An assembled infrared sensor

By designing a modular infrared sensor, the problems of difficult assembly and poor heat dissipation caused by the sealed structure are solved, achieving convenient installation and efficient heat dissipation.

CN224435436UActive Publication Date: 2026-06-30SHENZHEN LANGYIEN TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN LANGYIEN TECHNOLOGY CO LTD
Filing Date
2025-09-17
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

The sealed structure of existing infrared sensors makes assembly difficult, disassembly and assembly inconvenient, and heat dissipation difficult, which affects subsequent inspection and maintenance.

Method used

Adopting a modular design, the lower and upper boxes can be flipped open and closed via a connecting mechanism, supporting the circuit board to be suspended in the air, and heat dissipation holes are provided on both sides to achieve convenient installation and maintenance as well as effective heat dissipation.

Benefits of technology

It shortens the installation and maintenance time of circuit boards and electronic components, improves the heat dissipation efficiency of infrared sensors, and simplifies the maintenance process.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224435436U_ABST
Patent Text Reader

Abstract

This utility model relates to the field of infrared sensor technology and discloses an assembled infrared sensor, including a lower housing. A light-transmitting lens is installed on the inner wall of one end of the lower housing. Connecting edges are fixedly installed on both sides of the lower housing. A connecting mechanism is assembled on the lower housing to facilitate the assembly installation of the infrared sensor. The infrared sensor is assembled inside the lower housing and the upper housing. The lower housing and the upper housing can be flipped open and closed. Compared with the traditional fixed housing, the internal space of the lower housing can be exposed without completely removing the top cover, which greatly shortens the installation and maintenance time of circuit boards and electronic components. At the same time, the suspended assembly of the circuit board and the heat dissipation channels on both sides of the lower housing and the upper housing facilitate the heat dissipation inside the infrared sensor.
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Description

Technical Field

[0001] This utility model relates to the field of infrared sensor technology, specifically to an assembled infrared sensor. Background Technology

[0002] An infrared sensor is an electronic device that can detect and receive infrared rays emitted or reflected by an object and convert the infrared signal into a measurable electrical or mechanical signal. It utilizes the physical property that all objects with a temperature above absolute zero radiate infrared rays to achieve functions such as target detection, distance measurement, and temperature detection. It is widely used in many fields such as consumer electronics, industrial control, and security monitoring.

[0003] Existing infrared sensors, due to their high technological content, often employ a sealed structure to protect the main components during assembly. However, this method makes assembly difficult, disassembly and assembly inconvenient, and hinders later opening and maintenance. Furthermore, the sealed structure is not conducive to heat dissipation of the infrared sensor.

[0004] Therefore, it is necessary to propose an assembled infrared sensor. Utility Model Content

[0005] The purpose of this invention is to provide an assembled infrared sensor to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An assembled infrared sensor includes a lower housing, a light-transmitting lens is installed on the inner wall of one end of the lower housing, connecting edges are fixedly installed on both sides of the lower housing, and a connecting mechanism is assembled on the lower housing to facilitate the assembly and installation of the infrared sensor.

[0008] The connecting mechanism includes an upper box body, a connecting shaft, and a support assembly. The connecting shaft is fixedly installed at one end of the upper box body, and both ends of the connecting shaft are rotatably connected to the lower box body. The upper box body is snapped onto the top of the lower box body, and the support assembly is disposed inside the lower box body.

[0009] Preferably, the top of the lower box body is provided with a card slot, and one end of the upper box body is fixedly provided with a card strip that matches the card slot, and the card strip is inserted into the card slot.

[0010] Preferably, a first connecting block is fixedly provided at one end of the upper box body, a first screw is threadedly installed on the first connecting block, the first screw is threadedly connected to the lower box body, and a wire hole is provided at the other end of the upper box body.

[0011] Preferably, the support assembly includes a support block, a support frame, and a limiting module. The support block is fixedly installed inside the lower housing, the support frame is fixedly installed on the top of the support block, and the limiting module is located on one side of the top of the support frame.

