A monitoring device and semiconductor manufacturing equipment

By installing a pressure detection device in semiconductor manufacturing equipment to monitor the clogging of the vaporizer in real time, the problem of traditional equipment being unable to detect vaporizer clogging in a timely manner is solved, thus achieving stable equipment operation and cost reduction.

CN224450843UActive Publication Date: 2026-07-03PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO LTD
Filing Date
2025-08-14
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

The lack of real-time monitoring methods in existing semiconductor manufacturing equipment leads to the failure to detect vaporizer blockages in a timely manner, resulting in equipment downtime, high maintenance costs, and significant production capacity losses.

Method used

A pressure detection device is installed between the flow controller and the vaporizer to monitor pressure changes in real time. The risk of vaporizer blockage is determined by the pressure changes, and timely warnings and cleaning are carried out.

Benefits of technology

It effectively extends the service life of the vaporizer, reduces operation and maintenance costs, minimizes downtime losses, and improves equipment operation stability and production capacity.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

This invention provides a monitoring device and semiconductor manufacturing equipment. The monitoring device includes a vaporizer and a flow controller. The flow controller is connected to the vaporizer via a pipeline. A pressure detection device is fixed between the downstream end of the flow controller and the inlet end of the vaporizer. The pressure detection device is used to detect pressure changes between the flow controller and the vaporizer. By fixing the pressure detection device between the downstream end of the flow controller and the inlet end of the vaporizer, this application can detect pressure changes between the downstream end of the flow controller and the vaporizer in real time. This allows for monitoring of the vaporizer's blockage risk through pressure changes, thereby solving the problem of traditional equipment lacking real-time monitoring and only being able to passively handle vaporizer failures. This effectively extends the service life of the vaporizer, reduces maintenance costs, and minimizes production capacity losses caused by downtime for replacement.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a monitoring device and semiconductor manufacturing equipment. Background Technology

[0002] In silica thin film deposition, the vaporizer plays a crucial role in converting liquid tetraethyl orthosilicate into a gaseous state. The converted gaseous material is then carried by a carrier gas into the reaction chamber to complete the thin film deposition. During the process, the mixture of tetraethyl orthosilicate under high temperature and pressure and the carrier gas (gas-liquid two-phase) flows through the capillary nozzle, where it undergoes a sudden pressure drop, resulting in instantaneous and complete vaporization. This step directly affects the vaporization efficiency of the raw materials and the stability of subsequent reactions.

[0003] However, after prolonged operation, particulate impurities tend to accumulate at the capillary nozzle of the vaporizer. If not cleaned promptly by purging, these impurities will continue to build up until they completely clog the capillary, causing the vaporizer to malfunction or even become unusable. Current equipment lacks real-time monitoring methods to address this issue; faults can only be detected and components replaced when the vaporizer is completely blocked, unable to complete the vaporization process, or when significant abnormalities occur in the process performance.

[0004] More importantly, clogged vaporizers are often too damaged to be repaired, resulting not only in direct economic losses of equipment parts, but also in production interruptions due to downtime for replacement, significantly reducing equipment capacity and severely restricting the continuity and stability of the process. Utility Model Content

[0005] Embodiments of this utility model provide a monitoring device and semiconductor manufacturing equipment to monitor the blockage of the vaporizer in real time, avoid affecting equipment operation, and reduce operation and maintenance costs.

[0006] This utility model provides a monitoring device, which includes:

[0007] Carburetor;

[0008] A flow controller is provided, which is connected to the vaporizer via a pipeline. A pressure detection device is fixed between the downstream end of the flow controller and the inlet end of the vaporizer. The pressure detection device is used to detect pressure changes between the flow controller and the vaporizer.

[0009] In the monitoring device provided by this utility model, the pressure detection device is fixedly installed on the pipeline between the flow controller and the vaporizer.

[0010] In the monitoring device provided by this utility model, the monitoring device further includes a diverting valve, which is fixed at one end of the pipeline near the vaporizer, and the pressure detection device is fixed on the pipeline between the diverting valve and the flow controller.

