Electronic paper and display terminals

Abstract

This utility model discloses an electronic paper and a display terminal. The electronic paper includes a substrate, an array layer, and a light-shielding layer. The array layer is disposed on one side of the substrate and includes multiple thin-film transistors. The light-shielding layer is disposed on the side of the array layer away from the substrate, covering the thin-film transistors. The material of the light-shielding layer includes either a black organic material or an organic color resist material. By disposing of a light-shielding layer made of organic material on the side of the thin-film transistors away from the substrate, the thin-film transistors can be shielded from light, reducing the impact of external light on the photosensitivity of the thin-film transistors. At the same time, by using an organic material to form the light-shielding layer, replacing the metal light-shielding layer in related technologies, the structure of the electronic paper is simplified and the manufacturing process is reduced.

Description

Technical Field

[0001] This utility model relates to the field of battery technology, specifically to an electronic paper and display terminal. Background Technology

[0002] With the widespread application of electronic paper (E-paper) products in outdoor advertising, electronic tags, and smart terminals, higher demands are being placed on their display performance and system stability in high-brightness environments. Electronic paper uses electronic ink film (E-ink film) to display images. This structure has a paper-like reflective display effect, low power consumption, and comfortable reading, making it suitable for use in strong light environments.

[0003] To improve display quality and system reliability, electronic paper typically uses thin-film transistor (TFT) substrates as the driving circuit structure. TFT devices are generally photosensitive and may experience electrical drift under strong light, affecting driving accuracy and image stability. In related technologies, a metal layer is added to the display substrate to achieve a light-shielding effect. However, the adhesion and bonding strength between metal and organic materials are poor. If metal is directly deposited on the surface of organic materials, it can easily lead to poor adhesion, poor uniformity, or even delamination of the metal film, thereby reducing the production yield and reliability of the device. Utility Model Content

[0004] This utility model provides electronic paper and display terminal to solve the problems of TFT devices in electronic paper products being sensitive to photosensitivity and the complexity of existing light-shielding structures.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:

[0006] This utility model embodiment provides an electronic paper, the electronic paper comprising:

[0007] substrate;

[0008] An array layer is disposed on one side of the substrate, and the array layer includes a plurality of thin-film transistors;

[0009] A light-shielding layer is disposed on the side of the array layer away from the substrate, the light-shielding layer covers the thin-film transistor, and the material of the light-shielding layer includes one of a black organic material or an organic color resist material.

[0010] In the electronic paper provided in this embodiment of the present invention, the electronic paper further includes a pixel electrode layer and an insulating layer, the insulating layer including a passivation layer; wherein, the passivation layer, the light-shielding layer and the pixel electrode layer are sequentially stacked on the side of the array layer away from the substrate.

[0011] In the electronic paper provided in this embodiment of the present invention, the insulating layer further includes a planarization layer;

[0012] The passivation layer, the planarization layer, the light-shielding layer, and the pixel electrode layer are sequentially stacked on the side of the array layer away from the substrate.

[0013] In the electronic paper provided in this embodiment of the present invention, the passivation layer, the planarization layer, the light-shielding layer, and the pixel electrode layer are in contact in sequence.

[0014] In the electronic paper provided in this embodiment of the present invention, the ratio of the thickness of the light-shielding layer to the thickness of the planarization layer is greater than or equal to 0.38 and less than or equal to 0.55;

[0015] And / or, the thickness of the light-shielding layer is greater than or equal to 1 micrometer and less than or equal to 1.2 micrometers; the thickness of the planarization layer is greater than or equal to 2.2 micrometers and less than or equal to 2.6 micrometers.

[0016] In the electronic paper provided in this embodiment of the present invention, the passivation layer, the light-shielding layer, and the pixel electrode layer are in contact in sequence.

[0017] In the electronic paper provided in this embodiment of the present invention, the thickness of the light-shielding layer is greater than the thickness of the array layer.

[0018] In the electronic paper provided in this embodiment of the present invention, the electronic paper further includes an electronic ink layer and a common electrode layer. The electronic ink layer is disposed on the side of the pixel electrode layer away from the substrate, and the common electrode layer is disposed on the side of the electronic ink layer away from the substrate.

[0019] In the electronic paper provided in this embodiment of the present invention, the light-shielding layer includes at least three layers of color resist of different colors stacked together.

