Signal acquisition assembly and battery

Abstract

This application relates to a signal acquisition component and a battery, including a conductive component, an insulating component, a signal acquisition module, and a heat-fitting structure. The insulating component is located on one side of the conductive component in a first direction. The signal acquisition module includes an insulating component, a temperature acquisition plate, and a temperature sensor. The insulating component is located on the other side of the conductive component in the first direction, and the temperature acquisition plate is arranged between the conductive component and the insulating component in the first direction. The temperature sensor is electrically connected to the temperature acquisition plate and fixed inside the insulating component. The heat-fitting structure connects the conductive component, the insulating component, and the insulating component, and heat-fits them together. The technical solution of this application improves the connection reliability between the temperature acquisition plate and the battery cell, thereby improving the accuracy of the acquired temperature data of the battery cell. Furthermore, the integrated heat-fitting facilitates production line assembly and significantly reduces material and labor costs.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to signal acquisition components and batteries. Background Technology

[0002] A battery typically consists of multiple individual cells and a busbar, which electrically connects the battery's various terminals. The battery's temperature signal is usually acquired by a temperature acquisition board in a signal acquisition module, which is fixed to the top cover of the individual cells or the busbar with adhesive. If the temperature of the top cover or busbar rises, the adhesive's bonding performance deteriorates under high temperatures. Over prolonged exposure to high temperatures, the connection between the temperature acquisition board and the acquired component loosens, leading to inaccurate temperature readings. Utility Model Content

[0003] Therefore, it is necessary to provide a signal acquisition component and battery to address the problem of inaccurate temperature acquisition caused by a loose connection between the temperature acquisition board and the device being acquired.

[0004] In a first aspect, this application provides a signal acquisition component, including:

[0005] Conductive components;

[0006] An isolator is located on one side of the conductive element in the first direction;

[0007] The signal acquisition module includes:

[0008] An insulating element is located on the other side of the conductive element in the first direction;

[0009] A temperature sensing plate is arranged between the conductive element and the insulating element in the first direction; and,

[0010] A temperature sensor, electrically connected to the temperature acquisition board, and fixed inside the insulating component; and

[0011] A hot-riveting structure connects the conductive component, the insulating component, and the insulating component, and fixes the three components in place by hot riveting.

[0012] In some embodiments, the hot riveting structure includes a hot riveting post disposed on the spacer;

[0013] The conductive component includes a first channel extending along the first direction, and the insulating component includes a second channel extending along the first direction. The first channel and the second channel are coaxially arranged. The hot riveting post passes through the first channel and the second channel, and hot rivets the conductive component, the insulating component, and the insulating component together.

[0014] In some embodiments, the insulating member includes a lug located at the edge of the insulating member and protruding toward the conductive member;

[0015] The lug is inserted into and confined within the first channel, and the second channel is formed within the lug;

[0016] Along the first direction, the projection of the second channel is offset from the projection of the temperature acquisition plate.

[0017] In some embodiments, the first channel includes adjacent first channel segments and second channel segments;

[0018] Along the first direction, the projection of the inner wall of the first channel segment is located outside the projection of the inner wall of the second channel segment, the lug is matched with the shape of the first channel segment, and both the second channel segment and the second channel are matched with the shape of the hot riveting post.

[0019] In some embodiments, the conductive element includes a mounting surface located on the side of the conductive element away from the insulating element in the first direction; the mounting surface is recessed and provided with a positioning groove, and at least the temperature acquisition plate is positioned and mounted in the positioning groove; within the mounting surface, the thermal riveting structure is arranged offset from the positioning groove.

[0020] In some embodiments, the separator includes a clearance portion disposed through the first direction, the clearance portion exposing a portion of the conductive element to allow the exposed conductive element to be electrically connected to the terminal of a battery cell.

[0021] In some embodiments, the signal acquisition module includes a reinforcing member sandwiched between the temperature acquisition plate and the conductive member in the first direction.

[0022] In some embodiments, the insulating component includes a potting hole that extends through the first direction, the temperature sensor is located in the potting hole, and the potting hole is filled with thermally conductive adhesive.

[0023] In some embodiments, the signal acquisition component includes a main acquisition board;

[0024] The temperature acquisition board includes a welding section, a buffer section, and an acquisition section that are sequentially connected adjacent to each other along a second direction intersecting the first direction. The welding section is welded to the main acquisition board, and the acquisition section is located between the insulating component and the conductive component.

[0025] The welding section, the buffer section, and the acquisition section are all covered with an insulating film.

[0026] In some embodiments, the temperature acquisition plate further includes a weak structure, wherein at least one of the insulating film located in the welding section and the insulating film located in the acquisition section is connected to the insulating film located in the buffer section, and the weak structure is configured to break when the buffer section is stretched by an external force.

[0027] In some embodiments, a first hollow area and a second hollow area are formed on the insulating film of the welding segment. The first hollow area and the second hollow area are arranged side by side parallel to the second direction. The first hollow area and the second hollow area are arranged alternately along the second direction, and their projections along the second direction partially intersect or are completely offset in the third direction.

[0028] In some embodiments, the buffer segment includes an arched portion that arches along a first direction. The arched portion is deformed by external force towards its arch height. The deformation direction of the arched portion corresponds to the extension direction of the buffer segment. The width of the arched portion gradually decreases from both sides towards the center in its deformation direction. The insulating member is located on one side of the conductive member in the arching direction of the arched portion. The first direction, the second direction, and the third direction intersect each other and are not coplanar.

[0029] In some embodiments, the buffer section includes a first section, a second section, and a third section that are bent and connected in sequence. The third section and the first section are located at opposite ends in the extension direction of the second section and are respectively connected to the welding section and the acquisition section. The second section is provided with the arched portion.

