A dual-chip automatic alignment test device

Abstract

This utility model discloses a dual-chip automatic alignment testing device, which includes a first motion support mechanism, a second motion support mechanism, a third motion support mechanism, a vision positioning mechanism, and a probe mechanism. The first motion support mechanism is used to drive the second and third motion support mechanisms to move in the X and Y directions. The vision positioning mechanism includes a first vision mechanism and a second vision mechanism. The first and second vision mechanisms are used to determine the relative positions of the probe mechanism, the chip electrodes on the first chip and the second chip. The second and third motion support mechanisms are used to adjust the positions of the first chip and the second chip according to the relative positions, so that the chip electrodes on the first chip and the second chip are aligned with the probes on the probe mechanism, and testing is performed after alignment. This utility model has high precision, which can ensure the accuracy and stability of the test, and can also test two chips simultaneously, improving the testing efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip testing device technology, and in particular to a dual-chip automatic alignment testing device. Background Technology

[0002] A probe station is a precision instrument used in semiconductor manufacturing and testing. It is primarily used to perform electrical performance testing and analysis on chips on wafers. During testing, the probe station precisely contacts tiny probes with the chip electrodes on the wafer, applying electrical signals to the chip and simultaneously acquiring the chip's output signals. This allows the acquisition of various electrical parameters of the chip, such as current, voltage, and resistance. These parameters can be used to determine whether the chip meets design requirements and to filter out defective chips.

[0003] Existing probe stations include a stage and a probe holder. The stage is used to place the chip under test and features high-precision movement capabilities, enabling precise movement and positioning along the X, Y, Z, and R axes to adjust the chip's position and angle, ensuring that the probes on the probe holder accurately contact the chip electrodes. The probe holder is used to mount the probes, which correspond to the chip electrodes on the chip, allowing them to contact and test the electrodes during testing.

[0004] However, existing probe stations can only perform performance tests on one chip at a time during a single operation, and cannot test two chips simultaneously. The time cost of testing a single chip with a single probe station is high, which affects the chip testing efficiency.

[0005] In the process of realizing this utility model, the inventors discovered that the prior art has at least the following problems:

[0006] Existing probe stations can only perform testing on one chip at a time, resulting in low chip testing efficiency. Utility Model Content

[0007] The purpose of this invention is to provide a dual-chip automatic alignment testing device to solve the technical problem in the prior art where the probe station can only perform testing on one chip at a time, resulting in low chip testing efficiency. The various technical effects of the preferred solutions among the many technical solutions provided by this invention are detailed below.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] This utility model provides a dual-chip automatic alignment testing device, comprising: a first motion bearing mechanism, a second motion bearing mechanism, a third motion bearing mechanism, a visual positioning mechanism, and a probe mechanism;

[0010] The first motion support mechanism is used to support the second motion support mechanism and the third motion support mechanism, and to drive the second motion support mechanism and the third motion support mechanism to move; the second motion support mechanism and the third motion support mechanism are respectively used to support the first chip and the second chip, and to drive the first chip and the second chip to move.

[0011] The visual positioning mechanism includes a first visual mechanism and a second visual mechanism; the first visual mechanism is fixed on the first motion support mechanism, and the second visual mechanism and the probe mechanism are both mounted on the top of the first motion support mechanism via a frame; the first visual mechanism and the second visual mechanism cooperate with each other to determine the relative positions of the probe mechanism, the first chip, and the chip electrodes on the second chip;

[0012] The second motion support mechanism and the third motion support mechanism are used to adjust the positions of the first chip and the second chip according to the relative positions, so that the chip electrodes on the first chip and the second chip are aligned with the probes on the probe mechanism, and testing is performed after alignment.

[0013] Optionally, the first motion bearing mechanism includes an X-axis motion part, a Y-axis motion part, and a bearing platform;

[0014] One side of the X-axis moving part is connected to the Y-axis moving part via a connecting seat, and the other side is connected to the support platform; the second and third moving support mechanisms are both located above the support platform, and the first vision mechanism is located at the side end of the support platform; the second, third, and first vision mechanisms all move under the action of the first moving support mechanism.

[0015] Optionally, the second motion bearing mechanism includes a first vacuum displacement stage and a first placement stage;

[0016] One end of the first vacuum displacement stage is fixedly connected to the first motion bearing mechanism, and the other end is fixedly connected to the first placement stage; the first vacuum displacement stage can drive the first placement stage to move in the X-axis, Y-axis and TZ-axis directions, so as to drive the first chip to move.