[0020] This utility model embodiment also provides a display terminal, which includes the electronic paper described in any of the above claims.

[0021] The beneficial effects of this utility model embodiment: This utility model discloses an electronic paper and a display terminal. The electronic paper includes a substrate, an array layer, and a light-shielding layer. The array layer is disposed on one side of the substrate and includes multiple thin-film transistors. The light-shielding layer is disposed on the side of the array layer away from the substrate, covering the thin-film transistors. The material of the light-shielding layer includes one of black organic material or organic color resist material. By disposing of a light-shielding layer made of organic material on the side of the thin-film transistors away from the substrate, the thin-film transistors can be shielded from light, reducing the influence of external light on the photosensitivity of the thin-film transistors. At the same time, compared with metal materials, organic materials have advantages such as simple processing technology, good material uniformity, and easier thickness control. Therefore, a light-shielding layer made of organic material can replace the metal light-shielding layer in related technologies, thereby simplifying the structure of the electronic paper and reducing the number of manufacturing processes. Attached Figure Description

[0022] The technical solution and other beneficial effects of this utility model will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0023] Figure 1 A top view of the electronic paper provided in an embodiment of this utility model;

[0024] Figure 2 Provided for the embodiments of this utility model Figure 1 A magnified schematic diagram of the local structure at point A;

[0025] Figure 3 Provided for the embodiments of this utility model Figure 2 A schematic diagram of the first type of cross-sectional structure at point BB';

[0026] Figure 4 Provided for the embodiments of this utility model Figure 2 Schematic diagram of the second type of cross-sectional structure at BB' in the middle;

[0027] Figure 5 Provided for the embodiments of this utility model Figure 2 A schematic diagram of the third type of cross-sectional structure at point BB';

[0028] Figure 6 This is a schematic diagram of the structure of the display terminal provided in an embodiment of the present utility model.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1-Electronic paper; 100-Display area; 200-Non-display area; 11-Subpixel; 12-Scan line; 13-Data line; 10-Substrate; 20-Array layer; 21-Thin film transistor; 211-Gate; 212-Gate insulating layer; 213-Active layer; 214-Source; 215-Drain; 30-Insulating layer; 31-Passivation layer; 32-Planing layer; 33-Via; 331-First via; 332-Second via; 40-Light-shielding layer; 41-First color resist; 42-Second color resist; 43-Third color resist; 50-Pixel electrode layer; 51-Pixel electrode; 60-Electronic ink layer; 61-Electrophoresis unit; 70-Common electrode layer; 2-Display terminal; 3-Terminal body. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. In the present utility model, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower in the actual use or working mode of the device, specifically the drawing direction in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only, and features specified as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections or connections that allow for communication; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] The following disclosure provides many different embodiments for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, examples of various specific processes and materials are provided, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0035] This embodiment provides an electronic paper 1, such as... Figure 1 , Figure 2 and Figure 3 As shown, Figure 1 A top view of the electronic paper provided in an embodiment of this utility model; Figure 2 Provided for the embodiments of this utility model Figure 1 A magnified schematic diagram of the local structure at point A; Figure 3 Provided for the embodiments of this utility model Figure 2 A schematic diagram of the first type of cross-sectional structure at point BB'.

[0036] The electronic paper 1 includes, but is not limited to, any one of electrophoretic electronic paper, electrowetting electronic paper, electronic powder fluid electronic paper, or cholesteric liquid crystal electronic paper; the electronic paper 1 includes a display area 100 and a non-display area 200 located around the display area 100. The display area 100 is provided with a plurality of sub-pixels 11 and can be used to display images. The non-display area 200 is provided with a driving circuit, which is used to provide driving signals to the sub-pixels 11.

[0037] The electronic paper 1 includes a substrate 10, an array layer 20, an insulating layer 30, a light-shielding layer 40, and a pixel electrode layer 50. The substrate 10 can be made of transparent materials, such as glass or flexible plastics (including polyimide), which have excellent mechanical strength and optical transparency, making it suitable as the load-bearing body of the electronic paper 1.

