A heat dissipation device for data element processing equipment

Abstract

This utility model discloses a heat dissipation device for data component processing equipment, relating to the field of data component processing technology. It includes a chassis and a heat dissipation mechanism mounted on the chassis. The heat dissipation mechanism includes a cold head and an outer cylinder and an inner cylinder fitted together. Sealing rings are provided at both ends of the area enclosed by the outer and inner cylinders. The outer cylinder, inner cylinder, and two sealing rings together form an annular cavity filled with thermally conductive silicone grease. A heat dissipation pipe is spirally wound inside the annular cavity, with both ends of the heat dissipation pipe extending out of the outer cylinder and fixedly fitted with connecting pipes. This heat dissipation device for data component processing equipment, through a three-dimensional heat exchange system of "liquid cooling-phase change-air cooling," can quickly dissipate heat, avoiding performance degradation caused by heat accumulation, ensuring the continuity and efficiency of data component processing, and solving the equipment stability problem in the large-scale production of data components.

Description

Technical Field

[0001] This utility model relates to the field of data element processing technology, specifically a heat dissipation device for data element processing equipment. Background Technology

[0002] In the process of marketizing data elements, traditional data products often suffer from weak security control over raw data during production, leading to frequent incidents of data leakage, tampering, and misuse. This results in serious consequences, such as damage to personal information rights and endangering national security. This is also one of the reasons that seriously restricts the large-scale allocation of data elements in the market. Data elements, as an "intermediate state" of data between raw data and data products, are used for large-scale market circulation and security control, replacing raw data for circulation and trading. During the processing of data elements, the server heats up significantly, seriously affecting the processing efficiency of data elements.

[0003] Therefore, it is necessary to propose a heat dissipation device for data element processing equipment to solve the above problems. Utility Model Content

[0004] Technical problem to be solved: The purpose of this utility model is to provide a heat dissipation device for data element processing equipment, so as to solve the problem mentioned in the background art that the server heats up severely during the processing of data elements, which seriously affects the processing efficiency of data elements.

[0005] Technical Solution: To achieve the above objectives, this utility model provides the following technical solution: A heat dissipation device for data element processing equipment, comprising a chassis and a heat dissipation mechanism mounted on the chassis. The heat dissipation mechanism includes a cold head and an outer cylinder and an inner cylinder fitted together. Sealing rings are provided at both ends of the area enclosed by the outer cylinder and the inner cylinder. The outer cylinder, the inner cylinder, and the two sealing rings together form an annular cavity, which is filled with thermally conductive silicone grease. A heat dissipation pipe is spirally wound inside the annular cavity. Both ends of the heat dissipation pipe extend out of the outer cylinder and are fixedly fitted with connecting pipes. The other ends of the two connecting pipes are respectively connected to the input and output ends of the cold head. A water pump is provided inside the cold head. Multiple heat pipes are uniformly fixedly installed along the circumference at the top of the annular cavity. The lower ends of the heat pipes extend into the annular cavity. Multiple heat dissipation fins are vertically spaced above the annular cavity, and each heat dissipation fin is simultaneously fitted onto multiple heat pipes. A cooling fan for blowing air onto the heat dissipation fins is also fixedly installed on the chassis.

[0006] Preferably, a fixing seat is fixedly installed on the outer cylinder, and the fixing seat is fixedly connected to the chassis.

[0007] Preferably, the cooling fan is fixedly installed inside the chassis, and multiple ventilation holes are provided on the side wall of the chassis near the air outlet of the cooling fan, and the multiple ventilation holes are arranged in a rectangular array.

[0008] Preferably, the air outlet of the cooling fan is located between the uppermost and lowermost cooling fins, and the centerline of the air outlet of the cooling fan and the centerline of the cooling fins are in the same plane.

[0009] Preferably, the inner cylinder is fixedly installed with heat dissipation plates arranged in a crisscross pattern.

[0010] Beneficial effects: Compared with the prior art, this utility model provides a heat dissipation device for data element processing equipment. This heat dissipation device has a unique structure and is easy to use. Through a three-dimensional heat exchange system of "liquid cooling-phase change-air cooling", it can quickly dissipate heat, avoid performance degradation caused by heat accumulation, ensure the continuity and efficiency of data element processing, and solve the equipment stability problem in the mass production of data elements. The grid heat dissipation plate in embodiment 2 further increases the heat dissipation area. Embodiment 3 ensures the coordinated stability of power supply, hard drive and other components through air circulation inside and outside the chassis, indirectly improving the efficiency of the entire data element processing process. Attached Figure Description

[0011] Figure 1 This is a front view schematic diagram of the structure of this utility model;

[0012] Figure 2 This is a three-dimensional schematic diagram of the structure of this utility model;

[0013] Figure 3 This utility model Figure 1 Schematic diagram of the cross section at point AA;

[0014] Figure 4 This is a three-dimensional schematic diagram of the heat dissipation mechanism of this utility model;

[0015] Figure 5 This is a cross-sectional schematic diagram of the outer cylinder of this utility model.

