Pin bending device for semiconductor diode production

Abstract

This utility model discloses a lead bending device for semiconductor diode production, including an operating table. A bending assembly is provided on the upper surface of the operating table, and a blocking assembly is provided inside the bending assembly. By controlling the electric hydraulic push rod to drive the connecting plate to descend, the connecting plate can drive the lower pressure side plate to descend together. At the same time, the limiting pressure plate will also descend synchronously. The descending limiting pressure plate will first contact and press and fix multiple semiconductor diode bodies below. The connecting plate will drive the lower pressure side plate to continue to descend, simultaneously bending the leads to be bent at both ends of the multiple semiconductor diode bodies downward. By controlling the lifting electric push rod to drive the blocking rods on the left and right sides to extend upward through the support plate, the multiple semiconductor diode bodies in the limiting groove can be laterally limited, preventing the semiconductor diode bodies from rolling laterally during the bending process, thereby further improving the stability of the leads being bent.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor diode lead bending technology, specifically a lead bending device for semiconductor diode production. Background Technology

[0002] A semiconductor diode is an electronic device that utilizes the characteristics of semiconductors. Its main feature is the asymmetry of its current-voltage characteristics, meaning that it exhibits good conductivity in one direction and high resistance in the opposite direction. It can be used for rectification, detection, voltage regulation, constant current, varactor, switching, light emission, and photoelectric conversion. In the semiconductor diode manufacturing process, for some special applications, the electrode leads on both sides of the semiconductor diode are bent using a bending device according to the application requirements.

[0003] In the prior art, a pin bending device for electronic diode production, with publication number "CN220444911U", places the electronic diode in a first placement groove, fixes the diode by the gravity of the cover plate, and rotates the threaded rod by a turntable to adjust the angle between the placement plate and the connecting seat by means of a limit rod, a connecting shaft and a rotating block, thereby adapting to the bending of diode pins at different angles. Then, the slider slides along the slide groove away from the bending seat, and presses the connecting plate during the sliding process to drive the pressure block to bend the diode pins.

[0004] However, the above technical solutions and existing technologies have the following drawbacks:

[0005] Although this bending device can bend the diode leads, the operation steps are cumbersome and the bending convenience is not good. In addition, the device only relies on the weight of the cover plate to fix the diode, which is not a good way to fix the diode in actual use. As a result, the diode is prone to displacement during the bending process, and the bending stability needs to be further improved. Utility Model Content

[0006] The purpose of this invention is to provide a pin bending device for semiconductor diode production, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A lead bending device for semiconductor diode production includes an operating table, a semiconductor diode body, and leads to be bent. Multiple semiconductor diode bodies are placed on top of the operating table, and leads to be bent are provided at both ends of the semiconductor diode bodies. A bending assembly is provided on the upper surface of the operating table, and the bending assembly is used to bend the leads to be bent downwards. A blocking assembly is provided inside the bending assembly, and the blocking assembly is used to block and limit the semiconductor diode bodies during the bending process.

[0009] Preferably, the bending assembly includes a supporting mold, a bending stop strip, a limiting groove, a lower pressing side plate, a connecting plate, an electro-hydraulic push rod, a support frame, a connecting rod, a blocking ring, a compression spring, and a limiting pressure plate. The supporting mold is installed on the upper surface of the operating platform. The bending stop strip is symmetrically and fixedly connected to the front and rear ends of the supporting mold. A limiting groove is formed on the upper surface of the supporting mold, and the front-to-back length of the inner wall of the limiting groove is the same as the front-to-back length of the semiconductor diode. A support frame is fixedly connected to the rear side of the upper surface of the operating platform. An electro-hydraulic push rod is installed on the front side of the upper end of the support frame. A connecting plate is installed at the lower end of the electro-hydraulic push rod. Lower pressing side plates are symmetrically connected to the front and rear sides of the lower end of the connecting plate. Connecting rods are symmetrically inserted and installed on the left and right sides inside the connecting plate. A compression spring is fitted on the annular side of the connecting rod. A limiting pressure plate is connected to the bottom of the connecting rod. A blocking ring is fitted on the upper side of the annular side of the connecting rod.

[0010] Preferably, the blocking assembly includes a blocking rod, a support plate, a lifting electric push rod, a limiting cavity, and a through hole. The lower end face of the supporting mold has a limiting cavity. The lifting electric push rod is installed in the middle of the limiting cavity. The upper end of the lifting electric push rod is installed with a support plate. The upper end face of the support plate has blocking rods symmetrically arranged on the left and right sides. The supporting mold has through holes symmetrically opened on the left and right sides.

