Wafer processing equipment

Abstract

This application discloses a wafer processing apparatus. The apparatus includes a machine base with a tool mount; a detection device including a light emitter and a light receiver spaced apart from each other and mounted on the machine base; and a drive device connected to the tool mount. After a target tool is mounted on the tool mount, the drive device moves the tool mount between the light emitter and the light receiver to perform installation detection on the target tool. During the installation detection of the target tool, the emission axis of the light emitter and the reception axis of the light receiver are aligned. Through this method, this application can detect whether the tool is mounted in the correct position, thereby reducing the probability of wafer breakage and improving the efficiency of the wafer packaging process.

Description

Technical Field

[0001] This application relates to the field of wafer processing, and in particular to a wafer processing apparatus. Background Technology

[0002] In the wafer packaging process, a protective tape is applied to the front side of the wafer before wafer thinning, and then the tape is cut along the wafer edge with a blade. Current equipment designs do not detect blade position or have blade mounting mechanisms; blade installation and verification are typically done manually. Improper manual installation or inaccurate verification can cause the blade to scratch the wafer, leading to wafer breakage, impacting the wafer packaging process schedule, and wasting wafer materials. Utility Model Content

[0003] The main objective of this application is to provide a wafer processing apparatus capable of detecting whether the cutting tool is installed in the correct position, thereby reducing the probability of wafer breakage and improving the efficiency of wafer packaging processes.

[0004] In a first aspect, this application provides a wafer processing apparatus. The wafer processing apparatus includes a machine base with a tool mounting base; a detection device including a light emitter and a light receiver spaced apart from each other and mounted on the machine base; and a driving device connected to the tool mounting base, which, after a target tool is mounted on the tool mounting base, controls the tool mounting base to move between the light emitter and the light receiver to perform installation detection on the target tool; wherein, when performing installation detection on the target tool, the emission optical axis of the light emitter and the receiving optical axis of the light receiver are on the same straight line.

[0005] The beneficial effects of this application are as follows: By setting up relatively spaced light emitters and light receivers, after the target tool is installed on the tool mounting base, the drive device controls the tool mounting base to move between the light emitter and the light receiver. Since the emission optical axis of the light emitter and the receiving optical axis of the light receiver are on the same straight line, the installation position of the target tool can be automatically determined by the intensity of the light received by the light receiver. Compared with manual inspection, this can speed up the wafer packaging process efficiency, and the judgment is more accurate, reducing the probability of wafer breakage caused by improper installation of the target tool and reducing unnecessary cost consumption. Attached Figure Description

[0006] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0007] Figure 1This is a schematic diagram of the structure of the first embodiment of the wafer processing apparatus of this application;

[0008] Figure 2 This is a schematic diagram of the structure of the second embodiment of the wafer processing apparatus of this application;

[0009] Figure 3 This is a schematic diagram of the structure of the third embodiment of the wafer processing apparatus of this application;

[0010] Figure 4 This is a schematic diagram of the structure of the fourth embodiment of the wafer processing apparatus of this application;

[0011] Figure 5 This is a schematic diagram of the structure of the fifth embodiment of the wafer processing apparatus of this application;

[0012] Figure 6 This is a top view of an embodiment of the light blocker of this application;

[0013] Figure 7 This is a schematic diagram of the structure of the sixth embodiment of the wafer processing apparatus of this application. Detailed Implementation

[0014] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0016] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0017] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0018] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0019] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0020] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0021] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0022] In wafer packaging technologies, the current equipment processes are as follows.

[0023] First, install the tool on the tool mount.

[0024] Next, the machine begins its work, loading and moving the wafers to be processed onto the positioning platform for positioning.

[0025] After positioning, move the wafer to the placement platform and apply adhesive tape to the front side of the wafer.

[0026] After the tape is applied, it needs to be cut using a cutter on the tool mount. After cutting, the wafer with the tape on its front side is moved to the next node for subsequent processing.

[0027] In the current process, whether the tool is installed on the tool holder needs to be manually confirmed, and whether the tool's installation position is accurate can only be checked by the operator using relevant devices when installing the tool.

[0028] However, manual inspection has a higher probability of error, which can easily affect the wafer packaging process and reduce wafer packaging efficiency.

[0029] Based on the above considerations, this application provides a wafer processing apparatus that automatically detects whether the cutting tool is installed in the correct position, thereby reducing the probability of wafer breakage and improving the efficiency of wafer packaging process.

