A packaging structure

Abstract

This utility model relates to the field of semiconductor packaging technology, specifically to a packaging structure including a chip and a cover plate. The chip and the cover plate enclose a packaging cavity. The chip and / or the cover plate have pre-drilled evacuation channels for drawing a vacuum from the packaging cavity. These evacuation channels are then sealed by a sealing structure after a vacuum is achieved within the packaging cavity. This utility model, by providing evacuation channels on the cover plate, allows for precise positioning and enclosure of the chip and cover plate in a non-vacuum environment to form the packaging cavity. Then, the cavity is placed in a vacuum environment, and the gas inside is extracted through the evacuation channels. The evacuation channels are then partially sealed by a sealing structure. This eliminates the need for precise alignment and sealing under vacuum conditions, reducing equipment requirements and packaging costs, and facilitating mass production.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and specifically to a packaging structure. Background Technology

[0002] Due to functional requirements, many chips need to operate in a vacuum environment, such as microbolometers and accelerometers. Currently, the main method for high-volume, low-cost vacuum packaging is to evacuate the vacuum furnace, then close the cap and reflow it, using solder to achieve a vacuum seal. This method has the following problems: the packaging process requires precise alignment and capping in a vacuum environment, placing extremely high demands on the precision of the equipment and fixtures, resulting in high packaging costs and low efficiency. Summary of the Invention

[0003] The purpose of this invention is to provide a packaging structure that can at least solve some of the defects in the prior art.

[0004] To achieve the above objectives, the technical solution of this utility model is a packaging structure, including a chip and a cover plate. The chip and the cover plate enclose a packaging cavity. The cover plate has a pre-reserved air extraction channel for evacuating the packaging cavity. After the air extraction channel achieves a vacuum state in the packaging cavity, it is sealed by a sealing structure.

[0005] As one embodiment, the inner wall of the air extraction channel is provided with a first plating layer, and solder is provided in the end of the air extraction channel away from the encapsulation cavity. The solder is welded to the first plating layer to form the sealing structure.

[0006] As one embodiment, the dimension of the end of the air extraction channel away from the encapsulation cavity is larger than the dimension of the end of the air extraction channel close to the encapsulation cavity.

[0007] As one embodiment, the first coating is provided on the entire area of ​​the inner wall of the air extraction channel or at least the area away from the end of the encapsulation cavity.

[0008] As one embodiment, the first coating includes an adhesion layer, a barrier layer and a solder wetting layer sequentially stacked on the inner wall of the exhaust channel, wherein the solder is welded to the solder wetting layer.

[0009] As one implementation method, there is at least one air extraction channel.

[0010] As one embodiment, the cover plate includes a cover body and a pad layer, the pad layer being located between the cover body and the chip, and the pad layer being integrally formed with or connected to the cover body; the air extraction channel is disposed on the cover body and / or the pad layer.

[0011] As one embodiment, the air extraction channel is a straight hole structure, a bent hole structure, or a combination of straight holes and bent holes.

[0012] As one embodiment, one end of the air extraction channel extends to the inner side of the padding layer, and the other end extends to the outer side of the padding layer and / or the top surface of the padding layer.

[0013] As one implementation method, the cover is a sealing cover or a light window.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] This invention allows for precise positioning and enclosure of the chip and cover plate in a non-vacuum environment by setting an extraction channel on the cover plate. Then, the chip is placed in a vacuum environment, and the gas inside the packaging cavity is extracted through the extraction channel. The extraction channel is then partially blocked by a sealing structure. This eliminates the need for precise alignment and sealing in a vacuum environment, reducing equipment requirements and packaging costs, and making it easier for mass production. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the packaging structure provided in Embodiment 1 of this utility model;

[0018] Figure 2 This is a schematic diagram of the chip structure provided in Embodiment 1 of this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of a sealing cap provided in Embodiment 1 of this utility model;

[0020] Figure 4 Another structural schematic diagram of the sealing cap provided in Embodiment 1 of this utility model;

[0021] Figure 5 Another structural schematic diagram of the sealing cap provided in Embodiment 1 of this utility model;

[0022] Figure 6 Another structural schematic diagram of the sealing cap provided in Embodiment 1 of this utility model;

