A type of multi-resonant special tag

Abstract

This invention belongs to the field of radio frequency identification (RFID) technology, specifically relating to a multi-resonant special tag, comprising a flexible intermediate layer, a first antenna layer, a second antenna layer, a third antenna layer, and an outer protective layer; wherein, the first antenna layer includes a first patch, an RF chip, two second patches, and a third patch. This invention significantly improves the tag's adaptability to liquid and metal environments through a multi-layered structural design. The special U-shaped structure of the first antenna layer excites dual-resonance characteristics, simultaneously covering the ETSI and FCC frequency bands. The second antenna layer serves as a ground layer, enhancing signal coupling when attached to metal and shielding against dielectric interference when in contact with liquids. The third antenna layer optimizes impedance matching efficiency. Furthermore, the third patch adjusts stress and stiffness, and the outer protective layer provides environmental sealing and mechanical protection, enabling stable long-distance identification in composite media scenarios. It also possesses multi-band versatility, structural stability, and durability under complex operating conditions.

Description

Technical Field

[0001] This utility model belongs to the field of radio frequency identification technology, specifically relating to a multi-resonant special tag. Background Technology

[0002] Ultra-high frequency (UHF) radio frequency identification (RFID) technology is widely used in logistics, asset management, industrial automation and other fields due to its long-distance reading and multi-target identification capabilities.

[0003] However, both liquids and metals significantly affect the performance of UHF RFID tags. Metals reflect electromagnetic waves, blocking signal penetration and causing eddy current losses, leading to tag detuning and energy attenuation. Liquids (especially water) absorb electromagnetic energy, increasing dielectric loss. Both alter the antenna radiation environment, causing impedance mismatch and signal weakening.

[0004] To address the above issues, a dedicated, dielectric-resistant special tag needs to be designed. However, the conventional special tag structure uses a narrowband resonator, which, when fabricated into an RFID tag, exhibits a single-resonance curve, as shown in the attached figure. Figure 5 As shown, it can only achieve impedance matching at a single narrowband frequency point, has a narrow bandwidth, poor applicability to different frequency bands, and cannot be applied to two standard frequency bands (such as ETSI and FCC) at the same time. Utility Model Content

[0005] The purpose of this invention is to provide a multi-resonant special tag that solves the technical problems of existing technologies, such as incompatibility with different communication frequency bands, poor versatility, inability to adapt to both metal and liquid environments, and low environmental adaptability.

[0006] This utility model discloses a multi-resonance special tag, comprising:

[0007] Flexible interlayer;

[0008] The first antenna layer is stacked on the top surface of the flexible intermediate layer;

[0009] The second antenna layer is stacked on the bottom surface of the flexible intermediate layer;

[0010] The third antenna layer is disposed on the side of the flexible intermediate layer and extends in the vertical direction, with its upper end connected to the first antenna layer and its lower end connected to the second antenna layer;

[0011] The outer protective layer is a continuous integral structure that covers at least a portion of the top surface of the first antenna layer, the outer surface of the third antenna layer, and the bottom surface of the second antenna layer.

[0012] The first antenna layer includes:

[0013] The first patch has a first hollowed-out groove on it;

[0014] The radio frequency chip is disposed within the first hollowed-out slot;

[0015] Two second patches, L-shaped, are disposed opposite each other on both sides of the RF chip to form a U-shaped structure. The long arm of each second patch is connected to the first patch, and the short arm faces the RF chip and is electrically connected to it.

[0016] The third patch is disposed within the first hollow groove and located on the opposite side of the opening of the U-shaped structure.

[0017] This application significantly improves the tag's adaptability in liquid and metal environments through a multi-layer structure design. The special U-shaped patch structure of the first antenna layer excites dual-resonance characteristics, simultaneously covering the ETSI and FCC frequency bands, breaking through the frequency band limitations of traditional single-resonance tags. By setting a second antenna layer as a ground layer, the tag enhances signal coupling when attached to metal and shields dielectric interference when in contact with liquid. The third antenna layer connected on the side optimizes impedance matching efficiency. Furthermore, the external protective layer provides environmental sealing and mechanical protection, ultimately achieving stable long-distance identification in composite media scenarios, while also possessing multi-band versatility, structural stability, and durability under complex working conditions.