[0011] In the monitoring device provided by this utility model, the monitoring device further includes an atomic layer deposition valve, which is fixedly disposed at one end of the pipeline near the reaction chamber. The pipeline connects the reaction chamber and the flow controller. The pressure detection device is fixedly disposed between the flow controller and the diverting valve and is located upstream of the atomic layer deposition valve.

[0012] In the monitoring device provided by this utility model, the pressure detection device is fixedly connected to the pipeline through an IGS installation method or a VCR connector installation method.

[0013] In the monitoring device provided by this utility model, the pressure detection device is fixed at the outlet end of the flow controller.

[0014] In the monitoring device provided by this utility model, the flow controller includes an air outlet channel and a detection channel. The air outlet channel is connected to the pipeline, and the detection channel is connected to the air outlet channel and the pressure detection device.

[0015] In the monitoring device provided by this utility model, the flow controller includes a main body and a mounting base. The mounting base is fixedly disposed at the top of the outlet end of the main body. The mounting base is fixedly connected to the pressure detection device, and the mounting base is provided with the detection channel passing through both sides of it.

[0016] In the monitoring device provided by this utility model, the flow controller further includes a sealing element, which is fixed between the main body and the mounting base and surrounds the outside of the detection channel.

[0017] This utility model also provides a semiconductor manufacturing apparatus, which includes:

[0018] The monitoring device is any one of the monitoring devices described above.

[0019] This application improves the real-time detection of pressure changes between the downstream of the flow controller and the inlet of the vaporizer by fixing the pressure detection device between the downstream of the flow controller and the vaporizer. This allows the device to monitor the risk of blockage in the vaporizer by monitoring pressure changes, thus solving the problem of traditional equipment lacking real-time monitoring and only being able to passively handle the situation after the vaporizer fails. This effectively extends the service life of the vaporizer, reduces maintenance costs, and minimizes production capacity loss caused by downtime for replacement. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a layout diagram of the monitoring device in an embodiment of the present utility model;

[0022] Figure 2 This is a structural diagram of the flow controller in an embodiment of the present invention.

[0023] The labels for the attached figures are as follows:

[0024] 1. Flow controller; 11. Gas outlet channel; 12. Detection channel; 13. Main body; 14. Mounting base; 15. Seal; 2. Pressure detection device; 31. Diverting valve; 32. Atomic layer deposition valve; 33. Reaction chamber. Detailed Implementation

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0026] Reference Figures 1 to 2 The diagram illustrates an embodiment of the monitoring device and semiconductor manufacturing equipment of this invention. The monitoring device includes a vaporizer and a flow controller 1. The flow controller 1 is connected to the vaporizer via a pipeline. A pressure detection device 2 is fixed between the downstream end of the flow controller 1 and the inlet end of the vaporizer. The pressure detection device 2 is used to detect pressure changes between the flow controller 1 and the vaporizer.

[0027] Specifically, in semiconductor manufacturing equipment, thin film deposition is one of the core processes, mainly forming thin films through the chemical reaction of reactant gases. When the reactant gases are introduced into the reaction chamber, a vaporizer and a flow controller (MFC) are required to direct the gaseous reactant gases into the reaction chamber. However, current vaporizers are prone to clogging, and the equipment lacks reliable monitoring devices to detect the vaporizer's status. As a result, the fault can only be detected and components replaced when the vaporizer is completely blocked, unable to complete the vaporization process, or when significant abnormalities occur in the process performance. This increases maintenance costs and affects the operating efficiency of the equipment.

[0028] This application provides a monitoring device for monitoring whether the vaporizer is blocked, thereby providing real-time feedback on the vaporizer's status to reduce maintenance costs and improve equipment efficiency.