[0023] Figure 7A flowchart illustrating a vacuum packaging method for the packaging structure provided in Embodiment 1 of this utility model;

[0024] Figure 8 A flowchart illustrating another vacuum packaging method for the packaging structure provided in Embodiment 1 of this utility model;

[0025] Figure 9 This is a schematic diagram of the packaging structure provided in Embodiment 2 of this utility model;

[0026] Figure 10 This is a schematic diagram of the chip structure provided in Embodiment 2 of this utility model;

[0027] Figure 11 This is a schematic diagram of a cushion layer provided in Embodiment 2 of the present invention;

[0028] Figure 12 This is a schematic diagram of another structure of the padding layer provided in Embodiment 2 of this utility model;

[0029] Figure 13 This is a schematic diagram of another structure of the padding layer provided in Embodiment 2 of this utility model;

[0030] Figure 14 This is a schematic diagram of the structure of the light window provided in Embodiment 2 of this utility model;

[0031] Figure 15 A flowchart of a vacuum packaging method for the packaging structure provided in Embodiment 2 of this utility model;

[0032] Figure 16 A flowchart illustrating another vacuum packaging method for the packaging structure provided in Embodiment 2 of this utility model;

[0033] In the diagram: 1. Chip; 2. Sealing cap; 3. Gasket; 4. Vacuum channel; 5. Solder; 6. First plating layer; 7. Second plating layer; 8. Solder layer; 9. Photosensitive area; 10. Light window; 12. Third plating layer. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0035] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0037] This embodiment provides a packaging structure including a chip 1 and a cover plate. The chip 1 and the cover plate enclose a packaging cavity. The cover plate has a pre-drilled evacuation channel 4 for evacuating the packaging cavity. After a vacuum is achieved in the packaging cavity, the evacuation channel 4 is sealed by a sealing structure. By setting the evacuation channel 4 on the cover plate, this embodiment allows the chip and cover plate to be precisely positioned and enclosed to form a packaging cavity in a non-vacuum environment. Then, it is placed in a vacuum environment, and the gas in the packaging cavity is extracted through the evacuation channel 4. The evacuation channel 4 is then partially sealed by a sealing structure. This eliminates the need for precise alignment and sealing in a vacuum environment, reducing equipment requirements and packaging costs, and facilitating mass production.

[0038] In this embodiment, chip 1 includes a readout circuit and a MEMS device located on the readout circuit.

[0039] In some embodiments, a first plating layer 6 is provided on the inner wall of the extraction channel 4, and a solder 5 is provided in the end of the extraction channel 4 opposite to the encapsulation cavity. The solder 5 is welded to the first plating layer 6 to form the sealing structure. In this embodiment, the solder 5 and the first plating layer 6 are sealed by airtight welding, thereby sealing the extraction channel 4; the solder 5 can be made of materials such as indium, indium silver, gold tin, or tin-silver-copper.

[0040] Furthermore, the dimension of the end of the venting channel 4 opposite to the encapsulation cavity is larger than the dimension of the end of the venting channel 4 closest to the encapsulation cavity. For example... Figure 3 , Figure 6 as well as Figures 11-13As shown, the dimension of the end of the venting channel 4 away from the encapsulation cavity is larger than the dimension of the end of the venting channel 4 near the encapsulation cavity, so that the venting channel 4 forms a stepped hole at the end near the outside, so as to place more solder 5, and so that more solder 5 can be filled in the venting channel 4 after melting, ensuring sealing reliability.

[0041] Furthermore, the first plating layer 6 is provided on the entire area of ​​the inner wall of the venting channel 4, or at least on the area opposite to the end of the encapsulation cavity. By providing the first plating layer 6 on the entire area of ​​the inner wall of the venting channel 4, or at least on the area opposite to the end of the encapsulation cavity, it is ensured that the solder 5 can be welded to the first plating layer 6 and seal the venting channel 4 after melting.

[0042] In some embodiments, the first plating layer 6 includes an adhesion layer, a barrier layer, and a solder wetting layer sequentially stacked on the inner wall of the exhaust channel 4, wherein the solder 5 is welded to the solder wetting layer. The adhesion layer improves the adhesion performance of the barrier layer, preventing detachment, and can be one of metals such as Cr, Ti, or V; the barrier layer prevents metal diffusion between the solder wetting layer and the solder 5, ensuring bonding strength, and can be one of metals such as Ni, Cu, Pd, or Pt; the solder wetting layer uses a low surface energy material to make the molten solder 5 spread more easily, ensuring welding reliability, and can be one of gold, silver, or nickel.