[0012] Preferably, a first retaining edge is fixedly installed on the other side of the top of the support frame, and a first rubber layer is provided on the inner side of the first retaining edge.

[0013] Preferably, the limiting module includes a support shaft, a second screw, a second connecting block, a second retaining edge, and a second rubber layer. The second retaining edge is disposed on one side of the top of the support frame, and a second rubber layer is disposed on the inner side of the second retaining edge. The second connecting block is fixedly installed on the top of the second retaining edge. The support shaft is fixedly installed on the top of the support frame. The other end of the second connecting block is connected to the support shaft by a second screw. The circuit board is inserted between the first retaining edge and the second retaining edge.

[0014] Preferably, the lower box body has first heat dissipation holes on both sides, and the upper box body has second heat dissipation holes on both sides.

[0015] Compared with the prior art, the present invention, by adopting the above technical solution, has the following technical effects:

[0016] The infrared sensor is mounted inside the lower and upper housings. The lower and upper housings can be flipped open and closed. Compared with the traditional fixed housing, the internal space of the lower housing can be exposed without completely removing the top cover, which greatly shortens the installation and maintenance time of circuit boards and electronic components. At the same time, the suspended assembly of the circuit board and the heat dissipation channels on both sides of the lower and upper housings facilitate the heat dissipation inside the infrared sensor. Attached Figure Description

[0017] Figure 1 A schematic diagram of an assembled infrared sensor Figure 1 ;

[0018] Figure 2 A schematic diagram of an assembled infrared sensor Figure 2 ;

[0019] Figure 3 A schematic diagram of an assembled infrared sensor Figure 3 ;

[0020] Figure 4 This is a schematic diagram of a support component in an assembled infrared sensor.

[0021] Figure 5 This is a schematic diagram of a limit module in an assembled infrared sensor;

[0022] Figure 6 This is a schematic diagram of the upper housing in an assembled infrared sensor.

[0023] Explanation of reference numerals in the attached drawings: 1. Lower housing; 11. Transparent lens; 12. Connecting edge; 2. Connecting mechanism; 21. Upper housing; 211. Wire hole; 22. Connecting shaft; 23. Locking strip; 231. Locking groove; 24. First connecting block; 241. First screw; 25. Support assembly; 251. Support block; 252. Support frame; 253. First locking edge; 254. First rubber layer; 26. Limiting module; 261. Support shaft; 262. Second screw; 263. Second connecting block; 264. Second locking edge; 265. Second rubber layer; 27. Circuit board; 28. First heat dissipation hole; 29. ​​Second heat dissipation hole. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0026] like Figures 1-6 ;

[0027] An assembled infrared sensor includes a lower housing 1. The lower housing 1 is used to support and install the circuit board and electronic components of the infrared sensor. A light-transmitting lens 11 is installed on the inner wall of one end of the lower housing 1. The light-transmitting lens 11 has a protective effect and facilitates the infrared sensor to detect outwards. Connecting edges 12 are fixedly installed on both sides of the lower housing 1. Bolts are used to fix the position of the lower housing 1 on the connecting edges 12. A connecting mechanism 2 is assembled on the lower housing 1 to facilitate the assembly and installation of the infrared sensor.

