A positioning mechanism compatible with multi-specification bonding wire boards

Abstract

This utility model provides a positioning mechanism compatible with multiple specifications of bonded crystal wire boards. The positioning mechanism includes a supporting component, a first positioning component, and a second positioning component. The supporting component includes a positioning base plate and a limiting plate. The bonded crystal wire plastic board is placed on the positioning base plate. The limiting plate is located at a first end of the positioning base plate, the first positioning component is located at a second end of the positioning base plate, and the second positioning component is located at a third end of the positioning base plate. The first and second ends are positioned opposite each other, and the third end is located between the first and second ends. This positioning mechanism compatible with multiple specifications of bonded crystal wire boards can achieve positioning of the bonded crystal wire plastic board before bonding. Through the cooperation of the limiting plate, the first positioning component, and the second positioning component, the bonded crystal wire plastic board can be accurately positioned for robot gripping. Since the first and second positioning components can be adjusted in position, this positioning mechanism compatible with multiple specifications of bonded crystal wire plastic boards is applicable to various specifications of bonded crystal wire plastic boards.

Description

Technical Field

[0001] This application relates to the field of photovoltaic silicon wafer production equipment technology, and in particular to a positioning mechanism for multi-specification crystal bonding wire plates. Background Technology

[0002] Currently, the main processes in the photovoltaic silicon wafer industry for silicon wafer slicing are: silicon rod arrival - rod bonding - slicing - debinding - cleaning - sorting - packaging and shipping. Among them, in the rod bonding process, when bonding plastic sheets, robots are used to pick up the plastic sheets from the storage rack and place them on the crystal tray for bonding.

[0003] In the existing placement method, plastic boards are placed on the storage rack manually. Because it is done manually, there is no accurate positioning, resulting in a messy placement of the plastic boards. This causes the robot to grab the plastic boards inaccurately, making it impossible to accurately place the plastic boards and control their shape.

[0004] Therefore, it is necessary to design a positioning mechanism compatible with multi-specification die bonding boards to solve the above problems. Utility Model Content

[0005] In view of this, in order to overcome the shortcomings of the prior art, this utility model provides a positioning mechanism compatible with multi-specification bonding wire boards, which effectively solves the problem that the existing plastic board placement method does not accurately position the plastic board, resulting in inaccurate gripping position when the robot grips the plastic board.

[0006] According to a first aspect of this utility model, a positioning mechanism compatible with multi-specification bonding wire boards is provided for positioning bonding wire plastic boards before gluing. The positioning mechanism includes a support component, a first positioning component, and a second positioning component. The support component includes a positioning base plate and a limiting plate. The bonding wire plastic board is placed on the positioning base plate. The limiting plate is disposed at a first end of the positioning base plate. The first positioning component is disposed at a second end of the positioning base plate. The second positioning component is disposed at a third end of the positioning base plate. The first and second ends are disposed opposite to each other, and the third end is disposed between the first and second ends.

[0007] Preferably, the positioning base plate has a first waist-shaped hole, and the limiting plate is positioned in the first waist-shaped hole by means of a first moving component and a fixing component.

[0008] Preferably, the first moving component includes a longitudinal moving member and a lateral limiting member, the longitudinal moving member passing through the limiting plate and disposed in the first waist-shaped hole, and the lateral limiting member passing through the fixing component and connected to the limiting plate.

[0009] Preferably, there are multiple first moving components, which are spaced apart at the first end of the positioning base plate.

[0010] Preferably, the second end of the positioning base plate is provided with a first moving groove, and the first positioning component includes a first driving member, a first telescopic rod and a first positioning plate. The first driving member is disposed at the bottom of the positioning base plate, and the two ends of the first telescopic rod are respectively connected to the first positioning plate and the first driving member. The first driving member drives the first telescopic rod to extend and retract so that the first positioning plate moves in the first moving groove.

[0011] Preferably, there are multiple first positioning components, which are spaced apart at the second end of the positioning base plate.

