A PCB circuit board assembly

Abstract

This utility model discloses a PCB circuit board assembly consisting of two circuit boards: a main circuit board and a sub-circuit board. The main circuit board has gold finger pins extending from one side and positioned on both sides, integrally formed with the PCB board. A transformer winding is housed within the main circuit board. A large through-hole is located at the center of the transformer winding for the insertion of the planar transformer core post, and square slots are located on both sides of the transformer winding for the insertion of the planar transformer core side posts. The sub-circuit board also has gold finger pins extending from one side and integrally formed with the PCB board. Both the main and sub-circuit boards have large areas of copper plating. Compared with existing technologies, this PCB circuit board assembly enables the power supply to achieve high power and a small size.

Description

Technical Field

[0001] This utility model relates to the field of PCB circuit board technology, and in particular to a PCB circuit board assembly for a high power density, small volume AC / DC switching power supply. Background Technology

[0002] Power modules are power supplies that can be directly mounted on printed circuit boards. They can power application-specific integrated circuits, processors, memory, and digital or analog loads, and are widely used in industrial control, power instrumentation, and smart home applications where size requirements are stringent.

[0003] Switching power supply modules can be divided into two main categories: AC / DC and DC / DC. DC / DC converters have been modularized, and their design technology and manufacturing processes are mature and standardized both domestically and internationally. However, the modularization of AC / DC converters, due to their inherent characteristics, has encountered more complex technical and manufacturing challenges in the process of modularization.

[0004] PCBs, also known as printed circuit boards, are crucial electronic components. They serve as the support for electronic components in switching power supply modules and the carrier for electrical connections between these components. Made from an insulating substrate, they are cut to a specific size and have at least one conductive pattern and holes (such as component holes, mounting holes, and metallized holes). They replace the traditional chassis used for mounting electronic components and enable interconnection between them. Currently, commercially available AC / DC power modules struggle to balance size and performance, and fully automated production and proper insulation and safety treatment of the winding surfaces and magnetic cores are difficult to achieve. Utility Model Content

[0005] In view of the above problems, the present invention aims to overcome at least one of the shortcomings of the prior art and provide a new type of PCB circuit board assembly, which can further improve the power density of the package structure, make the switching power supply products smaller, and solve the insulation safety problem between the winding surface and the magnetic core.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A PCB circuit board assembly consists of two circuit boards, including a main circuit board and a sub-circuit board.

[0008] The main circuit board has gold finger pins that extend from one side and are located on both sides, forming an integral part of the PCB board.

[0009] The pins of the sub-circuit board have a gold finger structure, extending from one side and integrally formed with the PCB board; among them,

[0010] Two circuit boards can be stacked together to form a double-layer gold finger pin structure.

[0011] Preferably, the outer contours of the sub-circuit board and the main circuit board are substantially coincident, and the gold finger pins of the sub-circuit board and the main circuit board are distributed in the same position, forming two sets of gold finger pins with a double-layer structure, which are used as external pins of the primary and secondary sides of the switching power supply, and the two sets of gold finger pins are separated by the safety distance of the primary and secondary sides.

[0012] Preferably, the dual-layer gold finger pin structure is distributed on both sides, with one side having 3 or 4 gold finger pins and the other side having 1, 2, 3 or 4 gold finger pins.

[0013] Preferably, the total width of the pins on both sides of the main circuit board is set to be equal according to the center line position of the pin pads; and / or the width of the pins on each side of the main circuit board is set to be non-equal on both sides, and the width of one side pin is greater than the width of the other side pin.

[0014] Preferably, the main circuit board has a transformer winding, and a large through hole is opened at the center of the transformer winding for the central column of the planar transformer core to be inserted. A first groove and a second groove are opened in a stepped manner on both sides of the transformer winding position. The first groove is opened inside the second groove for the side column of the planar transformer core to be inserted into the first groove and for the support plate of the inner frame to be inserted into the second groove. Asymmetrical square slots are opened on both sides of the sub-circuit board.

