Clean seamless steel pipe for semiconductor

Abstract

This utility model relates to the field of seamless steel pipe technology, and more particularly to a clean seamless steel pipe for semiconductors. The technical solution includes a seamless steel pipe body and a limiting ring. The limiting ring is located at the end of the seamless steel pipe body. A post is fixedly installed on the lower surface of the limiting ring, and the post is located inside the seamless steel pipe body. An annular groove is provided on the outer surface of the post, and a sealing ring is provided inside the annular groove. A groove is provided on the upper surface of the post, and an air valve is fixedly connected to the bottom of the inner wall of the groove. A quick connector is fixedly connected to the end of the air valve. This utility model facilitates sealing both ends of the steel pipe during transportation, transfer, and handling of the clean seamless steel pipe for semiconductors, thereby preventing dust and other impurities from entering and reducing the cleanliness of the steel pipe's interior and increasing the roughness of the inner wall.

Description

Technical Field

[0001] This utility model relates to the field of seamless steel pipe technology, specifically a clean seamless steel pipe for semiconductors. Background Technology

[0002] Semiconductor-grade clean seamless steel tubing is a high-end tubing material specifically developed for semiconductor manufacturing environments. Made of high-quality stainless steel through high-precision cold drawing or cold rolling processes, the tubing wall is seamless and has no weld joints, eliminating the risk of impurity leakage at the source. Its inner wall roughness is extremely low (Ra≤0.2μm), and through precision treatments such as electrolytic polishing and passivation, the surface cleanliness reaches Class 100 or higher, effectively inhibiting metal ion precipitation and particulate matter adhesion. It also has excellent corrosion resistance and pressure resistance. In ultra-clean workshop scenarios such as wafer manufacturing and packaging testing, it can ensure the stability and purity of media transmission, making it a key basic component of semiconductor equipment and process pipeline systems.

[0003] Currently, during the transportation, transfer, and handling of clean seamless steel pipes used in semiconductors, dust and other impurities can easily enter the interior from both ends of the steel pipe, reducing the cleanliness of the inside of the steel pipe. At the same time, it can also easily cause wear and tear on the inner wall of the steel pipe, increasing its roughness. To address this, we propose a clean seamless steel pipe for semiconductors. Utility Model Content

[0004] The purpose of this utility model is to provide a clean seamless steel pipe for semiconductors. During the transportation, transfer, and handling of the clean seamless steel pipe for semiconductors, both ends of the pipe can be easily sealed to prevent dust and other impurities from entering and reducing the cleanliness of the pipe's interior, as well as increasing the roughness of the inner wall. This solves the problem that currently, during the transportation, transfer, and handling of clean seamless steel pipes for semiconductors, dust and other impurities easily enter the interior from both ends of the pipe, reducing the cleanliness of the pipe's interior and also easily causing wear and tear on the inner wall, thus increasing roughness.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a clean seamless steel tube for semiconductors, comprising a seamless steel tube body and a limiting ring, wherein the limiting ring is located at the end of the seamless steel tube body, an insert post is fixedly installed on the lower surface of the limiting ring and the insert post is located inside the seamless steel tube body, an annular groove is provided on the outer surface of the insert post and a sealing ring is provided inside the annular groove, a groove is provided on the upper surface of the insert post, an air valve is fixedly connected to the bottom of the inner wall of the groove, and a quick connector is fixedly connected to the end of the air valve.

[0006] Preferably, the lower surface of the insertion post has a chamfer near the edge, which facilitates the insertion of the insertion post into the seamless steel pipe body.

[0007] Preferably, a horizontal plate is fixedly installed inside the limiting ring, and the insert can be inserted into or pulled out of the seamless steel pipe body by holding the horizontal plate.

[0008] Preferably, a connecting port is provided at the bottom of the inner wall of the groove, and an arched diaphragm is fixedly installed at the bottom of the inner wall of the groove above the connecting port. During the process of removing air from the seamless steel pipe body, the pressure difference between the inside and outside of the seamless steel pipe body will cause the arched diaphragm to deform towards the connecting port. When the arched diaphragm becomes a concave diaphragm, the removal of air from the seamless steel pipe body should be stopped to avoid excessive vacuum inside the seamless steel pipe body, which would cause deformation of the seamless steel pipe body.