[0016] In the diagram: 1. Chassis; 2. Heat dissipation mechanism; 21. Outer shell; 22. Mounting base; 23. Inner shell; 24. Heat pipe; 25. Heat pipe; 26. Heat dissipation fins; 27. Connecting pipe; 28. Cold block; 29. ​​Cooling fan; 210. Heat sink. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Example 1: This Example 1 provides a heat dissipation device for data element processing equipment. It is a direct improvement on existing heat dissipation devices and has a unique structure. Please refer to [link / reference]. Figure 1-5As shown, the device includes a chassis 1 and a heat dissipation mechanism 2 mounted on the chassis 1. The heat dissipation mechanism 2 includes a cold head 28 and an outer cylinder 21 and an inner cylinder 23 that are fitted together. A fixing seat 22 is welded onto the outer cylinder 21. The fixing seat 22 has screw holes and is fixedly connected to the chassis 1 by screws. Sealing rings are provided at both the upper and lower ends of the area enclosed by the outer cylinder 21 and the inner cylinder 23. The outer cylinder 21, the inner cylinder 23, and the two sealing rings together form an annular cavity, which is filled with thermally conductive silicone grease.

[0019] The outer cylinder 21, inner cylinder 23, and sealing ring are integrally formed from aluminum alloy, combining lightweight and high thermal conductivity. The mounting base 22 is a rectangular stainless steel plate, fixed to the middle of the outer wall of the outer cylinder 21 by laser welding. M4 screw holes are opened at all four corners of the mounting base 22 to match the pre-set threaded holes of the chassis 1. It is detachably fixed by Phillips head countersunk screws, which facilitates future maintenance and replacement. A heat dissipation tube 24 is spirally wound inside the annular cavity. Both ends of the heat dissipation tube 24 extend out of the outer cylinder 21 and are fixedly fitted with connecting pipes 27. The other ends of the two connecting pipes 27 are respectively connected to the cold head. The input and output ends of 28 are connected. A water pump is installed inside the cold head 28. The cold head 28 is an existing device, and its internal structure and working principle will not be described in detail. The heat dissipation pipe 24 is a copper pipe, and both ends pass through the pre-set through holes on the side wall of the outer cylinder 21. The through holes and the heat dissipation pipe 24 are sealed by brazing to prevent leakage of thermal grease. Both ends of the heat dissipation pipe 24 extending out of the outer cylinder 21 are fixedly fitted with connecting pipe 27 by compression fittings. The connecting pipe 27 is a flexible hose, and its other end is sealed and connected to the input and output ends of the cold head 28 by quick-connect fittings to form a closed coolant circulation loop.

[0020] Multiple heat pipes 25 are uniformly fixedly installed around the top of the annular cavity, and the lower ends of the heat pipes 25 extend into the annular cavity. Multiple heat dissipation fins 26 are vertically spaced above the annular cavity, and each heat dissipation fin 26 is simultaneously fitted onto multiple heat pipes 25. A cooling fan 29 for blowing air onto the heat dissipation fins 26 is also fixedly installed on the chassis 1. The heat pipes 25 are made of copper vacuum heat pipes, and their penetration points with the outer cylinder 21 are sealed by soldering. The heat dissipation fins 26 are aluminum alloy stamping parts, and each heat dissipation fin 26 has through holes adapted to the heat pipes 25, and is tightly connected to the heat pipes 25 through a tube expansion process.

[0021] The cooling fan 29 is fixedly installed on the outside of the chassis 1. The air outlet of the cooling fan 29 is located between the uppermost and lowermost heat dissipation fins 26, and the axis of the air outlet of the cooling fan 29 is in the same plane as the axis of the heat dissipation fins 26. When the air blown out by the cooling fan 29 passes between the adjacent heat dissipation fins 26, it can dissipate heat on the heat pipe 25. On the other hand, due to the high air velocity between the adjacent heat dissipation fins 26, the air below the inner cylinder 23 is forced through the inside of the inner cylinder 23 under pressure, thereby dissipating heat from the inner cylinder 23, further improving the heat dissipation rate of the coolant and preventing heat accumulation.

[0022] Working principle: When the server is running, the built-in water pump of the cold head 28 starts, driving the coolant to circulate in the loop formed by the connecting pipe 27 and the heat dissipation pipe 24; the copper base of the cold head 28 absorbs the heat generated by the processor through the thermally conductive silicone pad and transfers it to the coolant. The heated coolant flows into the spiral heat dissipation pipe 24 and transfers the heat through the pipe wall to the high thermal conductivity silicone grease in the annular cavity; the thermally conductive silicone grease evenly transfers the heat to the heat pipe 25. The working fluid in the heat pipe 25 is heated and vaporized, and flows rapidly along the pipe cavity to the condensation section that is combined with the heat dissipation fins 26. Heat is released through phase change. After the working fluid liquefies, it flows back to the evaporation section, forming a highly efficient thermosiphon cycle.