[0015] Preferably, the main circuit board and the sub-circuit board are provided with insertion holes on both sides, and the distance between the outer edge of the cutout of the insertion hole and the edge of the board is less than 1 mm, so as to allow the metal pins of the electrical connection between the main circuit board and the sub-circuit board to be inserted.

[0016] Preferably, the total width of one side pin of the sub-circuit board and the one side pin of the main circuit board are set to be equal according to the position of the pin pad center line; and / or the outer contours of one side pin of the sub-circuit board and the one side pin of the main circuit board substantially coincide.

[0017] Preferably, the sub-circuit board and / or the main circuit board have a large area of ​​copper plating, with the large area of ​​copper plating in the sub-circuit board located on both sides; and / or the outer surface of the sub-circuit board has a silkscreen position for an electronic component, positioned between the large area of ​​copper plating on both sides.

[0018] Preferably, the main circuit board is a multilayer PCB board with two or more layers, one or more of which is used as the winding layer of the planar transformer; and / or the pad area of ​​the gold finger pin has small through holes to connect the copper foil of the pin pad area on the two surfaces of the gold finger through the copper foil of the inner wall of the small through holes to increase the mechanical strength of the copper foil of the pin pad area.

[0019] This utility model also provides

[0020] Preferably, a PCB circuit board assembly is characterized by comprising two circuit boards, including a main circuit board and a sub-circuit board.

[0021] The outer contours of the sub-circuit board and the main circuit board are basically coincident; the pin pads of the main circuit board are located on one side and on both sides; the pin pads of the sub-circuit board are located on one side. The pin pads of the sub-circuit board and the main circuit board are distributed in the same position. Two sets of pin pads with a double-layer structure can be formed by stacking the two circuit boards, and the two sets of pin pads are separated by the safety distance of the primary and secondary sides.

[0022] Preferably, the two sets of pin pads in the double-layer structure have one set of pin pads with 3 or 4 pin pads and the other set of pin pads with 1, 2, 3 or 4 pin pads; and / or the pins of the main circuit board are gold finger structures and the pins of the sub-circuit board are gold finger structures.

[0023] Preferably, the total width of the pin pads on both sides of the main circuit board is set to be equal according to the center line position of the pin pads; and / or when the two circuit boards are stacked together, the pin pads on one side of the sub-circuit board and the pin pads on one side of the main circuit board are basically coincident; and / or the sub-circuit board is provided with a large area of ​​copper plating, and the large area of ​​copper plating in the sub-circuit board is distributed on both sides.

[0024] Compared with the prior art, the beneficial effects of this utility model PCB circuit board assembly are as follows:

[0025] 1. A new type of PCB circuit board assembly can form a stacked combination structure in which the outer contours of the sub-circuit board and the main circuit board are basically overlapped, which can increase the power density of switching power supply products by more than 120% compared with the power density of existing products.

[0026] 2. By adopting a new type of PCB circuit board assembly with optimized circuit design, it can support circuits that have been improved from primary-side feedback circuits to secondary-side feedback circuits, and can make the product miniaturized structure of the switching power supply module applicable to a power range of 30W to several hundred watts.

[0027] 3. By flexibly adding windings, coordinating with PCB routing and adding output terminals, multiple outputs can be achieved to meet the requirements of multiple outputs at high power density.

[0028] 4. By covering the winding surface with an insulating film, the insulation safety performance between the winding and the magnetic core can still meet various safety certification standards when the input voltage is high and the output power is large. Attached Figure Description

[0029] Figure 1 This is a three-dimensional exploded view of the PCB circuit board assembly of this utility model;

[0030] Figure 2This is a perspective view of another sub-circuit board of the PCB circuit board assembly of this utility model;

[0031] Figure 3 A perspective view of a power supply product assembled with the PCB circuit board assembly of this utility model.

[0032] Figure 4 Another perspective view of the application assembly of the PCB circuit board component of this utility model in a power supply product;

[0033] Figure 5 This is a perspective view of a PCB circuit board assembly according to another embodiment of the present invention.