[0009] Preferably, a protective membrane tube is fixedly sleeved on the outer surface of the seamless steel pipe body. During transportation, transfer and handling, the protective membrane tube can prevent wear or scratches on the surface of the seamless steel pipe body.

[0010] Preferably, the protective membrane tube has a flange at its end, and the flange contacts the end of the seamless steel pipe body. The flange is then clamped between the end of the seamless steel pipe body and the limiting ring, which can effectively prevent rainwater and other substances from seeping into the space between the protective membrane tube and the seamless steel pipe body.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] 1. This utility model, by setting up a seamless steel pipe body, a limiting ring, an insert post, an annular groove, a groove, an air valve, and a quick connector, achieves the effect of easily sealing both ends of the steel pipe during the transportation, transfer, and handling of clean seamless steel pipes for semiconductors. This prevents dust and other impurities from entering and reducing the cleanliness of the steel pipe's interior and increasing the roughness of the inner wall. The insert post is inserted into the interior of the seamless steel pipe body from one end. The sealing ring seals the insert post and the inner wall of the seamless steel pipe body. The quick connector connects to the suction end of the air pump. After opening the air valve, the air pump removes the air from inside the seamless steel pipe body. Then, closing the air valve fixes the insert post and the limiting ring to the end of the seamless steel pipe body through the pressure difference between the inside and outside of the seamless steel pipe body. This effectively prevents dust and other impurities from entering the interior of the seamless steel pipe body during transportation, transfer, and handling. When the seamless steel pipe body needs to be used, opening the air valve connects the interior of the seamless steel pipe body to the outside, allowing the insert post to be removed from inside the seamless steel pipe body.

[0013] 2. This utility model achieves the effect of avoiding deformation of the seamless steel pipe body due to excessive vacuum inside by setting a connecting port and an arched diaphragm. During the process of removing air from the seamless steel pipe body, the pressure difference between the inside and outside of the seamless steel pipe body will cause the arched diaphragm to deform towards the connecting port. When the arched diaphragm becomes a concave diaphragm, the removal of air from the seamless steel pipe body should be stopped to avoid deformation of the seamless steel pipe body due to excessive vacuum inside the seamless steel pipe body.

[0014] 3. By using a protective membrane tube, this utility model can prevent wear or scratches on the surface of the seamless steel pipe during transportation, transfer and handling. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a partial three-dimensional cross-sectional view of the limiting ring of this utility model;

[0017] Figure 3 This utility model Figure 2 A magnified structural diagram of A in the middle;

[0018] Figure 4 This is a partial three-dimensional cross-sectional view of the main body of the seamless steel pipe of this utility model.

[0019] Reference numerals: 1. Seamless steel pipe body; 2. Protective membrane tube; 3. Limiting ring; 4. Insert post; 5. Chamfer; 6. Air valve; 7. Quick connector; 8. Groove; 9. Horizontal plate; 10. Arched diaphragm; 11. Connecting port; 12. Annular groove; 13. Sealing ring; 14. Flanged edge. Detailed Implementation

[0020] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0021] Example 1

[0022] like Figures 1-3As shown, this utility model proposes a clean seamless steel tube for semiconductors, including a seamless steel tube body 1 and a limiting ring 3. The limiting ring 3 is located at the end of the seamless steel tube body 1. The outer diameter of the limiting ring 3 is larger than the inner diameter of the seamless steel tube body 1 but smaller than the outer diameter of the seamless steel tube body 1. An insertion post 4 is fixedly installed on the lower surface of the limiting ring 3 and is located inside the seamless steel tube body 1. A chamfer 5 is provided on the lower surface of the insertion post 4 near the edge to facilitate the insertion post 4 into the seamless steel tube body 1. An annular groove 12 is provided on the outer surface of the insertion post 4, and a sealing ring 13 is provided inside the annular groove 12. A groove 8 is provided on the upper surface of the insertion post 4. An air valve 6 is fixedly connected to the bottom of the inner wall of the groove 8. The air valve 6 communicates with the interior of the seamless steel tube body 1, and a quick connector 7 is fixedly connected to the end of the air valve 6. Both the air valve 6 and the quick connector 7 are located inside the groove 8. A horizontal plate 9 is fixedly installed inside the limiting ring 3. The insertion post 4 can be inserted into or pulled out of the seamless steel tube body 1 by holding the horizontal plate 9.