[0030] Secondly, this application provides a battery, comprising:

[0031] A battery cell, including a terminal post located at one end in a first direction;

[0032] As described in any of the above embodiments, in the signal acquisition component, the isolator is disposed on the battery cell, and the battery cell and the conductive element are arranged on opposite sides of the isolator in the first direction, and the electrode post is electrically connected to the conductive element.

[0033] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0034] The aforementioned signal acquisition components and battery utilize a thermally anchored structure to clamp the temperature acquisition board between the insulating and conductive components. Compared to the existing method of bonding the temperature acquisition board to the conductive components, this method effectively ensures effective thermal contact between the temperature acquisition board and the conductive components in high-temperature environments, improving the connection reliability between the temperature acquisition board and the battery cell, and ensuring the accuracy of the data collected by the temperature sensor. Furthermore, the temperature sensor is fixed to the insulating component, ensuring the stability of its connection with the temperature acquisition board, further improving the accuracy of the acquired data. Moreover, eliminating the need for adhesive removal and pasting processes facilitates production line assembly and reduces material and labor costs, thereby lowering overall costs. Attached Figure Description

[0035] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0036] Figure 1 This is a schematic diagram illustrating the application of signal acquisition components on a battery in some embodiments.

[0037] Figure 2 This is a schematic diagram of the internal structure of a signal acquisition component in some embodiments.

[0038] Figure 3 This is a schematic diagram of the internal structure of the signal acquisition component in some other embodiments.

[0039] Figure 4 for Figure 3 An exploded view of the signal acquisition component in the illustrated embodiment.

[0040] Figure 5 This is an internal structural view of the signal acquisition component in some embodiments.

[0041] Figure 6 This is a schematic diagram of the signal acquisition module in some embodiments.

[0042] Figure 7 This is a schematic diagram of the signal acquisition module in some other embodiments.

[0043] Figure 8 This is a schematic diagram of the signal acquisition module in some other embodiments.

[0044] Figure 9 for Figure 8 A perspective view of the structure shown.

[0045] Figure 10 This is a schematic diagram of the signal acquisition module in some other embodiments.

[0046] The reference numerals in the detailed embodiments are as follows:

[0047] 1000, Battery; 100, Signal Acquisition Component; Z, First Direction; X, Second Direction; Y, Third Direction; 10, Conductive Component; 11, First Channel; 11a, First Channel Segment; 11b, Second Channel Segment; 12, Mounting Surface; 12a, Positioning Groove; 20, Isolator; 21, Clearance Position; 22, Hot Riveting Post; 30, Signal Acquisition Module; 31, Insulating Component; 31a, Second Channel; 31b, Lug; 31c, Potting Hole; 32, Temperature Acquisition Board; 32a, Welding Section; a1, First hollow area; a2, Second hollow area; 32b, Buffer section; g, Arched part; b1, First section; b2, Second section; b3, Third section; 32c, Acquisition section; 32A, Positive conductive layer; 32B, Negative conductive layer; 32C, Insulating film; 32d, Weak structure; 32e, Solder hole; 33, Temperature sensor; 34, Reinforcing component; 35, Thermally conductive adhesive; R, Hot riveting structure; 40, Main acquisition board; 200, Battery cell; 201, Terminal post. Detailed Implementation

[0048] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0049] In the description of this application, it should be understood that, where they appear, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0050] Furthermore, where applicable, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0051] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., shall be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral part; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; they may refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0052] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0053] It should be noted that, if an element is described as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is described as "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0054] This application provides a signal acquisition component and a battery to address the problems mentioned in the background art.

[0055] The battery in this embodiment includes a battery cell and a signal acquisition component. The signal acquisition component is capable of acquiring the temperature signal of the battery cell. The battery cell can be a secondary battery or a primary battery. The battery cell can be a lithium-sulfur battery, a sodium-ion battery, a lithium-ion battery, or a magnesium-ion battery, but is not limited to these. The battery cell can be cylindrical, flat, cuboid, prism, or other shapes.

[0056] In some embodiments, the battery cell includes a housing, an end cap, and an electrode assembly. The housing and the end cap together form an internal space for accommodating the electrode assembly. Specifically, a receiving cavity may be formed within the housing, with at least one end open. The end cap closes to the open end of the housing to seal the receiving cavity, and the electrode assembly is mounted within the receiving cavity. The housing may be, but is not limited to, a metal housing, such as an aluminum housing or a steel housing.

[0057] Electrode assemblies typically include a positive electrode, a negative electrode, and a separator separating the positive and negative electrodes. An electrolyte can be injected into the battery cell, allowing it to penetrate the electrode assembly and provide ion migration pathways for electrochemical reactions, as well as conductivity. Electrode assemblies can be in the form of wound, stacked, or other types. One or more electrode assemblies can be installed within a single battery cell.

[0058] Each battery cell is provided with a terminal post and an explosion-proof valve. In some embodiments, the terminal post and the explosion-proof valve are arranged on the same side of the battery cell. Specifically, the terminal post and the explosion-proof valve are arranged on the end cap. The terminal post includes a positive terminal post and a negative terminal post. The positive electrode has a positive tab, and the negative electrode has a negative tab. The positive terminal post is electrically connected to the positive tab, and the negative terminal post is electrically connected to the negative tab.