[0029] The monitoring device includes a vaporizer and a flow controller 1. The vaporizer is a "material conversion unit" whose inlet receives carrier gas regulated by the MFC and simultaneously receives liquid raw material (such as TEOS). Inside the vaporizer, the liquid raw material is heated and vaporized, mixing thoroughly with the carrier gas to form a gas-liquid mixture (or a gaseous mixture). At this time, the carrier gas acts as a "carrier," responsible for carrying the vaporized raw material gas through pipelines to the reaction chamber 33. The vaporizer is the key device for realizing the conversion of liquid raw material into gas. The vaporizer is a device that converts liquid raw material into gas by heating or pressure regulation, causing the liquid to vaporize under process conditions, providing gaseous raw material for subsequent reactions. The flow controller 1 is an MFC device and is the "flow control center" of the entire system. One end of the flow controller is connected to the carrier gas source or the reaction gas source, and the other end is connected to the inlet of the vaporizer through a pipeline or directly connected to the reaction chamber 33 through a pipeline. Its core function is to precisely regulate the flow rates of carrier gas and reactant gas, ensuring that the flow rate of carrier gas entering the vaporizer or the flow rate of reactant gas entering the reaction chamber 33 remains stable within the range set by the process.

[0030] The flow controller 1 is connected to the vaporizer via a pipeline. At the same time, the vaporizer is also connected to the reaction chamber 33 via a pipeline. The pipeline is a hollow channel connecting various devices and is used to transport gas or liquid, so that the system forms a continuous fluid path. This allows the carrier gas and the reaction gas to flow from the flow controller 1 into the pipeline. When the carrier gas flows along the pipeline into the vaporizer to mix with the reaction gas, the mixed reaction gas can finally flow from the outlet of the vaporizer through the pipeline into the reaction chamber 33 for reaction.

[0031] A pressure detection device 2 is fixedly installed between the downstream end of the flow controller 1 and the inlet end of the vaporizer. The downstream end of the flow controller 1 refers to the tail end of the flow controller 1, that is, near the outlet of the flow controller 1. In this embodiment, the pressure detection device 2 can be fixedly installed downstream of the flow controller 1 or on the pipeline between the flow controller 1 and the vaporizer, without limitation. The pressure detection device 2 is used to detect the pressure change between the flow controller 1 and the vaporizer, and can convert the pressure signal into a recognizable electrical signal or data to reflect the pressure change between the flow controller 1 and the vaporizer.

[0032] In the monitoring device, the flow controller 1 and the vaporizer form a tightly connected fluid passage through the pipeline. The flow controller 1 is responsible for regulating the fluid flow rate entering the vaporizer to ensure that the mixing ratio of raw material and carrier gas or the delivery volume of pure carrier gas meets the process requirements. To achieve accurate monitoring of the vaporizer's operating status, a pressure detection device 2 is fixedly installed downstream of the flow controller 1 and between the inlet end of the vaporizer. The pressure detection device 2 is connected to the interior of the flow controller 1 or the pipeline, thereby enabling real-time capture of the pressure values ​​in the flow controller 1 and the pipeline.

[0033] When the equipment is running normally, the flow controller 1 outputs a stable flow rate, and the fluid enters the vaporizer through the pipeline. At this time, the pressure value measured by the pressure detection device 2 remains within the preset normal range, indicating that the fluid flows smoothly in the pipeline and that there is no blockage in the inlet and internal channels (such as capillary nozzles) of the vaporizer.

[0034] If the vaporizer has been working for a long time, particulate impurities will begin to accumulate at the internal capillary nozzle, causing an increase in the resistance to fluid flow. In this case, with the output flow rate of the flow controller 1 remaining constant, the pressure between the downstream of the flow controller 1 and the inlet of the vaporizer will gradually increase. This is because the impurities hinder the fluid from entering the vaporizer, causing a certain degree of stagnation in the fluid downstream of the flow controller 1, and the pressure will rise accordingly.

[0035] The pressure detection device 2 can sensitively capture this pressure change and feed the data back to the control system in real time. By comparing the current pressure value with the normal pressure range, it can be determined whether there is a blockage trend inside the vaporizer: when the pressure value exceeds the normal range and continues to rise, it indicates that the blockage of the capillary nozzle is intensifying. At this time, the system can issue an early warning to prompt the operator to purge and clean in time to avoid further accumulation of impurities that could lead to complete blockage of the vaporizer.

