Heating assembly, humidification device, and ventilation therapy apparatus

Abstract

This utility model relates to the field of ventilation therapy technology, and discloses a heating component, a humidification device, and a ventilation therapy device. The heating component includes a semiconductor cooling module. One end of the semiconductor cooling module forms a hot end, which is located near the device to be heated and provides heat to the device. The other end of the semiconductor cooling module forms a cold end, which is located away from the device to be heated and isolated from it. When the above heating component is applied to a ventilation therapy device, the heating power of the semiconductor cooling module is equal to the sum of the electrical power input and the heat power generated by its hot end. Therefore, under the premise of achieving the same heating effect, the heating component consumes less power, thus reducing costs and solving the problems of high energy consumption and low utilization rate of existing ventilation therapy device heating components.

Description

Technical Field

[0001] This utility model relates to the field of ventilation therapy technology, specifically to a heating component, a humidification device including the heating component, and a ventilation therapy device including the heating component or the humidification device. Background Technology

[0002] In modern clinical medicine, ventilation therapy equipment, such as ventilators, is an auxiliary respiratory therapy device with artificial ventilation function. Breathing gas is supplied to the patient through the breathing tube and the patient interface. By increasing the patient's lung ventilation, it effectively improves the patient's respiratory function. It is now widely used to treat respiratory diseases such as respiratory failure, respiratory insufficiency, sleep apnea syndrome, and chronic obstructive pulmonary disease. It can play an important role in assisting patients' breathing and saving and prolonging their lives.

[0003] Commonly used ventilators are typically equipped with humidification devices featuring a water tank. This heats and humidifies the airflow passing through the tank before delivering it to the patient, providing a comfortable breathing experience. This function relies primarily on a heating element to heat the liquid within the tank; therefore, heating power and efficiency are crucial for performance improvement. Current heating elements utilize heating wires or heating rods, essentially converting electrical energy directly into heat energy through the thermal effect of current flowing through a resistor. In specific applications, the heating power is adjusted by changing the voltage or current across the resistor based on heating requirements and temperature feedback signals.

[0004] However, existing heating methods suffer from high energy consumption. Specifically, heating wires or heating rods utilize the Joule heating effect of resistance to convert electrical energy into heat energy. Since heat conduction is non-directional, in addition to heat conduction to the target heated body (such as a water tank), there are other loss paths. The main loss occurs on the side of the heating component that is not in contact with the water tank. Therefore, the effective utilization rate of resistance heating schemes is significantly lower than 100% (usually about 80% based on experience), resulting in insufficient economic efficiency. Utility Model Content

[0005] The purpose of this invention is to overcome the problem of high energy consumption in the heating components used in existing ventilators.

[0006] To achieve the above objectives, the first aspect of this utility model provides a heating assembly, which includes a semiconductor refrigeration module. One end of the semiconductor refrigeration module forms a hot end, which is disposed on a side close to the device to be heated and is used to provide heat to the device to be heated. The other end of the semiconductor refrigeration module forms a cold end, which is disposed on a side away from the device to be heated and is isolated from the device to be heated.

[0007] When the above-mentioned heating components are applied to ventilation therapy equipment, the heating power of the semiconductor cooling module is equal to the sum of the electrical power input to the power supply and the heat power generated by its hot end. Therefore, under the premise of achieving the same heating effect, the heating components consume less power, thus reducing costs and solving the problems of high energy consumption and low utilization rate of existing ventilation therapy equipment heating components.

[0008] In some embodiments, the heating assembly further includes an insulation layer surrounding the outer periphery of the side of the semiconductor refrigeration module located between the hot end and the cold end; or the insulation layer surrounding the outer periphery of the side of the semiconductor refrigeration module located between the hot end and the cold end and the side of the cold end away from the hot end.

[0009] In some embodiments, the heating assembly further includes a sealing layer surrounding the outer periphery of the insulation layer.

[0010] In some embodiments, the outer peripheral contour dimensions of the sealing layer are the same as those of the insulation layer.

[0011] In some embodiments, the heating assembly further includes at least two temperature sensing elements, which are used to measure the temperature of the hot end and the cold end of the semiconductor refrigeration module, respectively.

[0012] In some embodiments, the heating assembly further includes a temperature conductor connected to the cold end of the semiconductor refrigeration module.

[0013] In some embodiments, the heating assembly further includes a heating element disposed near the cold end of the semiconductor refrigeration module.

[0014] In some embodiments, the heating assembly further includes a cooling module disposed near the cold end of the semiconductor refrigeration module.

