A thermally conductive and wave-absorbing insulating pad with an inner lining structure

Abstract

This utility model discloses a thermally conductive and microwave-absorbing insulating gasket with an inner lining structure, comprising a substrate layer, a thermally conductive layer installed at the bottom of the substrate layer, a microwave-absorbing layer installed at the bottom of the thermally conductive layer, an insulating layer installed at the bottom of the microwave-absorbing layer, an adhesive layer installed at the bottom of the insulating layer, and a protective layer installed at the bottom of the adhesive layer. This utility model relates to the field of gasket technology. This thermally conductive and microwave-absorbing insulating gasket with an inner lining structure, through the refined design of functional layers and optimization of multi-physics field coupling, can meet the stringent requirements of modern electronic equipment for heat dissipation, electromagnetic compatibility, and insulation. At the same time, the layered composite structure achieves a balance between thermal conductivity and microwave absorption performance, and has good mechanical support and flexibility, rapid heat conduction, insulation, and other multifunctional properties.

Description

Technical Field

[0001] This utility model relates to the field of gasket technology, specifically a thermally conductive and wave-absorbing insulating gasket with an inner lining structure. Background Technology

[0002] Thermally conductive and microwave-absorbing insulating pads are composed of thermally conductive and microwave-absorbing materials. The thermally conductive part rapidly conducts the heat generated by the heat source to the heat sink or external environment through its high thermal conductivity, helping the equipment dissipate heat and preventing overheating. The microwave-absorbing part absorbs the energy of electromagnetic waves through its unique internal electromagnetic loss mechanism, converts it into heat energy and dissipates it, thereby reducing electromagnetic interference.

[0003] The aforementioned technologies have certain shortcomings: thermally conductive fillers such as metal oxides and boron nitride can reduce electromagnetic wave absorption efficiency, while magnetic wave-absorbing materials such as ferrites and carbon-based materials may hinder heat conduction. Therefore, there is a problem in balancing thermal conductivity and wave absorption performance.

[0004] To address these issues, this invention provides a thermally conductive and wave-absorbing insulating gasket with an inner lining structure. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a thermally conductive and wave-absorbing insulating gasket with an inner lining structure, thus solving the aforementioned problems.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: a thermally conductive and wave-absorbing insulating pad with an inner lining structure, comprising a substrate layer, a thermally conductive layer installed at the bottom of the substrate layer, a wave-absorbing layer installed at the bottom of the thermally conductive layer, a support layer installed at the bottom of the wave-absorbing layer, the support layer being a honeycomb metal mesh plate, a plurality of mounting cavities uniformly opened on the outside of the support layer, a plurality of elastic support rings uniformly installed on the inner wall of the plurality of mounting cavities, an insulating layer installed at the bottom of the support layer, an adhesive layer installed at the bottom of the insulating layer, and a protective layer installed at the bottom of the adhesive layer.

[0007] The above technical solution enables the entire gasket to have both good functionality and a balanced performance.

[0008] Furthermore, the substrate layer can be made of materials such as silicone rubber, epoxy resin, or polyimide. The substrate layer provides mechanical support and flexibility, ensuring that the gasket can be compressed and adhered to the surface of the device.

[0009] Through the above technical solution, the gasket has good mechanical support and flexibility, making it easy to stick to various positions of the device.

[0010] Furthermore, the thermally conductive layer can be made of particulate materials such as aluminum nitride and aluminum oxide. The thermally conductive layer mainly removes heat quickly through phonon conduction paths to reduce interfacial thermal resistance.

[0011] The above technical solution provides excellent heat dissipation through rapid heat conduction.

[0012] Furthermore, the absorbing layer can be made of materials such as ferrite, carbonyl iron powder, and carbon nanotubes. The absorbing layer converts electromagnetic waves into heat energy through hysteresis loss and dielectric loss, and the absorption rate needs to reach above -20dB.

[0013] The above technical solution enables the gasket to have good wave absorption function.

[0014] Furthermore, a honeycomb mesh is used in the support layer to improve the overall strength of the substrate layer and prevent excessive deformation.

[0015] The above technical solution can improve the overall strength of the gasket and prevent excessive deformation.

[0016] Furthermore, the insulating layer can be made of materials such as ceramic-filled polymers or mica sheets. The insulating layer can block the electrical path and prevent high-voltage breakdown. The adhesive layer can be made of materials such as thermally conductive pressure-sensitive adhesive or silicone grease. The adhesive layer can achieve low thermal resistance bonding with the device surface while compensating for surface roughness.