[0036] Therefore, this application improves the real-time detection of pressure changes between the downstream of the flow controller 1 and the inlet of the vaporizer by fixing the pressure detection device 2 between the downstream of the flow controller 1 and the vaporizer. This allows the pressure detection device 2 to monitor the risk of blockage in the vaporizer by monitoring pressure changes, thereby solving the problem that traditional equipment lacks real-time monitoring and can only be dealt with passively after the vaporizer fails. This can effectively extend the service life of the vaporizer, reduce maintenance costs, and reduce production capacity loss caused by downtime for replacement.

[0037] In one embodiment, reference is made to Figure 1As shown, the pressure detection device 2 is fixedly installed on the pipeline between the flow controller 1 and the vaporizer. Specifically, the flow controller 1 and the vaporizer are connected through the pipeline to form a fluid delivery path. The fluid output by the flow controller 1 enters the vaporizer through the pipeline to complete the vaporization process. To achieve effective monitoring of the fluid state within the pipeline, the pressure detection device 2 is fixedly installed on the pipeline between the flow controller 1 and the vaporizer. Its installation position ensures direct communication with the inside of the pipeline, enabling accurate detection of pressure changes within this section of the pipeline.

[0038] The core function of this installation method is to monitor the pressure of the fluid in real time after it exits the flow controller 1 and before it enters the vaporizer. When the system is operating normally, the fluid flows smoothly in the pipeline, and the pressure value measured by the pressure detection device 2 is stable within a preset range, indicating that the flow controller 1 is outputting normally and that there are no abnormalities in the pipeline or the vaporizer inlet. If, due to long-term use, particulate impurities accumulate inside the vaporizer (such as in a capillary nozzle), the resistance to the fluid entering the vaporizer increases, and the pressure in the pipeline between the flow controller 1 and the vaporizer gradually increases, even if the output flow rate of the flow controller 1 remains unchanged. This is because the fluid cannot smoothly enter the vaporizer, forming a certain degree of stagnation in the pipeline, and the pressure rises accordingly.

[0039] Therefore, the pressure detection device 2, continuously installed on this critical section of pipeline, can sensitively detect such pressure changes and feed the data back to the control system in real time. By comparing the real-time pressure value with the normal pressure range, the control system can promptly determine whether the vaporizer is showing signs of blockage: when the pressure value exceeds the normal range and continues to rise, it indicates that the blockage is worsening, and the system can issue an early warning, prompting the operator to purge and clean the vaporizer to prevent complete blockage.

[0040] The choice of fixing the pressure detection device 2 on the pipeline between the flow controller 1 and the vaporizer ensures the accuracy of pressure detection and enables timely detection of problems in the early stages of a fault. This effectively solves the shortcomings of traditional equipment that lacks real-time monitoring and can only be dealt with passively after a fault occurs, providing a reliable guarantee for the stable operation of the equipment.

[0041] In a specific embodiment, refer to Figure 1As shown, the monitoring device also includes a diverting valve 31, which is fixedly installed at one end of the pipeline near the vaporizer. The pressure detection device 2 is fixedly installed on the pipeline between the diverting valve 31 and the flow controller 1. Specifically, to ensure the direction of gas flow, the monitoring device further includes the diverting valve 31, which is a control valve capable of changing the direction of fluid flow. Through internal channel switching, the fluid is directed to different downstream devices or pipelines.

[0042] If the process includes the vaporizer, the carrier gas regulated by the flow controller 1 will first enter the vaporizer, carrying the vaporized liquid raw material (such as TEOS) to form a mixed gas; if the vaporization step is not required, it will be directly delivered to the reaction chamber 33. The diverting valve 31, as a flow direction switching node, receives the gas from the flow controller 1 (or the vaporizer) and changes the flow direction according to process requirements: it can either guide the gas to the atomic layer deposition valve 32 or switch it to other paths (such as purge pipelines or backup reaction paths). Its core function is to achieve flexible gas distribution between different process stages, adapting to the alternating needs of complex processes such as stacked deposition.

[0043] To enable pressure monitoring of critical nodes, the pressure detection device 2 is fixed on the pipeline between the diverting valve 31 and the flow controller 1. This position is downstream of the fluid output from the flow controller 1 and upstream of the diverting valve 31, and can directly monitor the fluid pressure state before entering the diverting valve 31.