[0059] The aforementioned battery can be a battery pack or a battery module. When the battery is a battery pack, the battery pack also includes a battery management system (BMS). Multiple battery cells can be electrically connected in series, parallel, or a combination of series and parallel connections, and communicate with the battery management system, which controls and monitors the operating status of each battery cell. Alternatively, multiple battery cells can first be combined with a module management system to form a battery module, and then multiple battery modules can be electrically connected in series, parallel, or a combination of series and parallel connections to form a battery pack together with the battery management system.

[0060] The signal acquisition components in the embodiments of this application are described below.

[0061] Figure 1 This is a schematic diagram illustrating the application of the signal acquisition component 100 in a battery 1000 according to some embodiments. Figure 2 This is a schematic diagram of the internal structure of the signal acquisition component 100 in some embodiments.

[0062] Reference Figure 1 and Figure 2The signal acquisition component 100 of this application embodiment includes a conductive element 10, an isolating element 20, a signal acquisition module 30, and a thermal riveting structure R. The isolating element 20 is located on one side of the conductive element 10 in the first direction Z. The signal acquisition module 30 includes an insulating element 31, a temperature acquisition plate 32, and a temperature sensor 33. The insulating element 31 is located on the other side of the conductive element 10 in the first direction Z, and the temperature acquisition plate 32 is arranged between the conductive element 10 and the insulating element 31 in the first direction Z. The temperature sensor 33 is electrically connected to the temperature acquisition plate 32 and fixed inside the insulating element 31. The thermal riveting structure R connects the conductive element 10, the isolating element 20, and the insulating element 31, and thermally rivets them together.

[0063] The conductive component 10 can be in the form of a sheet or a thin plate, and is used to connect to the terminal 201, specifically by welding, snap-fitting, etc. The conductive component 10 can be made of conductive materials such as copper or aluminum. In practical applications, the conductive component 10 can serve as a busbar structure for the battery 1000, enabling series / parallel connections between the terminals 201 of multiple battery cells 200.

[0064] The insulating member 31 and the isolating member 20 are arranged on opposite sides of the conductive member 10 in the first direction Z. The isolating member 20 may be in the form of a thin plate. The first direction Z corresponds to the direction on which the terminal post 201 of the battery cell 200 is located. In a state of use, the first direction Z is vertical, specifically the height direction of the battery cell 200. Both the insulating member 31 and the isolating member 20 have the effect of electrical isolation, and both may be made of polymer materials such as polyethylene terephthalate (PET), polyimide (PI), polypropylene (PP), and polyethylene (PE), but are not limited to these materials.

[0065] Can the temperature acquisition board 32 include an insulating film 32C and a circuit layer, with the insulating film 32C covering the circuit layer? The insulating film 32C can be a PI film layer, a PET film layer, etc. The circuit layer can be a copper foil layer, an aluminum foil layer, a silver foil layer, etc. The temperature sensor 33 is electrically connected to the circuit layer, and its acquired data is transmitted outward through this circuit layer. The temperature sensor 33 can be, but is not limited to, a thermistor. The temperature sensor 33 is fixedly disposed inside the insulating component 31, which serves to protect the temperature sensor 33.

[0066] The hot-riveting structure R is made of thermoplastic plastic, which hot-rivets the conductive component 10, the insulating component 20 and the insulating component 31. This not only facilitates integration and makes the battery 1000 lighter and more organized, but also provides a very secure fixation, preventing the components from loosening during vibration or movement, and improving the reliability and stability of the battery 1000.

[0067] In practical applications, the terminal post 201 is mounted on the top cover of the battery cell 200, and the separator 20 is supported on the top cover. From bottom to top, the top cover is sequentially arranged with the separator 20, the conductive element 10, the temperature sensing plate 32, and the insulating element 31. With the connection of the thermal riveting structure R, the insulating element 31 presses the temperature sensing plate 32 firmly onto the conductive element 10, ensuring reliable thermal contact between the temperature sensing plate 32 and the conductive element 10. This also facilitates the installation of the temperature sensor 33, simplifying the structure of the battery 1000 and reducing costs.

[0068] In this embodiment, the thermal riveting structure R clamps the temperature acquisition plate 32 between the insulating component 31 and the conductive component 10. Compared to the prior art where the temperature acquisition plate 32 is bonded to the conductive component 10, this method effectively ensures effective thermal contact between the temperature acquisition plate 32 and the conductive component 10 under high-temperature conditions, ensuring the accuracy of the data collected by the temperature sensor 33. Furthermore, the temperature sensor 33 is fixed by the insulating component 31, ensuring the stability of its connection with the temperature acquisition plate 32, further improving the accuracy of the collected data. Moreover, the thermal riveting process enables automated control, eliminating the need for adhesive removal and pasting processes, which is beneficial for production line assembly, improves production efficiency, and reduces material and labor costs, thereby lowering overall costs.

[0069] In some embodiments, the insulating member 20 has a heat insulation function. For example, the material of the insulating member 20 can be selected as polytetrafluoroethylene, polypropylene, etc., which have good heat insulation properties, or a heat insulation layer can be provided on the surface of the insulating member 20 to achieve a heat insulation effect. In this case, the insulating member 20 can block the conductive member 10 and the top cover of the battery cell 200. At this time, whether the heat insulation member 20 is in contact with the top cover of the battery cell 200 or not, it will not affect the temperature sensor 33's acquisition of the temperature of the conductive member 10, thereby improving the accuracy of the temperature acquisition of the conductive member 20.

[0070] In other embodiments, the separator 20 does not have a heat insulation function. In this case, the separator 20 is supported on the top cover. The heat conducted from the battery cell 200 through the terminal post 201 and the heat conducted through the top cover are both conducted to the temperature acquisition plate 32 through the conductive component 10. This makes the data collected by the temperature sensor 33 more accurately reflect the actual temperature of the battery cell 200 and improves the accuracy of the data collected by the temperature sensor 33.