[0038] The array layer 20 is disposed on one side of the substrate 10. The array layer 20 includes a plurality of thin-film transistors 21. The thin-film transistors 21 can be etch-block type, back-channel etch type, or classified into bottom-gate thin-film transistors, top-gate thin-film transistors, etc., according to the position of the gate 211 and the active layer 213. The plurality of thin-film transistors 21 are arranged in a regular manner according to certain columns and rows, and together with the data line 13 and the scan line 12, they form an active matrix structure, thereby enabling independent and stable electrical control of the sub-pixel 11.

[0039] Further, the thin-film transistor 21 may include a gate 211, a gate insulating layer 212, an active layer 213, a source 214, and a drain 215; the gate 211 may be disposed on the side of the active layer 213 near the substrate 10; the active layer 213 may include a channel portion and a source 214 portion and a drain 215 portion respectively connected to both ends of the channel portion, the source 214 portion and the drain 215 portion are in contact with each other; the active layer 213, the source 214, and the drain 215 may be disposed in the same layer; wherein, the material of the source 214, the drain 215, and the gate 211 may be any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0040] The insulating layer 30 is disposed on the side of the array layer 20 away from the substrate 10. The insulating layer 30 includes a passivation layer 31 and a planarization layer 32 stacked together. The passivation layer 31 is disposed on the side of the array layer 20 away from the substrate 10. The passivation layer 31 can be a single, continuous layer. The material of the passivation layer 31 can be an inorganic insulating material, specifically selected from silicon oxide (SiO2) or silicon nitride (SiN). X In one of the following methods, the passivation layer 31 can protect and isolate the thin film transistor 21, reduce the impact of ion permeation and moisture on the stability of the thin film transistor 21, and at the same time, reduce the interference of the surface area defects of the array layer 20 on the electrical performance of the thin film transistor 21.

[0041] The planarization layer 32 is disposed on the side of the passivation layer 31 away from the array layer 20. The planarization layer 32 can be a whole layer and covers the passivation layer 31. The material of the planarization layer 32 can be an organic material, specifically selected from acrylic resin, epoxy resin and perfluoroalkoxy resin, etc. The planarization layer 32 is used to form a flat surface, reduce surface undulations caused by the stacking of circuits and devices, and provide a good foundation for subsequent thin film deposition.

[0042] The light-shielding layer 40 is disposed on the side of the array layer 20 away from the substrate 10. The light-shielding layer 40 covers the thin-film transistor 21 and blocks the photo-induced leakage current and photo-induced instability effects caused by external light on the thin-film transistor 21, thereby improving the working stability and display uniformity of the thin-film transistor 21. At the same time, the material of the light-shielding layer 40 can be one of black organic material or organic color resist material, specifically selected from organic black color resist (Black Matrix, BM). By using organic material to form the light-shielding layer 40, replacing the metal light-shielding layer 40 in related technologies, the structure of the electronic paper 1 is simplified and the manufacturing process is reduced.

[0043] The pixel electrode layer 50 is disposed on the side of the light-shielding layer 40 away from the substrate 10. The pixel electrode layer 50 includes a plurality of pixel electrodes 51, each pixel electrode 51 corresponding to a thin film transistor 21, and each pixel electrode 51 can be connected to the source and drain of the corresponding thin film transistor 21. The thin film transistor 21 is used to provide a driving voltage for the pixel electrode 51. Each pixel electrode 51 can be provided with a different driving voltage, thereby controlling the display state of each sub-pixel 11, and thus realizing the grayscale and brightness adjustment of the display area 100 of the electronic paper 1.

[0044] The pixel electrode 51 can be made of one of the following materials: indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO), and indium gallium zinc tin oxide (IGZTO).

[0045] The insulating layer 30 is provided with at least one via 33, and the pixel electrode 51 is electrically connected to the drain electrode 215 through the via 33. The number of vias 33 can be set as needed; for example, the number of vias 33 can be one, two, three, four, etc. Figure 2 The diagram illustrates a scenario where four vias 33 are present. By providing at least one via 33, the connection reliability between the pixel electrode 51 and the drain 215 can be increased.

[0046] Specifically, the array layer 20 includes multiple scan lines 12 extending along a first direction X and multiple data lines 13 extending along a second direction Y. The first direction X and the second direction Y are arranged at an acute angle or a right angle. A pixel electrode 51 is disposed in the pixel area defined by two adjacent data lines 13 and two adjacent scan lines 12. The drain 215 is disposed on the same layer as the data lines 13. The scan lines 12 are disposed on the side of the data lines 13 near the substrate 10. Each pixel area corresponds to a sub-pixel 11, that is, a pixel electrode 51 is disposed in each pixel area.