[0015] In some embodiments, the heating assembly further includes a conductive element disposed on the side of the hot end away from the cold end.

[0016] A second aspect of this utility model provides a humidification device, including a water tank and a heating component for heating the water tank, wherein the heating component is the heating component described above, and the water tank is the device to be heated.

[0017] The humidification device, by employing the heating component provided by this invention, can effectively improve energy utilization and reduce energy consumption.

[0018] A third aspect of this utility model provides a ventilation therapy device, including a water tank and a heating component for heating the water tank, wherein the heating component is the heating component described above, and the water tank is the device to be heated.

[0019] The ventilation therapy device, by employing the heating component provided by this invention, can effectively improve energy utilization and reduce energy consumption.

[0020] In some embodiments, the ventilation therapy device further includes a main unit, and the heating component further includes a temperature conductor, one end of which is connected to the cold end of the semiconductor refrigeration module, and the other end of which is connected to the main unit.

[0021] In some embodiments, the host includes a host housing and a metal layer disposed on the inner wall surface of the host housing, and one end of the temperature-conducting element is connected to the metal layer.

[0022] In some embodiments, the heating assembly further includes a heating element disposed on the heat-conducting element.

[0023] In some embodiments, the ventilation therapy device further includes a cooling module disposed between the heating component and the main unit to dissipate cold energy into the environment.

[0024] In some embodiments, the heating component is integrated into the bottom of the water tank, forming a humidification device that is detachably mounted on the host unit together with the water tank.

[0025] In some embodiments, the heating assembly is integrated on the main unit, and the water tank constitutes a humidification device that is detachably mounted on the heating assembly of the main unit.

[0026] In some embodiments, the host unit is provided with an installation space for installing the humidification device, the installation space being configured for the humidification device to be installed vertically.

[0027] In some embodiments, an electrical conduction structure is provided between the humidification device and the installation space, the electrical conduction structure being configured to conduct when the humidification device is installed in the installation space.

[0028] In some embodiments, a power supply element is provided within the installation space, the power supply element being used to supply power to the semiconductor cooling module.

[0029] In some embodiments, a protective structure is provided between the humidification device and the installation space. The protective structure is configured to cause the humidification device to move upward when the water level in the water tank is lower than a preset water level, thereby disconnecting the electrical conduction structure.

[0030] In some embodiments, a snap-fit ​​structure is provided between the host and the humidification device, the snap-fit ​​structure being configured to connect the host and the humidification device when the humidification device is installed in the installation space; preferably, the snap-fit ​​structure is configured to provide a downward elastic force to the humidification device.

[0031] In some embodiments, the protective structure includes an elastic element disposed between the bottom of the humidification device and the bottom of the mounting space, the elastic element being configured to provide an upward elastic force to the humidification device.

[0032] In some embodiments, the snap-fit ​​structure is configured such that when the water level in the water tank is lower than a preset water level, the snap-fit ​​structure can disengage under the upward elastic force of the elastic element.

[0033] In some embodiments, the snap-fit ​​structure includes a first elastic snap and a second elastic snap that are adapted to each other. The first elastic snap is disposed on one side wall of the installation space, and the second elastic snap is disposed on the side wall of the water tank corresponding to one side wall of the installation space. The first elastic snap and the second elastic snap are configured to snap together in the vertical direction.

[0034] In some embodiments, the host is provided with a limiting member located near the top opening of the mounting space, and the limiting member is configured to limit the upward displacement of the humidification device after the snap-fit ​​structure is disengaged.

[0035] In some embodiments, the water tank includes a tank sleeve and a tank body, the tank sleeve being fitted over the tank body, and at least one side wall of the tank sleeve having a double-wall structure, wherein an outer layer of thermal insulation material and an inner layer of reflective material are disposed in the interlayer of the double-wall structure.

[0036] In some embodiments, the ventilation therapy device further includes a ventilation line, which includes a compressible pipe connector and a transmission line. One end of the compressible pipe connector is connected to the air outlet of the water tank, and the other end of the compressible pipe connector is connected to one end of the transmission line.

[0037] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0038] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0039] Figure 1 This is a schematic diagram of one embodiment of the heating component in this utility model;

[0040] Figure 2 This is a schematic diagram of another embodiment of the heating component in this utility model;

[0041] Figure 3 This is a schematic diagram of the semiconductor cooling module in this utility model;

[0042] Figure 4 This is a schematic diagram of the first embodiment of the ventilation therapy device in this utility model;

[0043] Figure 5 This is a schematic diagram of the second embodiment of the ventilation therapy device in this utility model;

[0044] Figure 6 This is a schematic diagram of the third embodiment of the ventilation therapy device in this utility model;

[0045] Figure 7 This is a structural schematic diagram of one embodiment of the water tank in this utility model.