[0030] Reference Figure 1 , Figure 1 This is a schematic diagram of the structure of the first embodiment of the wafer processing apparatus provided in this application.

[0031] In this embodiment, the wafer processing apparatus includes a machine base 10. A tool mounting base 20 is provided on the machine base 10. The tool mounting base 20 is used to mount a target tool. The target tool is used to cut the adhesive tape attached to the wafer. The wafer processing apparatus also includes a drive device 30, which is connected to the tool mounting base 20 and controls the movement of the tool mounting base 20, thereby controlling the movement of the target tool. The wafer processing apparatus also includes a detection device 40, which includes a light emitter 41 and a light receiver 42. The light emitter 41 and the light receiver 42 are disposed on the machine base 10 at a distance from each other.

[0032] After the target tool is placed on the tool mounting base 20, the drive device 30 controls the tool mounting base 20 to move between the light emitter 41 and the light receiver 42 to perform installation and testing on the target tool.

[0033] When the target tool is installed and tested, the emitting optical axis of the light emitter 41 and the receiving optical axis of the light receiver 42 are on the same straight line.

[0034] In this embodiment, by setting up a light emitter and a light receiver at a relative interval, after the target tool is installed on the tool mounting base, the drive device controls the tool mounting base to move between the light emitter and the light receiver. Since the emission optical axis of the light emitter and the reception optical axis of the light receiver are on the same straight line, the installation position of the target tool can be automatically determined by the intensity of the light received by the light receiver. Compared with manual inspection, this can speed up the wafer packaging process, and the judgment is more accurate, reducing the probability of wafer breakage caused by improper installation of the target tool and reducing unnecessary cost consumption.

[0035] In one embodiment, the light emitter is an infrared light emitter, and the light receiver is an infrared light receiver.

[0036] In one embodiment, the wafer processing apparatus includes a controller and an alarm, the controller being connected to a light receiver and the alarm.

[0037] The controller is connected to a light receiver and can obtain the light intensity received by the light receiver, thereby determining whether the installation position of the target tool is accurate based on the light intensity.

[0038] For example, assuming the light intensity of the light emitted by the light emitter is 100 when the light receiver receives all the light emitted, then when the target tool is installed and the tool mount is moved between the light emitter and the light receiver, the target tool will block part of the light emitted by the light emitter, thus reducing the light received by the light receiver. Assuming the lowest point of the target tool is located exactly in the middle of the light beam emitted by the light emitter, the target tool will block half of the light. The light receiver will then only receive half of the light, and the controller will obtain a light intensity of 50 from the light receiver. When detecting the position of the target tool, if the controller obtains a light intensity of 50 from the light receiver, it determines that the target tool's installation position is correct.

[0039] Furthermore, some margin of error can be allowed for the installation position of the target tool, setting a normal range for the controller to determine if the installation position is correct. For example, when detecting the position of the target tool, if the controller obtains a light intensity of 40-60 from the light receiver, it can be considered that the installation position of the target tool is correct, and the target tool can be used for subsequent cutting operations.

[0040] When the controller detects that the light intensity of the light receiver is 0, it determines that the target tool has completely blocked the light emitted by the light emitter, and that the target tool's installation position is too low and needs to be adjusted.

[0041] When the controller detects that the light intensity from the light controller is greater than 0 but less than the normal range, it determines that the target tool is blocking most of the light emitted by the light emitter, and that the target tool's installation position is too low and needs to be adjusted.

[0042] When the controller detects that the light intensity from the light controller is greater than 0 but greater than the normal range, it determines that the target tool is blocking a small portion of the light emitted by the light emitter, and that the target tool's installation position is too high and needs to be adjusted.

[0043] When the controller receives a light intensity of 0 from the light controller, it determines that the target tool is not blocking the light emitted by the light emitter, and that the target tool is installed too high or has not yet been installed, requiring adjustment.

[0044] In one embodiment, the light emitter 41 and the light receiver 42 are positioned in a fixed location and cannot be adjusted or moved; only the light emitter 41 and the light receiver 42 can be replaced. When positioned in a fixed location, it is necessary to ensure that the emission optical axis of the light emitter 41 and the receiving optical axis of the light receiver 42 are on the same straight line.

