An automated testing system for camera modules

Abstract

This utility model relates to the field of camera module testing technology, specifically disclosing an automatic testing system for camera modules, including a pin test fixture, at least one test control board, a switch, and a host computer. The pin test fixture is signal-connected to the camera module under test, and includes a fixture body and a pin array disposed on the fixture body. The test control board is electrically connected to the pin test fixture, and includes a microcontroller, a multi-channel ADC acquisition module, and a signal output interface. The microcontroller is electrically connected to both the multi-channel ADC acquisition module and the signal output interface, and the signal output interface is electrically connected to the pin test fixture via wires. The switch is electrically connected to both the microcontroller and the host computer. The host computer is used to send test commands, receive test data, and display test results. This system solves the problems of low testing efficiency, easily damaged connectors, and unstable signal transmission.

Description

Technical Field

[0001] This utility model relates to the field of camera module testing technology, specifically to an automatic testing system for camera modules. Background Technology

[0002] During the production process, camera modules need to undergo testing to verify their functional integrity (such as image quality and signal transmission stability). Current technologies rely on manual connector insertion (e.g., connecting the module interface to the testing equipment via a ribbon cable) or simple pin fixtures for individual, item-by-item testing. The shortcomings of existing testing technologies include: low testing efficiency (manual connector insertion requires individual operation, and each module needs to be tested individually, failing to meet mass production requirements); connectors are easily damaged (inconsistent insertion and removal force during manual insertion can lead to wear and deformation of the module interface pads); and unstable signal transmission (simple pin fixtures lack signal optimization structures, making high-frequency signals prone to attenuation or crosstalk, resulting in a high rate of false positives).

[0003] Therefore, there is an urgent need to design a camera module testing system that can achieve automatic testing, multi-channel parallel testing, and stable signal to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide an automatic testing system for camera modules, which solves the problems of low testing efficiency, easy damage to connectors, and unstable signal transmission.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] An automatic testing system for camera modules includes a pin test fixture, at least one test control board, a switch, and a host computer. The pin test fixture is signal-connected to the camera module under test and includes a fixture body and a pin array disposed on the fixture body. The test control board is electrically connected to the pin test fixture and includes a microcontroller, a multi-channel ADC acquisition module, and a signal output interface. The microcontroller is electrically connected to both the multi-channel ADC acquisition module and the signal output interface, and the signal output interface is electrically connected to the pin test fixture via a wire. The switch is electrically connected to both the microcontroller and the host computer. The host computer is used to send test commands, receive test data, and display test results.

[0007] A further technical solution is that the pin array consists of multiple spring pins, with the tip of each spring pin making elastic contact with the interface pad of the camera module under test, and the tail of the pin connecting to the PCB board built into the fixture body.

[0008] A further technical solution is that the signal output interface is electrically connected to the PCB board via a wire; the PCB board is provided with a microstrip line and a signal pad, and the signal pad is welded and fixed to the tail of the spring pin; one end of the microstrip line is electrically connected to the signal pad, and the other end extends to the output end of the fixture body and is adapted to the signal input interface of the test control board.

[0009] A further technical solution is that the test control board also includes a signal isolation module, which is disposed between the microcontroller and the ejector pin test fixture. The signal isolation module includes an optocoupler isolation chip and an isolation slot, which is a strip-shaped slot formed on the test control board to physically separate the input signal and the control signal.

[0010] A further technical solution is that the test control board also includes a power protection module, which includes a resettable fuse connected in series in the power input circuit of the test control board.

[0011] A further technical solution is that the switch and the test control board are connected via a shielded network cable, and the shield of the network cable is connected to the grounding terminal of the test control board; each port of the switch is provided with a corresponding filtering circuit, and the filtering circuit includes a common-mode inductor and a TVS diode.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] By combining a test pin fixture and a multi-channel test control board, parallel testing of multiple modules is achieved, thereby shortening the testing time for a single module and improving testing efficiency. The use of spring-loaded pins for elastic contact replaces manual insertion and removal, avoiding interface wear caused by hard contact and reducing the damage rate. Microstrip line impedance control is used to adapt to high-frequency signal transmission, while signal isolation modules and switch filtering circuits reduce crosstalk, ensuring signal transmission stability, improving test signal accuracy, and reducing the false positive rate. Power protection and fault isolation enhance system safety and maintainability. Attached Figure Description

[0014] Figure 1 A schematic diagram of the automatic testing system for camera modules provided by this utility model;

[0015] Figure 2 This is a structural diagram showing the connection relationship between the test control board and the ejector pin test fixture in an embodiment of this utility model.