[0012] Preferably, the third end of the positioning base plate is provided with a second moving groove. The second positioning component includes a second driving member, a second telescopic rod, and a second positioning plate. The second driving member is disposed at the bottom of the positioning base plate. The two ends of the second telescopic rod are respectively connected to the second positioning plate and the second driving member. The second driving member drives the second telescopic rod to extend and retract so that the second positioning plate moves within the second moving groove.

[0013] Preferably, a limit stop pin is provided at the fourth end of the positioning base plate, and the fourth end is disposed opposite to the second end.

[0014] Preferably, a positioning sensor is provided on the side of the limiting pin, and a second oblong hole is provided on the positioning base plate, wherein the positioning sensor is movably disposed in the second oblong hole.

[0015] Preferably, the positioning mechanism for the multi-specification bonding wafer board further includes a mounting bracket, the positioning base plate is disposed on the top of the mounting bracket, and the positioning base plate is disposed on the production line body through the mounting bracket.

[0016] According to the multi-specification bonding wire board positioning mechanism of this utility model, the positioning of the bonding wire plastic board before gluing can be achieved through the cooperation of the bearing component, the first positioning component and the second positioning component; through the cooperation of the limiting plate, the first positioning component and the second positioning component, the bonding wire plastic board can be accurately positioned on the positioning base plate, so as to facilitate the robot's gripping. At the same time, since the first positioning component and the second positioning component can adjust their positions, this multi-specification bonding wire board positioning mechanism can be applied to bonding wire plastic boards of various specifications.

[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a multi-specification die bonding board positioning mechanism according to an embodiment of the present invention is shown.

[0020] Figure 2 A bottom view of a multi-specification die bonding board positioning mechanism according to an embodiment of the present invention is shown.

[0021] Figure 3 A partial structural schematic diagram of a positioning mechanism for a multi-specification bonding wire plate according to an embodiment of the present invention is shown.

[0022] Figure 4 A partial bottom view of a positioning mechanism for a multi-specification bonding wire plate according to an embodiment of the present invention is shown.

[0023] Figure 5 A schematic diagram of the longitudinal moving member and the lateral limiting member according to an embodiment of the present invention is shown.

[0024] Reference numerals: 1- Adhesive wire plastic plate; 201- Positioning base plate; 202- Limiting plate; 203- First end; 204- Second end; 205- Third end; 206- Fourth end; 207- First oblong hole; 208- Longitudinal moving component; 209- Lateral limiting component; 210- Fixing component; 211- First moving groove; 212- Second moving groove; 213- Limiting stop pin; 214- Second oblong hole; 215- Material sensor; 3- First positioning component; 301- First driving component; 302- First telescopic rod; 303- First positioning plate; 4- Second positioning component; 401- Second driving component; 402- Second telescopic rod; 403- Second positioning plate; 5- Position sensor; 6- Mounting bracket. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] In the description of the embodiments of this application, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but can be slightly tilted.

[0028] In the description of the embodiments of this application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] According to the present invention, a positioning mechanism compatible with multi-specification bonding wire boards is provided, such as... Figures 1 to 5 As shown, the multi-specification bonding wire board positioning mechanism is used for positioning the bonding wire plastic board 1 before gluing. The multi-specification bonding wire board positioning mechanism includes a bearing component, a first positioning component 3, and a second positioning component 4.

[0030] In the following description, reference will be made to Figures 1 to 5 The detailed structure of the bearing component, the first positioning component 3, and the second positioning component 4 of the multi-specification bonding wire board positioning mechanism is described in detail.

[0031] like Figures 1 to 4 As shown, in this embodiment, the supporting component includes a positioning base plate 201 and a limiting plate 202. The bonding wire plastic plate 1 is placed on the positioning base plate 201. The bonding wire plastic plate 1 can be manually placed on the positioning base plate 201, and is automatically fixed and limited on the positioning base plate 201 by the first positioning component 3 and the second positioning component 4, so as to facilitate subsequent robot grasping.

