An active phased array transmit assembly heat sink structure

Abstract

This utility model discloses a heat dissipation structure for an active phased array transmitter, including a main cavity structure, multiple axial flow fans, and multiple sound insulation cotton. In this application, a primary air duct is formed inside multiple large heat sinks, and microchannel fins are embedded in the primary air duct to densify the heat dissipation channels and increase the thermal contact area, thus maintaining good heat dissipation performance even with miniaturized heat sink fins. In this application, both the shell and the transmitter cavity are composed of a vapor chamber containing capillary tubes, and multiple power amplifier chips are correspondingly mounted on multiple diamond-copper composite substrates. The multiple diamond-copper composite substrates are evenly distributed within the transmitter cavity, ensuring consistent temperature of the multiple power amplifier chips and resulting in low thermal resistance of the entire heat dissipation structure. In this application, the sound insulation cotton can absorb some of the noise generated by the axial flow fans.

Description

Technical Field

[0001] This utility model relates to the technical field of wideband phased array transmitter components, and in particular to a heat dissipation structure for an active phased array transmitter component. Background Technology

[0002] A phased array transmitter is a high-performance phased array jamming system. Its core components are multiple unit radio frequency transmitters and antennas. The transmitter refers to the radio frequency power amplifier module in the antenna array. Approximately 90% of the heat loss of the phased array is concentrated in the transmitter, making it the part with the highest heat flux density in the system.

[0003] Today, thanks to the rapid development of integrated circuit manufacturing technology, the design and manufacturing of phased array antennas are constantly improving. Antenna elements are smaller, array structures are more compact, resulting in smaller volume and weight. More functional components are integrated together, achieving a multi-functional integrated design. This high-density, miniaturized, and integrated antenna chip has a higher heat flux density during operation, which poses a significant challenge to the heat dissipation system.

[0004] Temperature changes have a significant impact on the amplitude and phase characteristics and gain of phased array transmitting components. As the temperature rises, the performance of the transmitting module will decrease sharply, and may even cause damage to the module. At the same time, since many transmitting modules are arranged on the array surface to work together, the temperature difference between the modules caused by various factors will affect the phase of the excitation current, thereby reducing the overall performance of the phased array transmitting component. Therefore, in the design, how to effectively control the temperature difference between different chips and the maximum temperature of the chips on the antenna array surface has become a crucial technology.

[0005] Currently, phased arrays partially employ liquid cooling due to their high heat flux density. However, liquid cooling has several drawbacks.

[0006] 1. Increase the overall weight of the machine;

[0007] 2. High cost;

[0008] 3. There is a risk of water leakage from the equipment;

[0009] 4. Additional equipment is required to provide a liquid cooling source, increasing system costs.

[0010] Currently, some phased array transmitting components also use metal structures for air cooling, but this method has the following drawbacks:

[0011] 1. Existing air-cooling solutions are ineffective at high power levels >10W / mm². 2 The lower thermal resistance is relatively high, making it difficult to meet the heat dissipation requirements of the transmitting component during long-term operation.

[0012] 2. The heat dissipation fins are too large, which cannot well meet the requirements of lightweight and compact integration;

[0013] 3. Poor temperature uniformity leads to uneven junction temperature of the RF chip, affecting phase consistency;

[0014] 4. The fan is noisy, which affects the user experience.

[0015] Therefore, it is necessary to develop a heat dissipation structure for active phased array transmitter components to solve the above problems. Utility Model Content

[0016] The purpose of this invention is to design a heat dissipation structure for an active phased array transmitter component in order to solve the above problems.

[0017] This utility model achieves the above objectives through the following technical solutions:

[0018] A heat dissipation structure for an active phased array transmitter component includes:

[0019] The main cavity structure includes a shell, multiple large heat sinks, multiple microchannel fins, and a mounting plate. The mounting plate is installed at the top inside the shell. After the mounting plate and the front of the shell are combined, they form a mounting cavity in the middle. Multiple large heat sinks are vertically installed in the mounting cavity, with the upper end of the large heat sink connected to the bottom of the mounting plate and the lower end of the large heat sink connected to the bottom of the shell. The multiple large heat sinks are parallel to each other, and a heat dissipation channel is provided between two adjacent large heat sinks. Multiple microchannel fins are vertically installed in the mounting cavity, with the multiple microchannel fins being parallel to each other. At least one microchannel fin is provided in each heat dissipation channel. An active phased array transmitter is installed on the top of the mounting plate. The upper end of the microchannel fin is connected to the bottom of the mounting plate, and the microchannel fin is positioned below the active phased array transmitter.