[0046] Explanation of reference numerals in the attached figures

[0047] 10-Heating component, 11-Semiconductor cooling module, 111-Cold end, 112-Hot end, 12-Insulation layer, 13-Sealing layer, 14-Temperature sensing element, 15-Temperature conductor, 16-Heating component, 17-Cooling module, 18-Conducting component, 19a-Electrical contact, 19b-Metal probe;

[0048] 20-Water tank, 21-Second elastic buckle, 22-Water tank sleeve, 221-Insulation material layer, 222-Reflective material layer, 23-Box body, 231-Air outlet, 232-Air inlet;

[0049] 30-Main unit, 31-Main unit casing, 32-Metal layer, 33-Installation space, 34-Power supply component, 341-Power supply pin, 35-Elastic component, 36-First elastic buckle, 37-Limiting component;

[0050] 40 - Ventilation line, 41 - Compressible line connector, 42 - Transmission line. Detailed Implementation

[0051] The embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this utility model by way of example, but should not be used to limit the scope of this utility model. This utility model can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0052] These embodiments are provided to make the present invention thorough and complete, and to fully express the scope of the present invention to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions and values ​​set forth in these embodiments should be interpreted as merely exemplary and not as limiting.

[0053] It should be noted that, in the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationships, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0054] Furthermore, the terms "first," "second," and similar words used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range. Words such as "including" or "comprising" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well.

[0055] It should also be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device.

[0056] All terms used in this invention have the same meaning as understood by one of ordinary skill in the art to which this invention pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0057] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0058] This utility model provides a heating component, see [link to related information] Figure 1 The heating component 10 includes a semiconductor refrigeration module (hereinafter referred to as the TEC module) 11 (see details). Figure 3 One end of the TEC module 11 forms a hot end 112, which is located on the side close to the device to be heated and is used to provide heat to the device to be heated (e.g., a water tank). The other end of the TEC module 11 forms a cold end 111, which is located on the side away from the device to be heated and is isolated from the device to be heated.

[0059] The heating component provided by this utility model, by using the TEC module 11 for heat pump heating, can obtain a larger amount of heat at the hot end than the input power (a heat pump is a device that transfers heat from a cold environment to a hot environment. The heat it obtains is equal to the heat it absorbs from the low-temperature heat source plus the work input (i.e., electrical energy) during the operation of the heat pump. Therefore, the theoretical efficiency of a heat pump is higher than 100% when used for heating. On the other hand, since the heat pump is directional, the heating output of the heating component can be directed as much as possible toward the target heated body, i.e. the device to be heated. Therefore, compared with the existing heating components of electric heating wire and other forms, it can effectively improve the heat utilization rate and reduce the power consumption), thereby effectively improving the energy utilization rate.

[0060] When the above-mentioned heating component is applied to a ventilation therapy device, the heating power of the TEC module 11 is equal to the sum of the electrical power input and the heat power generated by its hot end. Therefore, under the premise of achieving the same heating effect, the heating component consumes less power, thus reducing the cost and solving the problems of high energy consumption and low utilization rate of existing ventilation therapy device heating components.

[0061] Existing heating methods suffer from the following problems: low safety. Specifically, resistance heating can reach temperatures exceeding 100 degrees Celsius, posing a safety risk to users. Therefore, additional overheat protection measures are required, which are relatively complex. The effectiveness of these measures is also affected by usage conditions and product consistency, leaving room for improvement in overall safety. Low reliability. Specifically, current heating components typically use thermally conductive films or silicone sheets for positioning the heating wires. These materials deform under heat, causing incomplete positioning of the heating wires and affecting the stability of the heating component over long-term use. Furthermore, because the heating wires have extremely high temperature resistance (common heating components can operate at 200°C without breaking), far exceeding the maximum target temperature required by humidification devices (typically around 70-100°C), overheating risks can easily arise in special fault scenarios (such as software malfunction or short circuits in the heating switch).

[0062] The heating component of this invention utilizes a TEC module 11. Due to its inherent structural limitations, the maximum temperature it can withstand is typically limited to 80°C. Exceeding this temperature will cause it to fail and cease heating. This inherent safety feature offers a significant advantage in overheat protection for humidification devices. Furthermore, it should be noted that the TEC module 11 in this invention employs ceramic encapsulation, eliminating the problem of heat deformation. Its long-term operational consistency and reliability are superior to those achieved through heating wire methods.