[0071] In some embodiments, refer to Figure 2 The hot-riveting structure R includes a hot-riveting post 22, which is disposed on the insulating member 20. The conductive member 10 includes a first channel 11 extending along the first direction Z, and the insulating member 31 includes a second channel 31a extending along the first direction Z. The first channel 11 and the second channel 31a are coaxially arranged. The hot-riveting post 22 passes through the first channel 11 and the second channel 31a, and hot-rivets the conductive member 10, the insulating member 20, and the insulating member 31 together.

[0072] Specifically, the hot riveting post 22 and the isolation member 20 can be integrally formed. One end of the hot riveting post 22 is integrally formed with the isolation member 20, and the other end passes through the first channel 11 and the second channel 31a in sequence. After being hot riveted, it forms a mushroom head, which presses the insulating member 31 and the conductive member 10 onto the isolation member 20. This can position and insulate the signal acquisition module 30, while also achieving effective and stable thermal contact between the temperature acquisition board 32 and the conductive member 10.

[0073] Specifically, the first channel 11 can be a hole or groove structure formed on the conductive member 10, and the second channel 31a can be a hole or groove structure formed on the insulating member 31.

[0074] In actual assembly, the hot riveting post 22 is first used to cooperate with the first channel 11 and the second channel 31a to position the conductive part 10 and the insulating part 31 on the insulating part 20. Then, the part of the hot riveting post 22 extending out of the second channel 31a is hot riveted to form a mushroom head, and the three are fixedly connected.

[0075] Thus, the hot riveting post 22 has both connection and positioning functions, and the hot riveting post 22 only forms a mushroom head at one end, which can reduce processing costs and improve production efficiency.

[0076] Of course, in other embodiments, a corresponding channel can be provided on the isolation member 20 to pass through the hot riveting structure R, and mushroom heads can be formed at both ends of the hot riveting structure R to fix the three together.

[0077] It should be noted that, in one embodiment, there are multiple isolators 20, each corresponding one-to-one with a plurality of conductive elements 10, thereby allowing for adaptive settings of the size of the isolators 20, the position of the hot-riveting posts 22, etc., to achieve a fixed connection with different conductive elements 10. In another embodiment, the isolator 20 can be a single unit, corresponding to multiple conductive elements 10, as shown in the reference. Figure 1 As shown, the hot riveting post 22 can be set at different positions of the insulating member 20 according to the position of the conductive member 10. Different hot riveting posts 22 can correspond to different conductive members 10, thereby fixing multiple conductive members 10 to different positions of the insulating member 20, improving the overall integration, and facilitating production and installation.

[0078] Figure 3 This is a schematic diagram of the internal structure of the signal acquisition component 100 in some other embodiments.

[0079] In some embodiments, refer to Figure 2 and Figure 3The insulating member 31 includes a lug 31b, which is located at the edge of the insulating member 31 and protrudes toward the conductive member 10. The lug 31b is inserted into and confined in the first channel 11, and the second channel 31a is formed in the lug 31b. Along the first direction Z, the projection of the second channel 31a is offset from the projection of the temperature acquisition plate 32.

[0080] The second channel 31a is offset from the temperature acquisition board 32, indicating that the hot riveting post 22 does not penetrate the temperature acquisition board 32. This eliminates the need to set a corresponding avoidance structure on the temperature acquisition board 32, thereby reducing the processing cost of the signal acquisition component 100.

[0081] In addition, the lug 31b can be inserted into the first channel 11. During assembly, the lug 31b is used to position the insulating part 31 and the conductive part 10 of the signal acquisition module 30 before the hot riveting post 22 on the isolation part 20 is inserted, which can improve the processing efficiency of the signal acquisition component 100.

[0082] In some embodiments, refer to Figure 2 and Figure 3 The first channel 11 includes adjacent first channel segments 11a and second channel segments 11b. Along the first direction Z, the projection of the inner wall of the first channel segment 11a is located outside the projection of the inner wall of the second channel segment 11b. The lug 31b is matched with the shape of the first channel segment 11a. Both the second channel segment 11b and the second channel 31a are matched with the shape of the hot riveting post 22.

[0083] In other words, the first channel segment 11a and the second channel segment 11b are coaxial, and the inner diameter of the former is larger than that of the latter. The first channel segment 11a is used for positioning and installing the lug 31b, and the second channel segment 11b is used for mating and connecting the hot-riveting post 22. In this way, the second channel 31a can be adapted to both install the lug 31b and install the hot-riveting post 22, enhancing the reliability and stability of the connection.

[0084] Figure 4 for Figure 3 An exploded view of the signal acquisition component 100 in the illustrated embodiment.

[0085] In some embodiments, combined with Figure 3 and Figure 4 It is understood that the conductive element 10 includes a mounting surface 12, which is located on the side of the conductive element 10 facing away from the isolator 20 in the first direction Z. The mounting surface 12 is recessed in the positioning groove 12a, and at least the temperature acquisition plate 32 is positioned and mounted in the positioning groove 12a.

[0086] Alternatively, only the temperature acquisition plate 32 may be disposed within the positioning groove 12a. Alternatively, the entire temperature acquisition plate 32 and the insulating component 31 may be disposed within the positioning groove 12a. In this case, the positioning groove 12a can position the temperature acquisition plate 32 on the conductive component 10, thereby accelerating the processing efficiency of the signal acquisition assembly 100.