[0011] Preferably, there are two sets of blocking rods, and the two sets of blocking rods are of the same specification. The distance between the two sets of blocking rods is the same as the lateral length of the seven sets of semiconductor diodes. The through hole matches the blocking rod, and the limiting cavity matches the support plate.

[0012] Preferably, the upper surface of the connecting plate has symmetrically provided limit holes on the left and right sides, and the limit holes match the connecting rod. The bottom of the pressing side plate is semi-circular, and the cross-sectional shape of the bending stop strip is semi-circular.

[0013] Preferably, a limiting rod is connected to the rear side of the upper end face of the connecting plate, and the limiting rod is inserted inside the support frame. An anti-slip silicone sheet is adhered to the lower end face of the limiting pressure plate, and the lateral length of the limiting pressure plate is the same as the lateral length of the six sets of semiconductor diodes.

[0014] Preferably, a rectangular cavity is provided on the left side of the upper surface of the operating table, a collection box is inserted below the rectangular cavity, and a storage box is placed on the right side of the upper surface of the operating table.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. By controlling the electric hydraulic push rod to drive the connecting plate to descend, the connecting plate can drive the lower pressure plate to descend together. At the same time, the connecting plate will also drive the limiting pressure plate to descend synchronously through the connecting rod and compression spring. The descending limiting pressure plate will first contact and press and fix the multiple semiconductor diodes below. The connecting plate will drive the lower pressure plate to continue to descend, pressing down on the leads to be bent at both ends of the multiple semiconductor diodes simultaneously. The bending is convenient. In this process, the bending stop will make the leads to be bent more smoothly when they are pressed down by the lower pressure plate. The compression spring will be continuously compressed, so that the downward pressure of the limiting pressure plate will gradually increase, thereby preventing the semiconductor diodes from swaying or shifting up and down, thus ensuring the stability of the leads to be bent.

[0017] 2. By controlling the lifting electric push rod to drive the blocking rods on both sides to extend upward through the support plate, the multiple semiconductor diodes in the limiting groove can be laterally limited, preventing the semiconductor diodes from rolling laterally during the bending process, thereby further improving the stability of the bending of the pin. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0019] Figure 2 This is a structural diagram of the bending and blocking components in this utility model;

[0020] Figure 3 This is a schematic diagram of the explosion state of the connecting plate and the limiting pressure plate in this utility model;

[0021] Figure 4 This is a partial structural diagram of the blocking component in this utility model;

[0022] Figure 5 This is a structural diagram of the supporting mold in this utility model.

[0023] In the diagram: 1. Operating table; 11. Rectangular cavity; 12. Collection box; 13. Storage box; 2. Semiconductor diode body; 3. Lead to be bent; 41. Support mold; 42. Bending stop bar; 43. Limiting groove; 44. Lower pressure side plate; 45. Connecting plate; 451. Limiting through hole; 46. Electro-hydraulic push rod; 47. Limiting rod; 48. Support frame; 49. Connecting rod; 411. Blocking ring; 412. Compression spring; 413. Limiting pressure plate; 414. Anti-slip silicone sheet; 51. Blocking rod; 52. Support plate; 53. Lifting electric push rod; 54. Limiting cavity; 55. Through hole. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1-5 This utility model provides a technical solution:

[0026] Example 1:

[0027] A lead bending device for semiconductor diode production includes an operating table 1, a semiconductor diode body 2, and leads 3 to be bent. Multiple semiconductor diode bodies 2 of the same specification are placed on the operating table 1. Leads 3 to be bent are provided at both ends of the semiconductor diode body 2. Since the internal detailed structure and working principle of the semiconductor diode body 2 and the leads 3 to be bent are relatively mature technologies in the prior art, they will not be described in detail here. A bending assembly is provided on the upper surface of the operating table 1. The bending assembly is used to bend the leads 3 downward. A blocking assembly is provided inside the bending assembly. The blocking assembly is used to block and limit the semiconductor diode body 2 during the bending process to prevent the semiconductor diode body 2 from rolling laterally during the bending process.