[0047] Please continue to combine Figures 1 to 3 In one embodiment, the light-shielding layer 40 is disposed between the insulating layer 30 and the pixel electrode layer 50. The light-shielding layer 40 can be a whole-layer structure and completely covers the upper surface of the planarization layer 32. The material of the light-shielding layer 40 can be an organic black color resist or other organic materials suitable for forming a light-shielding structure. The organic black color resist has excellent optical density and good process adaptability, and can block interference caused by external light to the thin film transistor 21.

[0048] The passivation layer 31, the planarization layer 32, the light-shielding layer 40, and the pixel electrode layer 50 are sequentially contacted to form a tight fit, which helps to reduce gaps and light leakage between film layers. The side of the light-shielding layer 40 near the pixel electrode layer 50 can also be in direct contact with the side of the pixel electrode layer 50 near the light-shielding layer 40, thereby forming a stable and smooth overall structure. By sequentially stacking the insulating layer 30, the light-shielding layer 40, and the pixel electrode layer 50, the manufacturing process steps and material stacking of the electronic paper 1 are reduced, thereby reducing production costs.

[0049] Furthermore, a first through-hole 331 is provided on the insulating layer 30, the first through-hole 331 corresponds to the drain 215 of the thin film transistor 21, and the first through-hole 331 sequentially penetrates the planarization layer 32 and the passivation layer 31 along the thickness direction of the electronic paper 1; the light-shielding layer 40 has an extension section, the extension section extends from the light-shielding layer 40 toward the substrate 10, and the extension section covers the inner wall of the first through-hole 331, thereby forming a second through-hole 332, the second through-hole 332 at least exposes a portion of the drain 215, and the first through-hole 331 and the second through-hole 332 serve as the via 33; wherein, at least a portion of the pixel electrode 51 extends into the second through-hole 332 and is electrically connected to the drain 215, thereby realizing the electrical connection between the pixel electrode 51 and the thin film transistor 21.

[0050] Understandably, in this embodiment, the light-shielding layer 40 can be made of organic materials, the planarization layer 32 can be made of organic materials, and the passivation layer 31 can be made of inorganic insulating materials. The synergistic effect between the passivation layer 31, the planarization layer 32, and the light-shielding layer 40 increases the spacing between the pixel electrode 51 and the thin-film transistor 21 in the thickness direction of the electronic paper 1, thereby reducing the parasitic capacitance formed between the metal pattern of the pixel electrode 51 and the thin-film transistor 21, which helps to reduce interference effects and improve the display stability of the electronic paper 1.

[0051] Meanwhile, compared to related technologies where a physical vapor deposition (PV) process is required between the metal light-shielding layer 40 and the organic planarization layer 32 to achieve metal deposition on the surface of the organic material (the adhesion and bonding between the metal material and the organic material are relatively poor), this embodiment sets the light-shielding layer 40 to be made of organic material. The light-shielding layer 40 can be directly formed on the organic planarization layer 32 by coating, printing, or other methods without the need for an additional physical vapor deposition process. This simplifies the structure of the electronic paper 1, reduces process steps, lowers the production cycle and manufacturing cost, and is suitable for large-scale production.

[0052] Please continue to combine Figures 1 to 3 In one embodiment, the ratio of the thickness of the light-shielding layer 40 to the thickness of the planarization layer 32 is greater than or equal to 0.38 and less than or equal to 0.55. By controlling the ratio between the thickness of the light-shielding layer 40 and the thickness of the planarization layer 32, the light-shielding effect of the light-shielding layer 40 is improved, while achieving a thinner and lighter design for the electronic paper 1.

[0053] Furthermore, by setting the ratio of the thickness of the light-shielding layer 40 to the thickness of the planarization layer 32 to be greater than or equal to 0.38, the light-shielding layer 40 has sufficient thickness to form a good light-shielding effect, effectively blocking interference caused by external light to the thin-film transistor 21, thereby reducing the resulting photo-induced leakage current effect and improving the stability and reliability of the thin-film transistor 21. At the same time, by setting the ratio of the thickness of the light-shielding layer 40 to the thickness of the planarization layer 32 to be less than or equal to 0.55, the light-shielding layer 40 will not increase the thickness of the electronic paper 1 due to excessive thickness, which is conducive to realizing the thin and light design of the electronic paper 1, while also simplifying the production process, reducing the materials and processes required during production, and reducing the overall production cost.

