A semiconductor full-automatic plastic packaging equipment

Abstract

This invention provides a fully automated semiconductor molding and encapsulation device, relating to the field of wafer molding and encapsulation technology. It includes a worktable with a cover on its upper part. A translation module is fixed to the upper side wall of the cover, and a liquid epoxy molding compound dispensing assembly is fixedly connected to the output end of the translation module. A negative pressure stage for placing the molded wafer is provided on the worktable. A lifting assembly is installed on the lower side of the negative pressure stage, including a mounting platform on which a motor is fixedly mounted. The liquid epoxy molding compound is dispensed onto the center of the molded wafer on the negative pressure stage by the moving liquid epoxy molding compound dispensing assembly. Then, a contact temperature control assembly, in conjunction with a heating element, achieves point-to-point temperature rise on the back of the negative pressure stage. Combined with detection by an infrared thermal imager, this ensures uniform temperature of the molded wafer on the negative pressure stage, thereby significantly reducing wafer warpage.

Description

Technical Field

[0001] This invention relates to the field of wafer molding and encapsulation technology, specifically to a fully automated semiconductor molding and encapsulation device. Background Technology

[0002] Epoxy molding compounds are widely used in integrated circuit packaging as a type of packaging material. As integrated circuit packaging evolves towards miniaturization and high performance, the substrate undertakes more and more functions, and the requirements become increasingly stringent. To obtain extremely high-density substrates, line resolution, substrate thickness, and size are decreasing, while the number of layers, the number of microvias, and the component density are increasing.

[0003] During liquid epoxy molding of wafers, uneven surface temperature after the liquid epoxy flows often causes warping and deformation of the molded wafer, affecting the yield of the molding process. Summary of the Invention

[0004] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a fully automated semiconductor molding and encapsulation equipment, which solves the problem in existing technologies where temperature-induced warping of molded wafers during liquid epoxy molding and encapsulation affects the yield of molded wafers.

[0005] (II) Technical Solution To achieve the above objectives, the present invention provides the following technical solution: a fully automated semiconductor molding and encapsulation equipment, comprising a worktable, an upper cover provided on the worktable, a translation module fixed to the upper side wall of the cover, a liquid epoxy molding and encapsulation dispensing assembly fixedly connected to the output end of the translation module, a negative pressure stage for placing molded wafers provided on the worktable, a lifting assembly installed on the lower side of the negative pressure stage, the lifting assembly including a mounting platform, a motor fixedly mounted on the mounting platform, a rotary table fixedly connected to the output end of the motor, a cylinder three provided on the rotary table, and a contact temperature control assembly fixedly connected to the output end of the cylinder three; The workbench is equipped with a heating strip assembly on the lower side of the negative pressure platform. The contact temperature control component works in conjunction with the heating strip assembly to raise the temperature of the negative pressure platform.

[0006] Preferably, the liquid epoxy encapsulation dripping assembly includes a stand, a cylinder is fixedly installed on the inner side of the stand, the output end of the cylinder is fixedly connected to a sliding frame, and a liquid epoxy encapsulation dripping head is installed on the lower part of the sliding frame.

[0007] Preferably, the upright frame includes a guide groove parallel to the cylinder, and the vertical portion of the sliding frame is slidably connected to the guide groove.

[0008] Preferably, the sliding frame is provided with a mounting bracket on the side away from the liquid epoxy sealing dispensing head, and an infrared thermal imager and a high-definition camera are mounted on the lower end of the mounting bracket, both of which face the negative pressure stage.

[0009] Preferably, the workbench has a mounting groove in the middle, the negative pressure table includes a platform, the platform has an embedded negative pressure suction head, the side of the platform has a side plate, the platform and the side plate are connected to the negative pressure suction head, and one of the side plate tubes is connected to a vacuum device.

[0010] Preferably, the lifting assembly further includes a support rod, which is fixedly connected to the side plate and the mounting platform. A second cylinder is provided at the lower part of the mounting platform, and a guide frame that is slidably connected to the mounting platform is fixed on the lower side of the worktable.