[0018] Based on the above technical solution, the solution of this application can be further improved as follows:

[0019] Preferably, a plurality of microgrooves are formed on both sides of the first hollow groove on the first patch; by adopting this solution, the local stiffness of the first patch 21 is effectively reduced, and the overall flexibility and deformation adaptability of the label are improved, so that it can fit tightly to the curved carrier.

[0020] Preferably, a second hollow groove is formed on the bottom surface of the second antenna layer away from the third antenna layer; by adopting this solution, the structural rigidity of the second antenna layer can be locally weakened, allowing the second antenna layer to undergo adaptive deformation, increasing the effective contact area, thereby significantly improving the adhesion ability of the label to irregular surfaces.

[0021] Preferably, a first positioning mark is provided on the side of the second antenna layer near the bottom surface of the third antenna layer, and multiple second positioning marks are uniformly provided on the third antenna layer. This solution improves the assembly accuracy during production and processing, effectively eliminates impedance mismatch and frequency deviation caused by misalignment, and significantly improves the production yield.

[0022] Preferably, the first antenna layer includes:

[0023] Multiple fourth patches are arranged on the side of the first patch away from the third antenna layer; this scheme can form a coordinated resonance with the main radiating element, thereby expanding the bandwidth of the antenna.

[0024] Preferably, the flexible intermediate layer, the first antenna layer, and the second antenna layer are all rectangular, and their two ends in the length direction are aligned. This solution improves manufacturing efficiency, increases material utilization, and ensures high-consistency mass production of multi-resonant tags.

[0025] Preferably, the upper surface of the third antenna layer is flush with the top surface of the first antenna layer, and the lower surface of the third antenna layer is flush with the bottom surface of the second antenna layer. This design ensures structural flatness, allows the outer protective layer to form a gapless covering, and improves the sealing effect.

[0026] Preferably, the width of the flexible intermediate layer is greater than or equal to the width of the first antenna layer, the second antenna layer, and the third antenna layer, and the two ends of the flexible intermediate layer and the outer protective layer are flush in the width direction. This solution achieves full coverage of the antenna layers, improving the overall sealing effect while ensuring a neat appearance.

[0027] Through the above technical solution, this utility model achieves the following beneficial effects:

[0028] 1. This application significantly improves the tag's adaptability in liquid and metal environments through a multi-layer structure design. The special U-shaped patch structure of the first antenna layer excites dual resonance characteristics, simultaneously covering the ETSI and FCC frequency bands, breaking through the frequency band limitations of traditional single-resonant tags. By setting the second antenna layer as a ground layer, it enhances signal coupling when attached to metal and shields dielectric interference when in contact with liquid. The impedance matching efficiency is optimized by the third antenna layer connected to the side. Furthermore, the third patch is used to adjust stress and stiffness, and the external protective layer provides environmental sealing and mechanical protection. Ultimately, stable long-distance identification in composite media scenarios is achieved, and it also has multi-band versatility, structural stability, and durability under complex working conditions.

[0029] 2. This application effectively reduces the local stiffness of the first patch by setting microgrooves, improves the overall label's flexibility and deformation adaptability, enabling it to closely fit the curved carrier and reduce the risk of warping or falling off due to stress concentration.

[0030] 3. By setting a fourth patch as a parasitic element, this application can form a coordinated resonance with the main radiating element, thereby expanding the bandwidth of the antenna. Attached Figure Description

[0031] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0032] Figure 1 This is a cross-sectional schematic diagram of the multi-resonance special tag described in a specific embodiment of this application;

[0033] Figure 2 for Figure 1 The diagram shows the structure of the first antenna layer in the multi-resonant special tag.

[0034] Figure 3 for Figure 1 The diagram shows the structure of the second antenna layer in the multi-resonance special tag.

[0035] Figure 4 for Figure 1 The diagram shows the structure of the third antenna layer in the multi-resonant special tag.

