Steam treatment equipment for electroplating

Abstract

This utility model relates to a hot steam treatment device for electroplating, comprising: an electroplating sub-tank, an air filter, an exhaust fan, a heat pump unit, a first circulating water pump, and heat exchange pipelines. An exhaust port is provided at the opening of the electroplating sub-tank. The air filter is used to filter the gas output from the exhaust port. The heat pump unit is used to recover heat energy from the gas output from the exhaust port and cool the gas to a preset temperature before discharging it into the electroplating workshop. The heat pump unit uses the recovered heat energy to heat the liquid. The heat exchange pipelines are arranged in the main electroplating tank, and the liquid in the heat exchange pipelines circulates under the drive of the first circulating water pump and exchanges heat with the electroplating solution in the main electroplating tank. A heat energy recovery and utilization system for hot steam from the electroplating sub-tank is built around the heat pump unit, and the air filter is used to purify the hot steam, thereby solving the problems of rapid temperature rise and air pollution in the electroplating workshop caused by hot steam leakage.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to a hot steam treatment device for electroplating. Background Technology

[0002] In an electroplating workshop, the electroplating solution is stored in a master tank, which is equipped with a heat exchanger to heat and maintain the temperature of the electroplating solution (most electroplating solutions need to be maintained at around 60°C). During the electroplating operation, the electroplating solution in the master tank is pumped to the sub-tank where the specific electroplating process is performed, using a liquid pump.

[0003] A drawback of traditional electroplating workshops is that, although the sub-tanks, which serve as containers for specific electroplating processes, are generally equipped with flaps, the hot steam generated by the electroplating solution inside, which is at a higher temperature than room temperature, leaks out through the gap between the sub-tank and the flap. Furthermore, during electroplating operations, operators frequently need to open the flap to adjust the sub-tank, and when the flap is opened, a large amount of hot steam leaks out from the tank opening. This leaking hot steam not only causes a rapid rise in the temperature of the electroplating workshop but also severely pollutes the air within the workshop. Utility Model Content

[0004] Based on this, the present invention provides a hot steam treatment device for electroplating, which builds a heat energy recovery and utilization system for hot steam in electroplating sub-tanks with a heat pump unit as the core, and uses an air filter to purify the hot steam, thereby solving the problem of rapid temperature rise and air pollution in the electroplating workshop caused by hot steam leakage.

[0005] A hot steam treatment apparatus for electroplating processes, comprising:

[0006] Electroplating sub-tank; the electroplating sub-tank includes: a tank body and a hinged cover on the tank body; an exhaust vent is provided at the opening of the tank body, and the exhaust vent is located below the hinged cover;

[0007] An air filter is connected to the electroplating sub-tank; the air inlet of the air filter is connected to the exhaust port; the air filter is used to filter the gas output from the exhaust port to purify it.

[0008] An exhaust fan connected to an air filter; the air inlet of the exhaust fan is connected to the air outlet of the air filter; the exhaust fan is used to extract gas from the electroplating tank.

[0009] A heat pump unit is connected to an exhaust fan; the air inlet of the heat pump unit is connected to the air outlet of the exhaust fan; the heat pump unit is used to recover heat energy from the gas output from the exhaust fan and cool the gas to a preset temperature before discharging it into the electroplating workshop to achieve indoor cooling; at the same time, the heat pump unit uses the recovered heat energy to heat liquids.

[0010] The first circulating water pump is connected to the heat pump unit; the inlet of the first circulating water pump is connected to the outlet of the heat pump unit; and

[0011] A heat exchange pipeline is connected to the first circulating water pump; the inlet of the heat exchange pipeline is connected to the outlet of the first water pump, and the outlet of the heat exchange pipeline is connected to the inlet of the heat pump unit; the heat exchange pipeline is laid out in the electroplating mother tank, and the liquid in the heat exchange pipeline circulates under the drive of the first circulating water pump and exchanges heat with the electroplating solution in the electroplating mother tank to heat the electroplating solution.

[0012] In the aforementioned electroplating steam treatment device, during operation, the hot steam generated in the electroplating sub-tanks is first purified by an air filter under the action of an exhaust fan, and then transported to a heat pump unit for heat energy recovery. After heat energy recovery, the temperature of the hot steam decreases, and it is then blown as cool air into the electroplating workshop to lower the room temperature. Simultaneously, the heat pump unit uses the recovered heat energy to heat the liquid, and a first circulating water pump drives the liquid to circulate in the heat exchange pipeline. The heat exchange pipeline is located in the main electroplating tank. When the heated liquid flows through the main electroplating tank, it heats the electroplating solution in the main electroplating tank through heat exchange. Through this design, a heat energy recovery and utilization system for the hot steam from the electroplating sub-tanks is built with the heat pump unit as the core, and the hot steam is purified by an air filter, thereby solving the problems of rapid temperature rise and air pollution in the electroplating workshop caused by hot steam leakage.