[0016] Icons: Ejector test fixture 100, fixture body 110, ejector array 120, test control board 200, signal isolation module 210, microcontroller 220, multi-channel ADC acquisition module 230, power protection module 240, signal output interface 250, signal input interface 260. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0018] Example 1

[0019] like Figure 1 and Figure 2 As shown, this utility model embodiment provides an automatic testing system for camera modules, including a pin test fixture 100, at least one test control board 200, a switch, and a host computer. The pin test fixture 100 is used to establish a signal connection with the camera module under test. The pin test fixture 100 includes a fixture body 110 and a pin array 120 disposed on the fixture body 110. The fixture body 110 is rectangular plate-shaped. The pin array 120 is composed of multiple spring pins, such as 32 spring pins. Each spring pin corresponds to various functional interfaces of the camera module under test, such as power supply, indicator lights, and buttons. The spring pin includes a needle head, a needle tube, and a spring. The needle head can be made of beryllium copper and gold-plated on the surface. The spring can be made of stainless steel and the spring force is 50-80 grams. The needle head can extend and retract along the axial direction of the needle tube for elastic contact with the interface pads of the camera module under test.

[0020] In this embodiment, eight test control boards 200 are provided. Each test control board 200 is electrically connected to a pin test fixture 100. Each test control board 200 includes a microcontroller 220, a multi-channel ADC acquisition module, and a signal output interface 250. The microcontroller 220 is electrically connected to both the multi-channel ADC acquisition module and the signal output interface 250. The multi-channel ADC acquisition module is used to acquire voltage and current signals from the module under test. The signal output interface 250 is electrically connected to the pin test fixture 100 via wires. The microcontroller 220 communicates with a switch via a UART interface. The switch is electrically connected to both the test control boards 200 and a host computer to enable signal transmission between the test boards and the host computer. The switch is used to enable signal interaction between the multi-channel test control boards 200 and the host computer. An 8-port gigabit switch can be used, and each port of the switch is connected to the test control board via a shielded network cable. The test control board 200 is connected, and the network cable shielding layer is connected to the grounding terminal of the test control board 200, with a grounding resistance of ≤1Ω. Each port of the switch is equipped with a corresponding filtering circuit, which includes a common-mode inductor and a TVS diode to suppress electromagnetic interference. The host computer is used to send test commands, receive test data, and display test results. The host computer is used to install and run test software and send test commands (such as "imaging resolution test" or "power ripple test") to the test control board 200. The test control board 200 collects feedback signals (such as imaging data or voltage fluctuation values) from the module under test through the pin test fixture 100. After processing by the microcontroller 220, the signals are sent back to the host computer. The host computer automatically judges the results (e.g., a resolution ≥20 million pixels is considered qualified) and generates test results based on the judgment structure. The test results include qualified and unqualified results and are displayed.

[0021] Furthermore, the tip of the spring-loaded pin is used to make elastic contact with the interface pad of the camera module under test, and its tail is connected to the built-in PCB board of the fixture body 110. If the tail is fixed to the built-in PCB board of the fixture body 110, the signal output interface 250 of the microcontroller 220 is electrically connected to the built-in PCB board of the fixture body 110 through a wire. The PCB board has microstrip lines and signal pads, so the tail of the spring-loaded pin is soldered to the signal pad of the PCB board. For the microstrip line, the microstrip line is made of copper material, with a line width of 0.3mm and an impedance of 50Ω. Its signal pad is a circular copper foil with a diameter of 1mm. The signal pad and the microstrip line are integrally formed by PCB board etching process. One end of the microstrip line is electrically connected to the signal pad, and the other end extends to the output end of the fixture body 110 and is adapted to the signal input interface 260 of the test control board 200.

[0022] Example 2

[0023] Based on Embodiment 1, the test control board 200 also includes a power protection module 240. The power protection module 240 includes a self-resetting fuse connected in series in the 12V power input circuit of the test control board 200. The self-resetting fuse can be of model SMD1206 with a rated current of 1.5A. When the circuit is short-circuited, it can automatically disconnect and recover within a preset time to achieve automatic protection during short circuits, so as to prevent damage to the equipment.

