Cooling device for a laser head

Abstract

The utility model relates to cooling device technical field, concretely is a kind of cooling device for laser head, including heat-conducting substrate, be provided with circulating heat dissipation component in heat-conducting substrate;The circulating heat dissipation component includes the heat-conducting groove being opened in heat-conducting substrate, the heat-conducting groove is S-shaped arrangement, the outside of heat-conducting substrate is fixedly connected with circulating cooling pump, the output end of circulating cooling pump is fixedly connected with output pipe, the output pipe is fixedly connected with the liquid distribution pipe of being connected in communication in the end away from circulating cooling pump. In the utility model, through the setting of circulating heat dissipation component, and through the heat exchange of cooling liquid along heat-conducting groove circulation flow, and by multiple shunt pipe respectively through different position and lead into heat-conducting groove, make cooling liquid evenly distribute to each microchannel, avoid the heat dissipation dead angle caused by flow shortage in local, and through the setting of heat-conducting component, the heat generated by laser head can be quickly guided to heat-conducting substrate.

Description

Technical Field

[0001] This utility model relates to the field of cooling device technology, and in particular to a cooling device for a laser head. Background Technology

[0002] A laser cutting machine focuses a laser beam emitted from a laser source into a high-power-density beam through an optical path system. This beam irradiates the workpiece surface, causing it to reach its melting or boiling point. Simultaneously, high-pressure gas coaxial with the beam blows away the molten or vaporized metal. As the relative position of the beam and the workpiece moves, a kerf is formed in the material, achieving the cutting purpose. Laser cutting uses an invisible beam instead of a traditional mechanical blade, offering advantages such as high precision, fast cutting speed, no limitation on cutting patterns, automatic layout to save material, smooth cuts, and low processing costs. It is gradually improving upon or replacing traditional metal cutting equipment.

[0003] Regarding the aforementioned technologies, the existing cooling devices have the following drawbacks: they directly blow air onto the heat dissipation components of the laser head (such as laser diodes and resonant cavities) by a fan, resulting in limited heat dissipation capacity and an inability to meet the heat dissipation requirements of medium- and high-power laser heads. Therefore, this utility model provides a cooling device for laser heads. Utility Model Content

[0004] The purpose of this application is to provide a cooling device for laser heads, in order to solve the problem in the prior art that the heat dissipation capacity of directly blowing air onto the heat dissipation components (such as laser diodes and resonant cavities) of the laser head by a fan is limited and cannot meet the heat dissipation requirements of medium and high power laser heads.

[0005] To achieve the above objectives, this application provides the following technical solution: a cooling device for a laser head, comprising a heat-conducting substrate, wherein a circulating heat dissipation assembly is disposed within the heat-conducting substrate; the circulating heat dissipation assembly includes a heat-conducting groove formed within the heat-conducting substrate, the heat-conducting groove being S-shaped, a circulating cooling pump being fixedly connected to the outer side of the heat-conducting substrate, an output pipe being fixedly connected to the output end of the circulating cooling pump, a liquid distribution pipe being fixedly connected to the end of the output pipe away from the circulating cooling pump, a plurality of interconnected diversion pipes being fixedly connected to the outer side of the liquid distribution pipe, the diversion pipes passing through the heat-conducting substrate, the plurality of diversion pipes extending to a plurality of corners of the heat-conducting groove, and a heat-conducting assembly being disposed on the outer side of the heat-conducting substrate.

[0006] Preferably, the heat conduction assembly includes a laser head disposed on the outside of the heat conduction substrate, and a heat conduction pipe is disposed on the outside of the heat conduction substrate, with the heat conduction pipe partially covering the outside of the laser head.

[0007] Preferably, the return end of the circulating cooling pump is fixedly connected to a return pipe, and the end of the return pipe away from the circulating cooling pump passes through the heat-conducting substrate.

[0008] Preferably, the end of the return pipe away from the circulating cooling pump is connected to the heat-conducting groove, and the liquid distribution pipe is fixedly connected to the heat-conducting substrate.

[0009] Preferably, a pair of mounting plates are fixedly connected to the outer side of the thermally conductive substrate, and a plurality of miniature cooling fans are fixedly connected to the outer side of the mounting plates.