[0017] Through the above technical solution, the gasket has good insulation function and prevents high voltage breakdown during use, and can be pasted on various positions of the device.

[0018] Furthermore, the protective layer can be made of materials such as PET film and polytetrafluoroethylene, which provide moisture resistance, corrosion resistance, and improved environmental tolerance.

[0019] The above technical solution ensures that the gasket has good protection.

[0020] Beneficial effects

[0021] This invention provides a thermally conductive and microwave-absorbing insulating gasket with an inner lining structure. Compared with the prior art, it has the following advantages:

[0022] (1) The thermally conductive and wave-absorbing insulating pad with an inner lining structure can meet the stringent requirements of modern electronic equipment for heat dissipation, electromagnetic compatibility and insulation through the refined design of functional layers and the optimization of multi-physical field coupling. At the same time, the layered composite structure balances the thermal conductivity and wave absorption performance, and has good mechanical support and flexibility, fast heat conduction and insulation and other multi-functional properties. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall external structure of this utility model;

[0024] Figure 2 This is a cross-sectional view of the internal structure of this utility model;

[0025] Figure 3 This is a utility model Figure 2 Enlarged view of the structure at point A.

[0026] In the figure: 1. Substrate layer; 2. Thermally conductive layer; 3. Wave-absorbing layer; 4. Insulating layer; 5. Adhesive layer; 6. Protective layer; 7. Support layer; 71. Mounting cavity; 72. Elastic support ring. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Example 1:

[0029] Please see Figures 1-3 A thermally conductive and microwave-absorbing insulating pad with an inner lining structure includes a substrate layer 1, a thermally conductive layer 2 installed at the bottom of the substrate layer 1, a microwave-absorbing layer 3 installed at the bottom of the thermally conductive layer 2, a support layer 7 installed at the bottom of the microwave-absorbing layer 3, the support layer 7 being a honeycomb metal mesh plate, a plurality of mounting cavities 71 uniformly opened on the outside of the support layer 7, a plurality of elastic support rings 72 uniformly installed on the inner wall of the plurality of mounting cavities 71, an insulating layer 4 installed at the bottom of the support layer 7, an adhesive layer 5 installed at the bottom of the insulating layer 4, and a protective layer 6 installed at the bottom of the adhesive layer 5.

[0030] In this embodiment of the invention, the purpose of this arrangement is to enable the gasket to have both multifunctionality and performance balance. The refined design of the functional layer and the optimization of multi-physics coupling can meet the stringent requirements of modern electronic devices for heat dissipation, electromagnetic compatibility and insulation.

[0031] Example 2:

[0032] Please see Figures 1-3This embodiment provides a technical solution based on Embodiment 1: The substrate layer 1 can be made of materials such as silicone rubber, epoxy resin, or polyimide. The substrate layer 1 provides mechanical support and flexibility, ensuring the gasket can be compressed and adhered to the device surface. The thermally conductive layer 2 can be made of particulate materials such as aluminum nitride or alumina. The thermally conductive layer 2 mainly removes heat quickly through phonon conduction paths, reducing interfacial thermal resistance. The microwave absorbing layer 3 can be made of materials such as ferrite, carbonyl iron powder, or carbon nanotubes. The microwave absorbing layer 3 converts electromagnetic waves into heat energy through hysteresis loss and dielectric loss. The yield needs to reach -20dB or higher. The support layer 7 uses a honeycomb mesh to improve the overall strength of the substrate layer 1 and prevent excessive deformation. The insulating layer 4 can be made of materials such as ceramic-filled polymer or mica sheets. The insulating layer 4 can block the electrical path to prevent high voltage breakdown. The adhesive layer 5 can be made of materials such as thermally conductive pressure-sensitive adhesive or silicone grease. The adhesive layer 5 achieves low thermal resistance bonding with the device surface while compensating for surface roughness. The protective layer 6 can be made of materials such as PET film or polytetrafluoroethylene. The protective layer 6 has moisture-proof, corrosion-proof and environmental tolerance.

[0033] In this embodiment of the utility model, the purpose of this arrangement is that the thermally conductive and wave-absorbing insulating pad usually adopts a multi-layer composite structure, with each layer having a clear functional division, and simultaneously solves the problems of heat dissipation, electromagnetic wave absorption (EMI / RFI shielding) and electrical insulation in electronic equipment during use.