[0023] In use, the insert 4 is inserted into the interior of the seamless steel pipe body 1 from the end of the seamless steel pipe body 1. The sealing ring 13 seals the insert 4 and the inner wall of the seamless steel pipe body 1. The quick connector 7 is connected to the suction end of the air pump. After opening the air valve 6, the air pump removes the air from the interior of the seamless steel pipe body 1. Then, the air valve 6 is closed, and the insert 4 and the limiting ring 3 are fixed to the end of the seamless steel pipe body 1 by the pressure difference between the inside and outside of the seamless steel pipe body 1. This effectively prevents dust and other impurities from entering the interior of the seamless steel pipe body 1 during transportation, transfer, and handling, thus avoiding the reduction of the cleanliness of the interior of the seamless steel pipe body 1 and the increase of the roughness of the inner wall of the seamless steel pipe body 1 due to the entry of dust and other impurities. When the seamless steel pipe body 1 needs to be used, the air valve 6 is opened to connect the interior of the seamless steel pipe body 1 with the outside, and the insert 4 can be removed from the interior of the seamless steel pipe body 1.

[0024] Example 2

[0025] like Figure 1 and Figure 2 As shown, the present invention proposes a clean seamless steel tube for semiconductors. Compared with the first embodiment, this embodiment further includes a connecting port 11 at the bottom of the inner wall of the groove 8, and an arched diaphragm 10 fixedly installed at the bottom of the inner wall of the groove 8 above the connecting port 11. The arched diaphragm 10 is made of rubber-like elastic material.

[0026] In this embodiment, during the process of removing air from the interior of the seamless steel pipe body 1, the pressure difference between the inside and outside of the seamless steel pipe body 1 will cause the arched diaphragm 10 to deform toward the connecting port 11. When the arched diaphragm 10 becomes a concave diaphragm, the removal of air from the interior of the seamless steel pipe body 1 should be stopped to avoid excessive vacuum inside the seamless steel pipe body 1, which would cause deformation of the seamless steel pipe body 1.

[0027] Example 3

[0028] like Figure 1 and Figure 4 As shown, the present invention proposes a clean seamless steel tube for semiconductors. Compared with Embodiment 1, this embodiment further includes a protective membrane tube 2 fixedly sleeved on the outer surface of the seamless steel tube body 1. The end of the protective membrane tube 2 is provided with a flange 14, and the flange 14 contacts the end of the seamless steel tube body 1. The flange 14 is clamped between the end of the seamless steel tube body 1 and the limiting ring 3, which can effectively prevent rainwater and other substances from seeping into the space between the protective membrane tube 2 and the seamless steel tube body 1.

[0029] In this embodiment, during transportation, transfer and handling, the protective membrane tube 2 can prevent wear or scratches on the surface of the seamless steel pipe body 1.

[0030] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A clean seamless steel pipe for semiconductor use, comprising a seamless steel pipe main body (1) and a stop ring (3), characterized by: The limiting ring (3) is located at the end of the seamless steel pipe body (1). A plug (4) is fixedly installed on the lower surface of the limiting ring (3), and the plug (4) is located inside the seamless steel pipe body (1). An annular groove (12) is provided on the outer surface of the plug (4), and a sealing ring (13) is provided inside the annular groove (12). A groove (8) is provided on the upper surface of the plug (4). An air valve (6) is fixedly connected to the bottom of the inner wall of the groove (8), and a quick connector (7) is fixedly connected to the end of the air valve (6).

2. The clean seamless steel tube for semiconductor according to claim 1, characterized by: The lower surface of the insert (4) is provided with a chamfer (5) near the edge.

3. The clean seamless steel tube for semiconductor according to claim 1, characterized by: A horizontal plate (9) is fixedly installed inside the limiting ring (3).

4. The clean seamless steel tube for semiconductor according to claim 1, characterized by: The bottom of the inner wall of the groove (8) is provided with a communication port (11), and an arched diaphragm (10) is fixedly installed at the bottom of the inner wall of the groove (8) above the communication port (11).

5. The clean seamless steel tube for semiconductor according to claim 1, characterized by: The outer surface of the seamless steel pipe body (1) is fixedly fitted with a protective membrane pipe (2).

6. A clean seamless steel tube for semiconductor use according to claim 5, characterized by: The protective membrane tube (2) has a flange (14) at its end, and the flange (14) is in contact with the end of the seamless steel pipe body (1).

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