[0011] Preferably, the contact temperature control assembly includes an air outlet hood and a support plate. The air outlet hood is fixedly mounted on the rotating platform. The support plate is fixed on the rotating platform at a position corresponding to the outer side of the air outlet hood and is rotatably connected to a rotating roller. A second motor connected to the rotating roller is fixedly mounted on the support plate. Several rows of top heads are provided on the outer side of the rotating roller. A support head is fixedly connected to the middle of the rotating platform. The other end of the rotating roller is rotatably connected to the support head. The height of the top head gradually increases from one side of the support head to the side of the second motor on the rotating roller.

[0012] Preferably, a fan is provided on the rotating platform, the fan pipe is connected to an air outlet hood, and the upper part of the air outlet hood is provided with an air outlet hole facing the platform.

[0013] (III) Beneficial Effects This invention provides a fully automated semiconductor molding and encapsulation device. It has the following advantages: This invention uses a moving liquid epoxy molding compounding component to drop liquid epoxy molding compound onto the center of a molded wafer on a negative pressure stage. Then, through the contact temperature control component and the heating strip assembly, the temperature is raised point-to-point on the back of the negative pressure stage. Combined with the detection of an infrared thermal imager, the temperature of the molded wafer on the negative pressure stage is made uniform, thereby greatly reducing the warpage and deformation of the molded wafer. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the internal upper side view of the present invention; Figure 3 For the present invention in Figure 2 Front view of the structure after removing the liquid epoxy encapsulation and adding the component; Figure 4 for Figure 3 Side view of the structure; Figure 5 for Figure 2 A schematic diagram of the structure from the lower side view; Figure 6 This is a schematic diagram of the contact temperature control component in this invention; Figure 7 This is a top view of the contact temperature control component in this invention.

[0015] The components include: 1. Workbench; 2. Carrier platform; 3. Sliding frame; 4. Stand; 5. Translation module; 6. Cylinder 1; 7. Liquid epoxy sealing outlet; 8. Machine cover; 9. Air hood; 10. Mounting platform; 11. Vacuum equipment; 12. Fan; 13. Motor 1; 14. Cylinder 2; 15. Rotary table; 16. Guide frame; 17. Guide rod; 18. Support platform; 19. Cylinder 3; 20. Top head; 21. Rotating roller; 22. Motor 2; 23. Support plate; 24. Side plate; 25. Heating strip assembly; 26. Support head. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] like Figure 1-7 As shown, this embodiment of the invention provides a fully automated semiconductor encapsulation equipment, including a worktable 1. A machine box is provided at the bottom of the worktable 1, and a machine cover 8 is provided at the top of the worktable 1. A translation module 5 arranged along the length direction of the worktable 1 is fixed on the upper side wall of the machine cover 8. A liquid epoxy encapsulation dispensing component is fixedly connected to the output end of the translation module 5. That is, the liquid epoxy encapsulation dispensing component is driven to move along the length direction of the worktable 1 by the translation module 5. The aforementioned liquid epoxy encapsulation dispensing assembly includes a support frame 4, with a cylinder 6 fixedly installed on the inner side of the support frame 4. The output end of the cylinder 6 is fixedly connected to a sliding frame 3, and a liquid epoxy encapsulation dispensing head 7 is installed on the lower part of the sliding frame 3. Specifically, the cylinder 6 drives the sliding frame 3 to move up and down, thereby driving the liquid epoxy encapsulation dispensing head 7 to move up and down. Through the cooperation of the cylinder 6 and the translation module 5, the spatial movement of the liquid epoxy encapsulation dispensing head 7 is realized. The support frame 4 includes a guide groove parallel to the cylinder 6, and the vertical part of the sliding frame 3 is slidably connected to the guide groove. Through the cooperation of the support frame 4 and the sliding frame 3, the vertical up and down movement of the sliding frame 3 is guided, while the horizontal rotation of the sliding frame 3 is hindered. As described above, the sliding frame 3 is provided with a mounting bracket on the side that is away from the liquid epoxy molding compound dispensing head 7. An infrared thermal imager and a high-definition camera are mounted on the lower end of the mounting bracket. Both the infrared thermal imager and the high-definition camera face the negative pressure stage. The high-definition camera is used to obtain the dispersion state of the liquid epoxy molding compound after it is dripped from the liquid epoxy molding compound dispensing head 7, and the infrared thermal imager is used to obtain the temperature distribution of the liquid epoxy molding compound on the molded wafer.