[0032] Furthermore, the positioning base plate 201 is formed as a cuboid plate, which may include four ends: a first end 203, a second end 204, a third end 205, and a fourth end 206. The first end 203 and the second end 204 can be understood as the two ends of the cuboid plate in the width direction, and the third end 205 and the fourth end 206 can be understood as the two ends of the cuboid plate in the length direction. A limiting plate 202 is disposed at the first end 203 of the positioning base plate 201, a first positioning component 3 is disposed at the second end 204 of the positioning base plate 201, and a second positioning component 4 is disposed at the third end 205 of the positioning base plate 201. The limiting plates 202, the first positioning component 3, and the second positioning component 4, provided on different ends of the positioning base plate 201, can respectively limit the position of the bonding plastic sheet 1 placed on the positioning base plate 201. This allows the bonding plastic sheet 1 to be precisely repositioned before the adhesiveing ​​operation, ensuring that the position of the bonding plastic sheet 1 when gripped is relatively accurate, thereby guaranteeing the accurate shape and position of the bonding plastic sheet 1 when placed. Furthermore, since the first positioning component 3 and the second positioning component 4 are adjustable components, this bonding plastic sheet positioning mechanism can be applied to bonding plastic sheets 1 of various specifications. In this embodiment, it can, for example, be compatible with plastic sheets of various specifications with widths ranging from 104mm to 210mm and lengths from 830mm to 860mm.

[0033] This multi-specification compatible crystal wire bonding board positioning mechanism, through the cooperation of the bearing component, the first positioning component 3 and the second positioning component 4, can achieve the positioning of the crystal wire bonding plastic board 1 before bonding; through the cooperation of the limiting plate 202, the first positioning component 3 and the second positioning component 4, the crystal wire bonding plastic board 1 can be accurately positioned on the positioning base plate 201, so as to facilitate the robot's gripping. At the same time, since the first positioning component 3 and the second positioning component 4 can adjust their positions, this multi-specification compatible crystal wire bonding board positioning mechanism can be applied to crystal wire bonding plastic boards 1 of various specifications.

[0034] Preferably, such as Figures 3 to 5As shown, in this embodiment, the first end 203 of the positioning base plate 201 has a first oblong hole 207, and the limiting plate 202 is adjustablely positioned in the first oblong hole 207 via a first moving component and a fixing component 210. The position of the limiting plate 202 on the positioning base plate 201 is adjustable to accommodate plastic sheets 1 with different widths of bonding wires. The fixing component 210 may include, for example, a fixing plate and fastening bolts. The fixing plate is used for the insertion of the lateral limiting member 209 described below, and the fixing plate is fixedly installed on the first end 203 of the positioning base plate 201 by the fastening bolts.

[0035] Preferably, such as Figures 3 to 5 As shown, in this embodiment, the first moving component may include a longitudinal moving member 208 and a lateral limiting member 209. The longitudinal moving member 208 passes through the limiting plate 202 and is disposed in the first oblong hole 207. The lateral limiting member 209 passes through the fixing component 210 and is connected to the limiting plate 202. The longitudinal moving member 208 may be, for example, an adjusting bolt, which, by cooperating with the first oblong hole 207, adjusts the position of the limiting plate 202 on the positioning base plate 201. The lateral limiting member 209 may be, for example, a positioning bolt, which can limit the limiting plate 202 and prevent displacement.

[0036] Preferably, such as Figures 3 to 5 As shown, in this embodiment, in order to achieve accurate positioning and ensure the stability of the connection, there are multiple first moving components, which are spaced apart on the first end 203 of the positioning base plate 201. In this embodiment, there are two first moving components, which are respectively disposed at both ends of the limiting plate 202.