[0043] Furthermore, a second plating layer 7 is provided on the opposite surfaces of the chip and the cover plate, and the second plating layers 7 are soldered together by a solder layer 8. In this embodiment, since a vacuum channel 4 is provided, the second plating layers 7 on the chip and the cover plate can be reflow soldered in a protective gas atmosphere first, and then the vacuum channel 4 can be locally sealed with solder 5 in a vacuum environment.

[0044] Furthermore, there is at least one exhaust channel 4. In some embodiments, there is one exhaust channel 4, which enables communication between a single point of the encapsulation cavity and the outside; in other embodiments, there are not less than two exhaust channels 4, which enable communication between multiple points of the encapsulation cavity and the outside, and the multiple exhaust channels can be set on the same structure or on different structures.

[0045] In this embodiment, the cover plate includes a cover body and a pad 3. The pad 3 is located between the cover body and the chip, and the cover body and the pad 3 are integrally formed or connected as one piece; the air extraction channel 4 is disposed on the cover body and / or the pad 3.

[0046] Furthermore, the air extraction channel 4 is a straight hole structure, a bent hole structure, or a combination of straight holes and bent holes. In some embodiments, such as Figure 3 , Figure 5 and Figure 12As shown, the air extraction channel 4 is a straight hole structure, penetrating the cover vertically or the padding layer 3 horizontally; in other embodiments, such as Figure 4 , Figure 6 and Figure 11 As shown, the air extraction channel 4 has a bent hole structure, and it penetrates the cover body first vertically, then horizontally, and then vertically again; or it penetrates the padding layer 3 first vertically and then horizontally; in other embodiments, such as Figure 13 As shown, the air extraction channel 4 can also be a combination of straight holes and bent holes, with one end extending to the inner side of the pad 3 and the other end extending to the top and outer sides of the pad 3 respectively.

[0047] Furthermore, one end of the air extraction channel 4 extends to the inner side of the padding layer 3, and the other end extends to the outer side of the padding layer 3 and / or the top surface of the padding layer 3.

[0048] like Figure 1 As shown, the cover plate includes a cover body and a pad layer 3, which are integrally formed; the pad layer 3 and the chip 1 are both provided with a second plating layer 7 on their opposite sides, and the oppositely arranged second plating layers 7 are welded together by a solder layer 8. In this embodiment, an air extraction channel 4 can be provided on the cover body. Specifically, the air extraction channel 4 can be a straight hole structure that vertically penetrates the cover body, such as... Figure 3 As shown; the air extraction channel 4 can also be a bent hole structure with both ends extending to the top and bottom surfaces of the cover, as shown. Figure 4 and Figure 6 As shown. In this embodiment, an air extraction channel 4 can also be provided on the padding layer 3, such as... Figure 5 As shown, the air extraction channel 4 has a straight hole structure and horizontally penetrates the padding layer 3.

[0049] like Figure 9 As shown, the cover plate includes a cover body and a pad layer 3, which are welded together. A second plating layer 7 is provided on the opposite surfaces of the pad layer 3 and the chip, and the opposing second plating layers 7 are welded together by a solder layer 8. A third plating layer 12 is provided on the opposite surfaces of the pad layer 3 and the opposing third plating layers 12 are welded together by a solder layer 8. In this embodiment, an air extraction channel 4 can be provided on the pad layer 3. Specifically, the air extraction channel 4 can be a straight hole structure that vertically penetrates the pad layer 3, such as... Figure 12 As shown; the air extraction channel 4 can also be a bent hole structure with both ends extending to the top and inner surfaces of the padding layer 3, respectively, as shown. Figure 11 As shown; the air extraction channel 4 can also be a combination of straight holes and bent holes, with one end extending to the inner side of the padding layer 3, and the other end extending in two directions to the top and outer sides of the padding layer 3 respectively, as shown. Figure 13 As shown.