[0018] The workbench 1 is equipped with a negative pressure stage for placing molded wafers. The workbench 1 has a mounting groove in the middle. The negative pressure stage includes a carrier stage 2, which has an embedded negative pressure suction head. The side of the carrier stage 2 has a side plate, and the negative pressure suction head is connected to the inside of the carrier stage 2 and the side plate. One of the side plate tubes is connected to a vacuum pump 11. In the above-mentioned process, the vacuum pump 11, in conjunction with the negative pressure suction head, picks up the molded wafer on which the die is placed. Then, the translation module 5 moves the liquid epoxy molding compound dispensing component to the middle of the molded wafer. With the downward movement of the cylinder 6, the liquid epoxy molding compound dispensing head 7 can drip liquid epoxy molding compound onto the molded wafer. During the process, a high-definition camera combined with an external control terminal identifies the center position of the molded wafer before dripping liquid epoxy molding compound.

[0019] A lifting assembly is installed on the lower side of the side panel. The lifting assembly includes a mounting platform 10. A motor 13 is fixedly installed on the mounting platform 10. A rotary table 15 is fixedly connected to the output end of the motor 13. A cylinder 3 19 is provided on the rotary table 15. A contact temperature regulating assembly is fixed to the output end of the cylinder 3 19. As described above, the lifting assembly also includes a support rod, which is fixedly connected to the side plate and the mounting platform 10. A second cylinder 14 is provided at the lower part of the mounting platform 10. A guide frame 16 that is slidably connected to the mounting platform 10 is fixed on the lower side of the worktable 1. The lower end of the second cylinder 14 is fixedly installed at the bottom of the chassis. Specifically, after the mounting platform 10 is moved upward by the second cylinder 14, the support rod drives the side plate to move the platform 2 up and down. The workbench 1 is provided with a heating strip group 25 on the lower side of the platform 2. The contact temperature control component works with the heating strip group 25 to raise the temperature of the negative pressure platform. The heating strip group 25 is used to heat the platform 2.

[0020] The contact temperature control assembly includes an air outlet hood 9 and a support plate 23. The air outlet hood 9 is fixedly mounted on a rotary table 15. The support plate 23 is fixed on the rotary table 15 at a position corresponding to the outer side of the air outlet hood 9 and is rotatably connected to a rotating roller 21. A motor 22 connected to the rotating roller 21 is fixed on the support plate 23. Several rows of top heads 20 are arranged on the outer side of the rotating roller 21. A support head 26 is fixedly connected to the middle of the rotary table 15. A distance sensor is arranged on the top of the support head 26. The distance sensor is located at the distribution gap of the heating strip group 25, so that the position of the distance sensor to the platform 2 can be measured. In the above, the distance between the platform 2 and the distance sensor is 10mm by using the lifting assembly in conjunction with the distance sensor. At this time, the distance between the heating strip part of the heating strip group 25 and the platform 2 is 1-3mm. The installation position of the heating strip group 25 can be adjusted accordingly to meet the above conditions. The rotating roller 21... The other end is rotatably connected to the support head 26. The top head 20 gradually rises from the side of the support head 26 to the side of the motor 22 on the rotating roller 21. In the above, the cylinder 3 19 drives the contact temperature adjustment component to move upward, so that the rotating roller 21 driven by the motor 22 can bring the support head 26 closer to the heating strip group 25, thereby adjusting the upper position of the heating strip. Specifically, the rotating table 15 is rotated by the motor 13, which can change the position of the support head 26 on the rotating roller 21 relative to the point where the heating strip needs to be lifted. As the liquid epoxy molding compound flows along the surface of the molded wafer, the infrared thermal imager obtains the surface temperature distribution of the molded wafer, and the high-definition camera obtains the flow coverage of the liquid epoxy molding compound. In this way, the support head 26 at the position where the temperature is lower than the surrounding area within the flow range of the liquid epoxy molding compound can move the corresponding heating strip position upward, thereby realizing temperature increase adjustment.