[0037] Preferably, such as Figures 1 to 4 As shown in the embodiment, the second end 204 of the positioning base plate 201 has a first moving groove 211. The first positioning component 3 may include a first driving member 301, a first telescopic rod 302, and a first positioning plate 303. The first driving member 301 is disposed at the bottom of the positioning base plate 201. The two ends of the first telescopic rod 302 are respectively connected to the first positioning plate 303 and the first driving member 301. The first driving member 301 drives the first telescopic rod 302 to extend and retract, so that the first positioning plate 303 moves within the first moving groove 211. The first driving member 301 and the first telescopic rod 302 can be understood as a cylinder structure or an electric telescopic rod structure, etc. Driven by a cylinder or motor, the telescopic rod can extend or retract. The first positioning plate 303 moves within the first moving groove 211 driven by the first telescopic rod 302, thereby pushing the bonding plastic plate 1 located on the positioning base plate 201.

[0038] Preferably, such as Figures 1 to 4As shown, in this embodiment, there are multiple first positioning components 3, which are spaced apart and arranged at the second end 204 of the positioning base plate 201. Because the second end 204 of the positioning base plate 201 is relatively long, multiple first positioning components 3 are used to ensure that the bonding wire plastic plate 1 is pushed into place. In this embodiment, there are two first positioning components 3.

[0039] Preferably, such as Figures 1 to 4 As shown in the embodiment, the third end 205 of the positioning base plate 201 is provided with a second moving groove 212. The second positioning component 4 may include a second driving member 401, a second telescopic rod 402, and a second positioning plate 403. The second driving member 401 is disposed at the bottom of the positioning base plate 201. The two ends of the second telescopic rod 402 are respectively connected to the second positioning plate 403 and the second driving member 401. The second driving member 401 drives the second telescopic rod 402 to extend and retract, so that the second positioning plate 403 moves within the second moving groove 212. The second driving member 401 and the second telescopic rod 402 can be understood as a cylinder structure or an electric telescopic rod structure, etc. Driven by a cylinder or motor, the telescopic rod can extend or retract. The second positioning plate 403 moves within the second moving groove 212 driven by the second telescopic rod 402, thereby pushing the adhesive crystal wire plastic plate 1 located on the positioning base plate 201.

[0040] Preferably, such as Figures 1 to 4 As shown, in this embodiment, a limiting pin 213 is provided at the fourth end 206 of the positioning base plate 201, and the fourth end 206 is disposed opposite to the second end 204. The limiting pin 213 is used to limit the position of the bonding wire plastic plate 1 at the fourth end 206 to ensure accurate positioning.

[0041] Preferably, such as Figures 1 to 4 As shown, in this embodiment, a positioning sensor 5 and a material sensor 215 are provided on the side of the limiting pin 213. The positioning sensor 5 is used to determine whether the bonding plastic plate 1 is correctly positioned, and the material sensor 215 is used to determine whether the bonding plastic plate 1 is placed on the mechanism. The positioning base plate 201 has a second oblong hole 214, and the positioning sensor 5 is movably disposed in the second oblong hole 214.

[0042] Preferably, such as Figure 1 and Figure 2 As shown, in this embodiment, the multi-specification compatible die bonding wire positioning mechanism further includes a mounting bracket 6, with a positioning base plate 201 disposed on top of the mounting bracket 6. The positioning base plate 201 is mounted on the production line body via the mounting bracket 6. The production line body can be, for example, a production line of a photovoltaic silicon wafer production device, and the multi-specification compatible die bonding wire is mounted on the production line body via the mounting bracket 6.

[0043] The operation of this multi-specification bonding wire board positioning mechanism is as follows: Before use, the operator adjusts the position of the limiting plate 202 on the positioning base plate 201 according to the specifications of the bonding wire plastic board 1, and limits it using the lateral limiting member 209. During operation, the loading robot picks up the bonding wire plastic board 1 and places it on the positioning base plate 201. The material sensor 215 detects the bonding wire plastic board 1 and feeds the signal back to the PLC controller. The PLC controller outputs a command to activate the second driving member 401, which pushes the bonding wire plastic board 1 to the limiting stop pin 213 via the second positioning plate 403, after which the second positioning plate 403 resets. After the operation is completed, the PLC controller outputs a command to activate the two first driving members 301, which push the bonding wire plastic board 1 to the limiting plate 202 via the two first positioning plates 303, after which the two first positioning plates 303 reset. Finally, the sensor 5 transmits the output signal after the plastic plate 1 of the bonding line is blocked to the PLC controller. The PLC controller sends an instruction to the loading robot, and the robot picks up the plastic plate 1 of the bonding line and places it on the crystal tray of the line for bonding.