[0020] Multiple axial flow fans; a ring structure is formed at the rear of the casing, and multiple axial flow fans are installed inside the rear of the casing and located on one side of multiple large heat sinks. The axial flow fans are used to blow air into the heat dissipation channel.

[0021] Multiple sound insulation cotton; multiple sound insulation cotton are installed on the air-facing side of multiple axial flow fans respectively.

[0022] Specifically, the main cavity structure also includes N guide plates, which are vertically installed inside the rear of the housing. The N guide plates divide the rear of the housing into N+1 guide channels, and multiple axial flow fans are installed on the side away from the front of the housing in the N+1 guide channels.

[0023] Furthermore, the heat dissipation structure of the active phased array transmitter also includes an air inlet plate. The air inlet plate has multiple air inlets arranged horizontally, corresponding to the number and position of the axial flow fans. The air inlet plate is installed inside the rear of the housing and is placed on the side of the sound insulation cotton away from the axial flow fans.

[0024] Furthermore, the active phased array transmitter assembly includes multiple power amplifier chips, multiple diamond-copper composite substrates, a transmitter assembly cavity, a debugging cover plate, and a sealing cover plate. The transmitter assembly cavity is composed of a heat spreader containing capillary tubes. The multiple power amplifier chips are correspondingly mounted on the multiple diamond-copper composite substrates. The multiple diamond-copper composite substrates are evenly distributed and mounted in the transmitter assembly cavity. The debugging cover plate is placed on the multiple power amplifier chips, and the sealing cover plate is placed on the transmitter assembly cavity. The transmitter assembly cavity is mounted on a mounting plate.

[0025] Preferably, the housing is composed of a heat spreader containing capillary tubes.

[0026] The beneficial effects of this utility model are as follows:

[0027] In this application, a primary airflow channel is formed inside multiple large heat sinks, and microchannel fins are embedded in the primary airflow channel to densify the heat dissipation channel and increase the thermal contact area, so that the heat dissipation effect can still be good even with miniaturized heat dissipation fins.

[0028] In this application, multiple guide vanes are set to isolate the air ducts of different axial flow fans, so as to avoid mutual interference between axial flow fans;

[0029] In this application, both the housing and the transmitter assembly cavity are composed of a heat spreader containing a capillary tube, and multiple power amplifier chips are correspondingly mounted on multiple diamond-copper composite substrates. The multiple diamond-copper composite substrates are evenly distributed in the transmitter assembly cavity, ensuring that the temperature of the multiple power amplifier chips is consistent, resulting in a low thermal resistance of the entire heat dissipation structure.

[0030] In this application, by installing sound insulation cotton, some of the noise generated by the axial flow fan can be absorbed. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of this application;

[0032] Figure 2 This is an explosion diagram of this application;

[0033] Figure 3 This is an exploded schematic diagram of the launching component in this application;

[0034] Figure 4 This is a front view of the main cavity in this application;

[0035] Figure 5 for Figure 4 Schematic diagram of AA section in the middle;

[0036] Figure 6 This is a schematic diagram of the mating structure of the large heat sink and the microchannel fins in this application;

[0037] Figure 7 This is a schematic diagram of the half-section three-dimensional structure of the main cavity in this application;

[0038] Figure 8 This is a three-dimensional structural diagram of the main cavity in this application.

[0039] Legend: 1- Antenna radome; 2- Main cavity structure; 2-1- Large heat sink; 2-2- Microchannel fins; 2-3- Air guide plate; 2-4- Mounting plate; 3- Active phased array transmitter assembly; 3-1- Power amplifier chip; 3-2- Diamond-copper composite substrate; 3-3- Transmitter assembly cavity; 3-4- Debugging cover plate; 3-5- Sealing cover plate; 4- Axial flow fan; 5- Temperature sensor; 6- Sound insulation cotton; 7- Air inlet plate; 7-1- Air inlet hole. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0042] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0043] In the description of this utility model, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0044] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0045] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0046] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0047] like Figure 1-8 As shown, a heat dissipation structure for an active phased array transmitter includes:

[0048] Main cavity structure 2; Main cavity structure 2 includes a shell, multiple large heat sinks 2-1, multiple microchannel fins 2-2, and a mounting plate 2-4. The mounting plate 2-4 is installed at the top inside the shell. After the mounting plate 2-4 and the front of the shell are combined, a mounting cavity is formed in the middle. Multiple large heat sinks 2-1 are vertically installed in the mounting cavity, and the upper end of the large heat sink 2-1 is connected to the bottom of the mounting plate 2-4, and the lower end of the large heat sink 2-1 is connected to the bottom of the shell. The multiple large heat sinks 2-1 are parallel to each other, and two adjacent large heat sinks are connected to each other. Heat dissipation channels are provided between the heat sinks 2-1. Multiple microchannel fins 2-2 are vertically installed in the mounting cavity. The multiple microchannel fins 2-2 are parallel to each other. The microchannel fins 2-2 are also parallel to the large heat sink 2-1. At least one microchannel fin 2-2 is provided in each heat dissipation channel. The active phased array transmitter 3 is installed on the top of the mounting plate 2-4. The upper end of the microchannel fin 2-2 is connected to the bottom of the mounting plate 2-4, and the microchannel fin 2-2 is placed below the active phased array transmitter 3.

[0049] Three axial flow fans 4; a ring structure is formed at the rear of the housing, and the three axial flow fans 4 are installed inside the rear of the housing and located on one side of multiple large heat sinks 2-1. The axial flow fans 4 are used to blow air into the heat dissipation channel.

[0050] Three sound insulation cotton 6; the three sound insulation cotton 6 are respectively installed on the air-facing side of the three axial flow fans 4.

[0051] In some embodiments, such as Figure 4 and 7 As shown, the main cavity structure 2 also includes two guide plates 2-3. The two guide plates 2-3 are vertically installed inside the rear of the housing. The two guide plates 2-3 divide the rear of the housing into three guide channels. The three axial flow fans 4 are respectively installed on the side of the three guide channels away from the front of the housing.

[0052] In some embodiments, such as Figure 2 As shown, the heat dissipation structure of the active phased array transmitter 3 also includes an air inlet plate 7. The air inlet plate 7 has multiple air inlets 7-1 arranged horizontally, corresponding to the number and position of the axial flow fans 4. The air inlet plate 7 is installed inside the rear of the housing and is placed on the side of the sound insulation cotton 6 away from the axial flow fans 4.

[0053] In some embodiments, such as Figure 2 and 3 As shown, the active phased array transmitter assembly 3 includes multiple power amplifier chips 3-1, multiple diamond-copper composite substrates 3-2, a transmitter assembly cavity 3-3, a debugging cover plate 3-4, and a sealing cover plate 3-5. The transmitter assembly cavity 3-3 is composed of a heat spreader containing capillary tubes. The multiple power amplifier chips 3-1 are correspondingly mounted on the multiple diamond-copper composite substrates 3-2. The multiple diamond-copper composite substrates 3-2 are evenly distributed within the transmitter assembly cavity 3-3. The debugging cover plate 3-4 covers the multiple power amplifier chips 3-1, and the sealing cover plate 3-5 covers the transmitter assembly cavity 3-3. The transmitter assembly cavity 3-3 is mounted on a mounting plate 2-4. The top of the active phased array transmitter assembly 3 is sealed by an antenna cover 1.

[0054] In some embodiments, the housing is constructed as a heat spreader containing capillary tubes.

[0055] In operation, the axial fan 4 draws in external cold air through the air inlet 7-1 on the air inlet plate 7 and the sound insulation cotton 6, which then enters multiple guide channels and then between the large heat sink 2-1 and the microchannel fins 2-2. The heat generated by the power amplifier chip 3-1 is transferred to the large heat sink 2-1 and the microchannel fins 2-2 through the diamond-copper composite substrate 3-2, the transmitter component cavity 3-3, and the mounting plate 2-4, and is carried away by the airflow generated by the axial fan 4. In this application, a fin-like heat dissipation structure is also provided on the outer wall of the housing to assist in heat dissipation.

[0056] In this application, the whole machine is composed of a main cavity structure 2, which is mainly composed of a heat spreader containing capillary tubes. It includes a primary air duct composed of large heat sinks 2-1, and microchannel fins 2-2 are embedded in the primary air duct to densify the heat dissipation channel and increase the heat contact area. It also includes a guide plate 2-3 to isolate the air duct and avoid mutual interference between the fans.