[0045] In one embodiment, the light emitter 41 and the light receiver 42 may be mounted on an adjustable mechanism.

[0046] Continue to refer to Figure 1 The machine 10 is also equipped with a height adjuster 50, and a light emitter 41 and a light receiver 42 are mounted on the height adjuster 50.

[0047] The height of the light emitter 41 and the light receiver 42 can be adjusted using the height adjuster 50, but when performing tool position detection, it is necessary to ensure that the height of the light emitter 41 and the light receiver 42 are at the same height.

[0048] When different target tools are installed and there are different installation positions for inspection, the height adjuster 50 can more conveniently meet the inspection requirements.

[0049] For example, when target tool 1 is installed, if the lowest point of target tool 1 is 10cm, then the light emitter 41 and light receiver 42 are adjusted to the detection height corresponding to 10cm using the height adjuster. When target tool 2 is installed, if the lowest point of target tool 2 is 15cm, then the light emitter 41 and light receiver 42 are adjusted to the detection height corresponding to 15cm using the height adjuster.

[0050] Reference Figure 2 , Figure 2 This is a schematic diagram of the structure of the second embodiment of the wafer processing apparatus provided in this application.

[0051] The wafer processing apparatus includes a machine base 10. A tool mount 20 is provided on the machine base 10. The tool mount 20 is used to mount a target tool. The target tool is used to cut the adhesive tape attached to the wafer. The wafer processing apparatus also includes a drive device 30, which is connected to the tool mount 20 and controls the movement of the tool mount 20, thereby controlling the movement of the target tool. The wafer processing apparatus also includes an inspection device 40, which includes a light emitter 41 and a light receiver 42. The light emitter 41 and the light receiver 42 are arranged opposite each other on the machine base 10.

[0052] The wafer processing apparatus also includes a first position sensor 60. The first position sensor 60 is used to detect the position of the tool mount in the horizontal direction. The first position sensor 60 may be a distance sensor, used to detect whether the tool mount 20 has moved to the midpoint between the light emitter 41 and the light receiver 42 in the horizontal direction.

[0053] Reference Figure 3 , Figure 3 This is a schematic diagram of the third embodiment of the wafer processing apparatus provided in this application.

[0054] The wafer processing apparatus includes a machine base 10. A tool mount 20 is provided on the machine base 10. The tool mount 20 is used to mount a target tool. The target tool is used to cut the adhesive tape attached to the wafer. The wafer processing apparatus also includes a drive device 30, which is connected to the tool mount 20 and controls the movement of the tool mount 20, thereby controlling the movement of the target tool. The wafer processing apparatus also includes an inspection device 40, which includes a light emitter 41 and a light receiver 42. The light emitter 41 and the light receiver 42 are arranged opposite each other on the machine base 10.

[0055] The wafer processing apparatus includes a first position sensor 60 and a second position sensor 70. The first position sensor 60 is used to detect the position of the tool mount in the horizontal direction. The first position sensor 60 may be a distance sensor, used to detect whether the tool mount 20 has moved to the midpoint between the light emitter 41 and the light receiver 42 in the horizontal direction.

[0056] The second position sensor 70 is used to detect the position of the tool mount in the vertical direction. The second position sensor 70 may be a distance sensor, used to detect whether the tool mount 20 has moved to the midpoint between the light emitter 41 and the light receiver 42 in the vertical direction.

[0057] The relative position between the first position sensor 60 and the second position sensor 70 can be set according to actual conditions and is not limited here. The first position sensor 60 and the second position sensor 70 can achieve position detection based on the positioning device provided on the tool mount 20 and / or the drive device 30 or the structure of the sensor itself.

[0058] Reference Figure 4 , Figure 4 This is a schematic diagram of the fourth embodiment of the wafer processing apparatus provided in this application.

[0059] In a wafer fabrication apparatus, the first position sensor 60 and the second position sensor 70 can be arranged in the same vertical direction, which can reduce the space required for the device in the horizontal direction and improve the integration of the wafer fabrication apparatus. For example, the first position sensor 60 and the second position sensor 70 can be arranged on the same height adjuster 50.

[0060] Reference Figure 5 , Figure 5 This is a schematic diagram of the fifth embodiment of the wafer processing apparatus provided in this application.