[0050] In this embodiment, both the second plating layer 7 and the third plating layer 12 include an adhesion layer, a barrier layer, and a solder wetting layer stacked sequentially, and the solder wetting layer is welded to the solder layer 8. The solder layer 8 can be made of materials such as indium, indium silver, gold-tin, or tin-silver-copper; the adhesion layer improves the adhesion performance of the barrier layer and prevents detachment, and can be made of metals such as Cr, Ti, or V; the barrier layer prevents metal diffusion between the solder wetting layer and the solder 5, ensuring bonding strength, and can be made of metals such as Ni, Cu, Pd, or Pt; the solder wetting layer uses a low surface energy material to make the molten solder 5 spread more easily, ensuring welding reliability, and can be made of materials such as gold, silver, or nickel.

[0051] Furthermore, the pad 3 has a ring structure. The pad 3 is a closed ring structure, specifically it can be a square ring structure, or a circular or other irregularly shaped ring structure. The shapes of the first plating layer 6, the second plating layer 7, the third plating layer 12, and the solder layer 8 are the same as the shape of the pad 3. In this embodiment, the pad 3 can be made of a material with good airtightness and a low outgassing rate to ensure the reliability of vacuum packaging; specifically, materials such as silicon, glass, Kovar, stainless steel, and ceramics can be selected.

[0052] Further, the cover is either a sealing cover 2 or a light window 10. In some embodiments, the cover is a sealing cover 2; the sealing cover 2 is made of an airtight material, such as Kovar, silicon, germanium, sapphire, ceramic, glass, etc., and the venting channel 4 is disposed on the sealing cover 2 or the padding layer 3. In other embodiments, the cover is a light window 10; the chip 1 is provided with a photosensitive area 9 that performs optical sensing function, and the photosensitive area 9 is located inside the packaging cavity; the light window 10 is selected according to the spectral characteristics and airtightness requirements, and generally can be made of materials such as silicon, glass, sapphire, germanium, etc., and the venting channel 4 is disposed on the padding layer 3.

[0053] This embodiment also provides a vacuum packaging method for the above-described packaging structure, including the following steps:

[0054] S1. A vacuum channel 4 is reserved on the cover plate, and the chip 1 and the cover plate are enclosed to form a packaging cavity;

[0055] S2. Place the structure obtained in step S1 in a vacuum environment, extract the gas in the encapsulation cavity through the evacuation channel 4, and then seal the evacuation channel 4.

[0056] This embodiment sets up an extraction channel 4 on the cover plate, and first encloses the chip 1 and the cover plate in a non-vacuum environment to form a packaging cavity. Then, it is placed in a vacuum environment, and the gas in the packaging cavity is extracted through the extraction channel 4. Then, the extraction channel 4 is sealed. This eliminates the need for precise alignment and sealing under high temperature and high vacuum conditions, reduces the requirements for equipment and tooling precision, lowers packaging costs, and makes it easier for mass production and automation.

[0057] In this embodiment, chip 1 and the cover plate can be enclosed to form an encapsulation cavity under a protective gas atmosphere. The protective gas atmosphere is an inert gas atmosphere, specifically a nitrogen atmosphere, etc.

[0058] like Figure 7 and Figure 15 As shown, the inner wall of the extraction channel 4 is provided with a first plating layer 6. The method for sealing the extraction channel in step S2 is as follows: after the gas in the packaging cavity is extracted, solder 5 is processed at the end of the extraction channel 4 away from the packaging cavity and welded to the first plating layer 6 to seal the extraction channel 4. The solder 5 can be processed using local welding processes such as laser ball spraying or spot tinning. During the welding process, the heating temperature is lower than the melting point of the solder 5. After sealing the extraction channel 4, the solder 5 can cool and solidify rapidly, avoiding the generation of welding bubbles.

[0059] like Figure 8 and Figure 16 As shown, the inner wall of the evacuation channel 4 is provided with a first plating layer 6. The method for sealing the evacuation channel in step S2 is as follows: before placing the structure obtained in step S1 into a vacuum environment, solder 5 is placed in the end of the evacuation channel 4 away from the packaging cavity. After the gas in the packaging cavity is extracted, the solder 5 is melted, and the solder 5 flows and welds with the first plating layer 6, thus sealing the evacuation channel 4. Specifically, heating methods such as laser heating can be used to heat the entire structure or to locally heat the solder 5 to melt and flow it.