[0034] The reference numerals in the above figures are explained as follows:

[0035] 200 Main circuit board, 210 Pin, 211 Primary side pin, 212 Secondary side pin, 213 Small through hole, 214 Large through hole, 215 First recess, 216 Second recess, 217 Insertion hole

[0036] 300 Sub-circuit board, 310 Pins, 311 Primary edge pins, 313 Small through-hole, 315 Square slot, 317 Component insertion hole, 320 Silkscreen position for electronic components, 330 Large area copper plating.

[0037] 200' main circuit board, 210' pin pads,

[0038] 300' sub-circuit board, 310' pin pad,

[0039] 710' gold finger pin group (primary side pin area), 720' gold finger pin group (secondary side pin area)

[0040] 710 Gold Finger Pin Group (Primary Side Pin Area), 720 Gold Finger Pin Group (Secondary Side Pin Area)

[0041] Total width of pins on each side of the BC main circuit board

[0042] The total width of one side pins on the D-sub circuit board

[0043] E. Distance between the outer edge of the cutout for the insertion hole and the edge of the board.

[0044] W1.W2. Width of the main circuit board pins Detailed Implementation

[0045] To meet the market's higher demand for high-power (e.g., above 30W) switching power supplies, it is necessary to improve the performance of primary-side feedback circuits, including voltage accuracy, load regulation, and voltage regulation rate. However, improving the electrical performance of existing primary-side feedback circuits at higher power requires high-performance components and a larger product size, significantly limiting the potential for miniaturization of the switching power supply package structure. Therefore, further miniaturization improvements require first refining the circuit principle. Through systematic optimization analysis of the circuit topology, a secondary-side feedback method is preferred. However, this secondary-side feedback circuit requires the addition of optocouplers for isolation, which would inevitably increase the product's footprint if a traditional single-circuit board approach is used. Therefore, this invention attempts to adopt a double-layer structure, placing the optocouplers on another circuit board, so that the overall footprint of the power supply product on the application circuit board does not increase, thereby improving the electrical performance of the switching power supply while ensuring increased power density. Of course, with the implementation of mandatory 3C certification for some electronic products, whether an electronic device meets electromagnetic compatibility standards will affect its marketability. Therefore, simultaneously considering electromagnetic compatibility improvements while miniaturizing switching power supply products is also crucial.

[0046] The present invention and its beneficial effects will be further described in detail below with reference to specific embodiments and accompanying drawings. However, the specific embodiments of the present invention are not limited thereto.

[0047] Please see Figures 1 to 4 The attached figures are related to the PCB circuit board assembly of this utility model. A PCB circuit board assembly consists of two circuit boards, including a main circuit board 200 and a sub-circuit board 300. The pins 210 of the main circuit board are gold finger structures, extending from one side and disposed on both sides, and are integrally formed with the PCB board. The pins 310 of the sub-circuit board are gold finger structures, extending from one side and integrally formed with the PCB board. The two circuit boards can be stacked to form a double-layer gold finger pin structure.

[0048] Preferably, the outer contours of the sub-circuit board and the main circuit board are substantially overlapped. The gold finger pins of the sub-circuit board and the main circuit board are distributed in the same position, forming two sets of gold finger pins 710 and 720 with a double-layer structure. That is, the gold finger pins of the main circuit board 200 are distributed on both sides, with a gap in the middle required by the safety distance. The gold finger pins of the sub-circuit board 300 are also distributed on both sides, with a gap in the middle. For example, the main circuit board 200 has primary side pin 211 leading out from the left side and secondary side pin 212 leading out from the right side. The sub-circuit board 300 also has primary side pin 311 leading out from the left side. If it is a dual-output product and a secondary side pin needs to be added, it will also be led out from the right side (not shown in the figure). That is, one set of gold finger pins 710 is led out from one side and one set of gold finger pins 720 is led out from the other side, used as external pins of the primary and secondary sides of the switching power supply, respectively, and the two sets of gold finger pins are separated by the safety distance of the primary and secondary sides. Whether the two sets of gold finger pins are separated by the required safety distance between the primary and secondary sides can be determined by whether the power supply product using this PCB board assembly meets the relevant safety certification requirements or has obtained the relevant safety certification. Because the required safety distance varies depending on the product performance according to relevant standards, using measurement methods to determine it is limited by inconsistent measurement standards, and the interpretation of the measured safety distance may differ among parties. However, power supply products generally need to meet the relevant safety certification requirements, and power supply products that meet safety certification are basically those whose PCB board assembly's primary and secondary sides are separated by the required safety distance, or in other words, the two sets of gold finger pins on the PCB board assembly are effectively separated by the required safety distance between the primary and secondary sides.