[0044] When the equipment is operating normally, the flow controller 1 outputs a stable flow of fluid, which flows through the pipeline to the pressure detection device 2. The measured pressure value is within a preset normal range, indicating that the fluid flows smoothly in the pipeline section from the flow controller 1 to the diverting valve 31. If the diverting valve 31 becomes clogged due to prolonged exposure to a highly polluted environment, or if the vaporizer or atomic layer deposition valve 32 connected to it experiences increased flow resistance, the pressure in the pipeline upstream of the diverting valve 31 will increase due to obstructed fluid flow, provided the output flow of the flow controller 1 remains constant. The pressure detection device 2 can capture this pressure change in real time and transmit the data to the control system. By comparing it with the normal pressure threshold, it can promptly determine whether the diverting valve 31 or downstream equipment is showing signs of blockage, such as whether the vaporizer is clogged.

[0045] Therefore, in this embodiment, the pressure detection device 2 is fixed between the flow controller 1 and the diverting valve 31, so that the pressure detection device 2 can monitor the pipeline status from the flow controller 1 to the diverting valve 31; and indirectly reflect the operating status of the diverting valve 31 and downstream related equipment, thereby determining whether the diverting valve 31 and the vaporizer are blocked, thus providing accurate data support for early warning of blockage risks and avoiding equipment failure, effectively improving the stability of system operation and the timeliness of maintenance.

[0046] In one embodiment, reference is made to Figure 1 As shown, the monitoring device also includes an atomic layer deposition valve 32, which is fixedly installed at one end of the pipeline near the reaction chamber 33. The pipeline connects the reaction chamber 33 and the flow controller 1. The pressure detection device 2 is fixed between the flow controller 1 and the diverting valve 31, and is located upstream of the atomic layer deposition valve 32. Specifically, the monitoring device also includes the atomic layer deposition valve 32, which is a valve used to precisely control the gas flow direction and on / off state. It is mainly used in the atomic layer deposition process and can quickly switch gas paths to ensure the interlayer accuracy of thin film deposition. Its flow capacity is usually characterized by the CV value (flow coefficient). The larger the CV value, the stronger the valve's flow capacity.

[0047] The atomic layer deposition valve 32 is fixed at one end of the pipeline near the reaction chamber 33. The reaction chamber 33 is a closed space for chemical reactions such as thin film deposition, providing the environmental conditions such as temperature and pressure required for the process. In addition to connecting the flow controller 1 and the vaporizer, the pipeline also connects the flow controller 1 and the reaction chamber 33.

[0048] In the stacked process, the atomic layer deposition valve 32 at the reaction chamber end is responsible for rapidly switching the gas flow direction. However, its flow coefficient decreases at high temperatures, and the decrease may be inconsistent, leading to uneven gas distribution and causing differences in the process performance of chambers A and B. At this time, the pressure detection device 2 is fixed between the flow controller 1 and the diverting valve 31, and is located upstream of the atomic layer deposition valve 32.

[0049] The atomic layer deposition valve 32 is fixedly installed at the end of the pipeline near the reaction chamber 33, directly controlling the on / off state and flow rate of gas entering the reaction chamber 33. It is the final control node before the gas enters the reaction chamber 33. The diverting valve 31 is connected to the pipeline system, and its position is usually located between the flow controller 1 and the atomic layer deposition valve 32. It can switch the gas flow direction according to process requirements, such as switching the gas path between different reaction steps or realizing a purging function. The pressure detection device 2 is fixed on the pipeline between the flow controller 1 and the diverting valve 31. It can monitor the pressure status between the flow controller 1 and the reaction chamber 33, and can also detect the performance of the atomic layer deposition valve 32 under specific operating conditions.

[0050] When the diverting valve 31 is closed, its branch is cut off, and the gas output from the flow controller 1 can only flow along the pipeline to the atomic layer deposition valve 32. At this time, the flow controller 1 outputs a stable set flow rate, and the pressure detection device 2 can monitor the pressure changes in the pipeline in real time. Since the CV value of the atomic layer deposition valve 32 decreases under high temperature conditions, the valve flow rate of the atomic layer deposition valve 32 decreases and the flow resistance increases. At this time, the pressure of the pressure detection device 2 increases. Based on this principle, the change in the CV value of the atomic layer deposition valve 32 can be fed back through the pressure value change of the pressure detection device 2.

