A utensil back-embedded structure facilitating the peeling and placing of a chip

Abstract

This utility model relates to the field of smart tableware technology and discloses an embedded structure on the back of tableware that facilitates chip placement. The structure includes a tableware body and a chip placement component. An embedded groove is provided on the back of the tableware body, and the chip placement component is fitted into this groove. The chip placement component includes a base and a cover plate. The base and the bottom of the embedded groove are detachably connected by an elastic buckle. The cover plate is fitted onto the base, and its edge has a peeling groove for easy removal. Through the chip placement component consisting of the base and cover plate, along with the elastic buckle and peeling groove, the cover plate can be easily opened with the peeling groove when replacing the chip. The elastic buckle allows for quick assembly and disassembly of the base and embedded groove. Simultaneously, the positioning groove, magnetic structure, and elastic connection component work together to ensure precise and stable chip installation, facilitating future maintenance and significantly improving chip replacement efficiency, thus meeting the needs of the smart catering industry for frequent chip management.

Description

Technical Field

[0001] This utility model relates to the field of smart tableware technology, and in particular to an embedded structure on the back of tableware that facilitates the removal and placement of a chip. Background Technology

[0002] With the booming development of the smart catering industry, embedded chips in tableware have become an important means to improve the efficiency and safety of catering management. By embedding chips in the back of tableware, food traceability can be accurately realized. For every food served in this tableware, information such as the source of raw materials, processing procedures, and transportation routes can be recorded by the chip and uploaded to the management system in real time. Consumers can clearly understand the entire life cycle of the food simply by scanning the code, effectively improving consumer trust.

[0003] Currently, most chip-embedded structures on the back of tableware use a fixed packaging design, making it difficult to remove the chip after installation. When the chip malfunctions or needs to be replaced, the operation is cumbersome and may even damage the tableware, affecting its reusability. In addition, the traditional embedded structure has poor sealing performance, and water and oil can easily enter the embedded groove during tableware washing, leading to chip damage and reducing the chip's lifespan and reliability. Therefore, we propose an embedded structure on the back of tableware that facilitates chip removal and placement. Utility Model Content

[0004] The purpose of this utility model is to provide an embedded structure on the back of tableware that facilitates the removal and placement of chips, in order to solve the problems of the current chip embedded structure on the back of tableware, which mostly adopts a fixed packaging design, making it difficult to remove the chip after installation. When the chip malfunctions or needs to be replaced, the operation is cumbersome and may even damage the tableware, affecting its reusability. In addition, the traditional embedded structure has poor sealing performance, and water and oil can easily enter the embedded groove during tableware washing, leading to chip damage and reducing the chip's lifespan and reliability.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a tableware back embedded structure for easy chip removal, comprising a tableware body and a chip placement component. The tableware body has an embedded groove on its back, and the chip placement component is adapted to be installed in the embedded groove. The chip placement component includes a base and a cover plate. The base is detachably connected to the bottom of the embedded groove by an elastic buckle. The cover plate covers the base, and the edge of the cover plate has a peeling groove for easy peeling operation.

[0006] As a preferred embodiment, the elastic buckle includes multiple locking blocks located at the bottom of the base and multiple locking slots located at the bottom of the embedded groove, wherein the multiple locking blocks and the multiple locking slots are elastically engaged respectively.

[0007] As a preferred embodiment, the base has a positioning groove on its surface away from the embedded groove, and a magnetic attraction structure is provided between the base and the cover plate. The magnetic attraction structure includes a magnetic adsorption piece set in the positioning groove on the base and an iron piece at the corresponding position on the cover plate. The cover plate and the base are locked together by magnetic attraction.

[0008] As a preferred embodiment, a sealing ring is provided at the contact point between the base and the embedded groove. The sealing ring is made of an elastic sealing material, and the cover plate fits tightly against the sealing ring after it is closed.