[0049] The dual-layer gold finger pin structure is distributed on both sides. Taking a single-output switching power supply as an example, one side has 4 gold finger pins (i.e., the primary side or input side), and the other side has 2 gold finger pins (i.e., the secondary side or output side). When designing dual-output, multi-output, or single-output switching power supplies in other applications, the number of gold finger pins on the output side can be increased by adjusting the PCB routing, or the number of gold finger pins on both sides can be increased, decreased, or adjusted. For example, one side can have 3 or 4 gold finger pins, and the other side can have 1, 2, 3, or 4 gold finger pins. This allows for flexible design of the number of gold finger pins on both sides of the dual-layer gold finger pin structure to adapt to the pin design requirements of different applications such as single / dual output switching power supplies.

[0050] The total widths B and C of the pins on both sides of the main circuit board are set to be equal based on the center line position of the pin pads. The widths of all pins on the same side of the main circuit and sub-circuit are the same. The widths W1 and W2 of the pins on each side of the main circuit board are not equal, and the width W2 of one side of the pin is greater than the width W1 of the other side of the pin, in order to adapt to different power current transmission applications.

[0051] The total width D of the pins on one side of the sub-circuit board is equal to the total width B or C of the pins on one side of the main circuit board, based on the position of the pin pad centerline. Preferably, the outer contours of the pins on one side of the sub-circuit board and the pins on one side of the main circuit board substantially coincide, so that the structure of the same group of gold finger pins is consistent, which facilitates the subsequent structural design of the application circuit board. The substantial coincidence of the outer contours of the two refers, from a measurement perspective, to the original value of the same relevant dimensional parameters and the fluctuation value within the structural tolerance range of the original value of the relevant dimensional parameters; from a projection perspective, it refers to the projection cases of complete overlap and the overlapping projection cases with local offset within the structural tolerance range.

[0052] The main circuit board contains a transformer winding 220. A large through hole 214 is opened at the center of the transformer winding for the insertion of the planar transformer core post. A first groove 215 and a second groove 216 are steppedly formed on both sides of the transformer winding. The first groove 215 is located inside the second groove 216, for the insertion of the planar transformer core post into the first groove and the insertion of the inner frame support plate into the second groove. Asymmetrical square slots 315 are opened on both sides of the sub-circuit board for the insertion of the inner frame support plate.

[0053] The main circuit board and the sub-circuit board have insertion holes 217 and 317 on both sides, and the distance E between the outer edge of the cutout of the insertion hole and the edge of the board is less than 1 mm, which is used to insert the metal pins of the main circuit board and the sub-circuit board for electrical connection.

[0054] The sub-circuit board 300 and the main circuit board 200 have large areas of copper plating, with the large areas of copper plating 330 in the sub-circuit board located on both sides. The outer surface of the sub-circuit board has a silkscreen position 320 for electronic components, which is positioned between the large areas of copper plating on both sides to allow the optocoupler electronic components to identify their surface mount soldering positions during manufacturing.

