A pressure sensor packaging structure
By designing a pressure sensor packaging structure that includes a base, cover, locking block, and limiting components, the problem of difficult disassembly of traditional packaging structures is solved, enabling rapid inspection and replacement, improving maintenance efficiency, and ensuring the stability of the packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANJING LERUN INSTR CO LTD
- Filing Date
- 2025-04-28
- Publication Date
- 2026-06-30
AI Technical Summary
The integrated packaging structure of traditional pressure sensors is difficult to disassemble, making it difficult to repair and replace components, increasing resource waste and maintenance costs.
An encapsulation structure including a base, a cover, a locking block, a locking slot, and a limiting component is designed. Through the cooperation of the locking block and the locking slot and the design of the limiting component, the cover can be quickly installed and removed, ensuring the stability and reliability of the encapsulation.
It enables rapid inspection and replacement of sensing components, improves maintenance efficiency, ensures the stability and reliability of the package, and avoids loosening caused by vibration or impact.
Smart Images

Figure CN224435608U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of pressure sensor packaging, specifically a pressure sensor packaging structure. Background Technology
[0002] In the current field of sensor technology, pressure sensors, as an important detection element, are widely used in many fields such as industrial automation, automotive electronics, medical equipment, and aerospace. In order to ensure the protection requirements of pressure sensors in different application scenarios, their packaging structure is extremely important.
[0003] Traditional pressure sensors often employ an integrated package structure. This structure effectively protects the internal components by integrating key components such as the internal sensing chip and circuit board into a sealed housing. The integrated package structure has advantages such as compact structure, good sealing, and strong anti-interference ability, thus exhibiting good performance in many applications. However, in actual use, especially when the internal sensing chip or circuit board is damaged, the integrated package structure is sealed and cannot be disassembled, making it difficult to repair or replace the internal components. The entire package needs to be replaced, which not only wastes resources but also increases the difficulty of maintenance and operating costs.
[0004] In summary, this utility model provides a pressure sensor packaging structure to solve the above problems. Utility Model Content
[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:
[0006] A pressure sensor packaging structure, including
[0007] The encapsulation unit includes a base, a cover movably connected to and used to close the inner cavity of the base, a sensing component disposed in the inner cavity of the base, a locking block fixedly connected to the lower ends of both sides of the cover, a slot provided on both sides of the top of the base for providing placement space for the locking block, and a limiting component disposed on one side of the slot.
[0008] The limiting assembly includes a connecting groove, a spring fixedly connected to one side of the inner cavity of the connecting groove, a limiting block fixedly connected to one end of the spring, and a slide fixedly connected to one side of the limiting block.
[0009] Furthermore, in this invention, the inner cavity of the connecting groove is connected to the inner cavity of the card slot, and the card block extends into the inner cavity of the card slot and is movably connected to the inner cavity of the card slot.
[0010] Furthermore, in this utility model, the sensing component includes a placement base, a circuit board placed in the inner cavity of the placement base, and a sensing chip disposed on the top of the circuit board, and the bottom of the placement base is fixedly connected to the bottom of the inner cavity of the base.
[0011] Furthermore, in this utility model, a rubber ring is fixedly connected to the upper end of the surface of the placement seat, and the surface of the rubber ring is in contact with the inner wall of the cover.
[0012] Furthermore, in this utility model, a through groove is provided on one side of the inner cavity of the connecting groove, the slide passes through the inner cavity of the through groove and is movably connected to the inner cavity of the through groove, the surface of the slide is covered with a shield, and the shield is movably connected to the base through a damping pivot.
[0013] Beneficial effects: This utility model has the following beneficial effects:
[0014] This invention, through the ingenious combination of the locking block and the locking slot, as well as the design of the limiting component, enables the cover to be easily and quickly installed and disassembled, greatly improving the efficiency of the inspection and replacement of the sensing component. Furthermore, the spring and limiting block in the limiting component ensure that the cover is tightly fixed to the base when closed, effectively preventing loosening caused by vibration or impact, and ensuring the stability and reliability after encapsulation. The slide design makes the operation of the limiting component more intuitive and convenient, allowing users to easily complete the disassembly and assembly operations without complicated tools. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of this utility model;
[0016] Figure 2 This is a schematic diagram of the structure of this utility model in an exploded state;
[0017] Figure 3 This is a partial cross-sectional view of the base of this utility model, showing its structure separated from the shield;
[0018] Figure 4 This is a utility model Figure 3 A magnified schematic diagram of the structure at point A in the middle.
