A millimeter-wave transceiver

Abstract

This utility model discloses a millimeter-wave transceiver device, including a device body, a stepped groove for embedding an RF transceiver module, a baseband processing module, and a power module, two sets of antenna interfaces on one side of the RF transceiver module, a data interface on one side of the baseband processing module, an array of heat dissipation fins at the bottom of the device body, and a cover plate connected to the top by a fixing mechanism. The stepped groove of this utility model provides installation space for the RF transceiver module, the baseband processing module, and the power module. The RF transceiver module can transmit and receive millimeter-wave signals through the two sets of antenna interfaces, and the baseband processing module can output the processed signals through the data interface. During operation, heat can be conducted through the device body to the array of heat dissipation fins for dissipation. The cover plate can be easily removed and installed by the fixing mechanism for maintenance of the internal modules. Thus, through the above structure, the signal transmission stability, operational reliability, and maintenance convenience of the millimeter-wave transceiver device are improved as a whole.

Description

Technical Field

[0001] This utility model relates to the field of millimeter-wave communication technology, specifically to a millimeter-wave transceiver device. Background Technology

[0002] Millimeter wave technology, with its unique advantages in the 30-300GHz frequency band, is increasingly widely used in fields such as 5G / 6G ultra-wideband communication, millimeter wave radar high-precision detection, and security imaging. Its large bandwidth characteristics can support data transmission rates of more than 10Gbps, while its strong directionality can achieve centimeter-level detection accuracy.

[0003] Existing millimeter-wave transceivers suffer from the following drawbacks: Loose structure: The RF module and baseband module are separate, and cable connections lead to significant signal loss; Insufficient heat dissipation: Millimeter-wave devices generate high heat density during operation, and traditional aluminum casings have low heat dissipation efficiency, easily causing signal drift due to high temperatures; Complex assembly: Modules are fixed together with multiple sets of screws, making calibration procedures cumbersome and assembly time exceeding 30 minutes per unit; Poor interference resistance: The lack of effective electromagnetic shielding design makes the external electromagnetic environment prone to interfering with millimeter-wave signals. Therefore, a millimeter-wave transceiver needs to be designed to address these issues. Utility Model Content

[0004] The purpose of this invention is to provide a millimeter-wave transceiver to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a millimeter-wave transceiver device, comprising a device body, wherein the device body is an integrated die-cast aluminum alloy structure, and three sets of stepped grooves are provided inside the device body. A radio frequency transceiver module, a baseband processing module, and a power supply module are sequentially embedded in the three sets of grooves, and the three are electrically connected by a flexible radio frequency cable. The radio frequency transceiver module has two antenna interfaces penetrating the side wall of the device body on one side, and a data interface penetrating the side wall of the device body on one side of the baseband processing module. The bottom of the device body is provided with an array of heat dissipation fins, and the top is connected to a cover plate via a convenient disassembly and assembly fixing mechanism.

[0006] Preferably, the heat dissipation fins are integrally formed with the device body, and thermal grease is provided between the bottom of the radio frequency transceiver module and the heat dissipation fins.

[0007] Preferably, the fixing mechanism includes a retaining ball, and a fixing cylinder is passed through each of the four corners of the cover plate. A connecting screw is threaded to the inner side of the fixing cylinder. One end of the connecting screw is provided with a knob, and the other end is provided with an abutment head. Two sets of placement slots are symmetrically opened near the bottom of the inner wall of the fixing cylinder, and the retaining ball is placed therein. Four sets of retaining grooves that are adapted to the fixing cylinder and the retaining ball are opened at the four corners of the top of the device body.

[0008] Preferably, the surface of the radio frequency transceiver module is covered with a gold-plated shield, and the bottom of the cover plate is covered with a wave-absorbing material layer.

[0009] Preferably, the power module has a charging interface on one side that penetrates the side wall of the device body.

[0010] Preferably, the device body has mounting feet at both ends of its bottom, and two sets of mounting holes are provided on the top of each set of mounting feet.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. The main body of this utility model is an integrated die-cast aluminum alloy structure. Its internal three sets of stepped grooves provide installation space for the radio frequency transceiver module, the baseband processing module, and the power supply module, respectively. The three are electrically connected through a flexible radio frequency cable to transmit signals. The power supply module can supply power to the radio frequency transceiver module and the baseband processing module. The radio frequency transceiver module can transmit and receive millimeter-wave signals through two sets of antenna interfaces. The baseband processing module processes the signals and outputs them through the data interface. During operation, the heat generated by the radio frequency transceiver module can be conducted through the main body of the device to the array-type heat dissipation fins at the bottom for dissipation. The cover plate can be easily removed and installed through the fixing mechanism at the top for maintenance of the internal modules. Thus, through the above structure, the signal transmission stability, operational reliability, and maintenance convenience of the millimeter-wave transceiver device are improved as a whole. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a bottom view of the present invention;

[0015] Figure 3 This is a side view and a top view of the present invention;

[0016] Figure 4 This is a side sectional view of the present invention;

[0017] Figure 5 This is a side sectional view and bottom view of the present invention;

[0018] Figure 6 for Figure 4 Enlarged view of part A in the image.