[0034] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0035] The working principle of this device is as follows: The substrate layer 1, which can be made of materials such as silicone rubber, epoxy resin, or polyimide, provides mechanical support and flexibility, ensuring that the gasket can be compressed and adhered to the device surface. The thermally conductive layer 2, which can be made of particulate materials such as aluminum nitride or aluminum oxide, primarily dissipates heat quickly through phonon conduction paths, reducing interfacial thermal resistance (<0.5 K·mm). 2 / W), the absorbing layer 3 can be made of materials such as ferrite, carbonyl iron powder, and carbon nanotubes. It converts electromagnetic waves into heat energy through hysteresis loss and dielectric loss. The absorption rate needs to reach -20dB or more (1-10GHz). The support layer 7 can improve the strength of the entire gasket and prevent excessive bending. The support layer 7 has a certain elasticity. When the gasket is squeezed, the metal mesh plate and the elastic support ring 72 can also undergo a certain deformation to prevent the sealing resilience of the gasket from being greatly reduced.

[0036] The insulating layer 4 can be made of materials such as ceramic-filled polymer or mica sheets, which can block electrical paths and has a breakdown strength of >10kV / mm to prevent high-voltage breakdown. The adhesive layer 5 can be made of materials such as thermally conductive pressure-sensitive adhesive or silicone grease, which can achieve low thermal resistance bonding with the device surface while compensating for surface roughness (Ra<1μm). The protective layer 6 can be made of materials such as PET film or polytetrafluoroethylene. The protective layer 6 has moisture-proof, corrosion-proof and environmental resistance (passes salt spray test >500 hours).

[0037] The flexible substrate layer 1 is prepared by extrusion or molding process, and the magnetron sputtering absorbing layer 3, the screen-printed thermal conductive layer 2 or the chemical vapor deposition insulating layer 4 are stacked layer by layer. The layers are then tightly bonded in a vacuum hot press (temperature 150-200℃, pressure 5-10MPa). Laser cutting or plasma activation is used to improve edge sealing and bonding strength.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thermally conductive, wave-absorbing, insulated gasket having an inner liner structure, characterized by: The substrate includes a substrate layer (1), a heat-conducting layer (2) is installed at the bottom of the substrate layer (1), a wave-absorbing layer (3) is installed at the bottom of the heat-conducting layer (2), a support layer (7) is installed at the bottom of the wave-absorbing layer (3), the support layer (7) is a honeycomb metal mesh plate, a plurality of mounting cavities (71) are uniformly opened on the outside of the support layer (7), a plurality of elastic support rings (72) are uniformly installed on the inner wall of the plurality of mounting cavities (71), an insulating layer (4) is installed at the bottom of the support layer (7), an adhesive layer (5) is installed at the bottom of the insulating layer (4), and a protective layer (6) is installed at the bottom of the adhesive layer (5).

2. The thermally conductive and wave-absorbing insulating gasket with an inner lining structure according to claim 1, characterized in that: The substrate layer (1) can be selected from silicone rubber, epoxy resin, or polyimide materials. The substrate layer (1) provides mechanical support and flexibility to ensure that the gasket can be compressed and adhered to the surface of the device.

3. The thermally conductive and wave-absorbing insulating gasket with an inner lining structure according to claim 1, characterized in that: The thermal conductive layer (2) can be made of aluminum nitride or aluminum oxide particles. The thermal conductive layer (2) mainly removes heat quickly through the phonon conduction path to reduce the interfacial thermal resistance.

4. The thermally conductive and wave-absorbing insulating gasket with an inner lining structure according to claim 1, characterized in that: The absorbing layer (3) can be selected from ferrite, carbonyl iron powder, or carbon nanotube materials. The absorbing layer (3) converts electromagnetic waves into heat energy through hysteresis loss and dielectric loss, and the absorption rate needs to reach -20dB or more.

5. The thermally conductive and wave-absorbing insulating gasket with an inner lining structure according to claim 1, characterized in that: The support layer (7) uses a honeycomb mesh to improve the overall strength of the substrate layer (1) and prevent excessive deformation.

6. The thermally conductive and wave-absorbing insulating gasket with an inner lining structure according to claim 1, characterized in that: The insulating layer (4) can be selected from ceramic-filled polymer or mica sheet material. The insulating layer (4) can block the electrical path to prevent high voltage breakdown. The adhesive layer (5) can be selected from thermally conductive pressure-sensitive adhesive or silicone grease material. The adhesive layer (5) can achieve low thermal resistance bonding with the device surface while compensating for surface roughness.

7. The thermally conductive and wave-absorbing insulating gasket with an inner lining structure according to claim 1, characterized in that: The protective layer (6) can be selected from PET film or polytetrafluoroethylene material. The protective layer (6) has the functions of moisture protection, corrosion protection and improved environmental tolerance.

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