[0060] Furthermore, the solder 5 has a spherical, columnar, or annular structure. In this embodiment, the solder 5 can be in solid form. When the solder 5 is processed under vacuum at the end of the evacuation channel 4 away from the packaging cavity, the solder 5 can have a spherical or columnar structure. When the solder 5 is first placed at the end of the evacuation channel 4 away from the packaging cavity and then melted under vacuum, the solder 5 can have an annular structure to leave space for the evacuation channel 4. The solder 5 can also be in liquid form and directly filled into the evacuation channel 4.

[0061] The packaging structure and vacuum packaging method of this utility model will be described in detail below through two specific embodiments.

[0062] Example 1

[0063] like Figures 1-6As shown, this embodiment provides a packaging structure including a chip 1 and a cover plate. The cover plate includes a sealing cap 2 and a pad 3. The pad 3 is disposed on the bottom surface of the sealing cap 2 and is integrally formed with the sealing cap 2. The top surface of the chip 1 and the bottom surface of the pad 3 are both provided with a second plating layer 7. The second plating layer 7 on the chip 1 and the second plating layer 7 on the pad 3 are welded together by a solder layer 8 to form a packaging cavity. The sealing cap 2 or the pad 3 is provided with a suction channel 4. The inner wall of the suction channel 4 is provided with a first plating layer 6. The end of the suction channel 4 away from the packaging cavity is provided with solder 5. The solder 5 is welded to the first plating layer 6 and seals the suction channel 4.

[0064] like Figure 7 As shown, this embodiment provides a vacuum packaging method for the above-described packaging structure, including the following steps:

[0065] S1. Assemble the chip 1, the solder layer 8, and the cover plate together and weld them in a protective gas atmosphere to form an airtight connection between the solder layer 8 and the padding layer 3 of the chip 1 and the cover plate, and form the encapsulation cavity.

[0066] S2. Place the structure obtained in step S1 in a vacuum environment. First, evacuate the vacuum chamber by extracting the gas through the evacuation channel 4. Then, process the solder 5 at the end of the evacuation channel 4 away from the packaging cavity and weld it to the first plating layer 6 in an airtight manner to seal the evacuation channel 4, thereby achieving a vacuum seal for the packaging cavity. The solder 5 can be processed using localized soldering processes such as laser balling or spot tinning. During the soldering process, the heating temperature is lower than the melting point of the solder 5. After sealing the evacuation channel 4, the solder 5 can cool and solidify rapidly, avoiding the generation of solder bubbles.

[0067] like Figure 8 As shown, this embodiment also provides a vacuum packaging method for the above-described packaging structure, comprising the following steps:

[0068] S1. Assemble the chip 1, the solder layer 8, and the cover plate together and weld them in a protective gas atmosphere to form an airtight connection between the solder layer 8 and the padding layer 3 of the chip 1 and the cover plate, and form the encapsulation cavity.

[0069] S2. First, place solder 5 at the end of the evacuation channel 4 of the structure obtained in step S1 that is away from the packaging cavity, leaving the evacuation channel 4 open. Then, place the entire structure in a vacuum environment and evacuate the vacuum. Extract the gas from the packaging cavity through the evacuation channel 4. Then, melt the solder 5. The solder 5 flows and is airtightly welded to the first plating layer 6, sealing the evacuation channel 4, thereby achieving a vacuum seal for the packaging cavity. Specifically, heating methods such as laser heating can be used to heat the entire structure or to locally heat the solder 5 to melt and flow it.

[0070] Example 2

[0071] like Figures 9-14 As shown, this embodiment provides a packaging structure including a chip 1 and a cover plate. The cover plate includes a light window 10 and a pad 3. The pad 3 is disposed between the light window 10 and the chip 1. A third plating layer 12 is disposed on the opposite surfaces of the pad 3 and the light window 10, and the oppositely disposed third plating layers 12 are soldered together by a solder layer 8. A second plating layer 7 is disposed on the top surface of the chip 1 and the bottom surface of the pad 3, and the second plating layer 7 on the chip 1 and the second plating layer 7 on the pad 3 are soldered together by a solder layer 8 to form a packaging cavity. A venting channel 4 is disposed on the pad 3, and a first plating layer 6 is disposed on the inner wall of the venting channel 4. Solder 5 is disposed at the end of the venting channel 4 away from the packaging cavity. The solder 5 is soldered to the first plating layer 6 and seals the venting channel 4.

