Support device and laser cutting apparatus
By designing a material and waste support mechanism for the support device, the problem of waste adhering to the product during laser cutting was solved, achieving high-quality cutting results.
CN224444907UActive Publication Date: 2026-07-03SUNWODA ELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUNWODA ELECTRONICS CO LTD
- Filing Date
- 2025-06-18
- Publication Date
- 2026-07-03
AI Technical Summary
Technical Problem
When laser-cutting PET film products, waste materials and products may melt and stick together, resulting in a decrease in product quality, especially the formation of burrs at the holes.
Method used
A support device is designed, including a material support mechanism and a waste support mechanism. The support member of the waste support mechanism reciprocates at the discharge hole to support or release the waste, prevent the waste from overturning, and avoid over-melting and sticking.
Benefits of technology
It effectively prevents waste material from flipping over, avoids the generation of burrs at the product cutting position, and improves product quality.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224444907U_ABST
Abstract
This application relates to the field of processing equipment, and in particular to a support device and laser cutting equipment. The support device includes a material support mechanism and a waste support mechanism. The material support mechanism includes a material support component with a support surface to support the material to be cut. The material support component has a discharge hole, and the inlet of the discharge hole is located on the support surface. The waste support mechanism includes a support portion installed at the discharge hole. The support portion of the waste support mechanism can reciprocate relative to the discharge hole, so that the support portion is flush with or recessed relative to the support surface, thereby supporting or releasing the waste. The support device provided in this application, by setting the waste support mechanism, can lift and support the waste from the discharge hole during the cutting process, preventing the waste from flipping and moving downwards relative to the material to be cut. This avoids the problem of over-melting and connecting during laser cutting caused by the waste flipping, thereby preventing burrs from forming at the cutting position of the product and improving product quality.
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