[0028] The connecting mechanism 2 includes an upper housing 21, a connecting shaft 22, and a support assembly 25. The connecting shaft 22 is fixedly installed at one end of the upper housing 21, and both ends of the connecting shaft 22 are rotatably connected to the lower housing 1. The upper housing 21 is snapped onto the top of the lower housing 1. The upper housing 21 is rotatably assembled onto the lower housing 1 via the connecting shaft 22, making it easy for the upper housing 21 to be flipped and snapped onto the top of the lower housing 1. The lower housing 1 and the upper housing 21 not only protect the infrared sensor installed inside, but also make it easy to open the upper housing 21. The support assembly 25 is located inside the lower housing 1 and is used to support the circuit board and electronic components for suspended installation. The top of the lower housing 1 has an opening. The upper box 21 has a slot 231 for engaging with a card strip 23. One end of the upper box 21 is fixedly provided with a card strip 23 that matches the slot 231. When the upper box 21 is flipped and engaged with the top of the lower box 1, the card strip 23 is engaged in the slot 231. One end of the upper box 21 is also fixedly provided with a first connecting block 24 for supporting the installation of a first screw 241. The first connecting block 24 is threaded with a first screw 241. When the upper box 21 is flipped and engaged with the top of the lower box 1, the first screw 241 is threadedly connected to the lower box 1, thereby providing a stable connection between the upper box 21 and the lower box 1. The other end of the upper box 21 is provided with a wire hole 211 for wiring to pass through.

[0029] Furthermore, the support assembly 25 includes a support block 251, a support frame 252, and a limiting module 26. The support block 251 is fixedly installed inside the lower housing 1 and is used to support the suspended installation of the support frame 252. The support frame 252 is fixedly installed on top of the support block 251. The support frame 252 has a hollow center to facilitate heat dissipation of the circuit board 27. The top of the support frame 252 is used to support and assemble the circuit board 27 of the infrared sensor. The limiting module 26 is located on one side of the top of the support frame 252 and is used to limit the circuit board 27. The circuit board 27 is limited on one side, and a first locking edge 253 is fixedly installed on the other side of the top of the support frame 252. The first locking edge 253 is used to lock and limit one side of the circuit board 27. A first rubber layer 254 is provided on the inner side of the first locking edge 253 to protect the edge of the circuit board 27. The limiting module 26 includes a support shaft 261, a second screw 262, a second connecting block 263, a second locking edge 264, and a second rubber layer 265. The second locking edge 264 is provided on one side of the top of the support frame 252 and is used to lock the other side of the circuit board 27. A second rubber layer 265 is provided on the inner side of the second locking edge 264 to protect the edge of the circuit board 27. A second connecting block 263 is fixedly installed on the top of the second locking edge 264, providing support for the second locking edge 264. A support shaft 261 is fixedly installed on the top of the support frame 252 and is used to connect to the second screw 262. The other end of the second connecting block 263 is connected to the support shaft 261 by the second screw 262, which passes through the second connecting block 263 and the support shaft. 261 connection, the circuit board 27 is inserted between the first locking edge 253 and the second locking edge 264. By screwing the second screw 262, the second locking edge 264 is pressed downward, and the second locking edge 264 locks one side of the circuit board 27 for limiting. The second screws 262 at both ends of the second locking edge 264 do not need to be screwed at the same time. The lower box 1 has first heat dissipation holes 28 on both sides, and the upper box 21 has second heat dissipation holes 29 on both sides. The first heat dissipation holes 28 and the second heat dissipation holes 29 facilitate heat dissipation inside the lower box 1 and the upper box 21, respectively.

[0030] The working principle of this utility model is as follows: the assembly and fixation of the overall structure is achieved through the assembly design of the lower box 1 and the connecting mechanism 2. The lower box 1 serves as the basic load-bearing structure, and the circuit board and electronic components of the infrared sensor are installed inside. The light-transmitting lens 11 installed on the inner wall of one end provides protection while ensuring that the infrared signal can pass through normally to achieve the external detection function. The connecting edges 12 on both sides of the lower box 1 can be fixed with bolts to ensure the stability of the overall installation position of the sensor. The upper box 21 is rotatably connected to the lower box 1 through a connecting shaft 22 fixed at one end, so that the upper box 21 can be rotated around the connecting shaft 22, which facilitates the opening of the lower box 1 for the installation or maintenance of internal components. When the box needs to be closed, the upper box 21 is flipped over so that it is snapped onto the top of the lower box 1. At this time, the locking strip 23 at one end of the upper box 21 matches and snaps into the locking groove 231 at the top of the lower box 1 to achieve initial positioning. The first screw 241 is screwed into the lower box 1 to further strengthen the connection between the upper box 21 and the lower box 1 and ensure the stability of the overall structure. The support frame 252 realizes the suspended support installation of the circuit board 27, avoiding direct contact between the circuit board 27 and the lower box 1 and reducing heat conduction. One side of the circuit board 27 is first snapped into the support frame 252. The first rubber layer 254 on the inside can protect the edge of the circuit board 27 from damage. Then the second locking edge 264 is snapped into the other side of the circuit board 27. By screwing the second screw 262, the second locking edge 264 can be squeezed downward to make it tightly snap into the edge of the circuit board 27. The second rubber layer 265 on the inside also plays a protective role.