[0063] In some implementations, see Figure 1 The heating assembly 10 may also include an insulation layer 12, which surrounds the outer periphery of the side of the TEC module 11 located between the hot end 112 and the cold end 111; or the insulation layer 12 surrounds the outer periphery of the side of the TEC module 11 located between the hot end 112 and the cold end 111 and the side of the cold end 111 away from the hot end 112.

[0064] The heating component provided by this utility model can achieve temperature isolation by setting an insulation layer (such as insulation cotton) on the outer periphery of the TEC module 11, preventing heat from the hot end from being conducted outward and reducing heat consumption.

[0065] In some embodiments, the heating assembly 10 may further include a sealing layer 13 surrounding the outer periphery of the insulation layer 12.

[0066] Specifically, such as Figure 1As shown, the sealing layer 13 is sealed to the bottom of the TEC module 11. By setting the sealing layer 13 at the bottom of the TEC module 11, i.e., setting the sealing layer 13 on one side of the cold end 111, the heating assembly can perform watertight treatment on the TEC module 11, preventing condensate that may be generated at the cold end of the TEC module 11 from flowing out and damaging the normal operation of electronic devices and other equipment; at the same time, it can also reduce vibration of the TEC module 11 and prevent the TEC module 11 from being broken by impact.

[0067] In this utility model, regarding the setting of the sealing layer, in some embodiments, such as Figure 1 As shown, the outer peripheral contour dimensions of the sealing layer 13 are the same as those of the insulation layer 12. In other embodiments, see... Figure 5 The sealing layer 13 surrounds the bottom and sides of the TEC module 11 and the insulation layer 12.

[0068] In this utility model, see Figure 1 or Figure 2 The heating assembly 10 may further include at least two temperature sensing elements 14, which are used to measure the temperatures of the hot end 112 and the cold end 111 of the TEC module 11, respectively. The at least two temperature sensing elements 14 can obtain the temperatures of the hot end 112 and the cold end 111 in real time. During operation, the required current is calculated based on the required heating power and the current hot and cold end temperatures, and then the required voltage across the TEC module 11 is calculated. The corresponding equivalent voltage is controlled by adjusting the PWM (Pulse Width Modulation) duty cycle. When the temperature sensing element 14 detects that the temperature of the hot end 112 is too high, the power is cut off, causing the TEC module 11 to stop working.

[0069] In this utility model, see Figure 2 The heating assembly 10 may also include a heat-conducting element 15, which is connected to the cold end 111 of the TEC module 11. This allows for the utilization of the cooling power of the TEC module 11. In practical use, the heat-conducting element 15 can be brought into contact with or close to the heating elements (such as the motherboard or power module) inside the ventilation therapy device, transferring the cold air from the cold end to the heating elements to reduce their temperature, thereby improving their operational stability and safety. Simultaneously, due to the heat pump principle of the TEC module 11, the heating power of these heating elements can increase the temperature of the cold end, further improving the efficiency of the heat pump and reducing the electrical power consumed by the heating assembly. The heat-conducting element 15 can be, for example, an aluminum block or thermally conductive silicone.

[0070] In this utility model, see Figure 4The heating assembly 10 may further include a heating element 16, which is located near the cold end 111 of the TEC module 11. Additionally, the heating assembly 10 may also include a cooling module 17, which is located near the cold end 111 of the TEC module 11. In actual use, the cooling capacity generated by the cold end 111 of the TEC module 11 may exceed the heating power of the TEC module. In this case, the cooling module 17 can enhance conduction and convection cooling, allowing the cold energy to dissipate to the environment as quickly as possible, preventing condensation from forming due to excessively low cold end temperature. When the cold end temperature remains too low, causing condensation, the heating element 16 can be used to heat the module to prevent damage from excessively low temperatures and to prevent circuit failure caused by condensation. In some embodiments, the heating element 16 may be a heating wire, and the cooling module 17 may be a fan.

[0071] In this utility model, see Figure 1 or Figure 2 The heating assembly 10 may further include a conductive element 18, which is disposed on the top of the TEC module 11, i.e., on one side of the hot end of the TEC module 11. By making the hot end of the TEC module 11 fit against the conductive element 18, heat can be conducted to the device to be heated through the conductive element 18. Preferably, the outer peripheral contour dimension of the conductive element 18 is set to be consistent with the end face contour dimension of the insulation layer 12. The conductive element 18 may be a metal plate.

[0072] A second aspect of this invention provides a humidification device, including a water tank 20 and a heating component 10 for heating the water tank 20. It is understood that the water tank 20 is the device to be heated. The heating component 10 may be disposed at the bottom of the water tank 20 or in contact with the bottom of the water tank 20.