[0044] This multi-specification compatible crystal wire bonding board positioning mechanism, through the cooperation of the bearing component, the first positioning component, and the second positioning component, can achieve the positioning of the crystal wire bonding plastic board before gluing. Through the cooperation of the limiting plate, the first positioning component, and the second positioning component, the crystal wire bonding plastic board can be accurately positioned on the positioning base plate, so as to facilitate the robot's gripping. At the same time, since the first positioning component and the second positioning component can adjust their positions, this multi-specification compatible crystal wire bonding board positioning mechanism can be applied to crystal wire bonding plastic boards of various specifications.

[0045] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the technical scope disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A multi-specification compatible die-bonding line plate positioning mechanism for positioning a die-bonding line plastic plate before die-bonding adhesive application, characterized in that, The multi-specification bonding wire board positioning mechanism includes a support component, a first positioning component, and a second positioning component. The support component includes a positioning base plate and a limiting plate. The bonding wire plastic board is placed on the positioning base plate. The limiting plate is located at the first end of the positioning base plate. The first positioning component is located at the second end of the positioning base plate. The second positioning component is located at the third end of the positioning base plate. The first end and the second end are positioned opposite each other. The third end is located between the first end and the second end.

2. The multi-specification die bonding line board positioning mechanism according to claim 1, wherein The positioning base plate has a first waist-shaped hole, and the limiting plate is positioned in the first waist-shaped hole by means of a first moving component and a fixing component.

3. The multi-specification die bonding tape board positioning mechanism according to claim 2, wherein, The first moving component includes a longitudinal moving member and a lateral limiting member. The longitudinal moving member passes through the limiting plate and is disposed in the first waist-shaped hole. The lateral limiting member passes through the fixing component and is connected to the limiting plate.

4. The multi-specification die bonding tape board positioning mechanism according to claim 2, wherein, The number of the first moving components is multiple, and the multiple first moving components are disposed at intervals at the first end of the positioning base plate.

5. The multi-specification die bonding line board positioning mechanism according to claim 1, wherein The second end of the positioning base plate is provided with a first moving groove. The first positioning component includes a first driving member, a first telescopic rod and a first positioning plate. The first driving member is disposed at the bottom of the positioning base plate. The two ends of the first telescopic rod are respectively connected to the first positioning plate and the first driving member. The first driving member drives the first telescopic rod to extend and retract so that the first positioning plate moves in the first moving groove.

6. The multi-specification die bonding tape board positioning mechanism according to claim 5, wherein, The number of the first positioning components is multiple, and the multiple first positioning components are disposed at intervals at the second end of the positioning base plate.

7. The multi-specification die bonding line board positioning mechanism according to claim 1, wherein The third end of the positioning base plate is provided with a second moving groove. The second positioning component includes a second driving member, a second telescopic rod and a second positioning plate. The second driving member is disposed at the bottom of the positioning base plate. The two ends of the second telescopic rod are respectively connected to the second positioning plate and the second driving member. The second driving member drives the second telescopic rod to extend and retract so that the second positioning plate moves in the second moving groove.

8. The multi-specification die bonding line board positioning mechanism according to claim 1, wherein The fourth end of the positioning base plate is provided with a limit stop pin, and the fourth end is positioned opposite to the second end.

9. The multi-specification die bonding line board positioning mechanism according to claim 8, wherein A positioning sensor is provided on the side of the limiting pin, and a second oblong hole is provided on the positioning base plate. The positioning sensor is movably disposed in the second oblong hole.

10. The multi-specification die bonding line board positioning mechanism according to claim 1, wherein The positioning mechanism for the multi-specification bonding wafer board also includes a mounting bracket, and the positioning base plate is disposed on the top of the mounting bracket. The positioning base plate is disposed on the production line body through the mounting bracket.

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