[0021] A fan 12 is installed on the rotary table 15. The fan 12 is connected to the air outlet 9. The upper part of the air outlet 9 is provided with an air outlet facing the stage 2. The air outlet cools the support head 26 which is rotated to the lower position. The outlet air velocity is 5-8 m / min. This can prevent the stage 2 from cooling down too quickly. Through temperature regulation, the warpage deformation of the molded wafer is greatly reduced.

[0022] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fully automated semiconductor molding and encapsulation equipment, comprising a worktable (1), wherein a cover (8) is disposed on the upper part of the worktable (1), and a translation module (5) is fixed on the upper side wall of the cover (8), characterized in that: The output end of the translation module (5) is fixedly connected to a liquid epoxy encapsulation and dripping component. The worktable (1) is provided with a negative pressure platform for placing molded wafers. A lifting component is installed on the lower side of the negative pressure platform. The lifting component includes a mounting platform (10). A motor (13) is fixedly installed on the mounting platform (10). A rotary table (15) is fixedly connected to the output end of the motor (13). A cylinder (19) is provided on the rotary table (15). A contact temperature control component is fixed to the output end of the cylinder (19). The workbench (1) is provided with a heating strip group (25) on the lower side of the negative pressure table. The contact temperature control component works in conjunction with the heating strip group (25) to increase the temperature of the negative pressure table.

2. The fully automated semiconductor encapsulation equipment according to claim 1, characterized in that: The liquid epoxy encapsulation dripping assembly includes a stand (4), a cylinder (6) is fixedly installed on the inner side of the stand (4), the output end of the cylinder (6) is fixedly connected to the sliding frame (3), and a liquid epoxy encapsulation dripping head (7) is installed on the lower part of the sliding frame (3).

3. The fully automated semiconductor encapsulation equipment according to claim 2, characterized in that: The upright frame (4) includes a guide groove parallel to the cylinder (6), and the vertical part of the sliding frame (3) is slidably connected to the guide groove.

4. A fully automated semiconductor encapsulation device according to claim 2 or 3, characterized in that: The sliding frame (3) is provided with a mounting bracket on the side away from the liquid epoxy sealing drip head (7). An infrared thermal imager and a high-definition camera are installed at the lower end of the mounting bracket, and both the infrared thermal imager and the high-definition camera face the negative pressure stage.

5. A fully automated semiconductor encapsulation device according to claim 4, characterized in that: The workbench (1) has an installation groove in the middle. The negative pressure table includes a platform (2). The platform (2) has an embedded negative pressure suction head. The side of the platform (2) has a side plate. The platform (2) and the side plate are connected to the negative pressure suction head. One of the side plate tubes is connected to a vacuum device (11).

6. The fully automated semiconductor encapsulation equipment according to claim 5, characterized in that: The lifting assembly also includes a support rod, which is fixedly connected to the side plate and the mounting platform (10). The lower part of the mounting platform (10) is provided with a cylinder (14), and the lower side of the worktable (1) is fixed with a guide frame (16) that is slidably connected to the mounting platform (10).

7. A fully automated semiconductor encapsulation device according to claim 6, characterized in that: The contact temperature control assembly includes an air outlet hood (9) and a support plate (23). The air outlet hood (9) is fixedly mounted on a rotating table (15). The support plate (23) is fixed on the rotating table (15) at a position corresponding to the outer side of the air outlet hood (9) and is rotatably connected to a rotating roller (21). A second motor (22) connected to the rotating roller (21) is fixed on the support plate (23). Several rows of top heads (20) are provided on the outer side of the rotating roller (21). A support head (26) is fixedly connected to the middle of the rotating table (15). The other end of the rotating roller (21) is rotatably connected to the support head (26). The height of the top head (20) gradually increases from one side of the support head (26) to the side of the second motor (22) on the rotating roller (21).

8. A fully automated semiconductor encapsulation device according to claim 7, characterized in that: A fan (12) is provided on the rotating table (15), and the fan (12) is connected to the air outlet hood (9). The upper part of the air outlet hood (9) is provided with an air outlet hole facing the platform (2).

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