[0073] The humidification device, by employing the heating component 10 provided by this invention, can effectively improve energy utilization and reduce energy consumption.

[0074] Existing humidification devices use heating wires as heating elements, which can only generate external heat by converting electrical energy into heat energy, and cannot utilize the heat energy of the external environment itself. The humidification device of this invention uses a TEC module for heating. During operation, the cold end temperature of the TEC module is lower than the ambient temperature. Therefore, the temperature difference automatically drives the ambient heat to the cold end of the TEC module, and then, through the TEC heat pump principle, transfers it to its hot end. When a heat source is present in the environment, the energy of that heat source can be more effectively utilized and transferred to the water tank, enhancing heating efficiency and reducing energy consumption. Simultaneously, the cooling effect of its byproducts enhances the stability of the device's operation to some extent, especially in high-temperature environments.

[0075] The humidification device may include a conductive element 18, which may be disposed as part of the water tank 20 at the bottom of the water tank 20 (see [reference]). Figure 7It can also be disposed on top of the heating assembly 10 as part of the heating assembly 10 (see...). Figure 1 The conductive element 18 is used to conduct heat generated by the heating assembly to the water tank 20 to heat the liquid inside the tank. In some embodiments, the conductive element 18 may be a metal plate.

[0076] A third aspect of this utility model provides a ventilation therapy device, including a water tank 20 and a heating component 10 for heating the water tank 20. It is understood that the water tank 20 is the aforementioned heating device.

[0077] In some implementations, see Figure 4 The ventilation therapy device also includes a main unit 30, and the heating component 10 includes a heat-conducting element 15. One end of the heat-conducting element 15 is connected to the cold end of the TEC module 11, and the other end is connected to the main unit 30. In this way, the cold energy at the cold end can be conducted to the main unit 30 through the heat-conducting element 15 to cool the internal components of the main unit 30.

[0078] Preferably, the main unit 30 includes a main unit housing 31 and a metal layer 32 disposed on the inner wall surface of the main unit housing 31. The metal layer 32 can enhance conductivity. The other end of the heat-conducting element 15 can be connected to the metal layer 32.

[0079] like Figure 4 As shown, the heating assembly 10 may further include a heating element 16, which is disposed on the heat-conducting element 15. A cooling module 17 may also be disposed between the heating assembly 10 and the main unit 30. The cooling module 17 can enhance convection, allowing the cold air to dissipate into the environment as quickly as possible. When the cold end temperature of the heating assembly remains too low, causing condensation, the heating element 16 is activated to raise the temperature and prevent condensation. In some embodiments, the heating element 16 may be a heating wire, and the cooling module 17 may be a fan.

[0080] In this invention, the heating component 10 has two installation methods. The first method is that the heating component 10 is integrated into the bottom of the water tank 20, forming a humidification device that can be detachably installed on the main unit 30 together with the water tank 20 (see [link]). Figure 5 The second type integrates the heating element 10 onto the main unit 30, and the water tank 20 constitutes a humidification device that can be detachably installed on the main unit 30 (see...). Figure 6 For the first installation method described above, the hot end of the TEC module and the conductive component 18 at the bottom of the water tank are in direct contact, resulting in high heat transfer efficiency. Furthermore, there is no need to disassemble the two components, and there is no relative movement, which better protects the TEC module for normal operation. For the second installation method described above, the TEC module can be sealed onto the main unit, preventing the impact of condensation on the cold end.

[0081] The main unit 30 is provided with an installation space 33 for installing the humidification device, which can be installed in any direction within the installation space 33. For details, see [link to details]. Figure 5 or Figure 6 The mounting space 33 can be located on one side of the main unit 30. The mounting space 33 can have a top opening or a side opening. For compatibility with other structures (described below), the mounting space 33 is preferably configured for vertical mounting of the humidification device. In this case, the mounting space 33 can have both a top opening and a side opening (see [link]). Figure 5 or Figure 6 (The top and right side of the installation space 33 in the middle).

[0082] The installation space 33 may contain a power supply element 34, which can be used to supply power to the TEC module 11.

[0083] In this invention, an electrical conduction structure can be provided between the humidification device and the installation space 33. This structure is configured to conduct electricity when the humidification device is properly installed in the installation space 33. In other words, if the humidification device is not properly installed, the electrical conduction structure will not conduct electricity, and the heating component 10 will not function. This improves the safety of the ventilation therapy equipment.