[0054] Specifically, the thickness of the light-shielding layer 40 is greater than or equal to 1 micrometer and less than or equal to 1.2 micrometers. The thickness of the light-shielding layer 40 includes, but is not limited to, any one of 1.0 micrometer, 1.1 micrometer, and 1.2 micrometer. This embodiment does not impose any specific limitations on this.

[0055] It should be noted that in related technologies, to achieve stable deposition of the metal light-shielding layer on the surface of the organic planarization layer, a physical vapor deposition (PVD) step is usually added between the two. This is because the adhesion and bonding force between metal materials (such as aluminum and chromium) and organic materials are relatively weak. If the metal layer is directly deposited on the organic surface, it can easily lead to poor adhesion of the metal film, poor film uniformity, or even film delamination, thereby affecting the production yield and long-term reliability of the device. Therefore, related technologies often set an auxiliary passivation layer between the organic planarization layer and the metal light-shielding layer to improve the interfacial bonding performance and enhance device stability.

[0056] It is understood that, in this embodiment, by setting the material of the light-shielding layer 40 to be an organic material, the light-shielding layer 40 can be directly formed on the organic planarization layer 32 by coating, printing, or other methods without the need for an additional physical vapor deposition process. This simplifies the production process of the electronic paper 1, reduces the complexity of the production steps, and lowers the production cost. At the same time, by setting the thickness of the light-shielding layer 40 to be greater than or equal to 1 micrometer and less than or equal to 1.2 micrometers, the light-shielding layer 40 can block the interference caused by external light to the thin-film transistor 21, reduce the photo-induced leakage current effect, and ensure the stable operation of the thin-film transistor 21.

[0057] The thickness of the planarization layer 32 is greater than or equal to 2.2 micrometers and less than or equal to 2.6 micrometers. The thickness of the planarization layer 32 includes, but is not limited to, any one of 2.2 micrometers, 2.1 micrometers, 2.3 micrometers, 2.4 micrometers, 2.5 micrometers, and 2.6 micrometers. This embodiment does not impose specific limitations on this.

[0058] It should be noted that in related technologies, the thickness of the planarization layer 32 is typically 3 micrometers. In this embodiment, by setting the material of the light-shielding layer 40 to be an organic material, the light-shielding layer 40 composed of organic material can simultaneously serve as a spacing function (maintaining the required spacing between the pixel electrode layer 50 and the thin-film transistor 21). Thus, while keeping the overall spacing between the pixel electrode 51 and the thin-film transistor 21 approximately unchanged, the thickness of the planarization layer 32 can be appropriately reduced (reducing the thickness of the planarization layer 32 to 2.1 micrometers to 2.6 micrometers), thereby reducing the amount of material used in the planarization layer 32, saving production costs, and providing better conditions for mass production.

[0059] Please continue to combine Figures 1 to 3In one embodiment, the electronic paper 1 further includes an electronic ink layer 60 and a common electrode layer 70. The electronic ink layer 60 is disposed on the side of the pixel electrode layer 50 away from the substrate 10, and the common electrode layer 70 is disposed on the side of the electronic ink layer 60 away from the substrate 10. The common electrode layer 70 can be a single layer, thereby simplifying the manufacturing process of the electronic paper 1.

[0060] The electronic ink layer 60 includes multiple electrophoretic units 61, each containing electrophoretic particles and electrophoretic liquid. The electrophoretic unit 61 can be a microcapsule, a microcup, or a cofferdam, etc., and the electrophoretic particles can be colored electrophoretic particles, black electrophoretic particles, or white electrophoretic particles.

[0061] Under the influence of the electric field formed by the pixel electrode layer 50 and the common electrode layer 70, the electrophoretic particles move to either the side closer to the common electrode layer 70 or the side farther away from it. When the electrophoretic particles are closer to the common electrode layer 70, they can be used for display.