[0009] As a preferred embodiment, an elastic connection component is provided between the cover plate and the base. The elastic connection component includes a spring and a post disposed on the edge of the surface of the cover plate near the base. A insertion hole is provided on the base corresponding to the insertion post. The insertion post is inserted into the insertion hole. The spring provides an elastic preload to assist the cover plate in pressing the chip.

[0010] As a preferred embodiment, the inner wall of the base is provided with a cushioning pad, which is made of food-grade silicone. The depth of the embedded groove is adapted to the height of the chip placement component. After the cover is closed, it is flush with the back surface of the tableware body.

[0011] The technical effects and advantages of this utility model are as follows:

[0012] 1. The chip placement assembly, consisting of a base and a cover plate, along with elastic clips and a peeling groove, effectively solves the problem of chip removal and replacement in traditional fixed packaging designs. When replacing the chip, the cover plate can be easily opened with the peeling groove, and the elastic clips allow for quick disassembly and assembly of the base and the embedded slot without the need for violent disassembly. This simplifies the operation, avoids damage to the tableware, and ensures that the tableware can be reused. At the same time, the positioning groove, magnetic structure, and elastic connection components work together to ensure that the chip is installed accurately and securely, which facilitates later maintenance and greatly improves the chip replacement efficiency, meeting the needs of the smart catering industry for frequent chip management.

[0013] 2. In terms of sealing and protection, the sealing ring uses elastic sealing material, which together with the base and cover plate to form a sealing structure, effectively improving the problem of poor sealing of traditional embedded structures. The sealing ring tightly fills the contact gap between the base and the embedded groove. After the cover plate is closed, the sealing performance is further enhanced, which can prevent water and oil stains from entering during tableware washing and protect the chip from corrosion damage. The food-grade silicone cushioning pad on the inner wall of the base can alleviate external impacts during chip installation and tableware use, extend the chip's service life, and improve the overall reliability and stability of smart tableware. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0015] Figure 2This is a schematic diagram of the bottom structure of the tableware body of this utility model;

[0016] Figure 3 This is one of the schematic diagrams of the chip placement component structure of this utility model;

[0017] Figure 4 This is the second schematic diagram of the chip placement component structure of this utility model;

[0018] Figure 5 This is a schematic diagram of the cover plate structure of this utility model;

[0019] Figure 6 This is a schematic diagram of the base structure of this utility model.

[0020] In the diagram: 1. Tableware body; 2. Chip placement component; 3. Embedded groove; 201. Card slot; 202. Base; 203. Sealing ring; 204. Cover plate; 205. Peeling groove; 206. Card block; 207. Iron sheet; 208. Spring; 209. Insert post; 210. Positioning groove; 211. Magnetic adsorption piece; 212. Insertion hole. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see the appendix Figure 1 - Appendix Figure 4 An embedded structure on the back of a piece of tableware for easy chip placement is disclosed. The tableware body 1 includes a chip placement component 2. The back of the tableware body 1 has an embedded groove 3. The chip placement component 2 is fitted and installed in the embedded groove 3. The chip placement component 2 includes a base 202 and a cover plate 204. The base 202 is detachably connected to the bottom of the embedded groove 3 by an elastic buckle. The cover plate 204 covers the base 202, and the edge of the cover plate 204 has a peeling groove 205 for easy peeling. This structural design allows the chip placement component 2 to be stably installed in the embedded groove 3. At the same time, the elastic buckle and the peeling groove 205 enable convenient chip placement and removal, improving operational efficiency.