[0017] Optionally, the third motion bearing mechanism includes a second vacuum displacement stage and a second placement stage;

[0018] One end of the second vacuum displacement stage is fixedly connected to the first motion bearing mechanism, and the other end is fixedly connected to the second placement stage; the second vacuum displacement stage can drive the second placement stage to move in the TZ axis direction, so as to drive the second chip to move.

[0019] Optionally, the first vision mechanism includes a first imaging structure and a calibration structure; both the first imaging structure and the calibration structure are fixedly mounted on the first motion support mechanism, and the calibration structure is located within the imaging range of the first imaging structure; the first imaging structure is used to capture images of the calibration structure and the probe on the probe mechanism.

[0020] Optionally, the second vision mechanism includes a second imaging structure, which is aligned with the first motion support mechanism and is used to image the chip electrodes on the first chip and the second chip; and to image the calibration structure in the second vision mechanism when the first vision mechanism moves below the second imaging structure.

[0021] Optionally, the probe mechanism includes a probe mounting stage, a first probe group, and a second probe group. The first probe group and the second probe group are both fixedly mounted on the probe mounting stage. The first probe group and the second probe group respectively contact the chip electrodes on the first chip and the chip electrodes on the second chip. The number of probes and the spacing between two adjacent probes on the first probe group and the second probe group are matched with the number of chip electrodes on the first chip and the second chip and the spacing between two chip electrodes.

[0022] Optionally, the probe mechanism further includes a motion structure, the probe mounting platform is connected to the frame through the motion structure, and the first probe group and the second probe group disposed on the probe mounting platform are both displaced on the frame through the motion structure.

[0023] Optionally, the motion structure includes a Z-axis motion structure, which is used to drive the first probe group and the second probe group on the probe mounting stage to move in the Z-axis direction.

[0024] Optionally, the testing device further includes a support platform located at the bottom of the first motion bearing mechanism, which is used to directly or indirectly support the first motion bearing mechanism, the second motion bearing mechanism, the third motion bearing mechanism, the visual positioning mechanism, and the probe mechanism.

[0025] Implementing one of the above-described technical solutions of this utility model has the following advantages or beneficial effects:

[0026] The dual-chip automatic alignment testing device described in this invention uses a visual positioning mechanism to image and position the probes in the probe mechanism, the chip electrodes on the first chip, and the chip electrodes on the third chip. The second and third motion support mechanisms adjust the positions of the first and second chips, ultimately connecting the probes in the probe mechanism to the chip electrodes on the first and third chips for testing. This process is automated, reducing errors from manual operation and lowering time costs. Furthermore, it offers high precision, ensuring testing accuracy and stability, and can test two chips simultaneously, improving testing efficiency. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0028] Figure 1 This is a first-view schematic diagram of the overall structure of an embodiment of the present utility model;

[0029] Figure 2 This is a second-view schematic diagram of the overall structure of an embodiment of the present utility model;

[0030] Figure 3 This is a schematic diagram showing the connection between the first motion bearing mechanism, the second motion bearing mechanism, the third motion bearing mechanism and the first vision mechanism in an embodiment of this utility model;

[0031] Figure 4 This is a schematic diagram showing the connection between the probe mechanism, the second vision mechanism, and the frame in an embodiment of this utility model.

[0032] In the diagram: 1. First motion support mechanism; 11. X-axis motion unit; 12. Connecting seat; 13. Y-axis motion unit; 14. Support platform; 2. Second motion support mechanism; 21. First vacuum displacement stage; 22. First placement stage; 3. Third motion support mechanism; 31. Second vacuum displacement stage; 32. Second placement stage; 4. Visual positioning mechanism; 41. First vision mechanism; 411. First imaging structure; 412. Calibration structure; 42. Second vision mechanism; 5. Probe mechanism; 51. Probe mounting platform; 52. First probe group; 53. Second probe group; 54. Z-axis motion structure; 6. Frame; 7. Support platform; 8. First chip; 9. Second chip. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, various exemplary embodiments described below will be referenced to the accompanying drawings, which form part of the exemplary embodiments, illustrating various exemplary embodiments that may be adopted to implement this utility model. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. It should be understood that they are merely examples of processes, methods, and apparatuses consistent with some aspects of this utility model disclosed as detailed in the appended claims, and other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and spirit of this utility model.

[0034] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the referred element must have a specific orientation, or be constructed and operated in a specific orientation. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. The term "multiple" means two or more. The terms "connected" and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, communication connections, direct connections, indirect connections through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] To illustrate the technical solution described in this utility model, specific embodiments are described below, showing only the parts related to the embodiments of this utility model.