[0072] like Figure 15 As shown, this embodiment provides a vacuum packaging method for the above-described packaging structure, including the following steps:

[0073] S1. Assemble the chip 1, the solder layer 8, the optical window 10 and the pad layer 3 together, and weld them in a protective gas atmosphere to form an airtight connection between the chip 1 and the pad layer 3 and between the pad layer 3 and the optical window 10, and form the encapsulation cavity;

[0074] S2. Place the structure obtained in step S1 in a vacuum environment. First, evacuate the vacuum chamber by extracting the gas through the evacuation channel 4. Then, process the solder 5 at the end of the evacuation channel 4 away from the packaging cavity and weld it to the first plating layer 6 in an airtight manner to seal the evacuation channel 4, thereby achieving a vacuum seal for the packaging cavity. The solder 5 can be processed using localized soldering processes such as laser balling or spot tinning. During the soldering process, the heating temperature is lower than the melting point of the solder 5. After sealing the evacuation channel 4, the solder 5 can cool and solidify rapidly, avoiding the generation of solder bubbles.

[0075] like Figure 16 As shown, this embodiment also provides a vacuum packaging method for the above-described packaging structure, comprising the following steps:

[0076] S1. Assemble the chip 1, the solder layer 8, the optical window 10 and the pad layer 3 together, and weld them in a protective gas atmosphere to form an airtight connection between the chip 1 and the pad layer 3 and between the pad layer 3 and the optical window 10, and form the encapsulation cavity;

[0077] S2. First, place solder 5 at the end of the evacuation channel 4 of the structure obtained in step S1 that is away from the packaging cavity, leaving the evacuation channel 4 open. Then, place the entire structure in a vacuum environment and evacuate the vacuum. Extract the gas from the packaging cavity through the evacuation channel 4. Then, melt the solder 5. The solder 5 flows and is airtightly welded to the first plating layer 6, sealing the evacuation channel 4, thereby achieving a vacuum seal for the packaging cavity. Specifically, heating methods such as laser heating can be used to heat the entire structure or to locally heat the solder 5 to melt and flow it.

[0078] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A package structure comprising a chip and a cover plate, the chip and the cover plate enclosing a package cavity, characterized in that: The cover plate has a pre-reserved air extraction channel for evacuating the encapsulation cavity, and the air extraction channel is sealed by a sealing structure after the vacuum state is achieved in the encapsulation cavity.

2. The package structure of claim 1, wherein: The inner wall of the air extraction channel is provided with a first plating layer, and a solder is provided at the end of the air extraction channel away from the encapsulation cavity. The solder is welded to the first plating layer to form the sealing structure.

3. The packaging structure as described in claim 2, characterized in that: The dimension of the end of the air extraction channel away from the encapsulation cavity is larger than the dimension of the end of the air extraction channel closer to the encapsulation cavity.

4. The packaging structure as described in claim 2, characterized in that: The first coating is provided on the entire area of ​​the inner wall of the air extraction channel, or at least on the area away from the end of the encapsulation cavity.

5. The packaging structure as described in claim 2, characterized in that: The first coating includes an adhesion layer, a barrier layer, and a solder wetting layer sequentially stacked on the inner wall of the exhaust channel, wherein the solder is welded to the solder wetting layer.

6. The packaging structure as described in claim 1, characterized in that: There is at least one exhaust channel.

7. The packaging structure as described in claim 1, characterized in that: The cover plate includes a cover body and a pad layer. The pad layer is located between the cover body and the chip, and the pad layer is integrally formed with or connected to the cover body. The air extraction channel is provided on the cover body and / or the pad layer.

8. The packaging structure as described in claim 7, characterized in that: The air extraction channel can be a straight hole structure, a bent hole structure, or a combination of straight holes and bent holes.

9. The packaging structure as described in claim 7, characterized in that: One end of the air extraction channel extends to the inner side of the padding layer, and the other end extends to the outer side of the padding layer and / or the top surface of the padding layer.

10. The packaging structure as described in claim 8, characterized in that: The cover is either a sealing cover or a light window.

Images