[0028] The bending assembly includes a support mold 41, a bending stop 42, a limiting groove 43, a lower pressing side plate 44, a connecting plate 45, an electro-hydraulic push rod 46, a support frame 48, a connecting rod 49, a blocking ring 411, a compression spring 412, and a limiting pressure plate 413. The support mold 41 is installed on the upper surface of the operating table 1. The support mold 41 can support the semiconductor diode body 2 and the lead 3 to be bent. The bending stop 42 is symmetrically and fixedly connected to the front and rear ends of the support mold 41. The bending stop 42 and the support mold 41 are an integral structure. The bending stop 42 has a semi-circular cross-sectional shape. 42 makes the bending of the pin 3 to be bent smoother during the bending process by the pressing side plate 44. A limiting groove 43 is opened on the upper end face of the supporting mold 41, and the front and back length of the inner wall of the limiting groove 43 is the same as the front and back length of the semiconductor diode body 2. The vertical depth of the limiting groove 43 is the vertical distance between the lower side of the annular side of the pin 3 to be bent and the lower side of the annular side of the semiconductor diode body 2. The limiting groove 43 can not only limit the front and rear end faces of the semiconductor diode body 2, but also make the lower side of the annular side of the pin 3 to be bent fit exactly with the upper end face of the supporting mold 41 after the semiconductor diode body 2 is placed in the limiting groove 43.

[0029] A support frame 48 is fixedly connected to the rear side of the upper end face of the operating table 1. The support frame 48 is connected to the operating table 1 by welding. The support frame 48 can support the electric hydraulic push rod 46. The electric hydraulic push rod 46 is installed on the front side of the upper end face of the support frame 48. The electric hydraulic push rod 46 is electrically connected to the controller on the front side of the upper end face of the operating table 1 through the wire. When working, the electric hydraulic push rod 46 can drive the connecting plate 45 to rise and fall. A limit rod 47 is connected to the rear side of the upper end face of the connecting plate 45. The limit rod 47 is inserted inside the support frame 48. The bottom of the limit rod 47 is connected to the connecting plate 45 by welding. The limit rod 47 will follow the rise and fall of the connecting plate 45 to limit it, so as to prevent the connecting plate 45 from shaking or deviating during the raising and lowering process.

[0030] A non-slip silicone sheet 414 is attached to the lower end face of the limiting pressure plate 413. The non-slip silicone sheet 414 prevents hard contact between the limiting pressure plate 413 and the semiconductor diode body 2, which would cause the semiconductor diode body 2 to deform during the pressing process by the limiting pressure plate 413. A rectangular cavity 11 is provided on the left side of the upper end face of the operating table 1. A collection box 12 is inserted below the rectangular cavity 11. The rectangular cavity 11 facilitates the worker to push the semiconductor diode body 2 after the upper end face of the support mold 41 is bent to the left into the collection box 12, so that the worker can transfer the bent semiconductor diode body 2 in a centralized manner later. A storage box 13 is placed on the right side of the upper end face of the operating table 1. The width of the inner wall of the storage box 13 is greater than the total length of the semiconductor diode body 2 plus the lead 3 to be bent. The storage box 13 can store multiple semiconductor diode bodies 2 to be bent, so that the worker can easily bend the semiconductor diode bodies 2.

[0031] The lower end of the electric hydraulic push rod 46 is equipped with a connecting plate 45, which can support the pressing side plate 44. The pressing side plate 44 is symmetrically connected to the front and rear sides of the lower end of the connecting plate 45. The pressing side plate 44 and the connecting plate 45 are an integral structure. The distance between the front and rear of the pressing side plate 44 is greater than the total length of the supporting fixed mold 41 plus the front and rear two sets of bending baffles 42. During the downward movement, the two sets of pressing side plates 44 will simultaneously press the front and rear sides of the pin 3 to be bent downward to a 90-degree angle. The bottom of the pressing side plate 44 is semi-circular. The semi-circular bottom of the pressing side plate 44 will not scratch the surface of the pin 3 to be bent when it comes into contact with it.

[0032] Connecting rods 49 are symmetrically installed on the left and right sides inside the connecting plate 45. The connecting rods 49 are connected to the limiting pressure plate 413 by welding. Limiting through holes 451 are symmetrically opened on the left and right sides of the upper end face of the connecting plate 45, and the limiting through holes 451 match the connecting rods 49. The limiting through holes 451 not only facilitate the insertion of the connecting rods 49 into the connecting plate 45, but also limit the connection plate 45 to prevent the connecting rods 49 from shaking or shifting during use. A compression spring 412 is fitted on the annular side of the connecting rods 49. The compression spring 412 provides elastic support to the connecting rods 49 so that the anti-slip silicone sheet 414 can be placed against the semiconductor. After the body diodes 2 come into contact, it will not hinder the connecting plate 45 from driving the downward pressing side plate 44 to continue moving downward. The bottom of the connecting rod 49 is connected to a limiting pressure plate 413. The lateral length of the limiting pressure plate 413 is the same as the lateral length of the six sets of semiconductor diodes 2. After descending a certain distance, the limiting pressure plate 413 can press and fix the multiple semiconductor diodes 2 in the limiting groove 43. A blocking ring 411 is fitted on the upper side of the annular side of the connecting rod 49. The blocking ring 411 can block and limit the downward extension range of the connecting rod 49 to prevent the connecting rod 49 from slipping during use. A high-strength bolt is installed inside the blocking ring 411. Figure 3 (As shown in the drawing), the high-strength bolts facilitate the installation of the retaining ring 411 by the installers.