[0036] Example:

[0037] like Figure 1-4As shown, this utility model provides a dual-chip automatic alignment testing device, including: a first motion support mechanism 1, a second motion support mechanism 2, a third motion support mechanism 3, a visual positioning mechanism 4, and a probe mechanism 5; the first motion support mechanism 1 is used to support the second motion support mechanism 2 and the third motion support mechanism 3, and to drive the second motion support mechanism 2 and the third motion support mechanism 3 to move in the X-axis and Y-axis directions; the second motion support mechanism 2 is used to support the first chip 8, and to drive the first chip 8 to move in the X-axis, Y-axis, and TZ-axis directions; the third motion support mechanism 3 is used to support the second chip 9, and to drive the second chip 9 to move in the TZ-axis direction. Displacement; the visual positioning mechanism 4 includes a first visual mechanism 41 and a second visual mechanism 42; the first visual mechanism 41 is fixed on the first motion support mechanism 1, and the second visual mechanism 42 and the probe mechanism 5 are both mounted on the top of the motion support mechanism via the frame 6; the first visual mechanism 41 and the second visual mechanism 42 cooperate with each other to determine the relative positions of the chip electrodes on the probe mechanism 5, the first chip 8 and the second chip 9; the second motion support mechanism 2 and the third motion support mechanism 3 are used to adjust the positions of the first chip 8 and the second chip 9 according to the relative positions, so that the chip electrodes on the first chip 8 and the second chip 9 are aligned with the probes on the probe mechanism 5, and testing is performed after alignment.

[0038] In this embodiment, the testing device includes a first motion support mechanism 1, a second motion support mechanism 2, a third motion support mechanism 3, a visual positioning mechanism 4, and a probe mechanism 5; the visual positioning mechanism 4 includes a first visual mechanism 41 and a second visual mechanism 42. The second motion support mechanism 2, the third motion support mechanism 3, and the first visual mechanism 41 are all located above the second motion support mechanism 2 and are supported by the first motion support mechanism 1. It should be noted that the first motion support mechanism 1 is equipped with corresponding moving parts, capable of driving the second motion support mechanism 2, the third motion support mechanism 3, and the first visual mechanism 41 to move in the X-axis and Y-axis directions.

[0039] The second motion support mechanism 2 is used to support the first chip 8. The second motion support mechanism 2 is equipped with corresponding moving parts, which can drive the first chip 8 to move in the X-axis, Y-axis and TZ-axis directions. The third motion support mechanism 3 is used to support the second chip 9. The second motion support mechanism 2 is also equipped with corresponding moving parts, which can drive the second chip 9 to move in the TZ-axis direction.

[0040] The first vision mechanism 41 and the second vision mechanism 42 in the visual positioning mechanism 4 are used to obtain the relative positions between the probes on the probe mechanism 5, the chip electrodes on the first chip 8, and the chip electrodes on the second chip 9. Specifically, the first vision mechanism 41 is used to capture the positions of the probe mechanism 5 and the calibration structure 412, while the second vision mechanism 42 is used to capture the positions of the chip electrodes on the first chip 8, the chip electrodes on the second chip 9, and the calibration structure 412. Based on these calculations, the relative positions of the probes on the probe mechanism 5 with respect to the probes on the probe mechanism 5, the chip electrodes on the first chip 8, and the chip electrodes on the second chip 9 can be obtained. After obtaining these relative positions, the positions of the first chip 8 and the second chip 9 can be adjusted under the action of the second motion support mechanism 2 and the third motion support mechanism 3 to ensure the subsequent connection between the probes in the probe mechanism 5 and the chip electrodes on the first chip 8 and the second chip 9.

[0041] The dual-chip automatic alignment testing device described in this embodiment uses a visual positioning mechanism 4 to image and position the probes in the probe mechanism 5, the chip electrodes on the first chip 8, and the chip electrodes on the third chip. The second motion support mechanism 2 and the third motion support mechanism 3 can adjust the positions of the first chip 8 and the second chip 9. Finally, the probes in the probe mechanism 5 can connect with the chip electrodes on the first chip 8 and the chip electrodes on the third chip, and testing can then be performed. This process is automated, reducing errors from manual operation and lowering time costs. Furthermore, it has high precision, ensuring the accuracy and stability of the test, and can test two chips simultaneously, improving testing efficiency.

[0042] Below, we will combine Figure 1 +4 provides a detailed description of the dual-chip automatic alignment test device described in this embodiment.