[0010] Preferably, a pair of heat dissipation fins are fixedly connected to the outer side of the thermally conductive substrate, and grooves are provided on both sides of the heat dissipation fins, with the miniature cooling fan facing the heat dissipation fins.

[0011] In summary, the technical effects and advantages of this utility model are as follows:

[0012] In this invention, a circulating heat dissipation component is set up, and the coolant circulating along the heat conduction groove exchanges heat with it. Multiple diversion pipes are introduced into the heat conduction groove at different positions, so that the coolant is evenly distributed to each microchannel, avoiding heat dissipation dead zones caused by insufficient flow in some areas. Furthermore, the heat conduction component can quickly guide the heat generated by the laser head to the heat conduction substrate. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a first-view axial side view of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the second-view axial side structure of the present invention;

[0016] Figure 3 This is a schematic diagram of the structure of the diversion tube in this utility model;

[0017] Figure 4 for Figure 3 A magnified structural diagram at point A.

[0018] In the diagram: 1. Laser head; 2. Thermal conductive substrate; 3. Mounting plate; 4. Circulating cooling pump; 5. Output pipe; 6. Liquid distribution pipe; 7. Return pipe; 8. Miniature cooling fan; 9. Heat dissipation fins; 10. Groove; 11. Thermal conductive heat pipe; 12. Thermal conductive groove; 13. Diverter pipe. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] Example: Reference Figure 1-4The cooling device for a laser head shown includes a thermally conductive substrate 2. The thermally conductive substrate 2 serves as the core supporting component, providing a mounting base for the laser head 1 and various heat dissipation components. At the same time, it rapidly conducts the heat generated by the laser head 1 to the circulating heat dissipation component and the heat conduction component through its own high thermal conductivity.A circulating heat dissipation assembly is provided inside the thermally conductive substrate 2. This assembly includes a heat-conducting groove 12 formed within the substrate 2. The groove 12 is S-shaped, which extends the flow path of the coolant within the substrate, increases heat exchange time, and improves heat dissipation efficiency. A circulating cooling pump 4 is fixedly connected to the outside of the thermally conductive substrate 2. The pump provides power for the coolant circulation, driving the coolant to flow continuously within the heat-conducting groove 12, ensuring uninterrupted heat dissipation. An output pipe 5 is fixedly connected to the output end of the pump 4, which transports the coolant from the pump to the distribution pipe 6, achieving directional coolant transfer. The end of the output pipe 5 furthest from the pump 4 is fixedly connected to the distribution pipe 6. Before the initial distribution of coolant, temporary storage and pressure stabilization are performed to ensure uniform subsequent distribution. Multiple interconnected distribution pipes 13 are fixedly connected to the outside of the distribution pipe 6. These distribution pipes 13 pass through the heat-conducting substrate 2 and extend to multiple corners of the heat-conducting groove 12, directly supplying coolant to these corners. This avoids heat dissipation blind spots caused by reduced flow rate at the corners, ensuring uniform heat dissipation in all areas of the heat-conducting groove 12. A heat-conducting component is installed on the outside of the heat-conducting substrate 2. This component includes a laser head 1 located on the outside of the heat-conducting substrate 2. The laser head 1 is the heat source of the device, and the heat generated during its operation needs to be dissipated promptly through a cooling device. Heat pipes 11 are also installed on the outside of the heat-conducting substrate 2. 1. Utilizing the phase change heat transfer principle, it has extremely high thermal conductivity. Partially covering the outside of the laser head 1, it can quickly absorb the concentrated heat on the surface of the laser head 1 and transfer the heat to the heat-conducting substrate 2. The return end of the circulating cooling pump 4 is fixedly connected to a return pipe 7. The return pipe 7 guides the coolant, after heat exchange, from the heat-conducting tank 12 back to the circulating cooling pump 4, forming a complete circulation loop. The end of the return pipe 7 away from the circulating cooling pump 4 passes through the heat-conducting substrate 2. The end of the return pipe 7 away from the circulating cooling pump 4 is connected to the heat-conducting tank 12, allowing the heated coolant to flow back smoothly. The liquid distribution pipe 6 is fixedly connected to the heat-conducting substrate 2, enhancing the installation stability of the liquid distribution pipe 6 and preventing the pipe from falling off due to vibration. The outside of the heat-conducting substrate 2 is fixedly connected to... A pair of mounting plates 3 provide mounting points for the miniature cooling fans 8, ensuring stable operation of the cooling fans. Multiple miniature cooling fans 8 are fixedly connected to the outside of the mounting plates 3. The miniature cooling fans 8 generate directional airflow, accelerating the airflow around the heat dissipation fins 9 and promoting the diffusion of heat to the external environment. A pair of heat dissipation fins 9 are fixedly connected to the outside of the heat-conducting substrate 2. The heat dissipation fins 9 increase the heat dissipation area, quickly dissipating the heat conducted by the heat-conducting substrate 2 into the air. Grooves 10 are provided on both sides of the heat dissipation fins 9. The grooves 10 can increase the contact area between the fins and the air, and at the same time guide the airflow to flow evenly between the fins. The miniature cooling fans 8 face the heat dissipation fins 9 to ensure that the fan-out airflow directly acts on the heat dissipation fins 9, improving heat dissipation efficiency.