[0023] The elastic buckle includes multiple locking blocks 206 located at the bottom of the base 202 and multiple locking slots 201 located at the bottom of the recessed groove 3. The multiple locking blocks 206 and multiple locking slots 201 are elastically engaged, and the corresponding elastic engagement of the multiple locking blocks 206 and multiple locking slots 201 enhances the stability of the connection between the base 202 and the recessed groove 3, and also makes the disassembly and assembly process smoother. The locking block 206 is an elastic protrusion structure located at the bottom of the base 202, which is wedge-shaped with a slightly wider head and rounded edges. The arc transition, the tail end connects to the base 202 and has a certain elastic deformation capability. The slot 201 is a groove opened at the bottom of the embedded groove 3. Its shape is adapted to the slot block 206. The slot opening is provided with a limiting protrusion corresponding to the head of the slot block 206. When the slot block 206 is inserted into the slot 201, the slot block 206 is squeezed and generates elastic deformation. After entering the slot 201, it returns to its original shape and engages with the limiting protrusion to achieve elastic engagement, which not only ensures a stable connection, but also allows separation under external force.

[0024] A positioning groove 210 is provided on the surface of the base 202 away from the embedded groove 3. A magnetic attraction structure is provided between the base 202 and the cover plate 204. The magnetic attraction structure includes a magnetic adsorption piece 211 set in the positioning groove 210 on the base 202 and an iron piece 207 at the corresponding position on the cover plate 204. The cover plate 204 and the base 202 are closed and fixed by magnetic attraction. It is convenient to install the chip in the base 202. The magnetic attraction structure ensures that the cover plate 204 and the base 202 are tightly closed to prevent the chip from loosening.

[0025] Specifically, by setting up a chip placement component 2 consisting of a base 202 and a cover plate 204, along with elastic clips and a peeling groove 205, the problem of difficult chip removal and replacement under traditional fixed packaging designs is solved. When chip replacement is required, the cover plate 204 can be easily pried open with the peeling groove 205, and the elastic clips allow for quick disassembly and assembly of the base 202 and the embedded groove 3 without the need for violent disassembly. This simplifies the operation process, avoids damage to the tableware body 1, and ensures the tableware is reusable. At the same time, the positioning groove 210, the magnetic structure, and the elastic connection component work together to ensure precise and stable chip installation, facilitates later maintenance, and significantly improves chip replacement efficiency, meeting the needs of the smart catering industry for frequent chip management.

[0026] Please see the appendix Figure 1 and appendix Figure 5 - Appendix Figure 6 A sealing ring 203 is provided at the contact point between the base 202 and the inner groove 3. The sealing ring 203 is made of elastic sealing material. After the cover plate 204 is closed, it fits tightly with the sealing ring 203. The tight fit between the sealing ring 203 and the cover plate 204 forms a double seal, which effectively isolates moisture and oil stains and protects the chip.

[0027] An elastic connection assembly is provided between the cover plate 204 and the base 202. The elastic connection assembly includes a spring 208 and a post 209 disposed on the edge of the surface of the cover plate 204 near the base 202. A socket 212 is provided on the base 202 corresponding to the post 209. The post 209 is inserted into the socket 212. The spring 208 provides an elastic preload to assist the cover plate 204 in pressing the chip. The elastic connection assembly achieves positioning through the cooperation of the post 209 and the socket 212. The elastic preload of the spring 208 allows the cover plate 204 to press the chip more tightly, preventing the chip from shaking.

[0028] The inner wall of the base 202 is equipped with a cushioning pad made of food-grade silicone. The depth of the embedded groove 3 is adapted to the height of the chip placement component 2. After the cover 204 is closed, it is flush with the back surface of the tableware body 1. The food-grade silicone cushioning pad can buffer the impact of the outside world on the chip. The height of the embedded groove 3 and the chip placement component 2 are adapted to each other, and the design of the cover 204 being flush with the back of the tableware body 1 ensures the comfort of using the tableware.

[0029] Specifically, in terms of sealing and protection, the sealing structure constructed by the sealing ring 203 and the elastic sealing material, as well as the closing design of the base 202 and the cover plate 204, effectively solve the shortcomings of poor sealing in traditional embedded structures. The sealing ring 203 tightly fills the contact gap between the base 202 and the embedded groove 3, and the cover plate 204 further seals the gap after closing, preventing water and oil stains from entering during tableware washing and protecting the chip from corrosion damage. The food-grade silicone cushioning pad on the inner wall of the base 202 can also alleviate external impacts during chip installation and tableware use, extend the chip's lifespan, and improve the overall reliability and stability of smart tableware.