[0023] After the cooling fan 29 is started, the airflow passes vertically through the gaps in the heat sink fins 26, directly carrying away the heat released by the heat pipe 25. At the same time, due to the increased airflow velocity in the area of ​​the heat sink fins 26, a local low-pressure area is formed, which drives the cold air below the inner cylinder 23 to flow upward from the inside of the inner cylinder 23 and exchange heat through the pipe wall of the inner cylinder 23, further enhancing the heat dissipation effect and effectively avoiding performance throttling caused by heat accumulation.

[0024] Example 2: The difference between Example 2 and Example 1 is as follows: Figure 5 As shown, a heat dissipation plate 210 with crisscrossing arrangement is fixedly installed inside the inner cylinder 23. The heat dissipation plate 210 is made of copper. The horizontal heat dissipation plate and the vertical heat dissipation plate intersect perpendicularly to form a grid structure. The intersection points are fixed by brazing. The edge of the heat dissipation plate 210 is fixed to the inner wall of the inner cylinder 23 by soldering. The upper and lower end faces of the heat dissipation plate 210 are flush with the upper and lower end faces of the inner cylinder 23, respectively.

[0025] When the airflow generated by the cooling fan 29 passes through the inner cylinder 23, the mesh-like heat dissipation plate 210 not only increases the heat dissipation area of ​​the inner cylinder 23, but also creates turbulence on the airflow, breaks the laminar boundary layer, and allows the airflow to fully contact the heat dissipation plate 210 and the inner wall of the inner cylinder 23, further improving the heat exchange efficiency.

[0026] Example 3: The difference between Example 3 and Example 1 is as follows: Figure 2-3As shown, the cooling fan 29 is fixedly installed inside the chassis 1. Multiple ventilation holes are provided on the side wall of the chassis 1 near the air outlet of the cooling fan 29. The multiple ventilation holes are arranged in a rectangular array. After the cooling fan 29 is started, on the one hand, it blows airflow onto the heat dissipation fins 26 to achieve directional heat dissipation of the heat pipe 25; on the other hand, the negative pressure generated by the fan operation drives the hot air inside the chassis 1 to flow towards the air outlet and is discharged outside the chassis through the ventilation holes. At the same time, the air inlet on the other side of the chassis 1 is designed to draw in cold air, forming an air circulation inside the chassis, which improves the overall operating stability of the server.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A data element processing device cooling device comprising a cabinet (1), characterized in that: It also includes a heat dissipation mechanism (2) installed on the chassis (1). The heat dissipation mechanism (2) includes a cold head (28) and an outer cylinder (21) and an inner cylinder (23) fitted together. Sealing rings are provided at both ends of the area enclosed by the outer cylinder (21) and the inner cylinder (23). The outer cylinder (21), the inner cylinder (23) and the two sealing rings together form an annular cavity, and the annular cavity is filled with thermally conductive silicone grease. A heat dissipation tube (24) is spirally wound in the annular cavity. Both ends of the heat dissipation tube (24) extend out of the outer cylinder (21) and are fixedly fitted with a heat dissipation device. The two connecting pipes (27) are connected to the input and output ends of the cold head (28) respectively. A water pump is installed inside the cold head (28). Multiple heat pipes (25) are evenly fixedly installed on the top of the annular cavity along the circumference. The lower ends of the heat pipes (25) extend into the annular cavity. Multiple heat dissipation fins (26) are arranged vertically at intervals above the annular cavity. Each heat dissipation fin (26) is simultaneously fitted onto multiple heat pipes (25). A cooling fan (29) for blowing air onto the heat dissipation fins (26) is also fixedly installed on the chassis (1).

2. A heat sink for a data element processing device according to claim 1, wherein: A fixing seat (22) is fixedly installed on the outer cylinder (21), and the fixing seat (22) is fixedly connected to the chassis (1).

3. The heat sink for a data element processing device of claim 1, wherein: The cooling fan (29) is fixedly installed inside the chassis (1). Multiple ventilation holes are provided on the side wall of the chassis (1) near the air outlet of the cooling fan (29). The multiple ventilation holes are arranged in a rectangular array.

4. The heat dissipation device for data element processing equipment according to claim 1, characterized in that: The air outlet of the cooling fan (29) is located between the uppermost cooling fin (26) and the lowermost cooling fin (26), and the axis of the air outlet of the cooling fan (29) and the axis of the cooling fin (26) are in the same plane.

5. The heat dissipation device for data element processing equipment according to claim 1, characterized in that: The inner cylinder (23) is fixedly installed with heat dissipation plates (210) arranged in a crisscross pattern.

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