[0087] In some embodiments, the hot riveting structure R is staggered from the positioning groove 12a within the mounting surface 12. The portion of the conductive element 10 containing the positioning groove 12a is equivalent to a thinning process. The hot riveting structure R is staggered from the positioning groove 12a, meaning that the hot riveting structure R is located in the relatively thicker portion of the conductive element 10, which has a relatively small impact on the structure of the conductive element 10 and helps to improve the structural strength of the conductive element 10.

[0088] Figure 5 This is an internal structural view of the signal acquisition component 100 in some embodiments.

[0089] In some embodiments, refer to Figure 4 and Figure 5 The isolation member 20 includes a clearance portion 21, which is disposed through the first direction Z. The clearance portion 21 exposes a portion of the conductive member 10 to allow the exposed conductive member 10 to be electrically connected to the terminal post 201 of the battery cell 200.

[0090] Specifically, the clearance position 21 is a hole, slot, or other opening provided on the separator 20. In practical applications, a portion of the terminal post 201 may pass through the clearance position 21 and be electrically connected to the conductive element 10. Alternatively, a portion of the conductive element 10 may protrude into the clearance position 21 and be electrically connected to the terminal post 201 of the battery cell 200. Or, an adapter may be provided, which is welded to the terminal post 201, passes through the clearance position 21, and is electrically connected to the conductive element 10 exposed by the clearance position 21.

[0091] Figure 6 This is a schematic diagram of the structure of the signal acquisition module 30 in some embodiments.

[0092] In some embodiments, refer to Figure 3 , Figure 4 , Figure 5 and Figure 6 The signal acquisition module 30 includes a reinforcing member 34, which is sandwiched between the temperature acquisition plate 32 and the conductive member 10 in the first direction Z.

[0093] The reinforcing member 34 is located on the side of the temperature acquisition plate 32 opposite to the temperature sensor 33. The temperature acquisition plate 32 is usually thin. The reinforcing member 34 serves two purposes: first, it enhances the physical protection of the temperature acquisition plate 32; second, it absorbs and disperses external forces, acting as a damping and shock absorber, reducing mechanical fatigue caused by vibration or impact, and extending its service life. If subjected to vibration or impact, the reinforcing member 34 can effectively prevent false triggering, ensuring the accuracy of the measurement data.

[0094] Understandably, the reinforcing member 34 thermally connects the temperature sensing plate 32 and the conductive member 10. The reinforcing member 34 may be in the form of a thin plate. When the aforementioned positioning groove 12a is formed on the conductive member 10, the reinforcing member 34 is disposed within the positioning groove 12a. Both the reinforcing member 34 and the temperature sensing plate 32 may be adapted to the shape of the positioning groove 12a. The reinforcing member 34 may be bonded to the temperature sensing plate 32. The reinforcing member 34 may be an epoxy board.

[0095] In some embodiments, refer to Figure 3 , Figure 4 and Figure 5 The insulating component 31 includes a potting hole 31c, which is disposed through the first direction Z. The temperature sensor 33 is located in the potting hole 31c, and the potting hole 31c is filled with thermally conductive adhesive 35.

[0096] In practical applications, after the insulating component 31 is placed on the upper side of the temperature acquisition plate 32, the temperature sensor 33 is located in the potting hole 31c of the insulating component 31. Thermally conductive adhesive 35 is poured into the potting hole 31c from above. The thermally conductive adhesive 35 covers the temperature sensor 33, which not only achieves the fixation and protection of the temperature sensor 33, but also initially fixes the insulating component 31 and the temperature acquisition plate 32. It also helps the heat of the area on the temperature acquisition plate 32 other than the temperature sensor 33 to be evenly transferred to the temperature sensor 33 through the insulating component 31 and the thermally conductive adhesive 35, making its acquisition more accurate.

[0097] Figure 7 and Figure 8 This is a schematic diagram of the signal acquisition module 30 in different embodiments. Figure 8 This is a schematic diagram of the structure of the signal acquisition module 30 in some other embodiments. Figure 9 for Figure 8 A perspective view of the structure shown.

[0098] In some embodiments, refer to Figures 7 to 9 and combined Figure 1Understandably, the signal acquisition component 100 includes a main acquisition board 40, and the temperature acquisition board 32 includes a welding section 32a, a buffer section 32b, and an acquisition section 32c that are sequentially connected adjacently along a second direction X intersecting the first direction Z. The welding section 32a is welded to the main acquisition board 40, and the acquisition section 32c is located between the insulating component 31 and the conductive component 10. The welding section 32a, the buffer section 32b, and the acquisition section 32c all include an insulating film 32C.

[0099] The main acquisition board 40 can be a flexible circuit board, a flat flexible cable, etc., used to connect the data collected by the temperature acquisition board 32 to the signal of the battery management system on the battery 1000 through its connection terminals, so as to transmit the acquired data to the battery management system.

[0100] The temperature acquisition board 32 includes the aforementioned insulating film 32C and a circuit layer. The insulating film 32C extends along the second direction X and sequentially passes through the welding section 32a, the buffer section 32b, and the acquisition section 32c. The circuit layer also extends along the second direction X and sequentially passes through the welding section 32a, the buffer section 32b, and the acquisition section 32c. That is, the welding section 32a, the buffer section 32b, and the acquisition section 32c all include the insulating film 32C and the circuit layer, with the insulating film 32C covering the circuit layer and each section integrally connected. Understandably, the buffer section 32b is elastically deformable and buffers the connection between the welding section 32a and the acquisition section 32c in its deformation direction. Specifically, the buffer section 32b can be in an S-shape, double S-shape, U-shape, C-shape, or other tortuous extension shape.