[0043] As some alternative implementation methods, such as Figure 1-2 As shown, the testing device includes a support platform 7, which is located at the bottom of the first motion bearing mechanism 1 and is used to directly or indirectly support the first motion bearing mechanism 1, the second motion bearing mechanism 2, the third motion bearing mechanism 3, the visual positioning mechanism 4, and the probe mechanism 5. Specifically, the main purpose of the support platform 7 is to support the first motion bearing mechanism 1, the second motion bearing mechanism 2, the third motion bearing mechanism 3, the visual positioning mechanism 4, and the probe mechanism 5 to ensure their stability and reliability.

[0044] As some alternative implementation methods, such as Figure 3As shown, the first motion support mechanism 1 includes an X-axis motion part 11, a Y-axis motion part 13, and a support platform 14; one side of the X-axis motion part 11 is connected to the Y-axis motion part 13 through a connecting seat 12, and the other side is connected to the support platform 14; the second motion support mechanism 2 and the third motion support mechanism 3 are both located above the support platform 14, and the first vision mechanism 41 is located at the side end of the support platform 14; the second motion support mechanism 2, the third motion support mechanism 3, and the first vision mechanism 41 all move under the action of the first motion support mechanism 1.

[0045] Specifically, the first motion support mechanism 1 is used to support the second motion support mechanism 2, the third motion support mechanism 3, and the first vision mechanism 41, and can drive the second motion support mechanism 2, the third motion support mechanism, and the first vision mechanism 41 to move in position. It should be noted that both the X-axis motion part 11 and the Y-axis motion part 13 include slide rails and sliders, which will not be specifically described in this embodiment.

[0046] The bottom of the Y-axis motion unit 13 is fixedly connected to the support platform 7; specifically, the slide rail of the Y-axis motion unit 13 can be fixedly connected to the support platform 7. One side of the X-axis motion unit 11 is connected to the Y-axis motion unit 13 via the connecting seat 12, and the other side is fixedly connected to the support platform 14. The second motion support mechanism 2, the third motion support mechanism 3, and the first vision mechanism 41 are all fixedly connected to the support platform 14. Specifically, the slide rail of the X-axis motion unit 11 can be connected to the connecting seat 12. When the Y-axis motion unit 13 moves in the Y-axis direction, the second motion support mechanism 2, the third motion support mechanism 3, and the first vision mechanism 41 will all move synchronously in the Y-axis direction; when the X-axis motion unit 11 moves in the X-axis direction, the second motion support mechanism 2, the third motion support mechanism 3, and the first vision mechanism 41 will all move synchronously in the X-axis direction.

[0047] In this embodiment, the first motion support mechanism 1 will move the second motion support mechanism 2, the third motion support mechanism 3, and the first vision mechanism 41 according to the actual situation to ensure subsequent operations. For example: the first chip 8 and the second chip 9 carried by the first motion support mechanism 1 and the second motion support mechanism 2 are moved below the second vision mechanism 42 for imaging; the first vision mechanism 41 is moved below the probe mechanism 5 to image the probes in the probe mechanism 5; the first chip 8 and the second chip 9 carried by the first motion support mechanism 1 and the second motion support mechanism 2 are moved below the probe mechanism 5 for subsequent contact with the probes in the probe mechanism 5 for testing.

[0048] As some alternative implementation methods, such as Figure 3As shown, the second motion support mechanism 2 includes a first vacuum displacement stage 21 and a first placement stage 22; one end of the first vacuum displacement stage 21 is fixedly connected to the first motion support mechanism 1, and the other end is fixedly connected to the first placement stage 22; the first vacuum displacement stage 21 can drive the first placement stage 22 to move in the X-axis, Y-axis and TZ-axis directions, so as to drive the first chip 8 to move.

[0049] Specifically, the second motion support mechanism 2 is used to support the first chip 8 and drive the first chip 8 to move in position, so as to make precise position adjustment of the first chip 8.

[0050] The second motion support mechanism 2 includes a first vacuum displacement stage 21 and a first placement stage 22. The first placement stage 22 is located above the first vacuum displacement stage 21 and is fixedly connected to the first vacuum displacement control stage. The first vacuum displacement stage 21 is a displacement device that can cooperate with the first placement stage 22 to vacuum-adsorb or electro-adsorb the chip, enabling precise positional movement and positioning. In this embodiment, the first vacuum displacement stage 21 is a displacement stage capable of moving in the X-axis, Y-axis, and TZ-axis directions. The first vacuum displacement stage 21 has corresponding structures that allow the first placement stage 22, fixedly mounted above the first vacuum displacement stage 21, to move in the X-axis, Y-axis, and TZ-axis directions, thereby moving the first chip 8. In this embodiment, the first vacuum displacement stage 21 ensures the stability and accuracy of the first chip 8 during the displacement process.