[0024] Furthermore, the test control board 200 also includes a signal isolation module 210, which is located between the microcontroller 220 and the ejector pin test fixture 100. The signal isolation module 210 includes an optocoupler isolation chip and an isolation slot. The isolation slot is a strip-shaped slot formed on the test control board 200. The optocoupler isolation chip can be selected as TLP521 to achieve electrical isolation, while the isolation slot is used to physically separate the input signal and the control signal to avoid crosstalk.

[0025] Working principle: During use, the camera module under test is placed into the ejector pin test fixture. The spring ejector pin contacts the interface pad of the module. The host computer sends a test command, which is transmitted to the test control board via the switch. The test control board outputs test signals to the camera module under test through the ejector pin test fixture and collects feedback data. The test data is isolated by the signal, processed by the microcontroller, and then sent back to the host computer, which displays the test results.

[0026] This utility model has the following beneficial effects:

[0027] Improve testing efficiency: By combining the pin test fixture with the multi-channel test control board, one-to-many parallel testing can be achieved, which can support the simultaneous testing of multiple modules or multiple functional modules of the module under test. This greatly reduces the testing time of a single module and the testing time of multiple modules, thereby significantly improving efficiency.

[0028] Reduce connector failure rate: Spring-loaded pins replace manual insertion and removal with elastic contact (elastic force 50-80 grams), avoiding interface wear caused by hard contact and greatly reducing the failure rate;

[0029] Stable signal transmission: Microstrip line impedance control (50Ω) is suitable for high-frequency signal transmission. The signal isolation module and switch filtering circuit reduce crosstalk, improve the integrity rate of the test signal, and thus reduce the false judgment rate.

[0030] Although the present invention has been described herein with reference to several illustrative embodiments, it should be understood that many other modifications and implementations can be devised by those skilled in the art, which will fall within the scope and spirit of the principles disclosed herein. More specifically, various variations and modifications can be made to the components and / or layout of the subject matter combination within the scope of the drawings and claims disclosed herein. Besides variations and modifications to the components and / or layout, other uses will be apparent to those skilled in the art.

Claims

1. An automatic testing system for camera modules, characterized in that, Includes a pin test fixture, at least one test control board, a switch, and a host computer; The pin test fixture is signal-connected to the camera module under test. The pin test fixture includes a fixture body and a pin array disposed on the fixture body. The test control board is electrically connected to the ejector pin test fixture. The test control board includes a microcontroller, a multi-channel ADC acquisition module, and a signal output interface. The microcontroller is electrically connected to the multi-channel ADC acquisition module and the signal output interface, respectively. The signal output interface is electrically connected to the ejector pin test fixture via a wire. The switch is electrically connected to the microcontroller and the host computer respectively; The host computer is used to send test commands, receive test data, and display test results.

2. The automatic testing system for a camera module according to claim 1, characterized in that, The pin array consists of multiple spring pins. The tip of each spring pin makes elastic contact with the interface pad of the camera module under test, and the tail of the pin is connected to the PCB board built into the fixture body.

3. The automatic testing system for a camera module according to claim 2, characterized in that, The signal output interface is electrically connected to the PCB board via a wire; The PCB board is provided with microstrip lines and signal pads, and the signal pads are welded and fixed to the tail of the spring pin; One end of the microstrip line is electrically connected to the signal pad, and the other end extends to the output end of the fixture body and is adapted to the signal input interface of the test control board.

4. The automatic testing system for a camera module according to claim 1, characterized in that, The test control board also includes a signal isolation module, which is disposed between the microcontroller and the pin test fixture. The signal isolation module includes an optocoupler isolation chip and an isolation slot, which is a strip-shaped slot formed on the test control board to physically separate the input signal and the control signal.

5. The automatic testing system for a camera module according to claim 1, characterized in that, The test control board also includes a power protection module, which includes a resettable fuse connected in series in the power input circuit of the test control board.

6. The automatic testing system for a camera module according to claim 1, characterized in that, The switch is connected to the test control board via a shielded network cable, and the shield of the network cable is connected to the grounding terminal of the test control board. Each port of the switch is equipped with a corresponding filtering circuit, which includes a common-mode inductor and a TVS diode.

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