[0019] In the diagram: 1. Device body; 2. Groove; 3. RF transceiver module; 4. Baseband processing module; 5. Power module; 6. Antenna interface; 7. Data interface; 8. Charging interface; 9. Heat sink fins; 10. Thermal grease; 11. Gold-plated shield; 12. Cover plate; 13. Wave-absorbing material layer; 14. Fixing cylinder; 15. Connecting screw; 16. Knob; 17. Contact head; 18. Placement slot; 19. Clamping ball; 20. Clamping groove; 21. Mounting foot. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1

[0022] Please refer to Figure 1-6 As shown, this utility model provides a millimeter-wave transceiver device, including a device body 1. The device body 1 is an integrated die-cast aluminum alloy structure with three sets of stepped grooves 2 inside. The three sets of grooves 2 are sequentially embedded with an RF transceiver module 3, a baseband processing module 4, and a power module 5, and the three are electrically connected by a flexible RF cable. The RF transceiver module 3 has two sets of antenna interfaces 6 that penetrate the side wall of the device body 1 on one side. The baseband processing module 4 has a data interface 7 that penetrates the side wall of the device body 1 on one side. The bottom of the device body 1 is provided with an array of heat dissipation fins 9, and the top is connected to a cover plate 12 by a fixing mechanism that is easy to install and remove.

[0023] Specifically, the device body 1 is an integrated die-cast aluminum alloy structure. Its internal three sets of stepped grooves 2 provide installation space for the radio frequency transceiver module 3, the baseband processing module 4, and the power module 5, respectively. The three are electrically connected through flexible radio frequency cables to transmit signals. The power module 5 can supply power to the radio frequency transceiver module 3 and the baseband processing module 4. The radio frequency transceiver module 3 can transmit and receive millimeter-wave signals through two sets of antenna interfaces 6 that penetrate the side wall of the device body 1. The baseband processing module 4 processes the signal and outputs it through the data interface 7. During operation, the heat generated by the radio frequency transceiver module 3 can be conducted through the device body 1 to the array-type heat dissipation fins 9 at the bottom for dissipation. The cover plate 12 can be easily removed and installed through the fixing mechanism at the top for maintenance of the internal modules. Thus, through the above structure, the signal transmission stability, operational reliability, and maintenance convenience of the millimeter-wave transceiver device are improved as a whole.

[0024] The heat sink 9 is integrally formed with the device body 1. Thermal grease 10 is provided between the bottom of the RF transceiver module 3 and the heat sink 9. The heat sink 9 is integrally formed with the device body 1 and is used in conjunction with the thermal grease 10 to quickly conduct the heat of the RF transceiver module 3, which significantly improves the heat dissipation efficiency and ensures that the module can work stably in high-temperature environments.

[0025] The fixing mechanism includes a retaining ball 19. A fixing cylinder 14 passes through each of the four corners of the cover plate 12. A connecting rod 15 is threaded onto the inner side of each fixing cylinder 14. One end of the connecting rod 15 has a knob 16, and the other end has an abutment head 17. Two sets of placement slots 18 are symmetrically opened near the bottom of the inner wall of the fixing cylinder 14, and the retaining ball 19 is placed therein. Four sets of retaining grooves 20, which are adapted to the fixing cylinder 14 and the retaining ball 19, are correspondingly opened at the four corners of the top of the device body 1. The connecting rod 15 is threaded onto the fixing cylinder 14 at the four corners of the cover plate 12. By rotating the knob 16, the connecting rod 15 can drive the abutment head 17. When the contact head 17 moves downward, it can press the retaining ball 19 in the groove 18 on the inner wall of the fixing cylinder 14, causing the retaining ball 19 to protrude from the fixing cylinder 14 and be inserted into the corresponding grooves 20 at the four corners of the top of the device body 1. This can fix the cover plate 12 to the device body 1. Rotating the knob 16 in the opposite direction can drive the connecting screw 15 and the contact head 17 to move upward. At this time, the retaining ball 19 will return to its original position after losing pressure, and the cover plate 12 can be removed from the device body 1 to complete the disassembly and assembly operation. In this way, the cover plate 12 can be quickly fixed and disassembled from the device body 1, which simplifies the disassembly and assembly process and improves the convenience of maintenance.