[0033] Example 2:

[0034] Based on Embodiment 1, in this embodiment, by controlling the lifting electric push rod 53 to drive the blocking rods 51 on both sides to extend upward through the support plate 52, the multiple semiconductor diode bodies 2 in the limiting groove 43 can be laterally limited, so as to avoid the semiconductor diode bodies 2 from rolling laterally during the bending process of the lead 3 to be bent, thereby further improving the stability of the lead 3 to be bent.

[0035] The blocking assembly includes a blocking rod 51, a support plate 52, a lifting electric push rod 53, a limiting cavity 54, and a through hole 55. A limiting cavity 54 is provided on the lower end face of the supporting mold 41. The limiting cavity 54 matches the support plate 52. The limiting cavity 54 can not only limit the support plate 52, but also facilitate the use of the lifting electric push rod 53 in the middle position inside the supporting mold 41. The lifting electric push rod 53 is installed in the middle position inside the limiting cavity 54. The bottom of the lifting electric push rod 53 is installed on the upper end face of the operating table 1. The lifting electric push rod 53 is electrically connected to the controller on the front side of the upper end face of the operating table 1 through a wire. When working, the lifting electric push rod 53 can drive the support plate 52 to rise and fall.

[0036] A support plate 52 is installed on the upper end of the lifting electric push rod 53. The support plate 52 is connected to the blocking rod 51 by welding. The support plate 52 can support the blocking rod 51. The blocking rods 51 are symmetrically arranged on the left and right sides of the upper end face of the support plate 52. There are two sets of blocking rods 51, and the two sets of blocking rods 51 are the same in specifications. The distance between the two sets of blocking rods 51 is the same as the lateral length of the seven sets of semiconductor diode bodies 2. During use, the two sets of blocking rods 51 can block and limit the seven sets of semiconductor diode bodies 2 in the limiting groove 43 to prevent the seven sets of semiconductor diode bodies 2 from rolling laterally. The supporting fixed mold 41 has symmetrical through holes 55 on the left and right sides inside. The through holes 55 match the blocking rods 51. The through holes 55 facilitate the lifting and lowering of the blocking rods 51 inside the supporting fixed mold 41.

[0037] Working principle: During the production and processing of semiconductor diodes 2, this device is needed to bend the leads 3 on the front and rear end faces. The operator first places a storage box 13 filled with multiple semiconductor diodes 2 on the upper surface of the operating table 1. Then, the lifting electric push rod 53 is controlled to extend the blocking rods 51 on both sides upwards via the support plate 52. At this point, the semiconductor diodes 2 in the storage box 13 can be placed in the limiting groove 43 (see reference). Figure 1 After placing the required quantity, control the electric hydraulic push rod 46 to drive the connecting plate 45 to descend. The connecting plate 45 will drive the lower pressure side plate 44 to descend together. At the same time, the connecting plate 45 will also drive the limiting pressure plate 413 to descend synchronously through the connecting rod 49. During this process, the descending limiting pressure plate 413 will first contact the multiple semiconductor diode bodies 2 below and press and fix them. At this time, continue to control the connecting plate 45 to drive the lower pressure side plate 44 to descend, so that the lower pressure side plates 44 on both the front and rear sides can simultaneously press the bent pins 3 at both ends of the multiple semiconductor diode bodies 2 downward to bend to ninety degrees. At the same time, the bending stop 42 will make the bent pins 3 bend more smoothly during the bending process of the lower pressure side plate 44. The compression spring 412 will be continuously compressed, so that the downward pressure of the limiting pressure plate 413 will gradually increase, avoiding the semiconductor diode bodies 2 from swaying and displacing up and down, thereby ensuring the stability of the bent pins 3.

[0038] After the lead 3 to be bent is bent, the electric hydraulic push rod 46 is controlled to drive the lower pressure side plate 44 to rise to the initial position through the connecting plate 45. During this process, when the connecting plate 45 rises to contact the blocking ring 411, the limiting pressure plate 413 can be driven to rise together through the connecting rod 49. Then, the lifting electric push rod 53 and the cylinder support plate 52 are controlled to drive the blocking rods 51 on the left and right sides to descend until the top height of the blocking rod 51 is lower than the bottom height of the limiting groove 43. At this time, the multiple semiconductor diode bodies 2 after being bent in the limiting groove 43 can be pushed to the left, so that the multiple semiconductor diode bodies 2 fall through the rectangular cavity 11 into the collection box 12 for temporary storage, so that the staff can conveniently unload the bent semiconductor diode bodies 2. Then, the above operation can be repeated to bend the semiconductor diode bodies 2 in the storage box 13 again.