[0062] Specifically, ambient light from the outside world is incident from the common electrode layer 70 onto the electronic ink layer 60, and after being reflected by the electrophoretic particles, it displays the corresponding color; wherein, the colored electrophoretic particles can be red electrophoretic particles, yellow electrophoretic particles, etc., but are not limited to these.

[0063] It should be noted that two, three, or four colors of electrophoretic particles can be set within the same electrophoresis unit 61, and this embodiment does not impose any limitation on this. When three or four colors of electrophoretic particles are set within the same electrophoresis unit 61, the voltage response capability of the electrophoretic particles of different colors can be controlled by adjusting the mass and charge of the electrophoretic particles of different colors, so that one color of electrophoretic particles is closer to the side of the common electrode layer 70.

[0064] For example, when black electrophoretic particles move closer to the common electrode layer 70, external light incident on the electronic ink layer 60 is absorbed by the black electrophoretic particles, thus displaying black; when red electrophoretic particles move closer to the common electrode layer 70, external light incident on the electronic ink layer 60 is reflected by the red electrophoretic particles, thus displaying red. By controlling the positions of the electrophoretic particles of different colors, color images can be displayed.

[0065] Optionally, when two colors of electrophoretic particles are provided in the same electrophoresis unit 61, the electrical properties of the two different colors of electrophoretic particles can be set to be different, so that the electrophoretic particles of different colors move to different sides to achieve the corresponding color display.

[0066] Optionally, the electrophoresis unit 61 may be provided with white electrophoretic particles, black electrophoretic particles, and electrophoretic solution. Similarly, when white electrophoretic particles move to the side near the common electrode layer 70, white is displayed; when black electrophoretic particles move to the side near the common electrode layer 70, black is displayed. In this case, the electronic ink layer 60 can achieve black and white display.

[0067] Please combine Figure 1 , Figure 2 and Figure 4 ;in, Figure 4 Provided for the embodiments of this utility model Figure 2 A schematic diagram of the second type of cross-sectional structure at point BB'.

[0068] In one embodiment, the light-shielding layer 40 includes at least three layers of color resists of different colors stacked together. The multiple color resists of different colors are stacked sequentially, which can simultaneously block light of different wavelengths, reduce the interference of external stray light on the thin film transistor 21, suppress photo-induced leakage current effect, and thereby improve the stability of the thin film transistor 21.

[0069] Furthermore, the light-shielding layer 40 includes a first color resist 41, a second color resist 42, and a third color resist 43 stacked sequentially. The colors of the first color resist 41, the second color resist 42, and the third color resist 43 are all different. Specifically, the color of the first color resist 41 can be red, the color of the second color resist 42 can be green, and the color of the third color resist 43 can be blue. By stacking multiple color resists of different colors sequentially, a light blocking effect can be achieved, reducing the interference of external stray light on the thin-film transistor 21 and reducing the photo-induced leakage current effect. At the same time, the multiple color resists of different colors can work together to form an optical structure with a wide spectrum cutoff capability, thereby adapting to different wavelengths of interference light and meeting the needs of different display products.

[0070] Specifically, the materials of the first color resist 41, the second color resist 42, and the third color resist 43 are all organic color resist materials. Organic color resist materials can be sequentially formed on the planarization layer 32 through conventional semiconductor processing techniques such as printing, coating, photolithography, and development. Moreover, the formation process of organic color resist materials does not require vacuum evaporation or sputtering, making production conditions more convenient. This simplifies the production process, reduces production costs, and also reduces dependence on production equipment, making it suitable for mass production and the preparation of large-size display products.

[0071] Please combine Figure 1 , Figure 2 and Figure 5 ;in, Figure 5 Provided for the embodiments of this utility model Figure 2 A schematic diagram of the third cross-sectional structure at point BB'.

[0072] In one embodiment, the electronic paper 1 includes a substrate 10, an array layer 20, an insulating layer 30, and a pixel electrode layer 50; wherein, the insulating layer 30 includes a passivation layer 31, and a light-shielding layer 40 is disposed between the passivation layer 31 and the pixel electrode layer 50. The material of the light-shielding layer 40 is one of a black organic material or an organic color resist material, so that the light-shielding layer 40 can not only play a role in light shielding, but also serve as a planarization layer 32 in related designs, thereby simplifying the film structure of the electronic paper 1, reducing process steps, and lowering production costs.