[0013] In one embodiment, the air filter includes a removable filter element. The filter element effectively absorbs the electroplating solution from the hot vapor, and its removability facilitates replacement.

[0014] In one embodiment, the air filter also includes a removable activated carbon filter element. The filter element further enhances the adsorption of electroplating solutions in hot steam, and its removable design facilitates replacement.

[0015] In one embodiment, the electroplating hot steam treatment device further includes: a second circulating water pump and an insulated water tank connected between the heat pump unit and the first circulating water pump; the inlet of the second circulating water pump is connected to the outlet of the heat pump unit, and the outlet of the second circulating water pump is connected to the first inlet of the insulated water tank; the inlet of the insulated water tank is connected to the first outlet of the insulated water tank; the second outlet of the insulated water tank is connected to the inlet of the first circulating water pump, and the second inlet of the insulated water tank is connected to the outlet of the heat exchange pipeline; the insulated water tank is used to store and insulate the liquid output by the heat pump unit. The insulated water tank can store a large amount of high-temperature liquid, improving the operational stability of the heat exchange pipeline.

[0016] In one embodiment, there are multiple electroplating sub-tanks. Recovering the hot steam from these multiple sub-tanks allows the heat pump unit to collect more heat energy.

[0017] In one embodiment, the number of exhaust fans and air filters is the same as the number of electroplating sub-tanks, and they are connected in a one-to-one correspondence. By setting up a corresponding exhaust fan and air filter for each electroplating sub-tank, the purification effect and hot steam collection effect are improved.

[0018] In one embodiment, the slot is provided with a first magnetic chuck, and the flip cover is provided with a second magnetic chuck that attracts the first magnetic chuck. The magnetic locking method is simple to operate. Attached Figure Description

[0019] Figure 1 This is a perspective view of a hot steam treatment apparatus for electroplating according to an embodiment of the present invention;

[0020] Figure 2 for Figure 1 A perspective view of the hot steam treatment apparatus for electroplating shown from another angle;

[0021] Figure 3 for Figure 1 A perspective view of the electroplating solution tank in the open state of the hot steam treatment apparatus for electroplating processing.

[0022] The meanings of the labels in the attached diagram are as follows:

[0023] 100 - Hot steam treatment equipment for electroplating processes;

[0024] 10-Electroplating sub-tank, 11-Tank body, 111-Exhaust vent, 12-Flip cover;

[0025] 20-Air filter;

[0026] 30 - Exhaust fan;

[0027] 40 - Heat pump unit;

[0028] 50 - First circulating water pump;

[0029] 60 - Heat exchange piping;

[0030] 70 - Second circulating water pump;

[0031] 80-Insulated water tank. Detailed Implementation

[0032] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0033] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0035] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0036] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0037] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0038] like Figures 1 to 3 As shown, it is a hot steam treatment device 100 for electroplating processing according to an embodiment of the present invention.

[0039] like Figure 1 and Figure 2 As shown, the hot steam treatment device 100 for electroplating includes: an electroplating sub-tank 10, an air filter 20 connected to the electroplating sub-tank 10, an exhaust fan 30 connected to the air filter 20, a heat pump unit 40 connected to the exhaust fan 30, a first circulating water pump 50 connected to the heat pump unit 40, and a heat exchange pipeline 60 connected to the first circulating water pump 50 (only a partial structure of the heat exchange pipeline 60 is shown in the figure). The electroplating sub-tank 10 is the container for the electroplating operation. The exhaust fan 30 is used to draw the hot steam from the electroplating sub-tank 10 to the heat pump unit 40. The air filter 20 is used to purify the hot steam entering the exhaust fan 30. The heat pump unit 40 is used to recover and utilize the heat energy of the hot steam, on the one hand to reduce the room temperature of the electroplating workshop, and on the other hand, to work with the first circulating water pump 50 and the heat exchange pipeline 60 to heat the electroplating master tank using the recovered heat energy.

[0040] The following text, combined with Figures 1 to 3 The hot steam treatment apparatus 100 for electroplating processing described above will be further explained.

[0041] like Figure 3 As shown, the electroplating sub-tank 10 includes a tank body 11 and a hinged cover 12 hinged to the tank body 11. The tank body 11 has an exhaust vent 111 at its opening, and the exhaust vent 111 is located below the hinged cover 12.