[0084] For the electrically conductive structure, specifically, in the case where the humidification device includes a water tank 20 and a heating assembly 10, such as Figure 5 As shown, a power supply element 34 is disposed within the portion of the main unit 30 that defines the bottom of the mounting space 33. The power supply element 34 has an upwardly extending power supply pin 341, which is used to contact a power receiving contact 19a disposed at the bottom of the heating assembly 10 to provide power. The power supply pin 341 and the power receiving contact 19a constitute an electrically conductive structure. In the case where the humidification device does not include the heating assembly 10, such as... Figure 6 As shown, a conductive element 18 is provided at the bottom of the water tank 20, and the heating assembly 10 is disposed within the portion of the main unit 30 that defines the installation space 33 at the bottom. The heating assembly 10 is provided with an upwardly extending metal probe 19b, which is used to contact the conductive element 18 to conduct the circuit. The conductive element 18 and the metal probe 19b constitute an electrically conductive structure. It should be noted that the two metal probes 19b on the heating assembly 10 constitute a switch in the detection circuit. When the water tank is installed in place, the conductive element 18 at the bottom of the water tank is in close contact with the hot end of the TEC module, and the metal probe 19b contacts the conductive element 18, thus conducting the detection circuit. At this time, the heating circuit of the heating assembly operates. When the water tank is not installed in place, for example, when the water tank moves upward, the metal probe 19b separates from the conductive element 18, the detection circuit is broken, and the heating circuit does not operate.

[0085] In this invention, in order to prevent the water tank from burning dry, a protective structure can be provided between the humidification device and the installation space 33. The protective structure is designed to cause the humidification device to move upward when the water level in the water tank 20 is lower than the preset water level, thereby disconnecting the electrical conduction structure.

[0086] In the above, the protective structure can be any structure capable of fulfilling its function. See specifically... Figure 5 or Figure 6 In the illustrated embodiment, the protective structure may include an elastic element 35 disposed between the bottom of the humidification device and the bottom of the mounting space 33. The elastic element 35 is configured to provide an upward elastic force to the humidification device. There may be at least two elastic elements 35, respectively disposed at both ends of the bottom of the mounting space. The upward elastic force of the elastic element 35 may be set to be less than or equal to the sum of the weight of the humidification device and the weight of the preset amount of water in the water tank 20. In this case, when the amount of water in the water tank 20 decreases, for example, when the water level in the water tank 20 is lower than the preset water level, the humidification device will move upward under the action of the upward elastic force of the elastic element 35, causing the electrical conduction structure to disconnect. The elastic element 35 may be a compression spring.

[0087] In this invention, to improve the reliability of the humidification device installation on the main unit, a snap-fit ​​structure can be provided between the main unit 30 and the humidification device. This snap-fit ​​structure is designed to connect the main unit 30 and the humidification device when the humidification device is installed in the installation space 33. By providing this snap-fit ​​structure, the humidification device can be prevented from detaching from the main unit during operation, ensuring the reliability of the equipment operation.

[0088] It should be noted that the above-mentioned snap-fit ​​structure can have any suitable structure, as long as it can achieve a detachable connection between the humidification device and the main unit.

[0089] In order to enable the snap-fit ​​structure to cooperate with the protective structure to achieve anti-dry-burn protection for the humidification device and improve safety and reliability, this utility model preferably configures the snap-fit ​​structure to provide a downward elastic force to the humidification device. In this case, the upward elastic force of the elastic element 35 can be set to be equal to or less than the sum of the downward elastic force provided by the snap-fit ​​structure, the weight of the humidification device, and the weight of the preset water volume in the water tank 20. Specifically, the snap-fit ​​structure is configured such that when the water level in the water tank 20 is lower than the preset water level, the snap-fit ​​structure can disengage under the action of the upward elastic force of the elastic element 35.

[0090] With the above settings, during use, when the water tank has sufficient water, the gravity of the humidification device and the downward elastic force of the snap-fit ​​structure can balance the upward elastic force of the elastic element 35, fixing the humidification device in place. At this time, the electrical conduction structure is in close contact and conducts electricity, thereby supplying power to the heating component. When the water tank has less water, and the water level is lower than the preset level, the difference between the upward elastic force of the elastic element 35 and the gravity of the humidification device and the water exceeds the maximum elastic force that the snap-fit ​​structure can provide. The snap-fit ​​structure disengages, the humidification device moves upward relative to the main unit, the electrical conduction structure disconnects, and the heating component stops working. If the humidification device is not initially installed correctly, it cannot reach the position where the snap-fit ​​structure engages without external force, and the electrical conduction structure will also fail to conduct electricity.