[0036] Figure 5 This is a performance curve diagram of conventional special tags in existing technologies;

[0037] Figure 6 for Figure 1 The performance curve of the multi-resonant special tag is shown below;

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. Flexible interlayer;

[0040] 2. First antenna layer; 2A. U-shaped structure; 21. First patch; 211. First cutout groove; 212. Micro trench; 22. RF chip; 23. Second patch; 24. Third patch; 25. Fourth patch;

[0041] 3. Second layer; 31. Second hollowed-out groove; 32. First positioning mark;

[0042] 4. Third antenna layer; 41. Second positioning marker;

[0043] 5. External protective layer. Detailed Implementation

[0044] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0045] The terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as “first” or “second” may explicitly or implicitly include one or more of the stated features.

[0046] In this application, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0047] To better understand the above technical solutions, the following will provide a detailed description of the technical solutions in conjunction with the accompanying drawings and specific embodiments.

[0048] Example:

[0049] like Figure 1 and Figure 6 As shown in the figure, this application discloses a multi-resonant special tag with wide bandwidth response characteristics. It can be adapted to both metal and liquid environments and is compatible with ETSI and FCC frequency bands. It has the advantages of good versatility and high environmental adaptability. Its specific structure includes: a flexible intermediate layer 1, a first antenna layer 2, a second antenna layer 3, a third antenna layer 4, and an outer protective layer 5.

[0050] It should be noted that ETSI is the European electrical standard, with a frequency range of 865-868MHz; FCC is the American electrical standard, with a frequency range of 902-928MHz.

[0051] The flexible intermediate layer 1 is the structural foundation and dielectric isolation layer of the entire tag. It serves as a supporting structure between the first antenna layer 2 and the second antenna layer 3. Its flexibility allows the tag to be bent to fully conform to curved surfaces (such as pipes and circular containers), thereby enhancing its adaptability to practical applications.

[0052] The first antenna layer 2 is stacked on the top surface of the flexible intermediate layer 1. It is the top radiator, responsible for capturing the electromagnetic wave energy in space to power the chip, and radiating the signal processed by the chip back to the reader / writer to realize communication.

[0053] Among them, such as Figure 2 As shown, the first antenna layer 2 includes:

[0054] The first patch 21 has a first hollowed-out groove 211, which is the main radial structure;

[0055] The radio frequency chip 22 is disposed in the first hollow slot 211 and is used to store data and modulate / demodulate signals.

[0056] Two second patches 23, which are L-shaped, are disposed opposite each other on both sides of the radio frequency chip 22 to form a U-shaped structure 2A. The long arm of each second patch 23 is connected to the first patch 21, and the short arm faces the radio frequency chip 22 and is electrically connected to it.

[0057] The third patch 24 is disposed in the first hollow groove 211 and located on the opposite side of the opening of the U-shaped structure 2A. It is used to improve the stress at the radio frequency chip 22 and enhance the bonding force between the radio frequency chip 22 and the antenna.

[0058] It should be noted that the long arm of the second patch 23 is connected to the first patch 21, providing the main current path, and the end of its short arm is directly electrically connected to the RF chip 22. In this way, by precisely designing the size and width of the second patch 23 and the opening size of the U-shaped structure 2A, multiple impedance matching points can be formed to achieve multi-point resonance, thereby expanding the bandwidth and covering the required dual frequency bands.

[0059] It should be noted that the special U-shaped structure 2A design in the first antenna layer 2 (first patch 21 + second patch 23 + first slot 211) naturally excites two resonant modes by creating current paths of different lengths. The geometric parameters of the U-shaped structure 2A (L-arm length / width, opening size) can be independently adjusted to adjust the frequency and bandwidth of the two resonant points, so that it can accurately cover target frequency bands such as ETSI and FCC.

[0060] The second antenna layer 3 is stacked on the bottom surface of the flexible intermediate layer 1. It is the bottom ground layer and is used to connect with objects in the application environment. At the same time, this layer is also a conductor layer, so together with the objects connected to it, it forms the bottom plane of the antenna.

[0061] When the application environment is metallic, the second antenna layer 3 couples with the metal surface. Since metal is a good conductor and has a large area, the coupling is equivalent to forming a huge "ground plane". At this time, the first antenna layer 2 and this "ground plane" form a structure similar to a microstrip antenna. It utilizes the properties of metal—the electromagnetic waves reflected by the metal and the waves radiated by the first antenna layer 2 can be superimposed in phase under certain design (phase relationship), enhancing the signal (instead of the complete detuning of traditional tags). The second antenna layer 3 itself also shields the strong detuning effect caused by the first antenna layer 2 directly contacting the metal.

