The embodiments described above are merely preferred embodiments of this utility model. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of this utility model's technical solution should be included within the protection scope of this utility model.

Claims

1. A bonding device for a hemispherical resonant gyroscope housing and a base, characterized in that, The system includes a worktable (1), a three-axis movement module, a clamping module (6), and a bonding module. The three-axis movement module includes an X-axis sliding mechanism (3), a Y-axis sliding mechanism (2), and a Z-axis sliding assembly. The X-axis sliding mechanism (3) is placed on the worktable (1) and is used to support the Y-axis sliding mechanism (2), allowing the Y-axis sliding mechanism (2) to move in the X-axis direction. The Z-axis sliding assembly is placed on the Y-axis sliding mechanism (2), allowing the Z-axis sliding assembly to move in the Y-axis direction. The Z-axis sliding assembly includes a first Z-axis sliding mechanism and a second Z-axis sliding mechanism. The clamping module (6) is located at the lower end of the first Z-axis sliding mechanism. The bonding module includes an upper heating stage (7) and a lower heating stage (9). The lower heating stage (9) is located on the worktable (1), and the upper heating stage (7) is located at the lower end of the second Z-axis sliding mechanism. The first Z-axis sliding mechanism allows the clamping module (6) to move in the Z-axis direction. The clamping module (6) is used to clamp the base (13) on the worktable (1) and release the base (13) after it reaches the lower heating platform (9) under the drive of the three-axis moving module. It is also used to clamp the outer cover (12) on the worktable (1) and release the outer cover (12) after it reaches the lower heating platform (9) or the base (13) under the drive of the three-axis moving module. The second Z-axis sliding mechanism allows the upper heating platform (7) to move in the Z-axis direction. The upper heating platform (7) is used to abut against the outer cover (12) on the lower heating platform (9) under the drive of the three-axis moving module, so as to cooperate with the lower heating platform (9) to preheat the outer cover (12) or to bond the assembly of the outer cover (12) and the base (13).

2. The bonding device between the outer casing and the base of the hemispherical resonant gyroscope according to claim 1, characterized in that, The lower end of the upper heating platform (7) is provided with a lever arm (72) to facilitate contact with the outer cover (12).

3. The bonding device between the outer casing and the base of the hemispherical resonant gyroscope according to claim 1, characterized in that, A pressure sensor (91) is provided between the lower heating stage (9) and the worktable (1).

4. The bonding device between the outer casing and the base of the hemispherical resonant gyroscope according to claim 1, characterized in that, Heating rods (70) and thermocouples (92) are installed in both the upper heating platform (7) and the lower heating platform (9).

5. The bonding device between the outer casing and the base of the hemispherical resonant gyroscope according to claim 1, characterized in that, The first Z-axis sliding mechanism and the second Z-axis sliding mechanism have a set distance and are rigidly connected by a connecting member.

6. The bonding device between the outer casing and the base of the hemispherical resonant gyroscope according to claim 1, characterized in that, Both the workbench (1) and the lower heating platform (9) are equipped with sample placement chambers (14) for suspending the outer cover (12) or the base (13).

7. The bonding device between the outer casing and the base of the hemispherical resonator gyroscope according to claim 6, characterized in that, The upper surface of the sample placement chamber (14) is provided with a support groove (141) that matches the base (13). The bottom of the support groove (141) is provided with a receiving groove (142) for accommodating the electrode needle at the bottom of the base. The two ends of the side wall of the sample placement chamber (14) in the radial direction are provided with clearance grooves (143) to facilitate the clamping module (6) to clamp the outer cover (12) or the base (13).

8. The bonding device between the outer casing and the base of the hemispherical resonant gyroscope according to claim 7, characterized in that, The clamping module (6) includes a drive mechanism (61) and two sliders (63) that are connected to the drive mechanism (61) in a transmission manner. The drive mechanism (61) is used to drive the two sliders (63) to open and close. The lower end of the slider (63) is provided with a gripper (64) that cooperates with the clearance groove (143).

9. The bonding device between the outer casing and the base of a hemispherical resonant gyroscope according to any one of claims 1-8, characterized in that, It also includes a vacuum chamber, in which the worktable (1), the three-axis moving module, the clamping module (6) and the bonding module are all placed.

10. The bonding device between the outer casing and the base of the hemispherical resonant gyroscope according to claim 9, characterized in that, The X-axis sliding mechanism (3), Y-axis sliding mechanism (2), first Z-axis sliding mechanism and second Z-axis sliding mechanism all include a drive motor and a lead screw and nut pair structure that is connected to the drive motor for transmission.

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