[0051] As some alternative implementation methods, such as Figure 3 As shown, the third motion support mechanism 3 includes a second vacuum displacement stage 31 and a second placement stage 32; one end of the second vacuum displacement stage 31 is fixedly connected to the first motion support mechanism 1, and the other end is fixedly connected to the second placement stage 32; the second vacuum displacement stage 31 can drive the second placement stage 32 to move in the TZ axis direction, so as to drive the second chip 9 to move.

[0052] Specifically, the third motion support mechanism 3 is used to support the second chip 9 and drive the second chip 9 to move in position, so as to make precise position adjustment of the second chip 9.

[0053] The third motion support mechanism 3 includes a second vacuum displacement stage 31 and a second placement stage 32. The second placement stage 32 is located above the second vacuum displacement stage 31 and is fixedly connected to the second vacuum displacement control stage. The second vacuum displacement stage 31 is a displacement device that can cooperate with the second placement stage 32 to vacuum-adsorb or electro-adsorb the chip, enabling precise position movement and positioning. In this embodiment, the second vacuum displacement stage 31 can be selected as a displacement stage capable of moving in the TZ axis direction, or a displacement stage capable of moving in the X-axis, Y-axis, and TZ axis directions. If a displacement stage capable of moving in the TZ axis direction is selected, the second placement stage 32, fixedly mounted above the second vacuum displacement stage 31, can move in the TZ axis direction, thereby driving the second chip 9 to move in the TZ axis direction. If a displacement stage capable of moving in the X-axis, Y-axis, and TZ-axis directions is selected, the second placement stage 32, fixedly mounted above the second vacuum displacement stage 31, can move in the X-axis, Y-axis, and TZ-axis directions, thereby causing the second chip 9 to move in the X-axis, Y-axis, and TZ-axis directions. In this embodiment, to save manufacturing costs and space, a displacement stage capable of moving in the TZ-axis direction is preferred.

[0054] In this embodiment, the second vacuum displacement stage 31 is provided to ensure the stability and accuracy of the second chip 9 during the displacement process.

[0055] It should be noted that the first placement stage 22 and the second placement stage 32 can also adjust the shape of their placement stages according to the shape of the first chip 8 and the second chip 9 to ensure better support of the first chip 8 and the second chip 9, and to ensure that the chip electrodes of the first chip 8 and the chip electrodes of the second chip 9 are accurately captured by the second vision mechanism 42. In this embodiment, the first chip 8 and the second chip 9 are staggered in the Z-axis direction under the action of the first placement stage 22 and the second placement stage 32.

[0056] More specifically, in this embodiment, the second motion support mechanism 2 and the third motion support mechanism 3 are configured to adjust the relative position between the first chip 8 and the second chip 9 to ensure the accuracy of subsequent connection with the probe in the probe mechanism 5.

[0057] As some alternative implementation methods, such as Figure 3 As shown, the first vision mechanism 41 includes a first imaging structure 411 and a calibration structure 412; both the first imaging structure 411 and the calibration structure 412 are fixedly mounted on the first motion bearing mechanism 1, and the calibration structure 412 is located within the imaging range of the first imaging structure 411; the first imaging structure 411 is used to photograph the calibration structure 412 and the probe on the probe mechanism 5.

[0058] Specifically, the first vision mechanism 41 is used to acquire images of the probes in the probe mechanism 5. In this embodiment, the first vision mechanism 41 includes a first imaging structure 411 and a calibration structure 412, with the calibration structure 412 located within the imaging range of the first imaging structure 411. During the imaging process, the calibration structure 412 serves as a reference point, working in conjunction with the second vision mechanism 42 to calibrate and correct errors in the captured images, thereby improving the accuracy and precision of the imaging.

[0059] In this embodiment, the first imaging structure 411 captures images of the probes on the calibration structure 412 and the probe mechanism 5, obtaining the probe's position information. This is crucial for subsequent automatic dual-chip alignment testing, as it accurately determines the relative position between the probes and the first chip 8 and the second chip 9, ensuring the smooth progress of the testing process. Furthermore, the fixed connection between the first vision mechanism 41 and the first motion support mechanism 1 ensures the stability and reliability of the first vision mechanism 41 during the imaging process.

[0060] As some alternative implementation methods, such as Figure 4 As shown. The second vision mechanism 42 includes a second imaging structure, which is aligned with the motion support mechanism and is used to image the chip electrodes on the first chip 8 and the second chip 9; and to image the calibration structure 412 in the second vision mechanism 42 when the first vision mechanism 41 moves below the second imaging structure.