[0055] The main circuit board is a multilayer PCB with two or more layers, one or more of which are used as winding layers for the planar transformer. To fully utilize the structural design space of the main circuit board, a multilayer PCB structure is preferred. In a two-layer multilayer PCB, one layer is used as a winding layer for the planar transformer. If a four-layer multilayer PCB is required, two layers can be used as winding layers for the planar transformer. Thus, multiple winding layer PCBs can be stacked outside the main circuit board during the manufacturing of the switching power supply, and the surface of the winding layer PCBs is covered with an insulating film, providing a better and more flexible solution for safety issues between magnetic cores. Small through-holes 213 and 313 are provided in the pad areas of the gold finger pins on the main circuit board and sub-circuit boards. These through-holes connect the copper foil in the pin pad areas on the two surfaces of the gold finger through the copper foil on the inner wall of the small through-holes, thereby increasing the mechanical strength of the copper foil in the pin pad areas.

[0056] Because the PCB circuit board assembly of this utility model adopts a new packaging technology and an optimized circuit system design, namely, the optimized circuit is improved from the primary side feedback circuit to the secondary side feedback circuit, and the combination structure of the sub-circuit board and the main circuit board body with basically overlapping outer contours is improved, a new double-layer packaging structure of switching power supply can be realized, which increases the power density of switching power supply products by more than 120% compared with the power density of existing products, and enables the miniaturization structure of switching power supply module structure to be extended to the power range of 30W to several hundred watts.

[0057] The PCB circuit board assembly of this utility model can be further improved into a PCB circuit board assembly consisting of two circuit boards, including a main circuit board 200' and a sub-circuit board 300', the outer contours of the sub-circuit board and the main circuit board body are substantially coincident; the pin pads 210' of the main circuit board are located on one side and distributed on both sides; the pin pads 310' of the sub-circuit board are located on one side, and the pin pads 210' and 310' of the sub-circuit board and the main circuit board are distributed in the same position. Two sets of pin pads with a double-layer structure can be formed by stacking the two circuit boards, and the two sets of pin pads are separated by a primary and secondary safety distance. Whether the two sets of pin pads are separated by a primary and secondary safety distance can be determined by whether the power supply product meets the relevant safety certification requirements or has obtained relevant safety certifications. Because the required safety distance varies depending on the product performance according to relevant standards, the use of measurement methods to determine it is limited by the lack of uniform measurement standards. The interpretation of the measured safety distance may be inconsistent among different parties. However, power supply products generally need to meet the relevant requirements for safety certification. Power supply products that meet safety certification generally have a safety distance requirement for the separation distance between the primary and secondary sides, or in other words, a safety distance that separates the primary and secondary sides.

[0058] Preferably, in this embodiment, taking a single-output switching power supply product as an example, the two sets of pin pads in the double-layer structure have four pin pads 710' (i.e., primary side or input side) and two gold finger pin pads 720' (i.e., secondary side or output side). When designing dual-output, multi-output, or single-output switching power supply products in other implementations, the number of pin pads on the output side can be increased by adjusting the PCB routing, or the number of the two sets of pin pads can be increased, decreased, or adjusted. For example, one set of pin pads can have three or four pin pads, and the other set can have one, two, three, or four pin pads. This allows for flexible design of the number of pin pads in the two sets of pins in the double-layer structure, enabling the application of the double-layer, two-set pin structure of the switching power supply in different situations.

[0059] The total widths B and C of the pin pads on both sides of the main circuit board are set to be equal according to the center line position of the pin pads. When the two circuit boards are stacked together, the pin pads 310' on one side of the sub-circuit board and the pin pads 210' on one side of the main circuit board are basically overlapped. The sub-circuit board also has a large area of ​​copper plating, which is distributed on both sides.

[0060] The embodiments of this utility model are not limited thereto. Based on the above content of this utility model, using common technical knowledge and conventional means in the field, without departing from the basic inventive concept of this utility model, the specific implementation circuit of this utility model can be modified, replaced or changed in various other forms, all of which fall within the protection scope of this utility model.

Claims

1. A PCB circuit board assembly, characterized by: It consists of two circuit boards, including a main circuit board and a sub-circuit board. The main circuit board has gold finger pins that extend from one side and are located on both sides, forming an integral part of the PCB board. The pins of the sub-circuit board have a gold finger structure, extending from one side and integrally formed with the PCB board; among them, Two circuit boards can be stacked together to form a double-layer gold finger pin structure.