[0022] The working principle of this utility model is as follows: The heat from the laser head 1 is quickly directed to the heat-conducting substrate 2 via the heat pipe 11. The circulating cooling pump 4 controls the coolant to be introduced into the distribution pipe 6 through the output pipe 5, and then into the heat-conducting groove 12 through multiple branch pipes 13 at different positions, so that the coolant is evenly distributed to each microchannel, avoiding heat dissipation dead zones caused by insufficient flow in some areas. The heat-conducting groove 12 is S-shaped to extend the flow path of the coolant in the water-cooling head (such as a spiral pipe), increasing the heat absorption time. The coolant is returned to the circulating cooling pump 4 through the return pipe 7. Multiple heat dissipation fins 9 enhance the heat dissipation effect of the heat-conducting substrate 2. The heat dissipation fins 9 are blown by a micro heat dissipation fan 8 to accelerate the heat dissipation effect.

[0023] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. Cooling device for a laser head comprising a thermally conductive substrate (2), characterized in that: A circulating heat dissipation component is provided inside the thermally conductive substrate (2); The circulating heat dissipation assembly includes a heat-conducting groove (12) formed in the heat-conducting substrate (2). The heat-conducting groove (12) is S-shaped. A circulating cooling pump (4) is fixedly connected to the outside of the heat-conducting substrate (2). An output pipe (5) is fixedly connected to the output end of the circulating cooling pump (4). A liquid distribution pipe (6) is fixedly connected to the end of the output pipe (5) away from the circulating cooling pump (4). A plurality of connected diversion pipes (13) are fixedly connected to the outside of the liquid distribution pipe (6). The diversion pipes (13) pass through the heat-conducting substrate (2). The plurality of diversion pipes (13) extend to a plurality of corners of the heat-conducting groove (12). A heat-conducting component is provided on the outside of the heat-conducting substrate (2).

2. The cooling device for a laser head according to claim 1, wherein: The heat conduction assembly includes a laser head (1) disposed on the outside of the heat conduction substrate (2), and a heat conduction pipe (11) is disposed on the outside of the heat conduction substrate (2), with the heat conduction pipe (11) partially covering the outside of the laser head (1).

3. The cooling device for a laser head according to claim 2, wherein: The return end of the circulating cooling pump (4) is fixedly connected to a return pipe (7), and the end of the return pipe (7) away from the circulating cooling pump (4) passes through the heat-conducting substrate (2).

4. A cooling device for a laser head according to claim 3, characterized in that: The end of the return pipe (7) away from the circulating cooling pump (4) is connected to the heat-conducting tank (12), and the liquid distribution pipe (6) is fixedly connected to the heat-conducting substrate (2).

5. The cooling device for a laser head according to claim 4, wherein: A pair of mounting plates (3) are fixedly connected to the outside of the heat-conducting substrate (2), and a plurality of miniature heat dissipation fans (8) are fixedly connected to the outside of the mounting plates (3).

6. A cooling device for a laser head according to claim 5, characterized in that: A pair of heat dissipation fins (9) are fixedly connected to the outside of the heat-conducting substrate (2). Grooves (10) are provided on both sides of the heat dissipation fins (9), and the miniature heat dissipation fan (8) faces the heat dissipation fins (9).

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