[0073] Furthermore, the passivation layer 31, the light-shielding layer 40, and the pixel electrode layer 50 are sequentially contacted. The thickness of the light-shielding layer 40 is greater than the thickness of the array layer 20. The array layer 20 includes active device structures such as thin-film transistors 21 and data lines 13. By setting the thickness of the light-shielding layer 40 to be greater than the thickness of the array layer 20, sufficient optical shielding can be provided for the thin-film transistors 21, reducing interference from external stray light and suppressing photo-induced leakage current effects. At the same time, the thicker light-shielding layer 40 can also play a leveling role, smoothing out surface undulations formed by the underlying active devices, and providing a flatter and more uniform foundation for the subsequent formation of the pixel electrode layer 50.

[0074] Specifically, the light-shielding layer 40 can be formed by organic black color resist or by sequentially stacking organic color resists of different colors (such as by sequentially setting three organic materials: red color resist, green color resist, and blue color resist), thereby achieving broad-spectrum blocking of light of different wavelengths, reducing interference from external stray light to the thin-film transistor 21, and reducing photo-induced leakage current effect; at the same time, it enables the electronic paper 1 to be thinner and lighter, reducing the complexity of the production process.

[0075] Please combine Figure 1 , Figure 2 , Figure 3 and Figure 6 ;in, Figure 6 This is a schematic diagram of the structure of the display terminal provided in an embodiment of the present utility model.

[0076] This embodiment also provides a display terminal 2, which includes an electronic paper 1 and a terminal body 3, wherein the electronic paper 1 and the terminal body 3 are combined into one unit.

[0077] It is understood that the electronic paper 1 has been described in detail in the above embodiments and will not be repeated here; in particular, since the display terminal 2 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be elaborated here.

[0078] In specific applications, the display terminal 2 can be an electronic device with display function, such as a smartphone, tablet computer, e-reader, smartwatch, television, or vehicle display.

[0079] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0080] The above provides a detailed description of an electronic paper and display terminal provided by the embodiments of this utility model. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this utility model. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. An electronic paper, characterized in that, include: substrate; An array layer is disposed on one side of the substrate, and the array layer includes a plurality of thin-film transistors; A light-shielding layer is disposed on the side of the array layer away from the substrate, the light-shielding layer covers the thin-film transistor, and the material of the light-shielding layer includes one of a black organic material or an organic color resist material.

2. The electronic paper according to claim 1, characterized in that, The electronic paper further includes a pixel electrode layer and an insulating layer, the insulating layer including a passivation layer; wherein the passivation layer, the light-shielding layer, and the pixel electrode layer are sequentially stacked on the side of the array layer away from the substrate.

3. The electronic paper according to claim 2, characterized in that, The insulating layer further includes a planarization layer; The passivation layer, the planarization layer, the light-shielding layer, and the pixel electrode layer are sequentially stacked on the side of the array layer away from the substrate.

4. The electronic paper according to claim 3, characterized in that, The passivation layer, the planarization layer, the light-shielding layer, and the pixel electrode layer are in contact in sequence.

5. The electronic paper according to claim 4, characterized in that, The ratio of the thickness of the light-shielding layer to the thickness of the planarization layer is greater than or equal to 0.38 and less than or equal to 0.55; And / or, the thickness of the light-shielding layer is greater than or equal to 1 micrometer and less than or equal to 1.2 micrometers; the thickness of the planarization layer is greater than or equal to 2.2 micrometers and less than or equal to 2.6 micrometers.

6. The electronic paper according to claim 2, characterized in that, The passivation layer, the light-shielding layer, and the pixel electrode layer are in contact in sequence.

7. The electronic paper according to claim 6, characterized in that, The thickness of the light-shielding layer is greater than the thickness of the array layer.

8. The electronic paper according to claim 2, characterized in that, The electronic paper also includes an electronic ink layer and a common electrode layer. The electronic ink layer is disposed on the side of the pixel electrode layer opposite to the substrate, and the common electrode layer is disposed on the side of the electronic ink layer opposite to the substrate.

9. The electronic paper according to any one of claims 1 to 8, characterized in that, The light-shielding layer comprises at least three layers of color resist of different colors stacked together.

10. A display terminal, characterized in that, The display terminal includes electronic paper as described in any one of claims 1 to 9.

Images