[0051] Meanwhile, since the steering valve 31 and the atomic layer deposition valve 32 do not open simultaneously, when the steering valve 31 is closed, the atomic layer deposition valve 32 is open, and at this time the pressure detection device 2 detects the change in the CV value of the atomic layer deposition valve 32; when the steering valve 31 is open and the atomic layer deposition valve 32 is closed, the pressure detection device 2 detects the blockage of the steering valve 31 and the vaporizer.

[0052] This detection method requires no additional specialized equipment and can be achieved solely through the collaborative operation of existing system components. It can reflect the performance changes of the atomic layer deposition valve 32 under conditions such as high temperature in real time. When an abnormal decrease in CV value is detected or the difference in CV values ​​between different valves is too large, the system can issue an early warning in a timely manner, prompting maintenance or replacement, to avoid abnormal process performance in the reaction chamber 33 due to uneven gas distribution, thereby ensuring the stability of the process and the efficient operation of the equipment.

[0053] In a specific embodiment, the pressure detection device 2 is fixedly connected to the pipeline via either an IGS installation method or a VCR connector installation method (not shown in the figure). Specifically, the pressure detection device 2 is fixedly connected to the pipeline via either an IGS installation method or a VCR connector installation method. The IGS installation method is a connection method that achieves connection through an integrated gasket seal, relying on the elastic deformation of a special gasket to form a sealing surface, while bolts are used to secure the components. The VCR connector installation method is a connection method that uses a metal-face seal, consisting of a connector body, a nut, and a metal gasket. High-strength sealing is achieved through the compression of the metal gasket, suitable for high-pressure, high-cleanliness fluid systems.

[0054] In the monitoring device, the fixed connection between the pressure detection device 2 and the pipeline must simultaneously meet the requirements of sealing reliability and connection stability to ensure the accuracy of pressure detection and avoid measurement errors or fluid loss due to leakage. In practical applications, the installation method of IGS or VCR connector can be selected according to the process pressure, fluid properties, and cleanliness requirements.

[0055] In one embodiment, reference is made to Figure 2 As shown, the pressure detection device 2 is fixed to the outlet end of the flow controller 1. Specifically, by fixing the pressure detection device 2 to the outlet end of the flow controller 1, the pressure detection device 2 is added to the outlet end of the flow controller 1, making the pressure detection device 2 a part of the flow controller 1. This eliminates the need to add the pressure detection device 2 to the monitoring device, thus avoiding an increase in the size of the monitoring device and saving costs.

[0056] In a specific embodiment, refer to Figure 2 As shown, the flow controller 1 includes an outlet channel 11 and a detection channel 12. The outlet channel 11 is connected to the pipeline, and the detection channel 12 is connected to the outlet channel 11 and the pressure detection device 2. Specifically, the outlet channel 11 and the detection channel 12 are provided downstream of the flow controller 1, that is, the outlet end of the flow controller 1 is provided with the outlet channel 11 and the detection channel 12. The outlet channel 11 is used for gas discharge. The outlet channel 11 is connected to the pipeline, so that the gas located inside the flow controller 1 flows to the pipeline through the outlet channel 11, and then flows to the vaporizer or the reaction chamber 33.

[0057] The detection channel 12 is used to detect the pressure value downstream of the flow controller 1. One end of the detection channel 12 is connected to the gas outlet channel 11, and the other end is connected to the pressure detection device 2. That is, the detection channel 12 extends from the end connected to the gas outlet channel 11 toward the pressure detection device 2 and connects the gas outlet channel 11 and the pressure detection device 2, so that the pressure of the gas flowing out of the outlet of the flow controller 1 can be detected by the pressure detection device 2 through the detection channel 12.