[0091] Specifically, the snap-fit ​​structure may include a first elastic snap-fit ​​36 ​​and a second elastic snap-fit ​​21 that are mutually adapted to each other. The first elastic snap-fit ​​36 ​​is disposed on one side wall of the installation space 33, and the second elastic snap-fit ​​21 is disposed on the side wall of the water tank 20 corresponding to one side wall of the installation space 33. The first elastic snap-fit ​​36 ​​and the second elastic snap-fit ​​21 are configured to snap together vertically. Figure 5 or Figure 6 As shown, the first elastic buckle 36 can be a hook-shaped piece with its opening facing downwards, and the second elastic buckle 21 can be a hook-shaped piece with its opening facing upwards.

[0092] In this utility model, see Figure 5 or Figure 6 Alternatively, a limiting member 37 can be provided on the main unit 30. The limiting member 37 can be located near the top opening of the installation space 33. The limiting member 37 can be configured to limit the upward displacement of the humidification device after the snap-fit ​​structure is disengaged. Of course, in embodiments without a snap-fit ​​structure, the limiting member 37 can also serve to limit the upward displacement of the humidification device.

[0093] This utility model also provides a water tank 20, see [link]. Figure 7 The water tank 20 includes a tank sleeve 22 and a tank body 23. The tank body 23 defines a liquid storage chamber. The tank body 23 is provided with an air outlet 231 and an air inlet 232 communicating with the liquid storage chamber. The tank sleeve 22 is fitted over the tank body 23, with the air outlet 231 and air inlet 232 extending outside the tank sleeve 22. At least one side wall of the tank sleeve 22 has a double-wall structure. The double-wall structure has an outer insulation material layer 221 and an inner reflective material layer 222. The reflective material layer 222 reduces heat radiation from the water tank, while the insulation material layer 221 reduces heat conduction and dissipation, thus reducing heat loss during heating.

[0094] like Figure 7 As shown, a conductive element 18 may also be provided at the bottom of the water tank 20.

[0095] In this utility model, see Figure 5 or Figure 6 The ventilation therapy device may further include a ventilation pipeline 40, which includes a compressible pipe connector 41 and a transmission pipeline 42. One end of the compressible pipe connector 41 is connected to the air outlet 231 of the water tank 20, and the other end of the compressible pipe connector 41 is connected to one end of the transmission pipeline 42. The position of the transmission pipeline 42 can remain unchanged, and a stable fit with the water tank is achieved by compressing or stretching the compressible pipe connector 41.

[0096] In this invention, the ventilation therapy device can be a ventilator or a high-flow humidified oxygen therapy device, etc.

[0097] The various embodiments of this utility model have now been described in detail. To avoid obscuring the concept of this utility model, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0098] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in the different embodiments can be combined in any way.

Claims

1. A heating assembly, characterized by, The heating component (10) includes a semiconductor cooling module (11). One end of the semiconductor cooling module (11) forms a hot end (112), which is located on the side close to the device to be heated and is used to provide heat to the device to be heated. The other end of the semiconductor cooling module (11) forms a cold end (111), which is located on the side away from the device to be heated and is isolated from the device to be heated.

2. The heating assembly of claim 1, wherein, The heating assembly (10) further includes a heat insulation layer (12), which surrounds the outer periphery of the side of the semiconductor cooling module (11) located between the hot end (112) and the cold end (111); or the heat insulation layer (12) surrounds the outer periphery of the side of the semiconductor cooling module (11) located between the hot end (112) and the cold end (111) and the side of the cold end (111) away from the hot end (112).

3. The heating assembly of claim 2, wherein, The heating assembly (10) also includes a sealing layer (13) which surrounds the outer periphery of the insulation layer (12).

4. The heating assembly of claim 3, wherein, The outer periphery dimensions of the sealing layer (13) are consistent with the outer periphery dimensions of the insulation layer (12).

5. The heating assembly of claim 1, wherein, The heating assembly (10) further includes at least two temperature sensing elements (14), which are used to measure the temperature of the hot end (112) and the cold end (111) of the semiconductor cooling module (11), respectively; and / or The heating assembly (10) also includes a temperature conductor (15), which is connected to the cold end (111) of the semiconductor cooling module (11).

6. The heating assembly of claim 1, wherein, The heating assembly (10) further includes a heating element (16) disposed near the cold end (111) of the semiconductor cooling module (11); and / or The heating component (10) also includes a cooling module (17), which is located near the cold end (111) of the semiconductor cooling module (11).

7. The heating assembly of any one of claims 1-6, wherein, The heating assembly (10) also includes a conductive element (18) disposed on the side of the hot end (112) away from the cold end (111).