[0061] Specifically, the second vision mechanism 42 is mainly used to acquire images of the chip electrodes on the first chip 8 and the second chip 9. By capturing images of the chip electrodes on the first chip 8 and the second chip 9 through the second imaging structure, the positional information of the chip electrodes on the first chip 8 and the second chip 9 can be obtained, confirming their specific positions. Since the position of the probe on the probe mechanism 5 is fixed, if there is a difference in position between the chip electrodes on the first chip 8 and the second chip 9, the second motion support mechanism 2 and the third motion support mechanism 3 will move the first chip 8 and the second chip 9 to ensure subsequent contact with the probe on the probe mechanism 5, improving the accuracy and reliability of the test. It should be noted that the second vision mechanism 42 can be directly connected to the frame 6 or connected to the probe mechanism 5; this embodiment does not impose a specific limitation.

[0062] Furthermore, when the first vision mechanism 41 moves below the second imaging structure, the second imaging structure can also capture an image of the calibration structure 412, thereby achieving calibration between the two vision mechanisms. Specifically, by capturing an image of the calibration structure 412 through the second imaging structure, an image of the calibration structure 412 can be obtained, which can then be compared with the image of the calibration structure 412 captured by the first vision mechanism 41, thereby achieving calibration between the two vision mechanisms and further improving the accuracy and precision of the capture.

[0063] It should be noted that in this embodiment, the first shooting structure 411 and the second shooting mechanism can be selected as cameras, and the calibration structure 412 can be a calibration plate.

[0064] As some optional implementations, the probe mechanism 5 includes a probe mounting stage 51, a first probe group 52, and a second probe group 53. The first probe group 52 and the second probe group 53 are both fixedly mounted on the probe mounting stage 51. The first probe group 52 and the second probe group 53 respectively contact the chip electrodes on the first chip 8 and the chip electrodes on the second chip 9. The number of probes and the spacing between two adjacent probes on the first probe group 52 and the second probe group 53 are matched with the number of chip electrodes on the first chip 8 and the second chip 9 and the spacing between two chip electrodes.

[0065] Specifically, such as Figure 4 As shown, the probe mechanism 5 includes a probe mounting stage 51, a first probe group 52, and a second probe group 53. Both the first probe group 52 and the second probe group 53 are fixedly mounted on the probe mounting stage 51, and the interval between them is fixed. Therefore, when the relative positions of the first chip 8 and the second chip 9 are inaccurate, the second and third motion support platforms will adjust the relative positions of the first chip 8 and the second chip 9 to ensure that the chip electrodes on the first chip 8 and the chip electrodes on the second chip 9 correspond to the probes on the first probe group 52 and the probes on the second probe group 53, achieving precise contact and preventing misalignment.

[0066] Furthermore, the first probe group 52 and the second probe group 53 possess high flexibility and adaptability, and can be adjusted according to the chip electrode layout on the first chip 8 and the second chip 9 of different models and specifications. By adjusting the positions of the first probe group 52 and the second probe group 53 on the probe mounting stage 51, or by replacing probe groups with different numbers and spacings of probes, this probe mechanism 5 can easily adapt to various testing requirements, thereby improving the versatility and efficiency of testing.

[0067] As some alternative implementation methods, such as Figure 4As shown, the probe mechanism 5 also includes a motion structure. The probe mounting platform 51 is connected to the frame 6 through the motion structure. The first probe group 52 and the second probe group 53, which are set on the probe mounting platform 51, are both displaced on the frame 6 through the motion structure.

[0068] Specifically, the probe mechanism 5 includes a motion structure. The design of this motion structure ensures that the probe mounting stage 51 and the probe assembly on it can move accurately and stably on the frame 6. More specifically, the motion structure may include a guide rail and a drive component. The guide rail provides a smooth and accurate movement path, while the drive component generates the necessary power to allow the probe mounting stage 51 to move along a preset trajectory. This motion structure design improves the stability and accuracy of the probe mechanism 5 during testing, making the testing process more efficient and reliable. Furthermore, the motion structure may also have a calibration function, enabling it to periodically or automatically adjust the position of the probe mounting stage 51 as needed to eliminate minor errors caused by prolonged use or external factors, thereby ensuring long-term stability and accuracy of the test.

[0069] It should be noted that, as Figure 4 As shown, the motion structure in this embodiment is a Z-axis motion structure 54. The Z-axis motion structure 54 is used to drive the first probe group 52 and the second probe group 53 on the probe mounting stage 51 to move in the Z-axis direction. Specifically, the design of the Z-axis motion structure 54 allows the probe mounting stage 51 to move precisely in the vertical direction. When the first chip 8 and the second chip 9 have been displaced and their positions are below the first probe group 52 and the second probe group 53, the Z-axis motion structure 54 will drive the probe mounting stage 51 to move downward in the Z-axis direction, so that the first probe group 52 and the second probe group 53 move downward in the Z-axis direction at the same time. Finally, the first probe group 52 and the second probe group 53 make contact with the chip electrodes on the first chip 8 and the chip electrodes on the second chip 9. After the contact is completed, the probe group on the probe mounting stage 51 will begin to test the electrodes on the chip.