[0058] Therefore, in this embodiment, by fixing the pressure detection device 2 at the outlet of the flow controller 1 and guiding the pressure into the pressure detection device 2 through the detection channel 12, the pressure detection device 2 can monitor the pressure changes downstream of the flow controller 1 in real time to determine the blockage status of the diverting valve 31, the vaporizer, and the CV value change of the atomic layer deposition valve 32, thereby avoiding affecting equipment operation, reducing maintenance costs, facilitating process window parameter adjustment, and extending service life.

[0059] In a specific embodiment, refer to Figure 2 As shown, the flow controller 1 includes a main body 13 and a mounting base 14. The mounting base 14 is fixedly mounted on the top of the outlet end of the main body 13. The mounting base 14 is fixedly connected to the pressure detection device 2, and the mounting base 14 has detection channels 12 extending through its two sides. Specifically, the flow controller 1 includes a main body 13 and a mounting base 14. The main body 13 is the core part of the flow controller 1, and contains components such as valves and sensors for adjusting flow rate, serving as a key carrier for realizing the flow control function. The mounting base 14 is a connecting component fixed to the main body 13, mainly used to connect the main body 13 and the pressure detection device 2, while also providing support and fixation.

[0060] The mounting base 14 is fixed to the top of the outlet end of the main body 13. In the structural design of this flow controller 1, the main body 13 serves as the core load-bearing component, and its internal air outlet channel 11 is responsible for guiding the regulated fluid to the outlet end, ensuring that the fluid is output stably at the set flow rate. To achieve real-time monitoring of the fluid pressure at the outlet end, the mounting base 14 is fixedly installed at the top of the outlet end of the main body 13. The mounting base 14 is firmly connected to the main body 13 by welding or bolt fastening, ensuring that it will not loosen due to fluid pressure or vibration during long-term use.

[0061] The mounting base 14 not only connects the pressure detection device 2, but also has a detection channel 12 running through both sides. One end of the detection channel 12 is connected to the air outlet channel 11 of the main body 13, and the other end is connected to the pressure detection device 2 fixed on the mounting base 14, forming a pressure transmission path from the air outlet channel 11 to the pressure detection device 2. When fluid flows from inside the main body 13 through the air outlet channel 11 to the outlet end, part of the fluid pressure is transmitted to the pressure detection device 2 through the detection channel 12. Since the detection channel 12 is directly connected to the air outlet channel 11, the pressure data measured by the pressure detection device 2 can accurately reflect the real-time pressure status of the fluid at the outlet end of the flow controller 1.

[0062] Therefore, in this embodiment, the pressure detection function is integrated with the main body of the flow controller 1. The integrated design of the mounting base 14 ensures both the stable installation of the pressure detection device 2 and the timely and accurate transmission of pressure signals through the precise connection of the detection channel 12. Simultaneously, the placement of the mounting base 14 at the top of the outlet avoids interference with the main fluid flow path. While achieving pressure monitoring, it does not affect the normal flow regulation performance of the flow controller 1. This allows the entire device to perform both flow control and pressure monitoring functions within a compact structure, providing reliable data support for the stable operation of the process system.

[0063] More specifically, the pressure detection device 2 is installed at the outlet of the solenoid valve of the flow controller 1, and a bypass is added at the outlet. The bypass outlet is a mounting surface (i.e., mounting base 14), and the pressure detection device 2 is mounted on the surface with screws.

[0064] In one embodiment, reference is made to Figure 2 As shown, the flow controller 1 also includes a seal 15, which is fixed between the main body 13 and the mounting base 14 and surrounds the outside of the detection channel 12. Specifically, the connection between the main body 13 and the mounting base 14 is a key point to prevent fluid leakage. The mounting base 14 is fixed to the top of the outlet end of the main body 13, and one end of the detection channel 12 inside it is connected to the air outlet channel 11 of the main body 13, and the other end is connected to the pressure detection device 2, forming a pressure transmission path. To prevent fluid from leaking from the connection gap between the main body 13 and the mounting base 14, affecting the pressure detection accuracy or causing process contamination, a seal 15 is provided between the main body 13 and the mounting base 14.