[0019] In the picture:
[0020] 100. Packaging unit; 110. Base; 111. Shield; 120. Cover; 130. Locking block; 140. Locking slot; 150. Limiting component; 151. Connecting groove; 152. Spring; 153. Limiting block; 154. Carrier; 155. Through groove; 200. Sensing component; 210. Placement seat; 211. Rubber ring; 220. Circuit board; 230. Sensing chip. Detailed Implementation
[0021] To better understand the technical content of this utility model, specific embodiments are described below in conjunction with the accompanying drawings. Various aspects of this utility model are described in this disclosure with reference to the accompanying drawings, which illustrate numerous illustrative embodiments. The embodiments of this disclosure are not necessarily defined to include all aspects of this utility model. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed in this utility model are not limited to any particular implementation. Furthermore, some aspects of this utility model can be used alone or in any suitable combination with other aspects disclosed in this utility model.
[0022] Example 1
[0023] like Figure 1-4 As shown, this is the first embodiment of the present invention, which provides a pressure sensor packaging structure, including...
[0024] The encapsulation unit 100 includes a base 110, a cover 120 movably connected to the inner cavity of the base 110 and used to close it, a sensing component 200 disposed in the inner cavity of the base 110, a locking block 130 fixedly connected to the lower ends of both sides of the cover 120, a slot 140 opened on both sides of the top of the base 110 and used to provide placement space for the locking block 130, and a limiting component 150 disposed on one side of the slot 140.
[0025] The limiting assembly 150 includes a connecting groove 151, a spring 152 fixedly connected to one side of the inner cavity of the connecting groove 151, a limiting block 153 fixedly connected to one end of the spring 152, and a slide 154 fixedly connected to one side of the limiting block 153.
[0026] like Figure 1-4 As shown, by aligning the cover 120 with the base 110, the locking block 130 is aligned with the slot 140. By gently pressing down the cover 120, the locking block 130 gradually slides into the slot 140 and presses against the limiting block 153. At the same time, the return force of the spring 152 can push the limiting block 153 to lock the locking block 130, thus completing the sealing. Conversely, by pushing the slide 154, the limiting block 153 compresses the spring 152, which can release the limiting force on the locking block 130. By gently lifting the cover 120, the locking block 130 slides out of the slot 140, thus completing the disassembly and assembly. The whole process is quick and convenient, and users can easily complete the disassembly and assembly without complicated tools.
[0027] Example 2
[0028] Reference Figure 1 and 2 This is the second embodiment of the present invention, which is based on the previous embodiment.
[0029] In this embodiment, the inner cavity of the connecting groove 151 is connected to the inner cavity of the slot 140, and the locking block 130 extends into the inner cavity of the slot 140 and is movably connected to the inner cavity of the slot 140.
[0030] The sensing assembly 200 includes a placement base 210, a circuit board 220 placed in the inner cavity of the placement base 210, and a sensing chip 230 disposed on the top of the circuit board 220. The bottom of the placement base 210 is fixedly connected to the bottom of the inner cavity of the base 110.
[0031] A rubber ring 211 is fixedly connected to the upper end of the surface of the placement base 210, and the surface of the rubber ring 211 is in contact with the inner wall of the cover 120.
[0032] like Figure 1 and 2 As shown, the connection groove 151 communicates with the card slot 140. The main purpose of this design is to provide a channel for the limiting component 150 to interact with the card block 130. The circuit board 220 and the sensing chip 230 are located in the cavity of the placement seat 210, thereby ensuring the stability and reliability of the sensing chip 230 and the circuit board 220. The setting of the rubber ring 211 not only enhances the sealing between the placement seat 210 and the cover 120, but also effectively absorbs external vibrations, further protecting the sensing component 200 from damage.
[0033] Example 3
[0034] Reference Figure 3 and 4 This is the third embodiment of the present invention, which is based on the first two embodiments.