[0062] When the application environment is liquid, the second antenna layer 3 is located between the liquid and the first antenna layer 2. Since the second antenna layer 3 is a conductor, it shields the first antenna layer 2 from direct interference of the liquid dielectric properties, thus improving the impedance matching deterioration problem of conventional antennas when they are directly close to the liquid.

[0063] The third antenna layer 4 is disposed on the side of the flexible intermediate layer 1 and extends vertically. Its upper end is connected to the first antenna layer 2 and its lower end is connected to the second antenna layer 3, which is used to connect the two physically and electrically. Its size and shape are adjusted to help match the impedance of the first antenna layer 2 and the input impedance of the RF chip 22, thereby achieving the effect of a matching network and improving energy transmission efficiency.

[0064] The outer protective layer 5 is a continuous integrated structure that covers at least a portion of the top surface of the first antenna layer 2, the outer surface of the third antenna layer 4, and the bottom surface of the second antenna layer 3. It is the outermost layer of the tag, directly in contact with the environment, and has the function of protecting the internal materials and being suitable for different environments. Depending on the scenario, some applications can also perform the function of printing or printing information. The materials can be plastic polymers, coated paper, thermal paper, fabrics, etc.

[0065] This invention significantly improves the tag's adaptability in liquid and metal environments through a multi-layer structure design. The special U-shaped patch structure of the first antenna layer 2 excites dual-resonance characteristics, simultaneously covering the ETSI and FCC frequency bands, breaking through the frequency band limitations of traditional single-resonance tags. By setting the second antenna layer 3 as a ground layer, it enhances signal coupling when attached to metal and shields dielectric interference when in contact with liquid. The impedance matching efficiency is optimized by the third antenna layer 4 connected on the side. Furthermore, the third patch 24 is used to adjust stress and stiffness, and the external protective layer 5 provides environmental sealing and mechanical protection. Ultimately, it achieves stable long-distance identification in composite media scenarios, while also possessing multi-band versatility, structural stability, and durability under complex working conditions.

[0066] In some embodiments, such as Figure 2 As shown, a plurality of microgrooves 212 are formed on both sides of the first hollow groove 211 on the first patch 21.

[0067] By setting microgrooves 212, the local stiffness of the first patch 21 is effectively reduced, and the overall flexibility and deformation adaptability of the label are improved, enabling it to fit tightly to the curved carrier and reducing the risk of warping or falling off due to stress concentration.

[0068] In some embodiments, such as Figure 3 As shown, a second hollowed-out groove 31 is provided on the bottom side of the second antenna layer 3 away from the third antenna layer 4.

[0069] By setting the second hollow groove 31, the structural rigidity of the second line layer 3 can be locally weakened, allowing the second line layer 3 to undergo adaptive deformation, increasing the effective contact area, thereby significantly improving the adhesion ability of the label to irregular surfaces.

[0070] In some embodiments, such as Figure 3 and Figure 4As shown, a first positioning mark 32 is provided on the bottom side of the second antenna layer 3 near the third antenna layer 4, and multiple second positioning marks 41 are evenly provided on the third antenna layer 4.

[0071] By setting the first positioning mark 32 and the second positioning mark 41, the assembly accuracy during production and processing is improved, effectively eliminating impedance mismatch and frequency deviation caused by misalignment, and significantly improving the production yield.

[0072] In some embodiments, such as Figure 2 As shown, the first antenna layer 2 also includes:

[0073] Multiple fourth patches 25 are arranged on the side of the first patch 21 away from the third antenna layer 4.

[0074] It should be noted that the fourth patch 25, as a parasitic unit, has no direct electrical connection with the RF chip 22. Its energy transfer mechanism relies on spatial electromagnetic coupling. The coupling principle is as follows: the high-frequency current of the main radiating unit (directly fed to the RF chip 22) generates a time-varying magnetic field, inducing a current on the surface of the parasitic unit, thereby exciting secondary radiation. Its energy transfer efficiency follows... Where k is the coupling coefficient and d is the element spacing, therefore reducing the spacing will significantly enhance the coupling strength.