[0070] In this embodiment, the design of the Z-axis motion structure 54 not only improves the accuracy of the test but also ensures stable contact between the probes on the first probe group 52 and the second probe group 53 and the chip electrodes on the first chip 8 and the second chip 9. During the test, the Z-axis motion structure 54 can maintain the stability of the probe mounting stage 51, avoiding test errors caused by vibration or unstable movement. Simultaneously, by precisely controlling the moving distance and speed of the Z-axis motion structure 54, accurate testing of the chip electrodes can be achieved, ensuring the reliability of the test results. Furthermore, the Z-axis motion structure 54 also improves testing efficiency and convenience, making the testing process more efficient and easier to operate.

[0071] It should be noted that the motion structure may also include an X-axis motion structure, which is used to drive the probe mounting stage 51 to move in the X-axis direction. This is not specifically described in this embodiment.

[0072] The working principle of the dual-chip automatic alignment testing device described in this embodiment is as follows: the first imaging structure 411 in the first vision structure takes a picture of the calibration structure 412 to obtain the position of the calibration structure 412; the first motion bearing mechanism 1 drives the first vision mechanism 41 to move its position so that the calibration structure 412 in the first vision mechanism 41 is below the second vision mechanism 42, and the second imaging structure takes a picture of the calibration structure 412 to obtain an image of the calibration structure 412. At this time, the first imaging structure 411 and the second imaging structure will complete the position calibration under the action of the calibration structure 412.

[0073] Subsequently, the first motion support mechanism 1 moves the first vision mechanism 41 to a position below the probe mechanism 5, and the first imaging structure 411 takes a picture of the probes on the probe mechanism 5 to obtain the positions of the first probe group 52 and the second probe group 53 on the probe mechanism 5. Then, the first motion support mechanism 1 continues to move to move the second motion support mechanism 2 and the third motion support mechanism 3 to a position, so that the first chip 8 and the second chip 9 move to a position below the second vision mechanism 42, and the second imaging structure takes a picture to obtain the positional relationship between the chip electrodes on the first chip 8 and the chip electrodes on the second chip 9.

[0074] After obtaining the positional relationship between the chip electrodes on the first chip 8 and the chip electrodes on the second chip 9, the second motion support mechanism 2 and the third motion support mechanism 3 will move to adjust the positions of the first chip 8 and the second chip 9 so that the positional relationship between the chip electrodes on the first chip 8 and the chip electrodes on the second chip 9 corresponds to the positional relationship between the first probe group 52 and the second probe group 53 on the probe mechanism 5. Finally, based on the obtained positional relationship between the first probe group 52 and the second probe group 53, and the obtained positional relationship between the chip electrodes on the first chip 8 and the second chip 9, the positional relationship between the first probe group 52 and the second probe group 53 relative to the chip electrodes on the first chip 8 and the second chip 9 can be obtained. Ultimately, the Z-axis motion structure 54 in the probe mechanism 5 drives the first probe group 52 and the second probe group 53 on the probe mounting stage 51 to move downward along the Z-axis direction, so that the first probe group 52 contacts the chip electrode on the first chip 8, and the second probe group 53 contacts the chip electrode on the second chip 9. Finally, the first chip 8 and the second chip 9 are tested simultaneously to improve the chip testing efficiency.

[0075] The embodiment is merely a special case and does not indicate that this utility model is implemented in such a way.

[0076] The above description is merely a preferred embodiment of the present utility model. Those skilled in the art will understand that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present utility model. Furthermore, under the teachings of the present utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present utility model.

Claims

1. A dual-chip automatic alignment testing device, characterized in that, include: The system comprises a first motion support mechanism (1), a second motion support mechanism (2), a third motion support mechanism (3), a visual positioning mechanism (4), and a probe mechanism (5); The first motion support mechanism (1) is used to support the second motion support mechanism (2) and the third motion support mechanism (3), and to drive the second motion support mechanism (2) and the third motion support mechanism (3) to move; the second motion support mechanism (2) and the third motion support mechanism (3) are respectively used to support the first chip (8) and the second chip (9), and to drive the first chip (8) and the second chip (9) to move; The visual positioning mechanism (4) includes a first visual mechanism (41) and a second visual mechanism (42); the first visual mechanism (41) is fixed on the first motion support mechanism (1), and the second visual mechanism (42) and the probe mechanism (5) are both mounted on the top of the first motion support mechanism (1) via a frame (6); the first visual mechanism (41) and the second visual mechanism (42) cooperate with each other to determine the relative positions of the probe mechanism (5), the first chip (8), and the chip electrodes on the second chip (9); The second motion support mechanism (2) and the third motion support mechanism (3) are used to adjust the positions of the first chip (8) and the second chip (9) according to the relative positions, so that the chip electrodes on the first chip (8) and the second chip (9) are aligned with the probes on the probe mechanism (5) and then the test is performed after alignment.