8. A humidification device, comprising a water tank (20) and a heating assembly for heating the water tank (20), characterized in that, The heating component is the heating component according to any one of claims 1-7, wherein the water tank (20) is the device to be heated.

9. A humidification therapy apparatus comprising a water tank (20) and a heating assembly for heating the water tank (20), characterised in that, The heating component is the heating component according to claim 1, wherein the water tank (20) is the device to be heated.

10. The ventilation therapy device of claim 9, wherein, The ventilation therapy device also includes a main unit (30), and the heating component (10) also includes a temperature conductor (15). One end of the temperature conductor (15) is connected to the cold end (111) of the semiconductor refrigeration module (11), and the other end is connected to the main unit (30).

11. The ventilation therapy device of claim 10, wherein, The host (30) includes a host housing (31) and a metal layer (32) disposed on the inner wall surface of the host housing (31).

12. The ventilation therapy device according to claim 10, characterized in that, The heating assembly (10) further includes a heating element (16) disposed on the heat-conducting element (15); and / or The ventilation therapy device also includes a cooling module (17), which is disposed between the heating component (10) and the main unit (30) to dissipate cold energy into the environment.

13. The ventilation therapy device according to claim 10, characterized in that, The heating component (10) is integrated into the bottom of the water tank (20), and together with the water tank (20), forms a humidification device that is detachably installed on the main unit (30); or The heating component (10) is integrated on the host (30), and the water tank (20) constitutes a humidification device that is detachably installed on the heating component (10) of the host (30).

14. The ventilation therapy device of claim 13, wherein, The host (30) is provided with an installation space (33) for installing the humidification device.

15. The ventilation therapy device of claim 14, wherein, The installation space (33) is configured for the humidification device to be installed in the vertical direction.

16. The ventilation therapy device of claim 14, wherein, An electrical conduction structure is provided between the humidification device and the installation space (33), and the electrical conduction structure is configured to conduct when the humidification device is installed in the installation space (33).

17. The ventilation therapy device of claim 14, wherein, A power supply element (34) is provided in the installation space (33), which is used to supply power to the semiconductor cooling module (11).

18. The ventilation therapy device according to claim 16, characterized in that, A protective structure is provided between the humidification device and the installation space (33). The protective structure is configured to cause the humidification device to move upward when the water level in the water tank (20) is lower than the preset water level, thereby disconnecting the electrical conduction structure. and / or A snap-fit ​​structure is provided between the host (30) and the humidification device. The snap-fit ​​structure is configured to connect the host (30) and the humidification device when the humidification device is installed in the installation space (33).

19. The ventilation therapy apparatus of claim 18, wherein, The snap-fit ​​structure is configured to provide a downward elastic force to the humidification device.

20. The ventilation therapy apparatus of claim 18, wherein, The protective structure includes an elastic element (35) disposed between the bottom of the humidification device and the bottom of the mounting space (33), the elastic element (35) being configured to provide an upward elastic force to the humidification device.

21. The ventilation therapy device according to claim 20, characterized in that, The buckle structure is configured such that when the water level in the water tank (20) is lower than the preset water level, the buckle structure can disengage under the upward elastic force of the elastic element (35).

22. The ventilation therapy device according to claim 20, characterized in that, The latching structure includes a first elastic latch (36) and a second elastic latch (21) that are mutually adapted to each other. The first elastic latch (36) is disposed on one side wall of the installation space (33), and the second elastic latch (21) is disposed on the side wall of the water tank (20) corresponding to one side wall of the installation space (33). The first elastic latch (36) and the second elastic latch (21) are configured to latch onto each other in the vertical direction; and / or The host (30) is provided with a limiting member (37), which is located near the top opening of the installation space (33). The limiting member (37) is configured to limit the upward displacement of the humidification device after the snap-fit ​​structure is disengaged.

23. The ventilation therapy device according to any one of claims 9-22, characterized in that, The water tank (20) includes a tank sleeve (22) and a tank body (23). The tank sleeve (22) is fitted over the tank body (23). At least one side wall of the tank sleeve (22) is a double-wall structure. The double-wall structure has an outer layer of thermal insulation material (221) and an inner layer of reflective material (222) in the interlayer. The ventilation therapy device also includes a ventilation pipeline (40), which includes a compressible pipeline connector (41) and a transmission pipeline (42). One end of the compressible pipeline connector (41) is connected to the air outlet (231) of the water tank (20), and the other end of the compressible pipeline connector (41) is connected to one end of the transmission pipeline (42).

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