[0026] The surface of the radio frequency transceiver module 3 is covered with a gold-plated shield 11, and the bottom of the cover plate 12 is attached with a wave-absorbing material layer 13. The gold-plated shield 11 on the surface of the radio frequency transceiver module 3 and the wave-absorbing material layer 13 at the bottom of the cover plate 12 work together to effectively shield electromagnetic interference and absorb stray electromagnetic waves, improve the device's anti-interference capability, and ensure stable transmission of millimeter-wave signals.

[0027] The power module 5 has a charging interface 8 that penetrates the side wall of the device body 1 on one side. The charging interface 8 on one side of the power module 5 penetrates the side wall of the device body 1, which facilitates the connection of an external power source to power the device, ensures the continuous and stable operation of the power module 5, and improves the ease of use of the device.

[0028] The device body 1 has mounting feet 21 at both ends of its bottom. The top of each of the two sets of mounting feet 21 has two sets of mounting holes. The mounting feet 21 at both ends of the bottom of the device body 1 and the mounting holes at its top facilitate the secure installation of the device on the equipment or bracket by bolts, thereby improving the stability and installation adaptability of the device.

[0029] Working principle: First, the three sets of stepped grooves 2 inside the device body 1 provide installation space for the RF transceiver module 3, the baseband processing module 4, and the power module 5, respectively. The three can be electrically connected through a flexible RF cable to transmit signals. The power module 5 can supply power to the RF transceiver module 3 and the baseband processing module 4. The RF transceiver module 3 can transmit and receive millimeter-wave signals through two sets of antenna interfaces 6, which are transmitted to the baseband processing module 4 via the flexible RF cable. After processing, the baseband processing module 4 can output the data through the data interface 7. During operation, the heat generated by the RF transceiver module 3 is transferred through the thermal grease 10 between the bottom and the heat sink 9. The array-type heat dissipation fins 9, which are integrally formed with the device body 1, emit heat. The gold-plated shielding cover 11 on its surface and the wave-absorbing material layer 13 at the bottom of the cover plate 12 work together to resist electromagnetic interference. When maintenance is required, the knob 16 at one end of the connecting screw 15 inside the four corner fixing cylinders 14 of the cover plate 12 is rotated in the opposite direction. The knob can drive the connecting screw 15 and the contact head 17 to move upward, thereby releasing the retaining ball 19 in the placement slot 18. At this time, the retaining ball 19 returns to its original position after being squeezed, and the cover plate 12 can be removed from the device body 1 for operation. After maintenance, the knob 16 is rotated in the opposite direction to make the retaining ball 19 snap into the slot 20 to complete the fixation, thus completing the entire operation process.

[0030] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0031] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A millimeter-wave transceiver, comprising a device body (1), characterized in that: The device body (1) is an integrated aluminum alloy die-cast structure with three sets of stepped grooves (2) inside. The three sets of grooves (2) are sequentially embedded with a radio frequency transceiver module (3), a baseband processing module (4) and a power supply module (5), and the three are electrically connected by a flexible radio frequency cable. The radio frequency transceiver module (3) has two sets of antenna interfaces (6) that penetrate the side wall of the device body (1) on one side. The baseband processing module (4) has a data interface (7) that penetrates the side wall of the device body (1) on one side. The device body (1) has an array of heat dissipation fins (9) at the bottom and a cover plate (12) connected to the top by a fixing mechanism that is easy to install and remove.

2. The millimeter-wave transceiver according to claim 1, characterized in that: The heat dissipation fins (9) are integrally formed with the device body (1), and thermal grease (10) is provided between the bottom of the radio frequency transceiver module (3) and the heat dissipation fins (9).

3. The millimeter-wave transceiver according to claim 2, characterized in that: The fixing mechanism includes a ball (19), and a fixing cylinder (14) is passed through each of the four corners of the cover plate (12). A connecting screw (15) is threaded to the inside of the fixing cylinder (14). A knob (16) is provided at one end of the connecting screw (15), and an abutment head (17) is provided at the other end. Two sets of placement slots (18) are symmetrically opened on the inner wall of the fixing cylinder (14) near the bottom and the ball (19) is placed therein. Four sets of slots (20) that are adapted to the fixing cylinder (14) and the ball (19) are opened at the four corners of the top of the device body (1).

4. A millimeter-wave transceiver according to claim 3, characterized in that: The surface of the radio frequency transceiver module (3) is covered with a gold-plated shield (11), and the bottom of the cover plate (12) is covered with a wave-absorbing material layer (13).

5. A millimeter-wave transceiver according to claim 1, characterized in that: The power module (5) has a charging interface (8) that penetrates the side wall of the device body (1) on one side.

6. A millimeter-wave transceiver according to claim 5, characterized in that: The device body (1) has mounting feet (21) at both ends of its bottom, and two sets of mounting holes are provided on the top of the two sets of mounting feet (21).

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