[0035] In this embodiment, a through groove 155 is provided on one side of the inner cavity of the connecting groove 151. The slide 154 passes through the inner cavity of the through groove 155 and is movably connected to the inner cavity of the through groove 155. The surface of the slide 154 is covered with a shield 111, and the shield 111 is movably connected to the base 110 through a damping pivot.
[0036] like Figure 3 and 4 As shown, the through slot 155 provides space for the slide 154 to move and limits the movement trajectory of the limit block 153. The shield 111 is movably connected to the base 110 through a damping pivot. The main purpose of this design is to facilitate the user's operation of the slide 154, thereby controlling the limit block 153 and enabling the disassembly and assembly of the cover 120. At the same time, the design of the shield 111 protects the slide 154 from interference from the external environment. The use of the damping pivot makes the opening and closing of the shield 111 more stable and smooth.
[0037] In use, first, place the circuit board 220 and the sensor chip 230 in the inner cavity of the placement base 210, connect the circuit board 220 to the external circuit, turn on the power, and test whether the output signal of the sensor chip 230 is normal. If it is normal, the next packaging operation can be carried out. First, align the cover 120 with the base 110, align the locking block 130 with the slot 140, and gently press the cover 120. The locking block 130 gradually slides into the slot 140, pressing the limiting block 153 and the spring 152 until the locking block 130 moves to the bottom of the inner cavity of the slot 140, so that the spring 152 and the limiting block 153 lose the squeezing force. At this time, the return force of the spring 152 can push the limiting block 153 to lock. The locking block 130 positions the base 110 and the cover 120, thus completing the encapsulation operation. When the sensor component 200 needs to be inspected or replaced, the external circuit connection is first disconnected. Then, by opening the shield 111, the personnel can push the slide 154. The slide 154 can drive the limit block 153 and the spring 152 to move to one side, thereby releasing the limit on the locking block 130. Then, the cover 120 is gently lifted, so that the locking block 130 slides out of the slot 140, separating the cover 120 from the base 110. This completes the disassembly and assembly, facilitating the inspection and replacement of the internal sensor component 200. The whole process is fast and convenient, and users can easily complete the disassembly and assembly without complicated tools, greatly improving the efficiency of inspection or replacement.
[0038] All standard parts used in this application can be purchased from the market, and can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. The control method is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art and is common knowledge in the field. Since this application is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail in this application.
[0039] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this invention shall be determined by the claims.
Claims
1. A pressure sensor packaging structure, characterized in that: include The encapsulation unit (100) includes a base (110), a cover (120) movably connected to the inner cavity of the base (110) and used to close it, a sensing component (200) disposed in the inner cavity of the base (110), a locking block (130) fixedly connected to the lower ends of both sides of the cover (120), a slot (140) opened on both sides of the top of the base (110) and used to provide placement space for the locking block (130), and a limiting component (150) disposed on one side of the slot (140); The limiting assembly (150) includes a connecting groove (151), a spring (152) fixedly connected to one side of the inner cavity of the connecting groove (151), a limiting block (153) fixedly connected to one end of the spring (152), and a slide (154) fixedly connected to one side of the limiting block (153).
2. The pressure sensor packaging structure as described in claim 1, characterized in that: The inner cavity of the connecting groove (151) is connected to the inner cavity of the card slot (140), and the card block (130) extends into the inner cavity of the card slot (140) and is movably connected to the inner cavity of the card slot (140).
3. The pressure sensor packaging structure as described in claim 1, characterized in that: The sensing component (200) includes a placement base (210), a circuit board (220) placed in the cavity of the placement base (210), and a sensing chip (230) disposed on the top of the circuit board (220). The bottom of the placement base (210) is fixedly connected to the bottom of the cavity of the base (110).
4. The pressure sensor packaging structure as described in claim 3, characterized in that: A rubber ring (211) is fixedly connected to the upper end of the surface of the placement seat (210), and the surface of the rubber ring (211) is in contact with the inner wall of the cover (120).
5. The pressure sensor packaging structure as described in claim 1, characterized in that: A through groove (155) is provided on one side of the inner cavity of the connecting groove (151). The slide (154) passes through the inner cavity of the through groove (155) and is movably connected to the inner cavity of the through groove (155). The surface of the slide (154) is covered with a shield (111), and the shield (111) is movably connected to the base (110) through a damping pivot.