[0075] It should be noted that the impedance adjustment principle is as follows: the radiation field of the parasitic element acts back on the main radiating element through mutual impedance coupling, changing the impedance matching of its input to the overall antenna. Therefore, by optimizing the geometric parameters (size / shape) and spatial layout (spacing and position with the main radiating element) of the parasitic element, the parameters of the antenna system can be precisely tuned, achieving multi-band impedance matching.

[0076] By setting the fourth patch 25 as a parasitic element, it can form a coordinated resonance with the main radiating element, thereby expanding the bandwidth of the antenna.

[0077] In some embodiments, such as Figures 1-4 As shown, the flexible intermediate layer 1, the first antenna layer 2, and the second antenna layer 3 are all rectangular, and their two ends in the length direction are aligned.

[0078] The above-mentioned full-layer rectangular flush design improves manufacturing efficiency, enhances material utilization, and ensures high-consistency mass production of multi-resonant tags.

[0079] Based on the above embodiments, such as Figure 1 As shown, the upper surface of the third antenna layer 4 is flush with the top surface of the first antenna layer 2, and the lower surface of the third antenna layer 4 is flush with the bottom surface of the second antenna layer 3. This ensures the flatness of the structure and allows the outer protective layer 5 to form a gapless covering, thus improving the sealing effect.

[0080] Based on the above embodiments, such as Figure 1 As shown, the width of the flexible intermediate layer 1 is greater than or equal to the width of the first antenna layer 2, the second antenna layer 3 and the third antenna layer 4, and the two ends of the flexible intermediate layer 1 and the outer protective layer 5 are flush in the width direction.

[0081] By using the width overflow design of the flexible intermediate layer 1 and the edge full-coverage architecture of the outer protective layer 5, full coverage of the antenna layer is achieved, which improves the overall sealing effect while ensuring a neat appearance.

[0082] Numerous specific details are set forth in this specification. However, it will be understood that embodiments of this invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0083] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model, and they should all be covered within the scope of the claims and specification of this utility model.

Claims

1. A multi-resonant special tag, characterized in that, include: Flexible interlayer; The first antenna layer is stacked on the top surface of the flexible intermediate layer; The second antenna layer is stacked on the bottom surface of the flexible intermediate layer; The third antenna layer is disposed on the side of the flexible intermediate layer and extends in the vertical direction, with its upper end connected to the first antenna layer and its lower end connected to the second antenna layer; The outer protective layer is a continuous integral structure that covers at least a portion of the top surface of the first antenna layer, the outer surface of the third antenna layer, and the bottom surface of the second antenna layer. The first antenna layer includes: The first patch has a first hollowed-out groove on it; The radio frequency chip is disposed within the first hollowed-out slot; Two second patches, L-shaped, are disposed opposite each other on both sides of the RF chip to form a U-shaped structure. The long arm of each second patch is connected to the first patch, and the short arm faces the RF chip and is electrically connected to it. The third patch is disposed within the first hollow groove and located on the opposite side of the opening of the U-shaped structure.

2. The multi-resonance special tag according to claim 1, characterized in that, The first patch has several micro-grooves on both sides of the first hollow groove.

3. The multi-resonance special tag according to claim 1, characterized in that, The second antenna layer has a second hollowed-out groove on the bottom surface away from the third antenna layer.

4. The multi-resonance special tag according to claim 1, characterized in that, The second antenna layer has a first positioning mark on the side of the bottom surface near the third antenna layer, and the third antenna layer has a plurality of second positioning marks evenly distributed on it.

5. The multi-resonance special tag according to claim 1, characterized in that, The first antenna layer includes: Multiple fourth patches are arranged on the side of the first patch away from the third antenna layer.

6. The multi-resonance special tag according to claim 1, characterized in that, The flexible intermediate layer, the first antenna layer, and the second antenna layer are all rectangular, and their two ends along their length are aligned.

7. The multi-resonance special tag according to claim 6, characterized in that, The upper surface of the third antenna layer is flush with the top surface of the first antenna layer, and the lower surface of the third antenna layer is flush with the bottom surface of the second antenna layer.

8. The multi-resonance special tag according to claim 6 or the present invention, characterized in that, The width of the flexible intermediate layer is greater than or equal to the width of the first antenna layer, the second antenna layer, and the third antenna layer, and the two ends of the flexible intermediate layer and the outer protective layer are flush in the width direction.

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