[0065] The sealing element 15 is firmly fixed between the mating surfaces of the main body 13 and the mounting base 14, and is arranged in a ring around the outside of the detection channel 12. This ring-shaped arrangement allows the sealing element 15 to completely surround the communication area between the detection channel 12 and the air outlet channel 11, forming a closed sealing barrier.

[0066] When the mounting base 14 is fastened to the main body 13 by bolts or other means, the sealing element 15 is subjected to uniform compression and undergoes elastic deformation, tightly filling the tiny gap between the two connecting surfaces and completely blocking the possibility of fluid leakage from the channel to the outside.

[0067] Therefore, in this embodiment, the sealing element 15 is installed between the main body 13 and the mounting base 14 to avoid the pressure value distortion in the detection channel 12 due to leakage, thereby ensuring the accuracy of pressure detection; it also prevents the pollution of the equipment environment caused by fluid leakage, so that the flow controller 1 can realize the dual functions of flow regulation and pressure monitoring while having reliable anti-leakage performance, providing an important guarantee for the safe and stable operation of the entire process system.

[0068] This embodiment also provides a semiconductor manufacturing equipment (not shown in the figure), which includes a monitoring device. The monitoring device can be any kind of monitoring device provided by this utility model. Since the specific structure and working principle of the monitoring device have been described in detail in the previous description, they will not be repeated here for the sake of brevity.

[0069] The semiconductor manufacturing equipment in this embodiment employs the monitoring device provided by this invention. This monitoring device has the function of real-time monitoring of the blockage status of the vaporizer and the diverting valve 31, as well as the CV value change of the atomic layer deposition valve 32. Therefore, when the vaporizer or the diverting valve 31 is blocked, faults can be detected and repaired in a timely manner, thereby reducing the operation and maintenance costs of the semiconductor manufacturing equipment, avoiding affecting the operation of the semiconductor manufacturing equipment, and thus improving the production capacity of the semiconductor manufacturing equipment. At the same time, it can also adjust the parameters of the semiconductor manufacturing equipment in a timely manner according to the CV value change of the atomic layer deposition valve 32, so as to avoid affecting the quality of thin film deposition.

[0070] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A monitoring device, characterized in that include: Carburetor; A flow controller is provided, which is connected to the vaporizer via a pipeline. A pressure detection device is fixed between the downstream end of the flow controller and the inlet end of the vaporizer. The pressure detection device is used to detect pressure changes between the flow controller and the vaporizer.

2. The monitoring device of claim 1, wherein, The pressure detection device is fixed on the pipeline between the flow controller and the vaporizer.

3. The monitoring device of claim 2, wherein, The monitoring device also includes a diverting valve, which is fixed at one end of the pipeline near the vaporizer, and the pressure detection device is fixed on the pipeline between the diverting valve and the flow controller.

4. The monitoring device of claim 3, wherein, The monitoring device also includes an atomic layer deposition valve, which is fixed at one end of the pipeline near the reaction chamber. The pipeline connects the reaction chamber and the flow controller. The pressure detection device is fixed between the flow controller and the diverting valve and is located upstream of the atomic layer deposition valve.

5. The monitoring device according to any of claims 1-4, characterized in that, The pressure detection device is fixedly connected to the pipeline via an IGS installation method or a VCR connector installation method.

6. The monitoring device of claim 1, wherein, The pressure detection device is fixed at the outlet end of the flow controller.

7. The monitoring device of claim 6, wherein, The flow controller includes an outlet channel and a detection channel. The outlet channel is connected to the pipeline, and the detection channel is connected to the outlet channel and the pressure detection device.

8. The monitoring device of claim 7, wherein, The flow controller includes a main body and a mounting base. The mounting base is fixedly disposed at the top of the outlet end of the main body. The mounting base is fixedly connected to the pressure detection device, and the mounting base is provided with the detection channel passing through both sides of it.

9. The monitoring device of claim 8, wherein, The flow controller also includes a seal fixed between the main body and the mounting base, and surrounding the outside of the detection channel.

10. A semiconductor production apparatus characterized by comprising: include: A monitoring device, wherein the monitoring device is the monitoring device according to any one of claims 1-9.