[0101] Alternatively, the main acquisition board 40 and the temperature acquisition board 32 can be arranged on the same side of the isolation member 20. In practical applications, the isolation member 20 is electrically isolated between the main acquisition board 40 and the battery cell 200.

[0102] Figure 10 This is a schematic diagram of the structure of the signal acquisition module 30 in some other embodiments.

[0103] In some embodiments, refer to Figure 10 The temperature acquisition plate 32 also includes a weak structure 32d. At least one of the insulating film 32C located in the welding section 32a and the insulating film 32C located in the acquisition section 32c is connected to the insulating film 32C located in the buffer section 32b by the weak structure 32d. The weak structure 32d is configured to break when the buffer section 32b is stretched by an external force.

[0104] The weak structure 32d is composed of an insulating film 32C. The cross-section of the weak structure 32d is small, and its tensile strength is weak, making it easy to break. Specifically, the breaking force of the weak structure 32d is less than the welding peeling force of the welding section 32a, to ensure that the weak structure 32d is broken before the temperature acquisition plate 32 detaches from the main acquisition plate 40, so that the buffer section 32b can exert its buffering capacity and prevent the weld joint from detaching.

[0105] In practical applications, when welding the welding section 32a and the main acquisition board 40, the weak structure 32d can be used to limit the position of the buffer section 32b relative to the welding section 32a and / or the acquisition section 32c. The buffer section 32b is less prone to micro-deformation, thus improving the problem of welding position changes caused by micro-deformation of the buffer section 32b and enhancing welding reliability. When the main acquisition board 40 and the battery cell 200 change position due to factors such as expansion of the battery cell 200, the weak structure 32d will also break under tension during the tensile deformation of the buffer section 32b. The broken weak structure 32d will not restrict the deformation of the buffer section 32b, thus allowing the buffer section 32b to function effectively and reducing the risk of tearing or detachment of the temperature acquisition board 32.

[0106] In some embodiments, refer to Figures 7 to 10 A first hollow area a1 and a second hollow area a2 are formed on the insulating film 32C of the welding section 32a. The first hollow area a1 and the second hollow area a2 are arranged side by side parallel to the second direction X. The first hollow area a1 and the second hollow area a2 are arranged alternately along the second direction X, and their projections along the second direction X partially intersect or are completely offset in the third direction Y.

[0107] The first cutout area a1 and the second cutout area a2 are both used to expose the circuit layer so that the circuit layer of the soldering section 32a can be soldered to the main acquisition board 40. Understandably, the circuit layer of the temperature acquisition board 32 includes a positive conductive layer 32A and a negative conductive layer 32B, with an insulating film 32C covering and separating them to prevent short circuits. The positive conductive layer 32A is electrically connected to the positive electrode of the temperature sensor 33, and the negative conductive layer 32B is electrically connected to the negative electrode of the temperature sensor 33. The first cutout area a1 is used to expose the positive conductive layer 32A, and the areas of the positive conductive layer 32A exposed by the multiple first cutout areas a1 are defined as positive electrode soldering positions. The second cutout area a2 is used to expose the negative conductive layer 32B, and the areas of the negative conductive layer 32B exposed by the multiple second cutout areas a2 are defined as negative electrode soldering positions.

[0108] Understandably, the main acquisition board 40 is welded with multiple temperature acquisition boards 32 to enable the transmission of data collected from multiple battery cells 200. In practical applications, taking the main acquisition board 40 as a flat flexible cable as an example, the flat flexible cable includes multiple conductors arranged parallel to each other and spaced apart along the second direction X. The positive electrode conductive layer 32A of each temperature acquisition board 32 is selected to be welded to one of the conductors at one of its positive electrode welding positions, and the conductors welded to the positive electrode conductive layer 32A of different temperature acquisition boards 32 are different. Similarly, the negative electrode conductive layer 32B of each temperature acquisition board 32 is selected to be welded to one of its negative electrode welding positions at one of the conductors, and the conductors welded to the negative electrode conductive layer 32B of different temperature acquisition boards 32 are different. Each conductor is welded to either the negative electrode conductive layer 32B or the positive electrode conductive layer 32A.

[0109] At this point, multiple positive electrode welding positions are exposed through multiple first hollow areas a1, and multiple negative electrode welding positions are exposed through multiple second hollow areas a2. Multiple temperature acquisition boards 32 of the same specification can be welded to different wires by selecting different positions for the positive and negative electrode welding positions, without interference between their arrangement. This allows for standardized specifications of the temperature acquisition boards 32, enabling mass production, reducing production costs, and improving production efficiency.

[0110] Furthermore, the first hollow area a1 and the second hollow area a2 are arranged alternately in the second direction X. The positive and negative electrode welding positions of the same temperature acquisition board 32 can be selected from two adjacent wires for welding, making it less likely for the welding position to be incorrect. In addition, the projections of the first hollow area a1 and the second hollow area a2 along the second direction X are staggered or partially intersecting in the third direction Y, which helps to identify the positive and negative electrode welding positions and makes it less likely for the positive and negative electrode welding positions to be reversed.

[0111] It is worth mentioning that the first direction Z, the second direction X, and the third direction Y intersect each other but are not coplanar. In practical applications, the third direction Y corresponds to the width direction of the temperature acquisition plate 32, the second direction X corresponds to the extension direction of the temperature acquisition plate 32, and the first direction Z corresponds to the thickness direction of the temperature acquisition plate 32.

[0112] When the projections of the first hollow area a1 and the second hollow area a2 along the second direction X partially intersect in the third direction Y, it helps to reduce the size of the temperature sensing plate 32 in the third direction Y, making the structure of the temperature sensing plate 32 more compact and improving space utilization. When the projections of the first hollow area a1 and the second hollow area a2 along the second direction X are completely staggered in the third direction Y, it helps to improve the strength of the temperature sensing plate 32.