[0057] The active phased array transmitter assembly 3 consists of a transmitter assembly cavity 3-3, a diamond-copper composite substrate 3-2 (thermal conductivity ≥400W / m·K), a power amplifier chip 3-1, a debugging cover plate 3-4, and a sealing cover plate 3-5. The transmitter assembly cavity 3-3 is made of a heat spreader. The diamond-copper composite substrate 3-2 has a thickness of 0.8mm. The power amplifier chip 3-1 is directly soldered onto the diamond-copper composite substrate 3-2, which has a thermal conductivity ≥170 W / m·K.

[0058] The primary air duct consists of large aluminum heat sinks 2-1 (5-10mm spacing), which are native to the main cavity structure 2 and guide the airflow evenly to reduce wind resistance.

[0059] The secondary air duct is a 2-2 array of microchannel fins with a spacing of 1-2mm. It is manufactured using precision stamping and welded to the high-heat area to increase the heat dissipation area and improve heat dissipation efficiency.

[0060] This application preferably employs intelligent control, using a temperature sensor 55 with an accuracy of ±0.5℃ to detect the temperature of the active phased array transmitter 3 in real time, and PID control the fan speed (500-3000RPM); multiple fan speed levels (such as low power consumption and high power consumption) can be set, and the speed can be controlled according to different temperature conditions.

[0061] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A heat dissipation structure for an active phased array transmitting component, characterized in that, include: Main cavity structure; The main cavity structure includes a shell, multiple large heat sinks, multiple microchannel fins, and a mounting plate. The mounting plate is installed at the top inside the shell. After the mounting plate and the front of the shell are combined, they form a mounting cavity in the middle. Multiple large heat sinks are vertically installed in the mounting cavity, with the upper end of the large heat sink connected to the bottom of the mounting plate and the lower end of the large heat sink connected to the bottom of the shell. The multiple large heat sinks are parallel to each other, and a heat dissipation channel is provided between two adjacent large heat sinks. Multiple microchannel fins are vertically installed in the mounting cavity, with the multiple microchannel fins being parallel to each other. At least one microchannel fin is provided in each heat dissipation channel. An active phased array transmitter is installed on the top of the mounting plate. The upper end of the microchannel fin is connected to the bottom of the mounting plate, and the microchannel fin is positioned below the active phased array transmitter. Multiple axial flow fans; a ring structure is formed at the rear of the casing, and multiple axial flow fans are installed inside the rear of the casing and located on one side of multiple large heat sinks. The axial flow fans are used to blow air into the heat dissipation channel. Multiple sound insulation cotton; multiple sound insulation cotton are installed on the air-facing side of multiple axial flow fans respectively.

2. The heat dissipation structure for an active phased array transmitting component according to claim 1, characterized in that, The main cavity structure also includes N guide plates, which are vertically installed inside the rear of the housing. The N guide plates divide the rear of the housing into N+1 guide channels, and multiple axial flow fans are installed on the side away from the front of the housing in the N+1 guide channels.

3. The heat dissipation structure for an active phased array transmitting component according to claim 2, characterized in that, The heat dissipation structure of the active phased array transmitter also includes an air inlet plate. The air inlet plate has multiple air inlets arranged horizontally, corresponding to the number and position of the axial flow fans. The air inlet plate is installed inside the rear of the housing and is placed on the side of the sound insulation cotton away from the axial flow fans.

4. The heat dissipation structure for an active phased array transmitting component according to claim 1, characterized in that, The active phased array transmitter assembly includes multiple power amplifier chips, multiple diamond-copper composite substrates, a transmitter assembly cavity, a debugging cover plate, and a sealing cover plate. The transmitter assembly cavity is composed of a heat spreader containing capillary tubes. Multiple power amplifier chips are correspondingly mounted on multiple diamond-copper composite substrates. Multiple diamond-copper composite substrates are evenly distributed and mounted in the transmitter assembly cavity. The debugging cover plate is placed on the multiple power amplifier chips, and the sealing cover plate is placed on the transmitter assembly cavity. The transmitter assembly cavity is mounted on a mounting plate.

5. The heat dissipation structure for an active phased array transmitting component according to claim 1, characterized in that, The shell is composed of a heat spreader containing capillary tubes.

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