[0039] It should be noted that the circuits, electronic components, and electrical appliances involved in this utility model are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve improvements to the software and methods. At the same time, the power connection methods of each electrical device in this solution are existing mature technologies, which are well known to those skilled in the art, and will not be elaborated upon here.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A pin bending device for semiconductor diode production, comprising an operating table (1), a semiconductor diode body (2) and a pin to be bent (3), characterized in that: Multiple semiconductor diodes (2) are placed on the upper part of the operating table (1). Both ends of the semiconductor diodes (2) are provided with leads (3) to be bent. A bending assembly is provided on the upper surface of the operating table (1). The bending assembly is used to bend the leads (3) to be bent downwards. A blocking assembly is provided inside the bending assembly. The blocking assembly is used to block and limit the semiconductor diodes (2) during the bending process.

2. The pin bending device for semiconductor diode production according to claim 1, characterized in that: The bending assembly includes a support mold (41), a bending stop strip (42), a limiting groove (43), a lower pressing side plate (44), a connecting plate (45), an electric hydraulic push rod (46), a support frame (48), a connecting rod (49), a blocking ring (411), a compression spring (412), and a limiting pressure plate (413). The support mold (41) is installed on the upper surface of the operating table (1). The bending stop strip (42) is symmetrically and fixedly connected to the front and rear ends of the support mold (41). A limiting groove (43) is opened on the upper surface of the support mold (41), and the front and rear length of the inner wall of the limiting groove (43) is the same as the front and rear length of the semiconductor diode body (2). A support frame (48) is fixedly connected to the rear side of the upper end face of the operating table (1). An electric hydraulic push rod (46) is installed on the front side of the upper end face of the support frame (48). A connecting plate (45) is installed at the lower end of the electric hydraulic push rod (46). A pressing side plate (44) is symmetrically connected to the front and rear sides of the lower end face of the connecting plate (45). A connecting rod (49) is symmetrically inserted on the left and right sides inside the connecting plate (45). A compression spring (412) is fitted on the annular side of the connecting rod (49). A limit plate (413) is connected to the bottom of the connecting rod (49). A blocking ring (411) is fitted on the upper side of the annular side of the connecting rod (49).

3. The pin bending device for semiconductor diode production according to claim 2, characterized in that: The blocking assembly includes a blocking rod (51), a support plate (52), a lifting electric push rod (53), a limiting cavity (54), and a through hole (55). The lower end face of the supporting mold (41) has a limiting cavity (54). The lifting electric push rod (53) is installed in the middle of the limiting cavity (54). The upper end of the lifting electric push rod (53) is installed with a support plate (52). The upper end face of the support plate (52) has blocking rods (51) symmetrically arranged on the left and right sides. The supporting mold (41) has through holes (55) symmetrically opened on the left and right sides.

4. The pin bending device for semiconductor diode production according to claim 3, characterized in that: The blocking rod (51) is provided in two sets, and the two sets of blocking rods (51) are of the same specification. The distance between the two sets of blocking rods (51) is the same as the lateral length of the seven sets of semiconductor diode bodies (2). The through hole (55) matches the blocking rod (51), and the limiting cavity (54) matches the support plate (52).

5. The pin bending device for semiconductor diode production according to claim 2, characterized in that: The upper end face of the connecting plate (45) is symmetrically provided with limiting through holes (451) on the left and right sides, and the limiting through holes (451) are matched with the connecting rod (49). The bottom of the pressing side plate (44) is semi-circular, and the cross-sectional shape of the bending baffle (42) is semi-circular.

6. The pin bending device for semiconductor diode production according to claim 2, characterized in that: The upper end face of the connecting plate (45) is connected to a limiting rod (47), and the limiting rod (47) is inserted inside the support frame (48). The lower end face of the limiting pressure plate (413) is bonded with an anti-slip silicone sheet (414). The lateral length of the limiting pressure plate (413) is the same as the lateral length of the six sets of semiconductor diode bodies (2).

7. The pin bending device for semiconductor diode production according to claim 1, characterized in that: A rectangular cavity (11) is provided on the left side of the upper end face of the operating table (1), a collection box (12) is inserted below the rectangular cavity (11), and a storage box (13) is placed on the right side of the upper end face of the operating table (1).

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