[0113] It is worth noting that each cutout area (including the first cutout area a1 and the second cutout area a2) does not exceed the range of the circuit layer (including the positive conductive layer 32A and the negative conductive layer 32B), ensuring that the circuit layer near each cutout area is covered and fixed by the insulating layer, avoiding the exposure of the circuit layer edge by the cutout area, which helps to improve the tensile strength of the circuit layer and prevent the circuit layer from warping.

[0114] In some embodiments, refer to Figures 7 to 9 Solder holes 32e are provided on the positive conductive layer 32A and the negative conductive layer 32B. The first cutout area a1 exposes the solder holes 32e of the positive conductive layer 32A, and the second cutout area a2 includes the solder holes 32e of the negative conductive layer 32B.

[0115] The solder hole 32e passes through the welding position (including the positive and negative welding positions) in the third direction Y. In practical applications, the solder flows through the solder hole 32e between the welding section 32a and the main acquisition board 40 to weld the welding section 32a to the main acquisition board 40 and enhance the welding strength of the two.

[0116] Yes, multiple solder holes 32e can be provided at each welding position, which not only improves welding efficiency but also increases welding strength.

[0117] In some embodiments, refer to Figure 8 and Figure 9 The buffer section 32b includes an arched portion g that arches along the first direction Z. The arched portion g can be compressed and deformed towards its arch height when subjected to external force, and the deformation direction of the arched portion g corresponds to the extension direction of the buffer section 32b.

[0118] Specifically, the arched portion g is in the shape of a semi-circle, U-shape, C-shape, or other arches. The arch height of the arched portion g is the end that protrudes away from the welding section 32a or the acquisition section 32c in the first direction Z, roughly located in its middle position. When the buffer section 32b deforms under the expansion force generated by the expansion of the battery cell 200, the arched portion g can be squeezed and deformed towards its arch height or stretched and deformed away from its arch height. The structure is simple, easy to implement, and can better adapt to limited space, making the entire structure more compact and reasonable.

[0119] At this time, the arched part g is used to achieve the deformation of the buffer section 32b. This deformation can not only reduce the transmission of impact force, but also protect the circuit layer from the cumulative effect of repeated impacts, thereby extending the service life of the temperature acquisition board 32 and improving its reliability.

[0120] In some embodiments, refer to Figure 8 The width of the arched section g gradually decreases from both sides towards the center in its deformation direction. The wider sides increase the overall rigidity of the temperature sensing plate 32, enabling it to better resist bending deformation and provide sufficient support and protection. The gradually narrowing section in the middle maintains flexibility to some extent, allowing the entire arched section g to remain stable while also deforming flexibly under stress. The width of the arched section g is... Figure 8 The dimension indicated by w. At this time, the width of the middle part of the arch g is relatively small. When the arch g is compressed and deformed, the resistance provided by the arch height is smaller, which makes the deformation response of the arch g more rapid when it is compressed.

[0121] In some embodiments, refer to Figure 8The insulating member 31 is located on one side of the conductive member 10 in the arched direction of the arched portion g. That is, the arched direction of the arched portion g is consistent with the direction of the insulating member 31 relative to the conductive member 10. In practical applications, the arched portion g arches upwards, and the insulating member 31 is arranged above the conductive member 10. At this time, with the arched portion g and the insulating member 31 arranged on the same side, the arched portion g arches away from the isolator 20, and its deformation is less likely to be interfered with by the isolator 20.

[0122] In a further embodiment, such as Figure 8 and Figure 9 As shown, the buffer section 32b includes a first section b1, a second section b2 and a third section b3 connected in sequence by bending. The third section b3 and the first section b1 are located at opposite ends in the extension direction of the second section b2 and are respectively connected to the welding section 32a and the acquisition section 32c. An arched part g is provided on the second section b2.

[0123] In some cases, the expansion force of the battery cell 200 is approximately along the third direction Y. In this case, setting the third segment b3 to intersect with the first segment b1 and the second segment b2, so that the third region extends approximately along the third direction Y, and thus the arched part g on it deforms approximately along the third direction Y, can effectively adapt to the position change of the signal acquisition board caused by the expansion of the battery cell 200, improve the deformation capability of the buffer segment 32b in the direction of battery cell expansion, greatly reduce the risk of temperature acquisition board 32 detachment and breakage, and optimize space utilization in the second direction X.

[0124] Understandably, the solutions in the above embodiments can be freely combined to obtain more embodiments as long as they do not conflict.

[0125] Additionally, refer to Figure 1 The battery 1000 provided in this application embodiment includes a battery cell 200 and a signal acquisition component 100 of any of the above embodiments. The battery cell 200 includes a terminal post 201 located at one end in the first direction Z. An insulating member 20 is disposed on the battery cell 200, and the battery cell 200 and the conductive member 10 are arranged on opposite sides of the insulating member 20 in the first direction Z. The terminal post 201 is electrically connected to the conductive member 10.

[0126] Typically, the battery 1000 includes multiple battery cells 200. The multiple battery cells 200 can be arranged side by side along a third direction, and the same signal acquisition component 100 can simultaneously acquire temperature signals from multiple battery cells 200 through its multiple signal acquisition modules 30.

[0127] The battery 1000 includes all the beneficial effects described above.