2. The dual-chip automatic alignment testing device according to claim 1, characterized in that, The first motion bearing mechanism (1) includes an X-axis motion part (11), a Y-axis motion part (13), and a bearing platform (14); One side of the X-axis motion unit (11) is connected to the Y-axis motion unit (13) via a connecting seat (12), and the other side is connected to the support platform (14); the second motion support mechanism (2) and the third motion support mechanism (3) are both located above the support platform (14), and the first vision mechanism (41) is located at the side end of the support platform (14); the second motion support mechanism (2), the third motion support mechanism (3) and the first vision mechanism (41) are all displaced under the action of the first motion support mechanism (1).

3. The dual-chip automatic alignment testing device according to claim 1, characterized in that, The second motion bearing mechanism (2) includes a first vacuum displacement stage (21) and a first placement stage (22); One end of the first vacuum displacement stage (21) is fixedly connected to the first motion bearing mechanism (1), and the other end is fixedly connected to the first placement stage (22); the first vacuum displacement stage (21) can drive the first placement stage (22) to move in the X-axis, Y-axis and TZ-axis directions, so as to drive the first chip (8) to move.

4. The dual-chip automatic alignment testing device according to claim 1, characterized in that, The third motion bearing mechanism (3) includes a second vacuum displacement stage (31) and a second placement stage (32); One end of the second vacuum displacement stage (31) is fixedly connected to the first motion bearing mechanism (1), and the other end is fixedly connected to the second placement stage (32); the second vacuum displacement stage (31) can drive the second placement stage (32) to move in the TZ axis direction, so as to drive the second chip (9) to move.

5. The dual-chip automatic alignment testing device according to claim 1, characterized in that, The first vision mechanism (41) includes a first imaging structure (411) and a calibration structure (412); the first imaging structure (411) and the calibration structure (412) are both fixedly mounted on the first motion bearing mechanism (1), and the calibration structure (412) is located within the imaging range of the first imaging structure (411); the first imaging structure (411) is used to photograph the calibration structure (412) and the probe on the probe mechanism (5).

6. The dual-chip automatic alignment testing device according to claim 1, characterized in that, The second vision mechanism (42) includes a second imaging structure, which is aligned with the first motion support mechanism (1) and is used to capture images of the chip electrodes on the first chip (8) and the second chip (9); and to capture images of the calibration structure (412) in the second vision mechanism (42) when the first vision mechanism (41) moves below the second imaging structure.

7. The dual-chip automatic alignment testing device according to claim 1, characterized in that, The probe mechanism (5) includes a probe mounting stage (51), a first probe group (52), and a second probe group (53). The first probe group (52) and the second probe group (53) are both fixedly mounted on the probe mounting stage (51). The first probe group (52) and the second probe group (53) respectively contact the chip electrodes on the first chip (8) and the chip electrodes on the second chip (9). The number of probes and the spacing between two adjacent probes on the first probe group (52) and the second probe group (53) are matched with the number of chip electrodes on the first chip (8) and the second chip (9) and the spacing between two chip electrodes.

8. The dual-chip automatic alignment testing device according to claim 7, characterized in that, The probe mechanism (5) further includes a motion structure. The probe mounting platform (51) is connected to the frame (6) through the motion structure. The first probe group (52) and the second probe group (53) set on the probe mounting platform (51) are both displaced on the frame (6) through the motion structure.

9. The dual-chip automatic alignment testing device according to claim 8, characterized in that, The motion structure includes a Z-axis motion structure (54), which is used to drive the first probe group (52) and the second probe group (53) on the probe mounting stage (51) to move in the Z-axis direction.

10. The dual-chip automatic alignment testing device according to any one of claims 1-9, characterized in that, The testing device also includes a support platform (7), which is located at the bottom of the first motion bearing mechanism (1) and is used to directly or indirectly support the first motion bearing mechanism (1), the second motion bearing mechanism (2), the third motion bearing mechanism (3), the visual positioning mechanism (4), and the probe mechanism (5).

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