[0042] To improve the ease of operation for workers, in this embodiment, the tank 11 may be equipped with a first magnetic attractor (not shown), and correspondingly, the flip cover 12 may be equipped with a second magnetic attractor (not shown) that attracts the first magnetic attractor. The magnetic locking method is simple to operate. For example, a metal sheet is provided at the top of the tank 11, and a magnet is provided at the free end of the flip cover 12.

[0043] Combination Figure 2 and Figure 3 As shown, the air inlet of the air filter 20 is connected to the exhaust port 111. The air filter 20 is used to filter the gas output from the exhaust port 111 to purify it.

[0044] Furthermore, in this embodiment, the air filter 20 is equipped with a removable filter cotton element. The filter cotton element can effectively adsorb the electroplating solution in the hot steam, and its removability makes it easy to replace.

[0045] To further enhance the purification effect of the air filter 20, the air filter 20 is also equipped with a removable activated carbon filter element. The filter cotton filter element can further enhance the adsorption effect on electroplating solutions in hot steam, and its removable design makes it easy to replace.

[0046] like Figure 1 As shown, the air inlet of the exhaust fan 30 is connected to the air outlet of the air filter 20. The exhaust fan 30 is used to extract gas from the electroplating sub-tank 10 through the exhaust port 111.

[0047] like Figure 1 and Figure 2 As shown, the air inlet of the heat pump unit 40 is connected to the air outlet of the exhaust fan 30. The heat pump unit 40 is used to recover heat energy from the gas output from the exhaust port 111 and cool the gas to a preset temperature before discharging it into the electroplating workshop to achieve indoor cooling. At the same time, the heat pump unit 40 uses the recovered heat energy to heat liquids.

[0048] like Figure 2 As shown, the inlet of the first circulating water pump 50 is connected to the outlet of the heat pump unit 40.

[0049] like Figure 1 and Figure 2As shown, the inlet of the heat exchange pipe 60 is connected to the outlet of the first water pump, and the outlet of the heat exchange pipe 60 is connected to the inlet of the heat pump unit 40. The heat exchange pipe 60 is arranged in the electroplating tank, and the liquid in the heat exchange pipe 60 circulates under the drive of the first circulating water pump 50 and exchanges heat with the electroplating solution in the electroplating tank to heat the electroplating solution. For example, in this embodiment, the heat exchange pipe 60 can be a coil structure or an S-shaped bend structure and is installed in the electroplating solution tank. After hot water enters the heat exchange pipe 60, the hot water exchanges heat with the electroplating solution in the tank.

[0050] Brief description of working principle:

[0051] like Figure 1 As shown, during operation, the hot steam generated by the electroplating sub-tank 10 is first purified by the air filter 20 under the action of the exhaust fan 30, and then sent to the heat pump unit 40 for heat energy recovery. After heat energy recovery, the hot steam temperature drops and is blown as cold air into the electroplating workshop to lower the room temperature. At the same time, the heat pump unit 40 uses the recovered heat energy to heat the liquid, and drives the liquid to circulate in the heat exchange pipeline 60 through the first circulating water pump 50. The heat exchange pipeline 60 is arranged in the electroplating main tank. When the heated liquid flows through the electroplating main tank, it heats the electroplating solution in the electroplating main tank through heat exchange.

[0052] It should be noted that when the exhaust fan 30 is working, it can extract the hot steam from the tank 11 of the electroplating sub-tank 10. Therefore, a negative pressure is formed at the exhaust port 111, which can effectively reduce the amount of hot steam accumulated in the electroplating sub-tank 10. Thus, it can effectively alleviate the problem of hot steam leakage.

[0053] Based on the above working principle, the hot steam treatment device 100 for electroplating can be further improved.

[0054] For example, considering the risk of insufficient hot water supply to the heat exchange pipe 60 if hot water is supplied directly to the heat pump unit 40, therefore, if Figures 1 to 3As shown, in this embodiment, the electroplating processing hot steam treatment device 100 further includes a second circulating water pump 70 and an insulated water tank 80 connected between the heat pump unit 40 and the first circulating water pump 50. The inlet of the second circulating water pump 70 is connected to the outlet of the heat pump unit 40, and the outlet of the second circulating water pump 70 is connected to the first inlet of the insulated water tank 80. The inlet of the insulated water tank 80 is connected to the first outlet of the insulated water tank 80. The second outlet of the insulated water tank 80 is connected to the inlet of the first circulating water pump 50, and the second inlet of the insulated water tank 80 is connected to the outlet of the heat exchange pipeline 60. The insulated water tank 80 is used to store and insulate the liquid output from the heat pump unit 40. The insulated water tank 80 can store a large amount of high-temperature liquid, improving the operational stability of the heat exchange pipeline 60.