[0128] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0129] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A signal acquisition assembly (100), characterized by, include: Conductive component (10); The isolator (20) is located on one side of the conductive element (10) in the first direction (Z); The signal acquisition module (30) includes: An insulating element (31) is located on the other side of the conductive element (10) in the first direction (Z); A temperature acquisition plate (32) is arranged in the first direction (Z) between the conductive element (10) and the insulating element (31); and, A temperature sensor (33) is electrically connected to the temperature acquisition board (32) and fixed inside the insulating component (31); and A hot-riveting structure (R) connects the conductive element (10), the insulating element (20), and the insulating element (31), and hot-rivets the three together.

2. The signal acquisition assembly (100) according to claim 1, characterized in that The hot riveting structure (R) includes a hot riveting post (22), which is disposed on the isolation member (20); The conductive element (10) includes a first channel (11) extending along the first direction (Z), and the insulating element (31) includes a second channel (31a) extending along the first direction (Z). The first channel (11) and the second channel (31a) are coaxially arranged. The hot riveting post (22) passes through the first channel (11) and the second channel (31a) and hot rivets the conductive element (10), the insulating element (20) and the insulating element (31) together.

3. The signal acquisition assembly (100) of claim 2, characterized in that, The insulating member (31) includes a lug (31b) which is located at the edge of the insulating member (31) and protrudes toward the conductive member (10); The lug (31b) is inserted into and confined in the first channel (11), and the second channel (31a) is formed in the lug (31b); Along the first direction (Z), the projection of the second channel (31a) is offset from the projection of the temperature acquisition plate (32).

4. The signal acquisition assembly (100) of claim 3, characterized in that, The first channel (11) includes an adjacent first channel segment (11a) and a second channel segment (11b); Along the first direction (Z), the projection of the inner wall of the first channel segment (11a) is located outside the projection of the inner wall of the second channel segment (11b), the lug (31b) is matched with the shape of the first channel segment (11a), and both the second channel segment (11b) and the second channel (31a) are matched with the shape of the hot riveting post (22).

5. The signal acquisition assembly (100) according to any one of claims 1-4, characterized in that, The conductive element (10) includes a mounting surface (12), which is located on the side of the conductive element (10) facing away from the insulating element (20) in the first direction (Z); the mounting surface (12) is recessed and provided with a positioning groove (12a), at least the temperature acquisition plate (32) is positioned and installed in the positioning groove (12a); within the mounting surface (12), the hot riveting structure (R) is staggered from the positioning groove (12a); and / or, The isolation element (20) includes a clearance portion (21) which is disposed through the first direction (Z) and exposes a portion of the conductive element (10) to allow the exposed conductive element (10) to be electrically connected to the terminal (201) of the battery cell (200).

6. The signal acquisition assembly (100) according to any one of claims 1-4, characterized in that, The signal acquisition module (30) includes a reinforcing member (34), which is sandwiched between the temperature acquisition plate (32) and the conductive member (10) in the first direction (Z); and / or, The insulating component (31) includes a potting hole (31c), which is disposed through the first direction (Z). The temperature sensor (33) is located in the potting hole (31c), and the potting hole (31c) is filled with thermally conductive adhesive (35).

7. The signal acquisition assembly (100) according to any one of claims 1-4, characterized in that, The signal acquisition component (100) includes a main acquisition board (40); The temperature acquisition board (32) includes a welding section (32a), a buffer section (32b), and an acquisition section (32c) that are sequentially connected adjacent to each other along a second direction (X) that intersects the first direction (Z). The welding section (32a) is welded to the main acquisition board (40), and the acquisition section (32c) is located between the insulating component (31) and the conductive component (10). The welding section (32a), the buffer section (32b), and the acquisition section (32c) are all covered with an insulating film (32C).

8. The signal acquisition assembly (100) of claim 7, characterized in that, The temperature acquisition plate (32) further includes a weak structure (32d), wherein at least one of the insulating film (32C) located in the welding section (32a) and the insulating film (32C) located in the acquisition section (32c) is connected to the insulating film (32C) located in the buffer section (32b) via the weak structure (32d), the weak structure (32d) being configured to break when the buffer section (32b) is subjected to tensile elongation by an external force; and / or, A first hollow area (a1) and a second hollow area (a2) are formed on the insulating film (32C) of the welding segment (32a). The first hollow area (a1) and the second hollow area (a2) are arranged side by side parallel to the second direction (X). The first hollow area (a1) and the second hollow area (a2) are arranged alternately along the second direction (X), and their projections along the second direction (X) partially intersect or are completely offset in the third direction (Y); and / or, The buffer section (32b) includes an arched portion (g) that arches along a first direction (Z). The arched portion (g) can be deformed by external force towards its arch height. The deformation direction of the arched portion (g) corresponds to the extension direction of the buffer section (32b). The width of the arched portion (g) gradually decreases from both sides to the middle in its deformation direction. The insulating member (31) is located on one side of the conductive member (10) in the arching direction of the arched portion (g). The first direction (Z), the second direction (X), and the third direction (Y) intersect each other and are not coplanar.

9. The signal acquisition assembly (100) of claim 8, characterized in that, The buffer section (32b) includes a first section (b1), a second section (b2), and a third section (b3) that are bent and connected in sequence. The third section (b3) and the first section (b1) are located at opposite ends in the extension direction of the second section (b2) and are respectively connected to the welding section (32a) and the acquisition section (32c). The arched part (g) is provided on the second section (b2).

10. A battery, characterized by include: A battery cell (200) includes a terminal post (201) located at one end in a first direction (Z). ； In the signal acquisition component (100) as described in any one of claims 1-9, the isolator (20) is disposed on the battery cell (200), and the battery cell (200) and the conductive element (10) are arranged on opposite sides of the isolator (20) in the first direction (Z), and the terminal (201) is electrically connected to the conductive element (10).

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