2. The PCB circuit board assembly of claim 1, wherein: The sub-circuit board and the main circuit board have basically the same outer contour. The gold finger pins of the sub-circuit board and the main circuit board are distributed in the same position, forming two sets of gold finger pins with a double-layer structure, which are used as external pins of the primary and secondary sides of the switching power supply, and the two sets of gold finger pins are separated by the safety distance of the primary and secondary sides.

3. The PCB circuit board assembly of claim 1, wherein: The dual-layer gold finger pin structure is located on both sides, with one side having 3 or 4 gold finger pins and the other side having 1, 2, 3 or 4 gold finger pins.

4. The PCB circuit board assembly of claim 1, wherein: The total width of the pins on both sides of the main circuit board is set to be equal according to the center line position of the pin pads; and / or the width of the pins on each side of the main circuit board is set to be non-equal on both sides, and the width of one side pin is greater than the width of the other side pin.

5. The PCB circuit board assembly according to claim 1, characterized in that: The main circuit board contains a transformer winding. A large through hole is opened at the center of the transformer winding for the central column of the planar transformer core to be inserted. A first groove and a second groove are stepped on both sides of the transformer winding. The first groove is opened inside the second groove for the side column of the planar transformer core to be inserted into the first groove and for the support plate of the inner frame to be inserted into the second groove. Asymmetrical square slots are opened on both sides of the sub-circuit board.

6. The PCB circuit board assembly according to claim 1, characterized in that: The main circuit board and the sub-circuit board are provided with insertion holes on both sides, and the distance between the outer edge of the cutout of the insertion hole and the edge of the board is less than 1 mm, which is used to insert the metal pins of the main circuit board and the sub-circuit board for electrical connection.

7. The PCB circuit board assembly according to claim 1, characterized in that: The total width of one side pin of the sub-circuit board and one side pin of the main circuit board are set to be equal according to the position of the pin pad center line; and / or the outer contours of one side pin of the sub-circuit board and one side pin of the main circuit board are substantially coincident.

8. The PCB circuit board assembly according to claim 1, characterized in that: The sub-circuit board and / or the main circuit board have a large area of ​​copper plating, with the large area of ​​copper plating in the sub-circuit board located on both sides; and / or the outer surface of the sub-circuit board has a silkscreen position for an electronic component, positioned between the large area of ​​copper plating on both sides.

9. The PCB circuit board assembly according to claim 1, characterized in that: The main circuit board is a multilayer PCB board with two or more layers, one or more of which are used as winding layers of a planar transformer; and / or the pad area of ​​the gold finger pins is provided with small through holes to connect the copper foil of the pin pad area on the two surfaces of the gold finger through the copper foil on the inner wall of the small through holes to increase the mechanical strength of the copper foil of the pin pad area.

10. A PCB circuit board assembly, characterized in that: It consists of two circuit boards, including a main circuit board and a sub-circuit board. The outer contours of the sub-circuit board and the main circuit board are basically coincident; the pin pads of the main circuit board are located on one side and on both sides; the pin pads of the sub-circuit board are located on one side. The pin pads of the sub-circuit board and the main circuit board are distributed in the same position. Two sets of pin pads with a double-layer structure can be formed by stacking the two circuit boards, and the two sets of pin pads are separated by the safety distance of the primary and secondary sides.

11. The PCB circuit board assembly according to claim 10, characterized in that: The dual-layer structure has two sets of pin pads, one set having 3 or 4 pin pads and the other set having 1, 2, 3 or 4 pin pads; and / or the pins of the main circuit board are gold finger structures, and the pins of the sub-circuit board are gold finger structures.

12. The PCB circuit board assembly according to claim 10, characterized in that: The total width of the pin pads on both sides of the main circuit board is set to be equal according to the position of the pin pad center line; and / or when the two circuit boards are stacked together, the pin pads on one side of the sub-circuit board and the pin pads on one side of the main circuit board are basically coincident; and / or the sub-circuit board has a large area of ​​copper plating, and the large area of ​​copper plating in the sub-circuit board is distributed on both sides.

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