[0055] For example, considering that the amount of heat energy that can be recovered from the hot steam generated by a single electroplating sub-tank 10 is relatively small, in other embodiments, the number of electroplating sub-tanks 10 can be multiple. Recovering the hot steam from multiple electroplating sub-tanks 10 allows the heat pump unit 40 to collect more heat energy.

[0056] Furthermore, considering that the efficiency of a single air filter 20 and exhaust fan 30 may be insufficient when simultaneously recovering heat steam from multiple electroplating sub-tanks 10, multiple exhaust fans 30 and air filters 20 can be installed in this case, with the number of exhaust fans 30 and air filters 20 matching the number of electroplating sub-tanks 10 and connected in a one-to-one correspondence. Installing a corresponding exhaust fan 30 and air filter 20 for each electroplating sub-tank 10 results in better purification and heat steam collection.

[0057] The aforementioned electroplating hot steam treatment device 100 is built around a heat pump unit 40 to establish a heat energy recovery and utilization system for the hot steam of the electroplating sub-tank 10. It also uses an air filter 20 to purify the hot steam, thereby solving the problem of rapid temperature rise and air pollution in the electroplating workshop caused by hot steam leakage.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The above embodiments only illustrate preferred implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A thermal vapor treatment apparatus for electroplating processes, characterized by, include: Electroplating sub-tank; The electroplating sub-tank includes: a tank body and a hinged cover on the tank body; the tank body has an exhaust vent at the opening, and the exhaust vent is located below the hinged cover; An air filter is connected to the electroplating sub-tank; the air inlet of the air filter is connected to the exhaust port; the air filter is used to filter the gas output from the exhaust port to purify it. A blower is connected to the air filter; the air inlet of the blower is connected to the air outlet of the air filter; the blower is used to extract gas from the electroplating tank through the air outlet. A heat pump unit is connected to the exhaust fan; the air inlet of the heat pump unit is connected to the air outlet of the exhaust fan; the heat pump unit is used to recover heat energy from the gas output from the exhaust outlet and cool the gas to a preset temperature before discharging it into the electroplating workshop to achieve indoor cooling; at the same time, the heat pump unit uses the recovered heat energy to heat liquids. A first circulating water pump is connected to the heat pump unit; the inlet of the first circulating water pump is connected to the outlet of the heat pump unit; and A heat exchange pipeline is connected to the first circulating water pump; the inlet of the heat exchange pipeline is connected to the outlet of the first circulating water pump, and the outlet of the heat exchange pipeline is connected to the inlet of the heat pump unit; the heat exchange pipeline is arranged in the electroplating mother tank, and the liquid in the heat exchange pipeline circulates under the drive of the first circulating water pump and exchanges heat with the electroplating solution in the electroplating mother tank to heat the electroplating solution.

2. The thermal vapor treatment apparatus for electroplating processes according to claim 1, wherein, The air filter is equipped with a removable filter element.

3. The thermal vapor treatment apparatus for electroplating processes according to claim 2, wherein, The air filter also features a removable activated carbon filter element.

4. The thermal vapor treatment apparatus for electroplating processes according to claim 1, wherein Also includes: A second circulating water pump and an insulated water tank are connected between the heat pump unit and the first circulating water pump. The inlet of the second circulating water pump is connected to the outlet of the heat pump unit, and the outlet of the second circulating water pump is connected to the first inlet of the insulated water tank; the inlet of the insulated water tank is connected to the first outlet of the insulated water tank; the second outlet of the insulated water tank is connected to the inlet of the first circulating water pump, and the second inlet of the insulated water tank is connected to the outlet of the heat exchange pipeline; the insulated water tank is used to store and keep warm the liquid output by the heat pump unit.

5. The thermal vapor treatment apparatus for electroplating processes of claim 1, wherein, The number of electroplating sub-tanks is multiple.

6. The hot steam treatment apparatus for electroplating according to claim 5, characterized in that, The number of exhaust fans and air filters is the same as the number of electroplating sub-tanks, and they are connected in a one-to-one correspondence.

7. The thermal vapor treatment apparatus for electroplating processes of claim 1, wherein, The groove is provided with a first magnetic attraction element, and the flip cover is provided with a second magnetic attraction element that attracts the first magnetic attraction element.

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