[0061] The wafer processing apparatus includes a machine base 10. A tool mount 20 is provided on the machine base 10. The tool mount 20 is used to mount a target tool. The target tool is used to cut the adhesive tape attached to the wafer. The wafer processing apparatus also includes a drive device 30, which is connected to the tool mount 20 and controls the movement of the tool mount 20, thereby controlling the movement of the target tool. The wafer processing apparatus also includes an inspection device 40, which includes a light emitter 41 and a light receiver 42. The light emitter 41 and the light receiver 42 are arranged opposite each other on the machine base 10.

[0062] The wafer processing apparatus also includes a light blocker 80, which is arranged around the inspection equipment 40. Further reference can be made to... Figure 6 , Figure 6 This is a top view of an embodiment of a light blocker. In the figure, the light blocker 80 is arranged around the detection device 40 to block part of the light from the detection device 40, preventing other light from interfering with the light receiver 42 when the detection device 40 is installing and detecting the target tool.

[0063] Reference Figure 7 , Figure 7 This is a schematic diagram of the sixth embodiment of the wafer processing apparatus provided in this application.

[0064] The wafer processing apparatus includes a machine base 10. A tool mount 20 is provided on the machine base 10. The tool mount 20 is used to mount a target tool. The target tool is used to cut the adhesive tape attached to the wafer. The wafer processing apparatus also includes a drive device 30, which is connected to the tool mount 20 and controls the movement of the tool mount 20, thereby controlling the movement of the target tool. The wafer processing apparatus also includes an inspection device 40, which includes a light emitter 41 and a light receiver 42. The light emitter 41 and the light receiver 42 are arranged opposite each other on the machine base 10.

[0065] The wafer processing apparatus also includes a wafer carrier stage 90, which is used to hold the wafers to be processed.

[0066] In one embodiment, the wafer processing apparatus further includes a wafer driving device for moving the wafer to be processed to a wafer carrier stage.

[0067] In summary, by setting up relatively spaced light emitters and light receivers, after the target tool is installed onto the tool mount, the drive device controls the tool mount to move between the light emitter and the light receiver. Since the emission optical axis of the light emitter and the reception optical axis of the light receiver are on the same straight line, the installation position of the target tool can be automatically determined by the intensity of the light received by the light receiver. Compared with manual inspection, this can speed up the wafer packaging process, and the judgment is more accurate, reducing the probability of wafer breakage caused by improper installation of the target tool and reducing unnecessary cost consumption.

[0068] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0069] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0070] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0071] If the integrated units in the other embodiments described above are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0072] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A wafer processing apparatus characterized by comprising: include: A machine base, wherein a tool mounting base is provided on the machine base; The detection equipment includes light emitters and light receivers arranged at relatively intervals, and is mounted on the machine platform; A driving device is connected to the tool mounting base. After the target tool is placed on the tool mounting base, the device controls the tool mounting base to move between the light emitter and the light receiver to perform installation detection on the target tool. When the target tool is installed and tested, the emission optical axis of the light emitter and the receiving optical axis of the light receiver are on the same straight line.

2. The wafer processing apparatus according to claim 1, characterized in that, The wafer processing apparatus includes a controller and an alarm, the controller being connected to the light receiver and the alarm.

3. The wafer processing apparatus according to claim 1, characterized in that, The light emitter is an infrared light emitter, and the light receiver is an infrared light receiver.

4. The wafer processing apparatus according to claim 1, characterized in that, The machine is equipped with a height adjuster, and the light emitter and the light receiver are mounted on the height adjuster.

5. The wafer processing apparatus according to claim 1, characterized in that, The wafer processing apparatus includes a first position sensor for detecting the position of the tool mount in the horizontal direction.

6. The wafer processing apparatus according to claim 5, characterized in that, The wafer processing apparatus includes a second position sensor for detecting the position of the tool mount in the vertical direction.

7. The wafer processing apparatus according to claim 6, characterized in that, The first position sensor and the second position sensor are arranged in the same vertical direction.

8. The wafer processing apparatus according to claim 1, characterized in that, The wafer processing apparatus includes a light blocker arranged around the inspection equipment.

9. The wafer processing apparatus according to claim 1, characterized in that, The wafer processing apparatus includes a wafer carrier stage for holding the wafers to be processed.

10. The wafer processing apparatus according to claim 9, characterized in that, The wafer processing apparatus includes a wafer driving device for moving the wafer to be processed to the wafer carrier stage.

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