[0031] In summary, the infrared sensor is assembled inside the lower box 1 and the upper box 21. The lower box 1 and the upper box 21 can be flipped open and closed. Compared with the traditional fixed box, the internal space of the lower box 1 can be exposed without completely removing the top cover, which greatly shortens the installation and maintenance time of the circuit board and electronic components. At the same time, the suspended assembly of the circuit board and the heat dissipation channels on both sides of the lower box 1 and the upper box 21 are conducive to heat dissipation inside the infrared sensor.

[0032] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A prefabricated infrared sensor, comprising a lower housing (1), wherein a light-transmitting lens (11) is installed on the inner wall of one end of the lower housing (1), and connecting edges (12) are fixedly installed on both sides of the lower housing (1), characterized in that: The lower box (1) is equipped with a connecting mechanism (2), which facilitates the assembly and installation of the infrared sensor; The connecting mechanism (2) includes an upper box body (21), a connecting shaft (22) and a support component (25). The connecting shaft (22) is fixedly installed at one end of the upper box body (21), and both ends of the connecting shaft (22) are rotatably connected to the lower box body (1). The upper box body (21) is snapped onto the top of the lower box body (1), and the support component (25) is located inside the lower box body (1).

2. The assembled infrared sensor according to claim 1, characterized in that: The top of the lower box (1) is provided with a card slot (231), and one end of the upper box (21) is fixedly provided with a card strip (23) that matches the card slot (231), and the card strip (23) is inserted into the card slot (231).

3. The assembled infrared sensor according to claim 1, characterized in that: One end of the upper box (21) is also fixedly provided with a first connecting block (24), and a first screw (241) is threadedly installed on the first connecting block (24). The first screw (241) is threadedly connected to the lower box (1). The other end of the upper box (21) is provided with a wire hole (211).

4. The assembled infrared sensor according to claim 1, characterized in that: The support assembly (25) includes a support block (251), a support frame (252) and a limiting module (26). The support block (251) is fixedly installed inside the lower box (1), the support frame (252) is fixedly installed on the top of the support block (251), and the limiting module (26) is located on one side of the top of the support frame (252).

5. The assembled infrared sensor according to claim 4, characterized in that: The first locking edge (253) is fixedly installed on the other side of the top of the support frame (252), and a first rubber layer (254) is provided on the inner side of the first locking edge (253).

6. The assembled infrared sensor according to claim 5, characterized in that: The limiting module (26) includes a support shaft (261), a second screw (262), a second connecting block (263), a second retaining edge (264), and a second rubber layer (265). The second retaining edge (264) is disposed on one side of the top of the support frame (252), and the second rubber layer (265) is disposed on the inner side of the second retaining edge (264). The second connecting block (263) is fixedly installed on the top of the second retaining edge (264). The support shaft (261) is fixedly installed on the top of the support frame (252). The other end of the second connecting block (263) and the support shaft (261) are connected by the second screw (262). The circuit board (27) is inserted between the first retaining edge (253) and the second retaining edge (264).

7. The assembled infrared sensor according to claim 1, characterized in that: The lower box (1) has a first heat dissipation hole (28) on both sides, and the upper box (21) has a second heat dissipation hole (29) on both sides.