[0030] Working principle of this utility model: This utility model is an embedded structure on the back of a piece of tableware that facilitates the removal and placement of a chip. When placing the chip, firstly, the cover plate 204 is removed from the base 202 through the peeling groove 205, and the chip is placed into the base 202. The buffer pad inside the base 202 protects the chip. Then, the insertion post 209 of the cover plate 204 is aligned with the insertion hole 212 of the base 202 and inserted. The spring 208 is compressed to generate an elastic pre-tightening force to assist the cover plate 204 in pressing the chip. At the same time, the iron piece 207 of the cover plate 204 attracts the magnet in the positioning groove 210 of the base 202. The chip is magnetically secured by the attachment 211. Then, the locking block 206 at the bottom of the base 202 is aligned with the locking slot 201 at the bottom of the embedded groove 3 to engage, so that the sealing ring 203 at the contact point between the base 202 and the embedded groove 3 fits tightly, thus completing the chip placement. When removing the chip, first apply external force to separate the locking block 206 of the base 202 from the locking slot 201 of the embedded groove 3, remove the base 202, and then open the cover plate 204 through the peeling groove 205, pull out the insertion post 209, and the chip can be removed. The whole process is convenient and can effectively protect the tableware and the chip. At this point, the entire process is complete.

[0031] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A utensil back inner embedding structure facilitating the peeling of a chip placement core, comprising a utensil body (1) and a chip placement assembly (2), characterized in that: The tableware body (1) has an embedded groove (3) on its back. The chip placement component (2) is adapted to be installed in the embedded groove (3). The chip placement component (2) includes a base (202) and a cover plate (204). The base (202) and the bottom of the embedded groove (3) are detachably connected by an elastic buckle. The cover plate (204) covers the base (202), and the edge of the cover plate (204) is provided with a peeling groove (205) to facilitate peeling operation.

2. The back-inset structure of a tableware for facilitating the peeling and placing of a chip according to claim 1, characterized in that: The elastic buckle includes multiple locking blocks (206) at the bottom of the base (202) and multiple locking slots (201) at the bottom of the inner groove (3), and the multiple locking blocks (206) and the multiple locking slots (201) are elastically engaged respectively.

3. The back-inset structure of a tableware for facilitating the peeling and placing of a chip according to claim 1, characterized in that: The base (202) has a positioning groove (210) on its surface away from the inner groove (3). A magnetic attraction structure is provided between the base (202) and the cover plate (204). The magnetic attraction structure includes a magnetic adsorption piece (211) set in the positioning groove (210) on the base (202) and an iron piece (207) at the corresponding position on the cover plate (204). The cover plate (204) and the base (202) are closed and fixed by magnetic attraction.

4. The back-inset structure of a tableware for facilitating the peeling and placing of a chip according to claim 1, characterized in that: A sealing ring (203) is provided at the contact part between the base (202) and the inner groove (3). The sealing ring (203) is made of elastic sealing material. After the cover plate (204) is closed, it fits tightly with the sealing ring (203).

5. The embedded structure on the back of a tableware for easy chip placement according to claim 1, characterized in that: An elastic connection assembly is provided between the cover plate (204) and the base (202). The elastic connection assembly includes a spring (208) and a post (209) disposed on the edge of the surface of the cover plate (204) near the base (202). A socket (212) is provided on the base (202) corresponding to the post (209). The post (209) is inserted into the socket (212). The spring (208) provides an elastic preload to assist the cover plate (204) in pressing the chip.

6. The back-inset structure of a utensil for facilitating the peeling and placing of a chip according to claim 1, wherein: The inner wall of the base (202) is provided with a buffer pad, which is made of food-grade silicone. The depth of the embedded groove (3) is adapted to the height of the chip placement component (2). After the cover plate (204) is closed, it is flush with the back surface of the tableware body (1).

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